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Apple Watch Chipsets Faced Years Of Neglect With Subpar Improvements, But The A20 Pro Helped Pave The Way For The S11’s Generational Upgrade This Year

12 September 2026 at 12:08

The latest Apple Watch's S11 chip is derived from the A20 Pro

The SiP (System in Package) belonging to the Apple Watch went through a series of mediocre and iterative changes, meaning that these smartwatches had to offer different major selling points to warrant an upgrade. This year, however, the S11 found in the Apple Watch Series 12 and Apple Watch Ultra 4 has finally broken that cycle, and it’s all thanks to the A20 Pro found in the latest iPhone 18 Pro and iPhone Duo. The S11 is derived from the A20 Pro, with a series of specification upgrades such as memory improvements and more that help to improve the on-device AI […]

Read full article at https://wccftech.com/apple-watch-s11-chipset-upgrade-a20-pro-architecture/

Apple Proves Chip Design Will Always Trump Latest Technology Standards; A20 Pro Has Higher Memory Bandwidth Than Xiaomi’s XRING 03, Despite Using Older LPDD5X RAM

11 September 2026 at 13:34

Apple's A20 Pro and higher memory bandwidth than Xiaomi's XRING 03, despite the latter supporting LPDDR6 RAM

The A20 Pro wasn’t just designed around a packaging change to enable Apple’s newest 2nm SoC to deliver raw performance gains, but it was also to improve the on-device AI experience, which meant the company’s engineers had to work some magic on increasing memory bandwidth without unnecessarily raising costs by switching to the LPDDR6 standard. The result is a chipset that edges past Xiaomi’s XRING 03, which, by the way, offers LPDDR6 RAM support but loses to the A20 Pro in memory bandwidth. At 115.2GB/s, the A20 Pro manages to beat the XRING 03, which tops out at 113.8GB/s; here’s how […]

Read full article at https://wccftech.com/apple-a20-pro-memory-bandwidth-beats-xiaomi-xring-03-lpddr5x-ram/

Samsung Reportedly Passes Technical Hurdles For Manufacturing Qualcomm’s 2nm Chips, But Company Hits A New And Different Snag; Price Agreements

11 September 2026 at 10:12

Samsung and Qualcomm reportedly hit price agreement for 2nm chip manufacturing

Qualcomm was already facing a torrent of struggles with its declining chipset business due to the DRAM crisis, and to make matters worse, it’s going to pay TSMC a hefty sum for utilizing its 2nm lithography for the upcoming Snapdragon 8 Elite Gen 6 Pro and Snapdragon 8 Elite Gen 6. The only solace for the company to reduce its manufacturing costs is teaming up with Samsung, but the latest report states that both entities have failed to enter into an agreement due to pricing differences. Exynos 2700 is proof that Samsung has stabilized its advanced 2nm yields, but cannot […]

Read full article at https://wccftech.com/samsung-passes-technical-hurdles-manufacturing-qualcomm-2nm-chips-hits-price-agreement-snag/

A20 Pro’s Dual 16-Core Neural Engine Has A Peak Compute Throughput Higher Than Its 7-Core GPU, But Only When It Comes To Specialized Workloads

11 September 2026 at 07:59

A20 Pro's dual 16-core Neural Engine has a peak compute throughput than its 7-core GPU

It goes without saying that the A20 Pro is truly a wonder when it comes to smartphone chipsets, with the latest look at its single-core and multi-core scores cementing its reputation in the industry. However, we’re still learning about the SoC’s impressive feats, with the latest one being that its dual 16-core Neural Engine is said to have a higher peak compute than its 7-core GPU, assuming those workloads are specifically tailor-made for the NPU. Running smaller 3B on-device AI models and prompt processing would be specific tasks for the A20 Pro’s dual 16-core Neural Engine, offering immense peak performance gains On […]

Read full article at https://wccftech.com/a20-pro-dual-16-core-neural-engine-peak-compute-throughput-higher-than-7-core-gpu-specialized-workloads/

Apple’s A20 Pro Sets New Record For Fastest Single-Core CPU Score In Geekbench 6; Up To 27% Faster Than A19 Pro & M3 in Multi-Core Test, Beats Reigning King, M5 Max

10 September 2026 at 11:34

A20 Pro Geekbench 6 scores

A new manufacturing process and a package redesign gave Apple the proper direction to develop the A20 Pro, and with these changes come massive improvements showcased in Geekbench 6. Not only has the chipset achieved a new record in the single-core result, but its multi-core scores rival those of Apple’s M-series SoCs like the M3. The latest Geekbench 6 scores show that the A20 Pro is approaching 5,000 points in single-core workloads What’s interesting about the latest leak is that the A20 Pro wasn’t tested in Geekbench 7, but the older Geekbench 6 suite, yet the results are still impressive, […]

