Korean chip manufacturer SK hynix had been planning to double its memory production capacity by 2030 and 2031 from current levels, even before a request from NVIDIA CEO Jensen Huang, suggests a report from the Korean media. The NVIDIA CEO wrote "please make more" on a hynix wafer at the Computex conference in Taiwan, and supply chain sources suggest that the memory manufacturer plans to expand its DRAM wafer input capacity to one million per month by 2030. SK hynix's Chinese Production Facilities To Play Key Role In Memory Production Capacity Expansion, Says Report With the passage of time, as […]

Read full article at https://wccftech.com/sk-hynix-was-already-planning-to-double-memory-capacity-before-jensen-huang-scribbled-please-make-more-on-a-wafer/

G.Skill has announced its new Trident Z5 NeoX RGB DDR5 memory series at Computex 2026, introducing support for AMD's newly released Ultra Low Latency EXPO profiles. The new kits feature specifications ranging from DDR5-6000 CL36 down to DDR5-6000 CL26.

The memory kits leverage the newly updated AMD EXPO ULL technology. According to G.Skill, this technology includes several new memory sub-timing settings designed to deliver better latency performance at identical memory speeds. These enhancements particularly benefit non-X3D AMD desktop processors, and users can enable the performance boost by activating the profile through a compatible BIOS.

This new lineup is an upgrade to the existing Trident Z5 Neo RGB series, and both product families will continue to coexist. G.Skill is offering the memory modules in three colour finishes: mirrored black, matte black, and matte white.

At Computex 2026, the company showcased four distinct specifications in 32GB (2x 16GB) dual-channel kit capacities. These include DDR5-6000 CL36, DDR5-6000 CL30, DDR5-6000 CL28, and DDR5-6000 CL26 configurations. G.Skill states that all kits have been validated through internal stress tests across various motherboards to ensure platform compatibility.

KitGuru says: Getting DDR5-6000 down to CL26 with AMD's new ultra-low-latency profiles should deliver a nice performance bump.

DDR4 isn't going anywhere despite witnessing some temporary decline in popularity in some regions as we reported recently. DDR4 Memory and Motherboards Witness Significant Demand As DDR5 Memory Continues to Sell for 4-5 Times Higher In some regions, we see DDR4 platforms recording a decline in popularity, while most regions witness huge demand for DDR4 platforms. Soaring DDR5 and SSD prices have made it extremely difficult to build even an entry-level system for under $1000, and the rise in prices continues as we enter the second half of 2026. DDR4 memory is also quite expensive, but nothing compared to similar-capacity […]

Read full article at https://wccftech.com/several-vendors-are-reportedly-increasing-production-of-ddr4-platforms/

DDR4 platforms are weakening in popularity in Germany, while DDR5 platforms are getting more popular than ever. AM4 Loses to LGA 1851 Platform at Popular German Retailer With Now Just 6.2% of Total Share, While AM5 Shows is Dominance With Over 80% Share It appears that AM4 couldn't maintain its dominance for long after seeing the RAMpocalypse era. The platform is gradually dying as AM5 takes over the hardware market. While the latest data doesn't represent a true representation of the platform's popularity, in Germany things are going in a completely different direction after witnessing the dominance of AM4 for […]

Read full article at https://wccftech.com/ddr4-platforms-take-a-deep-dive-in-popularity-in-germany-as-am4-dips-below-10-share-for-the-first-time/

AMD EXPO ULL (Ultra Low Latency) memory brings faster gaming performance & auto memory overclock to DDR5 modules. AMD Guns For Lower-Latency Driven Gaming Performance Boosts With EXPO Ultra Low Latency DDR5 Memory Today at Computex, AMD is teasing a brand new technology for its EXPO memory standard called EXPO Ultra Low Latency. With EXPO ULL, AMD is adding a new performance boost for its Ryzen platforms with tightly tuned DDR5 DIMMs that enable more FPS in games. So what is ULL? It's another set of features being added to modernize and enhance the existing EXPO Memory technology. We know […]

Read full article at https://wccftech.com/amd-expo-ultra-low-latency-memory-brings-better-gaming-performance/

TeamGroup is preparing a wide range of new memory, storage and cooling products for Computex 2026, covering its T‑Force gaming line, T‑Create creator hardware and industrial‑grade solutions. The company’s showcase spans DDR5 modules, PCIe SSDs, external drives and new accessories.

