The Taiwan Semiconductor Manufacturing Company (TSMC) might double its chip-on-wafer-on-substrate (CoWoS) capacity from 2026 levels in 2028, suggests a report from the Taiwanese media. TSMC's CoWoS is the leading packaging technology for AI GPUs and is used by major firms such as NVIDIA. The details suggest that the capacity expansion comes at a time when existing constraints have led to a spillover to other firms, such as Taiwan's UMC and Amkor. Intel Expected To Reach Up To 45,000 Wafers Per Month Of Equivalent CoWoS Capacity In 2028, Says Report The booming demand for TSMC's CoWoS technology and the resulting shortage […]

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The Taiwan Semiconductor Manufacturing Company's (TSMC) next-generation 1.4-nanometer production could kick off in April, suggests a new report in the Taiwanese press. TSMC's 1.4-nanometer process technology, also called the 14A manufacturing node, will succeed the firm's 2-nanometer technology. According to the details, TSMC's 1.4-nanometer facility in Taichung could enter trial production in April 2027, with mass production expected in the second half of the year. TSMC Submits Application To Build Two Temporary Offices At Taichung 1.4-nanometer Facility, Says Report According to the details, the technology park where the plant is being built has revealed that construction of the plant started […]

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China's Semiconductor Manufacturing International Corporation (SMIC) was one of the fastest-growing foundries in the second quarter, according to fresh data from market research firm TrendForce. SMIC grew its revenue by 20% during the second quarter and was the third biggest chip manufacturer in the world in terms of revenue, as it comfortably sat above GlobalFoundries. Taiwan's TSMC, courtesy of its advanced manufacturing process technologies and stable revenue, remained the biggest foundry and commanded 72.5% of the overall market. Consumer Electronics Helped SMIC To Grow Revenue 20% In Q2, Shows Data The booming demand for artificial intelligence memory chips has reshaped […]

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The Taiwan Semiconductor Manufacturing Company (TSMC)'s bonuses for the second quarter outpaced the firm's revenue growth, as shown in the firm's filings with the Securities and Exchange Commission (SEC). During the second quarter, TSMC paid out NT$36 billion in bonuses, which marked a 50.6% growth over the year ago figure of NT$35 billion. At the same time, the firm's second quarter revenue of NT$1.2 trillion marked a 36% annual growth. TSMC Paid 4% Of Its Operating Profit As Bonuses To Employees In Q2 2026 Bonuses have become a contentious issue in the semiconductor industry following the AI boom. The ball […]

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A former TSMC engineer in Taiwan has been caught by authorities after running an illicit currency exchange network between Taiwan and South Korea. The individual left his role at TSMC due to health complications. Taiwanese authorities started their investigation into Chang's network in February after receiving a tip about a logistics company purportedly involved in handling currency between the two regions. Former TSMC Engineer Found Running Money Laundering Network For Apparel Companies According to the details, the former TSMC engineer was operating a money laundering network since 2018 to facilitate payments for Taiwanese apparel business sourcing goods from South Korea. […]

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The Taiwan Semiconductor Manufacturing Company's (TSMC) Arizona facility continues to grow its share of revenue and profit for the entire group, according to data from Bank of America. TSMC's Arizona campus houses its most advanced production lines in America, and since the project started, multiple voices have raised concerns about the higher costs of construction in America. TSMC's Arizona Fab Accounted For More Than 4% of Group's Sales In Second Quarter, Shows Data TSMC's Arizona facility currently includes three phases, out of which the first phase is operational. This phase is responsible for semiconductors manufactured through the 4-nanometer chip process […]

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With the demand for its CoWoS chip packaging technology booming, TSMC might be losing some market share to Intel, suggests data from SemiAnalysis Chipbook. CoWoS, which is short for chip-on-wafer-on-substrate (CoWoS), is a key step in the AI chip manufacturing process. It involves combining multiple GPUs and memory chips in a single package, which is then used in a data center or other computing infrastructure. Export Data Suggests Intel Might Be Gaining Market To Meet CoWoS Packaging Shortage While TSMC's well-oiled chip manufacturing machine has ensured that global AI computing chips, primarily GPUs, have not been in short supply despite […]

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The Taiwan Semiconductor Manufacturing Company (TSMC) has achieved 98% yield for some of its CoWoS packaging products, according to the firm's Vice President of Advanced Packaging Technology and Services, Ho Chun. As reported by the Economic Daily, Ho outlined that the high yield is for several AI-related products packaged through CoWoS and it involves the technology that relies on a 5.5x reticle size. TSMC Plans To Expand CoWoS Technology To 14x Reticle Size By 2029, Says Executive When it comes to manufacturing AI chips, lithography is just one part of the process, even though it might be among the most […]

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The DRAM shortage has certainly forced a myriad of companies to contemplate their uncertain future, but Apple doesn’t appear to be on this list. Earlier, we reported that the iPhone maker was facing a supply chain migraine of epic proportions, where TSMC was sitting on a whopping $1 billion worth of A20 Pro supply because of inadequate DRAM supply. Fortunately for Apple, an analyst believes these claims are nothing but hot air and that Apple’s and TSMC’s tightly integrated and efficient operations are being severely underestimated. Analyst Ming-Chi Kuo believes Apple has planned its 2nm chipset production schedule at least three months in advance, […]