Read full article at https://wccftech.com/apples-a20-pro-shatters-geekbench-6-records-beats-m5-max/

A20 Pro Is The iPhone’s First 2nm SoC, New GPU Offers 40% Faster Graphics & 2x FP8 Performance, 20% Faster CPU, Combining Neural Engine Delivers 50% Bandwidth Increase

9 September 2026 at 19:39

Apple announces the A20 Pro

The iPhone 18 Pro, iPhone 18 Pro Max, and iPhone Duo will be rocking Apple’s new 2nm chipset, the A20 Pro, making it the first time in the technology giant’s history that it has introduced a silicon fabricated on a next-generation lithography. There are a ton of improvements incorporated into the SoC, including a packaging redesign, so let us get into the details. Apple claims the A20 Pro features a desktop-class CPU, retaining a 6-core configuration while delivering decent performance gains The new A20 Pro features two new super cores that are 20 percent faster than the A19 Pro’s performance […]

Read full article at https://wccftech.com/apple-a20-pro-iphone-first-2nm-soc-gpu-cpu-neural-engine/

Apple’s A20 Pro Rumored Specifications Arrive Before Official Announcement, Up To 4.90GHz CPU, 7-Core GPU, Higher Memory Bandwidth Than M3 & More

9 September 2026 at 15:46

Apple's A20 Pro rumored specifications revealed before official launch

The entire iPhone lineup, which is expected to be unveiled in less than two hours, is expected to be equipped with Apple’s second 2nm SoC after the M6, the A20 Pro. Just before the official announcement, a multitude of rumored specifications have come through. In short, the new silicon will likely be a beast in nearly all departments, so let us check out all the details. New A20 Pro to also feature 36MB of SLC cache, bringing a massive performance boost A previous front die shot leak revealed that the A20 Pro would retain a 6-core CPU configuration like its immediate predecessor, the […]

Read full article at https://wccftech.com/apple-a20-pro-leaked-specs-4-9ghz-cpu-7-core-gpu-m3-bandwidth/

DLSS 5 Gets Tested On Apple’s M5 Pro Using Unofficial Experimental Layer, Massively Boosting Image Quality But At The Expense Of 10x The Latency Of An RTX 5050

9 September 2026 at 00:49

DLSS 5 was tested on Apple's M5 Pro, with major trade-offs

NVIDIA’s newest DLSS 5 has been going through the testing blender to see the level of Neural Rendering changes the company’s latest upscaling iteration brings to the table. Naturally, the unofficial version isn’t exactly kind to modern-day GPUs, as various modded games deliver crippled performance. However, DLSS 5 is exceptionally unforgiving of Apple Silicon like the M5 Pro, delivering insane image quality improvements but also major trade-offs like single-digit framerates and 10 times the input latency compared to a desktop RTX 5050. M5 Pro’s lackluster showing with DLSS 5 enabled is due to a lack of dedicated FP8 hardware units, bringing […]

Read full article at https://wccftech.com/dlss-5-tested-apple-m5-pro-experimental-layer-boosts-image-quality-latency-penalty/

Snapdragon 8 Elite Gen 6 Pro Live Chipset Die Leak Shows A Massive SoC Thanks To The New Heatsink Implementation That’s Meant To Cool The DRAM Effectively

5 September 2026 at 19:47

Qualcomm Snapdragon 8 Elite Gen 6 Pro live chipset die leak

The first design glimpse of Qualcomm’s upcoming flagship SoC, the Snapdragon 8 Elite Gen 6 Pro, revealed that the chipset has a Heat Pass Block similar to Samsung’s Exynos 2600. Now, we get to see this solution live because a real-life chipset die has been pictured, showing a significantly bigger area than the Snapdragon 8 Elite Gen 5, indicating that we could bear witness to exceptional thermals in the future. Snapdragon is finally prioritizing thermals with the Snapdragon 8 Elite Gen 6 Pro, with a new cooling solution The traditional PoP (Package-on-Package) implementation is expected to be retired with the arrival […]

Read full article at https://wccftech.com/snapdragon-8-elite-gen-6-pro-die-leak-heatsink-dram-cooling/

Apple’s A20 Pro Front Side Die Shot Shows New Record For GPU Core Count To Deliver Better Graphics Performance, New Packaging Allows For Increased Memory Bus Width