T‑Force is marking its 10th anniversary with the Carbon Style series, introducing a new black finish across DDR5 memory and storage. The Delta RGB DDR5 Carbon Style kits offer a fresh aesthetic, alongside support for high capacities. The Xtreem DDR5 Carbon Style kits go a step further, offering capacities up to 128GB. On the storage side, the Z54E Carbon Style PCIe 5.0 SSD uses Phison’s E37T controller and reaches up to 14GB/s sequential read speeds.

For SSD cooling, TeamGroup has a new-generation Liquid II SSD cooler, which might be an upgrade to consider if you use a PCIe 5 drive regularly and want to maintain fast speeds for longer periods of time.

For creators, the T‑Create lineup includes the Expert AI LPCAMM2 module for workstation laptops, offering up to 64GB and speeds up to 8533MT/s. Desktop users get the Expert AI 4R CUDIMM, a 4‑rank module supporting up to 128GB per stick and 8000MT/s operation. There is also the ultra-fast Master AI I6E PCIe 6.0 SSD, which brings speeds up to 28GB/s. That last one doesn't mean much to consumers right now as PCIe 6 has yet to reach us.

For portable storage, TeamGroup is showcasing its Expert P33 external SSD with an integrated E‑Ink display. TeamGroup will also show ruggedised solutions including the ECC CU‑DIMM+ESD module with enhanced electrostatic protection, the U512T write‑protected USB drive with dual‑interface support, and the P250Q PCIe 4.0 SSD series with integrated hardware and software data‑erasure features.

KitGuru says: We'll be at Computex all week so stay tuned for our direct coverage. 

Ahead of Computex this week, we've seen numerous announcements from hardware companies across the industry. Cooler Master is adding itself to the list through a new collaboration with G.Skill to bring active cooling to DDR5 memory.

The new MasterDimm AC DDR5 memory will feature active cooling developed by Cooler Master. While most memory kits come with a passive heatsink for cooling, these units will have a slightly thicker heatsink, alongside a small blower-style fan to help keep temperatures down and maintain high-speeds.

The G.Skill x Cooler Master MasterDimm memory will ship with overclocking profiles for both AMD EXPO and Intem XMP, enabling up to DDR5-6000 CL26 on AMD systems and up to DDR5-8400 on Intel systems.

According to Cooler Master, the active cooler is capable of improving memory temperatures by up to 15°C.

KitGuru Says: We will be getting a closer look at this during Computex next week so stay tuned for our coverage.

G.Skill is one of the first names to come to mind when we think of extreme-speed memory. Ahead of Computex next week, G.Skill just announced one of its highest-speed DDR5 kits yet, operating at an impressive 9200MHz.

The new G.Skill DDR5-9200 CL74 memory kit is being announced this week, with the company set to demo the memory at Computex next week. This ultra high-speed DDR5 CU-DIMM memory comes in a 32GB kit (16GB x2), operating at 9200MHz with CL74-74-74-148 timings, while keeping the DRAM voltage down to 1.1V.

The memory has been tested and validated running on an MSI MEG Z890 Godlike motherboard, paired with an Intel Core Ultra 7 270K processor.

We are expecting more news out of G.Skill over the course of Computex, as the Overclocking World Cup gets underway. G.Skill also has a new partnership in place with Cooler Master for actively-cooled memory kits.

KitGuru Says: We will be at Computex next week so stay tuned for more in-depth coverage direct from the event.

Silicon Power has announced the launch of the XPower Cyclone R DDR5 memory module, a new addition to its performance-focused gaming lineup. As this memory is developed in collaboration with Asus as part of the brand's 20th-anniversary, the module has official ROG-certified status.

The memory module is built on the standard DDR5 architecture, delivering operating speeds of up to 6000MT/s. To maintain reliability under heavy processing loads, the hardware incorporates onboard power management integrated circuits (PMICs) and native on-die Error Correction Code (ECC) technology. The modules also include built-in profiles for AMD EXPO, providing automated overclocking configurations for AMD Ryzen-based PCs.

The design utilises a phantom-black aluminium heat spreader with reverse-slanted gradient lines. There is also an ARGB light bar on the top, which as you would expect, supports Asus Aura Sync. Silicon Power will display the XPower Cyclone R DDR5 memory kits at Computex 2026, which starts next week.

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KitGuru says: We'll be at Computex, so we may get a closer look at these ourselves soon. 

Corsair has announced Shugo DDR5, a limited‑edition memory line that pairs high‑end DDR5 performance with Japanese‑inspired art designs created in collaboration with community artists. The series launches with two themes, Onyx Blade and Sakura Noa, each produced in limited quantities for collectors and showcase‑PC builders.

