Cadence has announced its new AuraStack AI Super Agent, which aims to solve PCB & advanced packaging bottlenecks by leveraging Agentic AI. Cadence's AuraStack AI Super Agent Brings The World's First Agentic AI Platform To PCB & Advanced Packaging Manufacturing, Solving One of The Biggest Bottlenecks That The Tech Industry Faces Right Now The Cadence AuraStack AI Super Agent runs on the company's Allegro AI Studio and is the first Agentic AI platform that is built for PCB and Advanced Packaging design. The stack allows PCB designers to take planned systems into a final product through a single AI-native environment. […]

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TSMC's key supplier has stated that no technology was leaked to China, but it also filed a lawsuit against its former General Manager. TSMC Supplier Denies That Key Technology Was Leaked To China, But Files A Lawsuit Against Its Former General Manager GPTC (Grand Process Technology Corporation), which is a key supplier for TSMC's Advanced Packaging solutions such as CoWoS, has denied recent reports that key TSMC technology was leaked to China. In a recent press release, the company confirmed that no technology leaks were observed after recent rumors emerged. However, at the same time, the company has filed a […]

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Intel Foundry has welcomed its newest member, Shawn Han, from Samsung Foundry, as the company continues to build its A-Team in the semiconductor business. Shawn Han of Samsung Foundry Joins Intel Foundry, Bringing Years of Semiconductor Experience The announcement was made by Intel Executive Vice President, Naga Chandrasekaran, on LinkedIn, and shared by the Intel Foundry handle on X. In the post, Naga announced that Shawn Han has joined Intel & will serve in a leadership position as the Senior Vice President and General Manager of Foundry Services. Shawn begins his role from May this year, and the important part […]

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One of the biggest supply constraints the AI industry faces is with advanced packaging, and given that every entity relies on TSMC, it appears the firm is gearing up to add significant capacity. TSMC's Advanced Packaging Supply Constraints Force the Firm to Rapidly Add New Capacity, or Risk Losing Customers We have discussed advanced packaging (AP) bottlenecks extensively on the website, but it is important to note that without adding new capacity, there is no other way to solve this bottleneck in the future. Based on a new report by Taiwan's CNA, it appears that TSMC is now ready to […]

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Well, you read the headline right, and we are talking about a critical element in AI chips that is not only in tremendous shortage but also originally comes from an MSG maker. Ajinomoto, the MSG Maker, Controls the Production of ABF That Is Absolutely Crucial For Advanced Packaging The aggressiveness of the AI demand cycle has left almost every supply chain entity involved facing shortages, whether in semiconductors, advanced packaging, OSAT services, and more. Traditionally, the computing industry has an idea of demand cycles, given how they have historically evolved, but with the AI datacenter buildout, the scale of customer […]

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Intel's advanced packaging services have been a significant opportunity for the foundry division in recent times, and now it seems customer interest is flowing in. Intel's Advanced Packaging Has Already Seen "Billions" In Customer Commitments This Year Advanced packaging has become a commodity for the tech industry, as significant as semiconductors in today's market, given that manufacturers like NVIDIA have resorted to using it to scale performance without entirely relying on Moore's Law. Right now, TSMC entirely sources advanced packaging demand, with customers looking at products like CoWoS-L for their AI architectures. The important point to note here is that […]

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