One of the biggest supply constraints the AI industry faces is with advanced packaging, and given that every entity relies on TSMC, it appears the firm is gearing up to add significant capacity. TSMC's Advanced Packaging Supply Constraints Force the Firm to Rapidly Add New Capacity, or Risk Losing Customers We have discussed advanced packaging (AP) bottlenecks extensively on the website, but it is important to note that without adding new capacity, there is no other way to solve this bottleneck in the future. Based on a new report by Taiwan's CNA, it appears that TSMC is now ready to […]

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Well, you read the headline right, and we are talking about a critical element in AI chips that is not only in tremendous shortage but also originally comes from an MSG maker. Ajinomoto, the MSG Maker, Controls the Production of ABF That Is Absolutely Crucial For Advanced Packaging The aggressiveness of the AI demand cycle has left almost every supply chain entity involved facing shortages, whether in semiconductors, advanced packaging, OSAT services, and more. Traditionally, the computing industry has an idea of demand cycles, given how they have historically evolved, but with the AI datacenter buildout, the scale of customer […]

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Intel's advanced packaging services have been a significant opportunity for the foundry division in recent times, and now it seems customer interest is flowing in. Intel's Advanced Packaging Has Already Seen "Billions" In Customer Commitments This Year Advanced packaging has become a commodity for the tech industry, as significant as semiconductors in today's market, given that manufacturers like NVIDIA have resorted to using it to scale performance without entirely relying on Moore's Law. Right now, TSMC entirely sources advanced packaging demand, with customers looking at products like CoWoS-L for their AI architectures. The important point to note here is that […]

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Intel's packaging services are being considered a viable alternative to TSMC's CoWoS, as supply constraints are forcing US fabless customers to seek other options. Intel's EMIB Packaging Orders Could Reach 'Billions in Revenue' Moving Into H2 2026; a New Prospect For the Foundry Business Advanced packaging has emerged as a major driver of computing power in modern-day AI architectures, and alongside semiconductors, solutions like CoWoS are seen as vital for firms like NVIDIA and AMD. With the start of the AI frenzy, advanced packaging has been dominated by TSMC, but as demand for CoWoS and derivatives ramps up, a supply […]

Read full article at https://wccftech.com/intel-emib-challenges-tsmcs-cowos-as-america-answer-to-the-ai-packaging-bottleneck/