Normal view

There are new articles available, click to refresh the page.
Yesterday — 26 April 2026Main stream

TSMC’s Key CoWoS Packaging Supplier Drags Ex-General Manager to Court While Denying Any Tech Reached China

25 April 2026 at 08:30

TSMC's Key CoWoS Packaging Supplier Drags Ex-General Manager to Court While Denying Any Tech Reached China

TSMC's key supplier has stated that no technology was leaked to China, but it also filed a lawsuit against its former General Manager. TSMC Supplier Denies That Key Technology Was Leaked To China, But Files A Lawsuit Against Its Former General Manager GPTC (Grand Process Technology Corporation), which is a key supplier for TSMC's Advanced Packaging solutions such as CoWoS, has denied recent reports that key TSMC technology was leaked to China. In a recent press release, the company confirmed that no technology leaks were observed after recent rumors emerged. However, at the same time, the company has filed a […]

Read full article at https://wccftech.com/tsmc-supplier-drags-ex-general-manager-to-court-denies-any-tech-reached-china/

Before yesterdayMain stream

Meta Is Adding Tens of Millions of AWS Graviton Cores To Its Compute Portfolio As Agentic AI Becomes “Almost As Big a CPU Story As A GPU Story”

24 April 2026 at 14:40

A close-up of a computer chip with the logos of 'Meta' and 'AWS' connected by a line, with the word 'Arm' partially visible on the chip corner.

Meta has partnered with Amazon's AWS to bring tens of millions of Graviton CPU cores to its AI compute portfolio for Agentic AI. The CPU Is The New GPU For Agentic AI - Meta is adding millions of Amazon AWS Graviton CPU Cores To Its AI Infrastructure. As the Agentic AI era rages on, companies are rapidly expanding their AI infrastructure to meet rising compute demands. We have seen multi-GigaWatt deals being signed here and there, and CPU usage is on the rise. With all of this happening, Meta has also announced its blockbuster partnership with Amazon's AWS. The new […]

Read full article at https://wccftech.com/meta-is-adding-tens-of-millions-of-aws-graviton-cpu-cores-to-its-compute-portfolio/

Bolt Graphics tapes out Zeus GPU test chip on TSMC 12nm FFC

23 April 2026 at 15:00

Bolt Graphics has officially announced the successful tape-out of its Zeus GPU test chip based on TSMC's 12nm FFC process node. This architecture, which has undergone four years of FPGA testing and customer evaluation, is designed as a highly scalable compute platform targeting high-performance computing (HPC), AI, and professional rendering. 

The Zeus GPU(via Guru3D) is designed to scale across multiple configurations, including single-slot PCIe cards and massive 2U server systems. The entry-level “Bolt Zeus 1c26” single-chiplet model features 32GB of LPDDR5X memory and two DDR5 SO-DIMM slots, allowing for memory expansion up to 160GB within a modest 120W power envelope. For more intensive workloads, the dual-chiplet “2c26” variant offers up to 128GB of onboard LPDDR5X and four SO-DIMM slots for a total capacity of 384GB. This configuration is rated for 154 Gigarays of path tracing performance and 40 TFLOPs of FP16 compute at a 250W TBP.

Bolt Graphics' performance benchmarks place the Zeus GPU significantly ahead of Nvidia's RTX 5090. The company claims the 120W single-chiplet Zeus offers 2.5x the path tracing performance of a 575W RTX 5090, increasing to 5x with the 250W dual-chiplet GPU and 10x with the 4-chiplet GPU. In the HPC sector, Bolt reports up to a twelve-fold performance increase, while electromagnetic simulations reportedly see a 300x boost when comparing a quad-chiplet Zeus setup to a single RTX 5090.

While the hardware has reached tape-out, Bolt expects to begin mass production and achieve broad product availability only by Q4 2027. The company claims the Zeus platform can reduce total compute costs by up to 17 times compared to current market leaders, with a focus on performance-per-dollar efficiency.

Discuss on our Facebook page, HERE.

