SK Hynix is leveraging advanced packaging technologies such as Intel's EMIB for its next-gen HBM solutions, which will eventually enter the 3D packaging stage. Scaling HBM Comes With Big Challenges & SK Hynix Is Leveraging Advanced Packaging Solutions To Address Them As It Ventures Into The 3D Era At Hot Chips 2026, Jaesik Lee (VP Package Engineering at SK Hynix) presented the "Advanced Packaging for High-Bandwidth Memory" brief, which talks about how the company plans to leverage advanced packaging tech to accelerate its HBM roadmap. The company started by presenting how HBM is currently built. The HBM structure consists of […]

Read full article at https://wccftech.com/sk-hynix-advanced-packaging-technologies-intel-emib-next-gen-hbm-memory/

Well, you read the headline right, and we are talking about a critical element in AI chips that is not only in tremendous shortage but also originally comes from an MSG maker. Ajinomoto, the MSG Maker, Controls the Production of ABF That Is Absolutely Crucial For Advanced Packaging The aggressiveness of the AI demand cycle has left almost every supply chain entity involved facing shortages, whether in semiconductors, advanced packaging, OSAT services, and more. Traditionally, the computing industry has an idea of demand cycles, given how they have historically evolved, but with the AI datacenter buildout, the scale of customer […]

Read full article at https://wccftech.com/the-seasoning-company-behind-your-food-flavors-could-control-the-future-of-ai-chips/

Intel's advanced packaging services have been a significant opportunity for the foundry division in recent times, and now it seems customer interest is flowing in. Intel's Advanced Packaging Has Already Seen "Billions" In Customer Commitments This Year Advanced packaging has become a commodity for the tech industry, as significant as semiconductors in today's market, given that manufacturers like NVIDIA have resorted to using it to scale performance without entirely relying on Moore's Law. Right now, TSMC entirely sources advanced packaging demand, with customers looking at products like CoWoS-L for their AI architectures. The important point to note here is that […]

Read full article at https://wccftech.com/intels-advanced-packaging-is-getting-the-attention-it-needs-from-ai-customers/

Intel's packaging services are being considered a viable alternative to TSMC's CoWoS, as supply constraints are forcing US fabless customers to seek other options. Intel's EMIB Packaging Orders Could Reach 'Billions in Revenue' Moving Into H2 2026; a New Prospect For the Foundry Business Advanced packaging has emerged as a major driver of computing power in modern-day AI architectures, and alongside semiconductors, solutions like CoWoS are seen as vital for firms like NVIDIA and AMD. With the start of the AI frenzy, advanced packaging has been dominated by TSMC, but as demand for CoWoS and derivatives ramps up, a supply […]

Read full article at https://wccftech.com/intel-emib-challenges-tsmcs-cowos-as-america-answer-to-the-ai-packaging-bottleneck/

Intel's CFO, David Zinsner, took the stage at the Morgan Stanley conference, and based on his comments on the foundry front, Team Blue looks a lot more confident about division breakeven. Intel's 18A-P & 14A Will Prove to Be Effective Solutions For External Customers; Packaging To Bring 'Billions' In Revenue Under CEO Lip-Bu Tan, Intel has been entering the foundry market at a time when the AI frenzy significantly drives customer demand. One of the more significant achievements under Tan was the successful ramp-up of Panther Lake, and according to Zinsner, 18A has delivered on expectations, with yield rates improving […]

Read full article at https://wccftech.com/intel-foundry-breakeven-target-for-2027-now-looks-a-lot-more-real/