2 September 2026 at 21:04

Apple A20 Pro front side die shot

The upcoming “Surprise and Shine” event scheduled for September 9 will showcase Apple’s first-ever 2nm chipset for the iPhone, the A20 Pro. We’ve already had our initial glimpse at the SoC’s packaging, showing that Apple will move to WMCM (Wafer-Level Multi-Chip Module) technology, ditching the older InFO_PoP solution. Now, we’ve stumbled upon our first front-side die shot of the silicon, showing a higher GPU core count and other improvements, so let us begin. A20 Pro could be Apple’s first iPhone SoC with a 7-core GPU, thanks to the new packaging change, bringing exceptional graphics performance to the table A previous look […]

Read full article at https://wccftech.com/apple-a20-pro-die-shot-record-gpu-cores-wider-memory-bus/

DRAM And NAND Flash Combination Of Non-Flagship Smartphones Now Exceed Premium Chipset Costs, New Estimate Says Price Has Increased By 340% Since Last Year

29 August 2026 at 17:26

Non-flagship smartphone's DRAM and NAND flash now costs more than a flagship chipset

Advanced lithography and next-generation manufacturing processes meant that a smartphone’s chipset would be the costliest component running inside these mobile devices, that’s until the AI boom arrived. According to a tipster’s latest estimations, a DRAM and NAND flash pairing has become 340 percent more expensive and costs more than a top-end SoC. With a 12GB RAM + 256GB NAND flash combo costing approximately $310, smartphone manufacturers will struggle immensely to generate healthier margins Despite smartphone SoCs moving to TSMC’s 2nm “N2” and “N2P” process this year, starting with Apple’s A20 Pro, it still won’t be as expensive as DRAM and […]

Read full article at https://wccftech.com/dram-nand-flash-costs-exceed-soc-bom/

Apple M6’s Only Significance Is That It Validates TSMC’s 2nm Process, But As Far As Commercial Viability Goes, The A20 Pro Launch Holds More Weight

28 August 2026 at 10:57

Apple's M6 only possesses importance that TSMC's 2nm node is market-ready

The M6 might be Apple’s first 2nm chipset thanks to its long-standing partnership with TSMC, but there’s a massive difference between having bragging rights over adopting a newer lithography and how well it’s going to be adopted. For the new Apple Silicon, a new report states that its importance is limited to proving that TSMC’s 2nm node is ready for the mass market. As for increasing the share of this manufacturing process, that’s a job for the A20 Pro. An ongoing DRAM shortage risks the M6 Mac mini’s adoption, thanks to its 50 percent price increase compared to the M4 Mac […]

Read full article at https://wccftech.com/apple-m6-validates-tsmc-2nm-process-a20-pro-launch-holds-more-weight/

Apple Isn’t Skipping M6 Pro, M6 Max Launches, New Report Says Company Will Adopt A Combination Of SoIC-MH & WMCM Technologies To Improve Interconnect Density And More

27 August 2026 at 11:15

Apple isn't giving up on the M6 Pro and M6 Max, according to the latest report

The M6 Pro and M6 Max were getting skipped in favor of the M7 Pro and M7 Max, but shortly after the M6 and Mac mini refresh announcement, an update claims that Apple is still developing both higher-end SoCs, and they are said to arrive with advanced packaging technologies like SoIC-MH and WMCM (Wafer-Level Multi-Chip Module), bringing a host of benefits to the table. The iPhone 18 packaging is coming to the M6 Pro and M6 Max, assuming the report checks out An article published by Commercial Times states that the base M6 retains the use of Apple’s SoIC-MH technology, […]

Read full article at https://wccftech.com/apple-m6-pro-m6-max-soic-mh-wmcm-packaging-report/

NVIDIA Develops Custom “NVHBM” Memory For AI, Claiming 30% More Bandwidth and 15% Lower Power Than HBM4E

26 August 2026 at 21:45

A detailed view of the NVIDIA H100 Tensor Core GPU chip featuring a grid of gold and silver components.