KitGuru says: With Zeus promising to outperform an RTX 5090 in path tracing while using less than half the power in an older node, do you think we're seeing a shift toward “compute-first” GPU architectures that move away from traditional gaming-centric designs?

The post Bolt Graphics tapes out Zeus GPU test chip on TSMC 12nm FFC first appeared on KitGuru.

Bolt Graphics Tapes Out Zeus GPU Which It Claims Is 5x Faster Than NVIDIA’s RTX 5090 In Path Tracing At Half The Power

22 April 2026 at 18:20

Bolt Graphics has successfully taped out its Zeus GPU, which is expected to offer up to 6x faster HPC & 5x faster Path Tracing performance than NVIDIA's RTX 5090. The Bolt Graphics Zeus "12nm" GPU Aims To Offer 5x Faster Path Tracing Performance Than An RTX 5090 "5nm" Graphics Card Last year, Bolt Graphics announced its Zeus chip and claimed some big numbers. Today, we can finally confirm that Zeus wasn't just a paper announcement, as the chip has been successfully taped out. In a press release shared with us, Bolt Graphics confirms that its Zeus GPU test chip has […]

Read full article at https://wccftech.com/bolt-graphics-tapes-out-zeus-gpu-5x-faster-vs-nvidia-rtx-5090-in-path-tracing/

Tesla Pulls 2nm AI Chip Production Onto US Soil, Splitting AI6 and AI6.5 Between Samsung Texas and TSMC Arizona

19 April 2026 at 11:05

Tesla Pulls 2nm AI Chip Production Onto US Soil, Splitting AI6 and AI6.5 Between Samsung Texas and TSMC Arizona 1

Elon Musk lays out the plans for Tesla's future AI ecosystem, utilizing both Samsung & TSMC 2nm tech for AI6 & AI6.5 chips. Tesla's 2nm Duo Confirmed: AI6 Goes Samsung With LPDDR6 & AI6.5 Goes TSMC With Improved Performance A few days ago, Tesla announced the successful tape out of its AI5 chip, made at Samsung. The chip is just one of the many custom silicon designs that Elon Musk and his enterprises are making to fulfill their in-house AI demand. Musk also talked about the next-generation chips, such as AI6 and the Dojo3 supercomputer project. The company is aiming […]

Read full article at https://wccftech.com/tesla-pulls-2nm-ai-chip-production-onto-us-soil-splits-ai6-ai6-5-between-samsung-tsmc/

ASML Sees Memory Chip Orders Explode Past Logic for the First Time as DRAM Makers Scramble for EUV Slots

18 April 2026 at 08:50

Makers of The World's Most Advanced Chipmaking Machine Also Say That Chip Demand Will Continue To Outstrip Supply For The Foreseeable Future

ASML continues to solidify its investments in AI-driven infrastructure, as demand for logic and memory chips continues to grip the industry. ASML Says Advanced Logic & Memory Chips Will Continue To Be Constrained For The Foreseeable Future During its Q1 2026 earnings call, ASML President & CEO Christophe Fouqet highlighted the company's increased investment in the necessary tools to speed up advanced logic and memory chip production in the AI ecosystem as demand rises to an exponential scale as AI factories scale up to the next level. Customers are adding capacity aggressively, and the reason behind it is to address […]

Read full article at https://wccftech.com/asml-memory-chip-orders-explode-past-logic-first-time-as-dram-makers-scramble-for-euv-slots/

Elon Musk Tells TSMC’s CEO That Terafab Wouldn’t Exist if the Foundry Could Keep Up With His Chip Demand

18 April 2026 at 07:00

Elon Musk Tells TSMC's CEO That Terafab Wouldn't Exist if the Foundry Could Keep Up With His Chip Demand 1

Elon Musk confirms that SpaceX & Tesla will always remain a major customer of TSMC, but the Taiwanese chipmaker alone couldn't fulfill its demand, which is why they started the Terafab project with Intel. Terafab Is Essential To Elon's Ambitious "In-House" Chipmaking Goals, But Says That SpaceX & Tesla Will Remain A Customer of TSMC A few days ago, Lip-Bu Tan (CEO of Intel) and Elon Musk announced their partnership on the ground-breaking Terafab project, which will be responsible for producing custom and in-house chips for Tesla, SpaceX, xAI, and other ventures. The project is expected to begin its first […]