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Following a report that the Taiwan Semiconductor Manufacturing Company (TSMC) is sitting on a billion dollars' worth of inventory of Apple chips, an expert from Taiwan believes that the company can reallocate capacity to products that contribute more to its revenue. The rapid AI infrastructure buildout and the corresponding uptick in demand for the latest chips have led to a reshaping of TSMC's income statement, as most of the firm's revenue comes from high-performance computing chips. TSMC Can Navigate Apple Chip Buildup By Reallocating Production Lines, Says Expert Just as the AI race has reshaped NVIDIA's business from being a […]

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The 1.4nm process was previously reported to be progressing smoothly, with TSMC seemingly facing zero obstacles. However, the semiconductor giant wasn’t experiencing technical difficulties, but its plans to secure the necessary real estate were stalled due to protests from landowners. Fortunately, this little distraction is no longer a problem, as the latest report states that TSMC has secured the land for two 1.4nm plants and one panel-level advanced packaging facility. Pilot production for the 1.4nm process is said to kick off as early as H2 2027; the majority of the land for the plants was owned by the locals The […]

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The Taiwan Semiconductor Manufacturing Company (TSMC), in partnership with the National Yang Ming Chiao Tung University (NYCU) in Taipei, Taiwan, has made a key breakthrough for next-generation transistor design. TSMC and the NYCU have demonstrated that instead of focusing on depositing new materials on the transistor channel, a better approach is to engineer the channel material to create a buffer before adding the insulating material and then the gate to control the electron flow across the transistor. TSMC & NYCU Demonstrate That Depositing Epitaxial Aluminum On Monolayer Molybdenum Disulfide (MoS₂) Channel Leads To Implementation With Low Scattering Most of today's […]

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AI customers will eventually move their orders towards TSMC’s 2nm process in droves to target higher inference performance while utilizing less power to reduce the datacenter footprint. This demand surge has already forced the biggest semiconductor manufacturer in the world to make production adjustments for its lucrative customers, with a new report stating that NVIDIA, AMD, and others will push TSMC towards achieving that 100,000 monthly wafer milestone by the end of 2026. Demand for 3nm wafers is not yet waning, as TSMC is said to achieve its target of 180,000 monthly wafers ahead of schedule A report from Economic […]

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With TSMC's CoWoS advanced capacity egregiously constrained, and Intel's more nimble EMIB attracting a growing volume of orders, the Taiwan-based chipmaker has realized that it needs to change course to retain its competitive edge. And, it has chosen to do so by attempting to clone some elements of Intel's novel approach to advanced packaging, as per the reporting by The Information. Apparently, the new packaging project is referred to internally at TSMC as a "quasi-EMIB," borrowing heavily from Intel's novel approach For the benefit of those who might not be aware, TSMC's Chip-on-Wafer-on-Substrate (CoWoS-S) packaging solution uses large, expensive silicon […]

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Intel has overcome one big challenge that will lead to the creation of hyper-large chips beyond 12x reticle size through advanced packaging technologies. Intel Is Creating The World's Most Advanced & Largest Chips in the US at Its New Mexico "Rio Rancho" Facility, Leveraging Next-Gen Packaging Innovations Modern-day chips don't rely on a single piece of silicon, and instead utilize a range of silicon dies, interconnected together using the latest packaging solutions. The terminology used for such designs is chiplets, and chiplets were made to overcome scaling bottlenecks and the growing demand for compute. Inside Intel's Rio Rancho, New Mexico […]

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NVIDIA and TSMC have just achieved a major milestone that significantly bolsters the prospects of on-shore chip fabrication, insulating the US against geopolitical shocks. Even so, there is still quite a lot left to be done, including on the advanced packaging front. TSMC has just fabricated some of the first NVIDIA GB300 GPUs in its Arizona facility, taking a significant step towards fulfilling the demands of the US to onshore chip manufacturing According to the Commercial Times, TSMC has just fabricated some of the first NVIDIA GB300 AI GPUs on its 4nm node in Arizona's Fab 21. Even so, the […]

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A major milestone has reportedly been achieved by TSMC as the world’s largest semiconductor foundry races to complete its transition from the 3nm process to the 2nm one. One of the company’s plants has reached 20,000 monthly wafers as it prepares to begin shipping chips for a long list of customers. Apple and Google are likely to introduce the first 2nm chips soon, but it's AI customers that’ll make up the majority of TSMC’s wafer volume A total of five fabs located in Taiwan are solely focused on 2nm production, according to Economic Daily News. Out of the five, Fab […]

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TSMC is the undisputed king of the global semiconductor market, and to extend its lead, it has succeeded in developing cutting-edge lithography and advanced packaging. Samsung certainly has a lot of ground to cover in this aspect, but its strengths lie in being able to secure partnerships beyond its 2nm contracts, which have ultimately led to a mammoth $200 billion agreement with Broadcom to build next-generation AI infrastructure over the next five years. The major payoff will include Samsung’s 2nm process and HBM4 memory that Broadcom will use for its AI accelerators Given that memory and storage have already established […]

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Intel Foundry might be heading into a big deal with NVIDIA, as the company is expected to offer packaging and wafer support for next-gen Feynman GPUs. NVIDIA Feynman GPUs Could Be Intel Foundry's Biggest Win To Date With Chipzilla Providing Both Packaging & Wafer Supply A deal between Intel and NVIDIA won't be a major surprise for those following our previous reports, but it is definitely a big win for Intel's Foundry business. Earlier this year, we reported that NVIDIA might be looking into Intel's upcoming process & advanced packaging technologies for its next-generation GPUs, codenamed Feynman. Well, according to […]

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