NVIDIA has just announced its custom HBM solution called NVHBM, which will be used in future GPUs, offering higher bandwidth & lower power. NVHBM Is A Custom HBM Solution Designed By NVIDIA & Amazon's Annapurna Labs To Speed Up DRAM Capabilities For Future Agentic & Physical AI Workloads The NVIDIA NVHBM DRAM solution is an extension of NVLink Fusion, offering higher memory performance and efficiency to XPUs at a time when memory bandwidth is becoming critical as model sizes increase tremendously into the trillion-parameter era. NVIDIA says that its NVHBM solution offers better bandwidth and efficiency than standard HBM solutions […]

Read full article at https://wccftech.com/nvidia-develops-custom-nvhbm-memory-for-ai-more-bandwidth-lower-power-than-hbm4e/

Fujitsu’s Monaka Chip 3D Stacks 2nm “144-Core CPU” With 5nm “SRAM” Dies While Monaka-X Eyes 2029 Release on 1.4nm & NVLink Fusion

26 August 2026 at 16:20

A split image showcases Fujitsu Fugaku supercomputers with the text 'Technology Cultivated Through the Development of World-Class Supercomputers' and a Fujitsu-Monaka series next-generation arm v9-base CPU chip with a visual representation of circuitry.

Fujitsu's Monaka CPU launches in 2027 with 144 cores, 2.9 GHz, 500W TDP, & 2x AI performance using Arm v9.3-A architecture and 3D chiplets. Fujitsu's Monaka Stacks a 2nm 144-Core CPU Atop 5nm SRAM Dies, Cutting Silicon Area 30% for 2027 Launch Fujitsu is preparing the upcoming Monaka CPU, which will succeed its A64FX chip, first featured on the Japanese Fugaku supercomputer. The predecessor was the first chip to implement Arm SVE & offers low-voltage operation on a 7nm node while aiming HPC and AI segments. The successor is being designed for a 2027 launch and will feature many upgrades […]

Read full article at https://wccftech.com/fujitsus-monaka-chip-3d-stacks-2nm-cpu-5nm-sram-dies-monaka-x-eyes-2029-1-4nm-nvlink-fusion/

Intel 18A-P Hits 30% Frequency Gain at 0.5V on Production Silicon, Powering Diamond Rapids and Nova Lake CPUs

26 August 2026 at 13:25

Intel's 18A-P is coming to Diamond Rapids & Nova Lake CPUs, delivering backside power delivery and power boost using GAA transistors for boosted frequencies. Intel Diamond Rapids & Nova Lake CPUs Are On-Track To Deliver The Earliest of 18A-P Gains, Offering Double-Digit Frequency Gains At Low/High Voltages At Hot Chips, Intel is giving us more details on its 18A-P process technology, which brings GAA (Gate-All-Around) transistors with backside power delivery (GAA-BSPD), Power Boost, and an increased metal layer count to deliver 30% higher operating frequency at low voltages on x86 "in-production" silicon. The Futurum Research Group partnered with Intel to […]

Read full article at https://wccftech.com/intel-18a-p-30-percent-frequency-gain-on-production-silicon-diamond-rapids-nova-lake/

Xiaomi’s XRING 03 Goes Official On TSMC’s 3nm N3P Process, Sports 24 Billion Transistors, First Smartphone SoC To Support LPDDR6 RAM, All-Big-Core CPU Design & More

24 August 2026 at 10:58

Xiaomi XRING 03 goes official

The XRING 03 might not leverage TSMC’s latest and greatest 2nm lithography, but Xiaomi has successfully managed to bring a host of improvements while sticking with the 3nm N3P node, just a small step-up compared to the XRING 01. With 24 billion transistors, an All-Big-Core CPU design, upgraded GPU, and LPDDR6 RAM support, there’s so much to discuss about the latest release, so let us get started. New CPU cluster brings 6 “Ultra” cores to the XRING 03 at varying clock speeds, with a 16-core G2-Ultra NX GPU providing a massive performance boost Xiaomi has made the XRING 03 boast […]

Read full article at https://wccftech.com/xiaomi-xring-03-official-tsmc-3nm-n3p-lpddr6-ram/

Laptop RTX 5090 Runs Circles Around M5 Max In Prompt Processing & Token Generation With Up To 133% Faster Performance, Until Bigger LLMs Or Context Length Come Into Play

20 August 2026 at 21:30

Laptop RTX 5090 hammers the M5 Max in prompt processing and token generation

NVIDIA’s laptop RTX 5090 boasts sufficient VRAM to be able to crank every visual setting in the most demanding AAA titles, but when running AI workloads, it’s a whole new ballgame for the GPU’s 24GB framebuffer. Still, a series of tests shows that it’s able to hold its own against Apple’s M5 Max by comprehensively beating it in a series of LLM workloads, that is, until the benchmarks fire up a heavier AI model coupled with increased Context Length. The unified memory architecture of M5 Max comes to the rescue, significantly beating the RTX 5090 in token generation once the Context Length […]

Read full article at https://wccftech.com/rtx-5090-laptop-vs-m5-max-llm-benchmarks/

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