Read full article at https://wccftech.com/elon-musk-tells-tsmcs-ceo-that-terafab-wouldnt-exist-if-the-foundry-could-keep-up-with-his-chip-demand/

TSMC Will Force Smartphone Makers To Make Chipset Downgrades This Year, With DRAM Shortage Also Contributing To This Burden

16 April 2026 at 01:46

Expect smartphone makers to make chipset downgrades this year, thanks to TSMC

The 2nm node is expected to be the most cutting-edge lithography the industry has ever laid eyes on, with none other than TSMC leading from the front with orders secured for AI chips and mobile SoCs. Unfortunately, the complexities of mass-producing these advanced wafers at a monumental scale pose a major challenge for multiple smartphone companies planning to use these chipsets in their devices. In fact, one tipster suggests that TSMC will partly be responsible for firms introducing silicon downgrades to their handsets later this year, with the other culprit being the DRAM crisis. The advanced 2nm process has ‘insufficient […]

Read full article at https://wccftech.com/tsmc-to-force-smartphone-makers-to-make-chipset-downgrades-this-year/

TSMC Is Now Pushing to Solve One of the Biggest Constraints For the AI Industry Through Massive Investments in Taiwan and the US

13 April 2026 at 19:15

TSMC could surpass Apple in market value by 2030, predicts analyst

One of the biggest supply constraints the AI industry faces is with advanced packaging, and given that every entity relies on TSMC, it appears the firm is gearing up to add significant capacity. TSMC's Advanced Packaging Supply Constraints Force the Firm to Rapidly Add New Capacity, or Risk Losing Customers We have discussed advanced packaging (AP) bottlenecks extensively on the website, but it is important to note that without adding new capacity, there is no other way to solve this bottleneck in the future. Based on a new report by Taiwan's CNA, it appears that TSMC is now ready to […]

Read full article at https://wccftech.com/tsmc-is-now-pushing-to-solve-one-of-the-biggest-constraints-for-the-ai-industry/

Apple To Use M5 Pro & M5 Max Architecture To Boost AI Efforts, New Server Chips’ Performance Boost Will Improve Siri Experience & More

10 April 2026 at 15:59

A close-up view of an unbranded central processing unit (CPU) with visible pins on a motherboard, surrounded by a digital circuit pattern.

Apple is beginning to lay the critical groundwork for its next-gen custom chips, including a much-anticipated server chip, dubbed Baltra, as per a new analysis from Morgan Stanley Apple is increasing its reservation slots for TSMC's SoIC packaging tech in anticipation of its next-gen custom chips, including the Baltra ASIC Morgan Stanley has noted in a fresh analysis that Apple is "ramping up" SoIC-related activity at TSMC: "Apple is materially ramping SoIC capacity at TSMC, pointing to a major push in Apple silicon for AI servers. TSMC (covered by Charlie Chan) is expanding its SoIC (System on Integrated Circuit) capacity, […]

Read full article at https://wccftech.com/apple-is-materially-ramping-soic-capacity-at-tsmc-as-it-prepares-for-its-baltra-asic-m5-pro-max-m6-pro-max-chips-with-60k-capacity-equivalent-wafers-reserved-for-2027/

Samsung’s 2nm Process Has Yet To Reach Qualcomm’s Required Benchmark, Making It Difficult To Reduce Dependency On TSMC

10 April 2026 at 12:05

Qualcomm wants a dual-sourcing approach with Samsung, but only if the latter improves its 2nm process