Shugo DDR5 uses premium aluminium heat spreaders with layered UV and pad printing to turn each module into a visual centrepiece. Corsair’s new light‑emitting micro‑drilling technology allows RGB lighting to shine through patterns cut directly into the artwork, creating effects that blend into the design rather than sitting on top of it. The modules include individually addressable RGB LEDs and full support for Corsair iCUE.

As you may expect from an enthusiast product, these DDR5 modules use binned ICs and a custom PCB, improving signal integrity and overclocking headroom. The kits are compatible with both Intel and AMD systems, and for those who want to fill up all of their RAM slots without breaking the bank, you can also get matching Light Enhancement Kits, which use the same designs as the proper memory DIMMs, but don't actually contain any memory. This allows system builders to populate all of the RAM slots on their motherboard without going overboard on capacity and by extension, price.

Corsair Shugo DDR5 will debut in 32GB (2x 16GB) kits rated up to 6000MT/s CL28 at 1.4V. A set-up with two DDR5 memory modules and two Light Enhancement modules costs €662.99.

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KitGuru Says: These kits look nice, but they are also very pricey.

It's no fun talking about memory at the moment, as DDR5 prices are horrifically inflated.  The 32GB Kingston Fury Renegade DDR5-7600 used in The FPS Review's look at the Core Ultra 7…

Hardware enthusiast wxnod identified a Corsair Vengeance DDR5 module using CXMT-sourced DRAM silicon, a notable departure for Corsair, which has traditionally sourced its memory chips from other manufacturers.

wxnod (via Wccftech) shared CPU-Z screenshots detailing the specific hardware of these kits, identified as the “CMK5X16G3E60C36A2”, a 16GB Vengeance DDR5-6000 module distributed as part of 32GB dual-channel kits. According to the technical readings, the module runs at DDR5-6000 frequencies with latencies configured at 36-44-44-96 under a 1.35V operating voltage. The memory includes programmed profiles to support both AMD EXPO and Intel XMP overclocking standards.

Image credit: wxnod

At the moment, much of the global DRAM market is controlled by Samsung, SK Hynix and Micron, all of which have raised prices amid a surge of demand from AI datacentres. If China's memory chips become more globally available, it could help alleviate the pressure currently on the consumer market and bring some stability back.

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KitGuru says: Now that Corsair (and hopefully other memory module vendors) are gaining access to CXMT memory, do you think pricing will improve?

NVIDIA CFO Collette Kress blames other firms for suffering in the ongoing memory shortage. In an interview with Tae Kim, Kress shared how her firm had ordered memory in advance as it understood that a price surge was imminent. The surge in memory prices due to high demand from AI chip companies has transformed the industry, with workers at companies such as SK hynix receiving hefty bonuses and those at Samsung protesting. Others Should Have Ordered Memory A Long Time Ago, Says NVIDIA CFO The high-performance requirements of AI GPUs have led to significant turmoil in both the high bandwidth […]

Read full article at https://wccftech.com/nvidia-cfo-teases-rivals-caught-off-guard-by-memory-shortage-says-her-firm-knew-prices-would-soar/

With the memory chip market being significantly disrupted due to high demand from the artificial intelligence market, advisor to Samsung Electronics, Kye-hyun Kyung, believes that prices will come down in the second half of next year. Kyung previously served as the head of Samsung's Device Solutions (DS) group, which is the firm's chip and display manufacturing business division. The former executive believes that high investment by China in the memory market will be responsible for the lower prices and adds that Korea needs to expand its presence in the global fabless chip fabrication market in order to remain competitive with […]

Read full article at https://wccftech.com/ex-samsung-chip-boss-says-chinas-dram-blitz-could-crush-the-414-ddr5-price-spike-within-a-year/

Asus has entered the enthusiast computer memory market with the launch of its first ROG-branded RAM modules, the ROG DDR5 RGB Edition 20. Developed in partnership with Biwin, the special-edition memory kits feature a black-and-red aesthetic with gold accents to mark the 20th anniversary of the ROG brand.

According to VideoCardz, the kit is sold in a 48GB configuration, consisting of two 24GB DIMMs, each using SK Hynix M-Die integrated circuits. Out of the box, the memory operates at a base speed of DDR5-6000 with tight primary timings of CL26-36-36-76 at 1.45V. For universal hardware compatibility across current AMD Ryzen and Intel Core desktop platforms, the modules support both AMD EXPO and Intel XMP memory profiles.

A defining feature of this kit is the “ROG Mode” dual-profile configuration extension that unlocks advanced performance metrics when paired with Asus ROG Crosshair, ROG Maximus, or ROG Strix motherboards. Through this BIOS-level implementation, users can alternate between the low-latency 6000 MT/s gaming configuration and a high-bandwidth 8000 MT/s profile running at CL36-48-48-110 at 1.40V. Also, the modules have a top-edge addressable RGB light bar that can be integrated with Asus Aura Sync profiles.