The Snapdragon 8 Elite Gen 6 and Snapdragon 8 Elite Gen 6 Pro are expected to be exclusively mass produced on TSMC’s 2nm ‘N2P’ process, making it yet another year where Qualcomm and Samsung cannot come to terms on becoming partners. To be fair, it’s not the San Diego firm’s fault, as a new report states that even the Korean giant’s 2nm GAA node is running into stability issues, to the point that the technology cannot reach the desired benchmark. These limitations have apparently created a rift between the two companies, preventing them from forming a long-term foundry business. With the […]

Read full article at https://wccftech.com/samsung-2nm-process-not-satisfied-qualcomm-quality-benchmark/

TSMC Has Enabled Smartphone SoCs To Approach 5GHz Frequencies Thanks To Advanced Lithography; Huawei The Biggest Loser In All Of This

9 April 2026 at 23:40

TSMC has allowed smartphone chipset manufacturers to nearly touch the 5.00GHz barrier

Companies like Apple, Qualcomm, and MediaTek have benefited greatly from extending their partnership with TSMC, as not only have they developed the most cutting-edge smartphone chipset technology, but the level of performance is uncanny and would likely not be possible without the Taiwanese semiconductor behemoth providing its advanced nodes. Later this year, we shall bear witness to SoCs reaching clock speeds of 5.00GHz, making it the first time in history, with Huawei sadly unable to keep up with its rivals as it doesn’t have access to the foundry giant’s technology. Huawei didn’t jump into EUV lithography fast enough, as its […]

Read full article at https://wccftech.com/tsmc-advanced-lithography-allows-smartphone-socs-to-reach-5ghz-huawei-missing-out/

TSMC’s Chipmaking Edge Is So Strong That Competitors Are Fighting to Work with Its Supply Chain Partners, Viewing Them as a Winning Bet

9 April 2026 at 15:46

TSMC could surpass Apple in market value by 2030, predicts analyst

TSMC's dominance over the semiconductor industry also stems from how disciplined its supply chain partners have become, and rivals are now looking to capitalize on this edge. TSMC's Supply Network Has Created a Moat For Them In The Chip Industry, After Passing Them Through Stringent QC Tests The Taiwan chip giant has been known for its work in the semiconductor industry, not just in terms of the process technology it has brought into the market, but also how it has created standards that have become industry benchmarks, whether it is customer relations, dealing with geopolitical tensions, or managing the supply […]

Read full article at https://wccftech.com/tsmc-edge-is-so-strong-that-competitors-are-racing-to-work-with-its-supply-chain-partners/

Intel’s Advanced Packaging Is Getting the Attention It Needs From AI Customers, With EMIB Gaining Ground Against TSMC’s CoWoS

6 April 2026 at 16:53

A person holding an unbranded computer processor with a visible die layout.

Intel's advanced packaging services have been a significant opportunity for the foundry division in recent times, and now it seems customer interest is flowing in. Intel's Advanced Packaging Has Already Seen "Billions" In Customer Commitments This Year Advanced packaging has become a commodity for the tech industry, as significant as semiconductors in today's market, given that manufacturers like NVIDIA have resorted to using it to scale performance without entirely relying on Moore's Law. Right now, TSMC entirely sources advanced packaging demand, with customers looking at products like CoWoS-L for their AI architectures. The important point to note here is that […]

Read full article at https://wccftech.com/intels-advanced-packaging-is-getting-the-attention-it-needs-from-ai-customers/

TSMC Is Set to Talk About the Biggest Risk It Faces with Chip Production Right Now; One That Could Derail the AI Frenzy

6 April 2026 at 15:18

TSMC could surpass Apple in market value by 2030, predicts analyst

TSMC's earnings call is scheduled for April 16, and one of the key factors the industry is watching is the potential consequence of supply chain disruptions, amid the Middle East crisis. Taiwan's Reliance on LNG Imports From the Middle East Has Turned Out To Be a Costly Bet, One That Could Influence TSMC On a Larger Scale The AI industry is centered on TSMC's semiconductor services, with not just entities such as NVIDIA, AMD, and Intel, but also hyperscalers and ASIC manufacturers. It won't be wrong to say that a disruption in TSMC's production lines could affect the supply chain […]

Read full article at https://wccftech.com/tsmc-is-set-to-talk-about-the-biggest-risk-it-faces-with-chip-production/

TSMC Reportedly Converting Its 4nm Node Capacity Into 3nm Chip Production Lines As Demand From Entry-Level And Mid-Tier Smartphones Faces Utter Decimation

3 April 2026 at 10:36

TSMC building four plants for 1.4nm production

If you want to gauge just how desolate the smartphone landscape has turned over the past few months, look no further than TSMC, which is now moving its increasingly idle 4nm capacity into still-constrained 3nm chip production lines as smartphone-led demand for the more mature nodes faces utter decimation. TSMC forced to recalibrate its production lines in favor of the more advanced 3nm process as smartphone-led demand for the more mature nodes continues to collapse According to a Taiwanese publication, TSMC is currently in the process of converting its 4nm-based chip production lines into 3nm ones as "non-Apple mobile phone […]

Read full article at https://wccftech.com/tsmc-reportedly-converting-its-4nm-node-capacity-into-3nm-chip-production-lines-as-demand-from-entry-level-and-mid-tier-smartphones-faces-utter-decimation/

TSMC’s US Expansion Plans Grow More Aggressive With Twelve Planned Arizona Fabs, as Sole Reliance on Taiwan Appears to Be a ‘Dead End’

2 April 2026 at 14:25

Silicon wafer inside a semiconductor manufacturing machine.

TSMC's US fab network is growing at an unprecedented pace, and according to a new report, the chip giant is eager to build a 'GigaFab' cluster in Arizona that rivals Taiwan's output. TSMC's Arizona Is Expected To Turn Out To Be a Taiwan-Level Fab Network, Driven by Gigantic Investments The Taiwan chip giant has managed to pivot towards America's semiconductor industry, and several factors have influenced this shift, which we'll discuss later. However, according to a new report by DigiTimes, it is disclosed that TSMC's plans for the US have already "exceeded expectations", and that now, the firm has plans […]

Read full article at https://wccftech.com/tsmc-us-expansion-plans-grow-more-aggressive-with-twelve-planned-arizona-fabs/

TSMC’s 2nm Secrets Were Stolen With Just a Smartphone Camera; The Engineers Behind It Now Face Up to 14 Years in Prison

30 March 2026 at 15:58

Masked individuals in dark clothing inspect a large, colorful semiconductor wafer under dim lighting.

TSMC's former and current engineers were involved in a 2nm theft incident, and after an extensive investigation, the individuals are now being legally pursued. TSMC's Former Engineers Stole Information Around the 2nm Process to Give Their Newer Employers a Leverage When it comes to technology theft, semiconductors are an area that is actively targeted, and this isn't limited to internal elements within TSMC; it also involves geopolitics. Taiwan has taken theft claims in this segment very seriously, and one recent case is an alleged 2nm theft by TSMC's own employees. We'll discuss the incident ahead, but for now, a recent […]

Read full article at https://wccftech.com/tsmcs-2nm-secrets-were-stolen-with-just-a-smartphone-camera/

Taiwan Is Facing Its Worst Rainfall in 75 Years, and the Hardest-Hit Area Is Exactly Where TSMC’s Most Advanced Fabs Are

27 March 2026 at 21:04

TSMC could surpass Apple in market value by 2030, predicts analyst

On top of the gigantic semiconductor demand Taiwan is witnessing, the nation is experiencing a tough period with water supply, as local authorities report a 75-year low in rainfall. Taiwan's Water Shortages Are Influencing TSMC's Largest Fab Network, But There Are No Production Concerns For Now Taiwan is the world's semiconductor hub and is likely a chokepoint for the modern AI infrastructure buildout, given that the region hosts one of the world's most advanced fab networks and is also under consistent geopolitical pressure. At the same time, a new report by the Taiwanese media outlet Liberty Times has disclosed that […]

Read full article at https://wccftech.com/taiwan-is-facing-its-worst-rainfall-in-75-years-and-the-hardest-hit-area-is-exactly-where-tsmc-most-advanced-fabs-are/

❌
❌