Alongside the launch, the company formalised the “ROG Certified Memory Program”. Under this initiative, 14 major third-party memory vendors, including Corsair, G.Skill, Kingston, and TeamGroup, can manufacture and badge their own consumer kits with official ROG certification. These approved modules will natively support Aura Sync RGB lighting and gain access to custom ROG Mode sub-timing profiles.

The ROG DDR5 RGB Edition 20 is launching first in China, priced at 5,999 yuan, which converts to roughly £661, and carries a lifetime product warranty.

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KitGuru says: As expected in the current memory market, this memory kit isn't cheap, especially given its special edition status.

Chinese DRAM and memory makers are accelerating their DDR5 development to tackle the growing needs of AI, Enterprise, and Consumer segments. China's CXMT Is Leading The Charge In Accelerating DDR5 Memory Development With Faster DRAM Modules That Match Its Main Rivals As the memory crisis rages on, Chinese manufacturers are speeding up their DRAM and module development plans, quickly catching up with the big three: Samsung, SK Hynix, and Micron. This acceleration was prompted by the big three, who have so far failed to address supply constraints & regardless of how much investment they are pouring in towards the construction […]

Read full article at https://wccftech.com/chinese-memory-makers-accelerate-ddr5-development-8000-mtps-dram-speeds/

At a time when Samsung employees are on the verge of initiating a debilitating union-authorized strike to secure fair compensation, SK hynix employees are apparently living the high life, so much so that they are now attracting laser-focused attention from within South Korea's very competitive marriage mart, all thanks to SK hynix's generous, operating profit-based bonuses. SK hynix's generous bonuses have made its employees a veritable catch in South Korea's marriage mart For the benefit of those who might not be aware, SK hynix recently reported 52.6 trillion won ($35.6 billion) in revenue for the first quarter of 2026, beating […]

Read full article at https://wccftech.com/sk-hynix-workers-become-the-hottest-commodity-in-south-koreas-marriage-mart-after-a-2-5-billion-bonus-pool-hits-their-bank-accounts/

New rumors suggest that Intel's upcoming “Razor Lake-AX” processors will utilise on-package memory and high-core-count integrated graphics. If confirmed, this would mark a strategic shift for Intel, which previously stated that the on-package memory design seen in Lunar Lake (Core Ultra 200V) was a “one-off” due to cost and margin complexities.

According to Jaykihn (via VideoCardz), Razor Lake-AX is being designed as a high-performance APU featuring two primary GPU configurations: 16 or 32 Xe3 cores. While these core counts are substantial, they fall short of the 48-core Xe setup previously rumoured for the now-uncertain Nova Lake-AX project.

As for the on-package memory design, the report is from Haze (via VideoCardz). The decision to return to on-package memory could be due to the bandwidth requirements of a 32-core iGPU. Integrating LPDDR5X or a similar high-speed memory directly onto the package would help minimise latency and maximise throughput, thereby improving overall performance.

Razor Lake-AX is expected to use the BGA4326 socket, indicating it is not a standard desktop product but rather a specialised solution (e.g., high-end laptops, small-form-factor workstations, or handhelds).

As it stands, Intel's Razor Lake-AX is positioned as Intel's response to “Halo-class” products, such as AMD's Strix/Medusa Halo APUs and Apple's M-Series Pro/Max silicon. A release is not expected until late 2027 at the earliest, placing it in direct competition with AMD's next-generation architectures and Apple's future M-series iterations.

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KitGuru says: Do you think Intel Razor Lake can stand toe-to-toe with what AMD and Apple are preparing as their next-generation Halo and M-series Pro silicon?

The new server memory can achieve a staggering 9600 MT/s on Intel W890 and can operate at just 1.1V while running at 8000 MT/s. V-Color Unveils World's First RDIMM Memory to Hit 9600 MT/s on ASUS PRO WS W890E; Available in Up To 256 GB Capacity Per Module Popular memory maker, V-Color, has expanded its memory catalog by introducing OC RDIMM for the workstation segment, featuring high-speed operation at a low voltage. The OC RDIMM is aimed at the Intel W890 platform (Intel Xeon 6) and can reach a staggering 9600 MT/s on the ASUS PRO WS W890E-SAGE SE. The […]

Read full article at https://wccftech.com/v-colors-new-oc-rdimm-smashes-the-9600-mt-s-barrier-on-intels-w890-platform-while-sipping-just-1-1v-at-8000-mt-s/