Normal view

There are new articles available, click to refresh the page.
Before yesterdayMain stream

China’s CXMT Is Getting Ready To Make History As LPDDR6 RAM Mass Production Scheduled To Happen In September; One Hint Reveals Limitations In Total Output

30 August 2026 at 15:41

CXMT to begin LPDDR6 RAM mass production in September

Xiaomi’s XRING 03 was previously reported to be the first smartphone chipset to have support for LPDDR6 RAM thanks to the Chinese firm’s partnership with CXMT. Now, it appears that there’s no stopping the momentum of the memory maker because mass production of the next-generation DRAM is expected to start next month. However, while CXMT has the upper hand over Samsung, SK hynix, and Micron, volume production isn’t going to be its strong suit. Based on CXMT’s teaser, LPDDR6 RAM will be reserved for Xiaomi 18 Fold, which isn’t expected to ship even 500,000 units, hinting at a low-volume partnership between […]

Read full article at https://wccftech.com/chinas-cxmt-lpddr6-ram-mass-production-september-output-limit-hint/

Intel’s Razor Lake-AX Surfaces In HWiNFO Support, Confirming Halo-Class SoC To Challenge AMD’s Halo Around 2028

12 August 2026 at 07:35

Intel Resurrects On-Package Memory With Razor Lake-AX, Loading Up LPDDR6 to Hunt Down AMD's Medusa Halo by 2028

Intel's very own "Halo" SoCs are being prepped as next-generation Razor Lake-AX chips have received first support on HWiNFO. HWiNFO Silently Adding Support For Razor Lake-AX SoCs, Confirming That Intel's Halo Competitor Is on its Way The Intel Razor Lake-AX chips will be part of the Razor Lake lineup, which will feature next-gen CPU, GPU, and NPU architectures. The AX lineup is different from the standard S and H SKUs, as the family is designed to be bigger and better. There has so far been no "AX" chip on the market; the first was going to be Nova Lake-AX, but […]

Read full article at https://wccftech.com/intel-razor-lake-ax-socs-surfaces-in-hwinfo-support/

CXMT’s LPDDR6 Clears R&D Verification at 12.8 Gbps, Inching Closer to a Full Mass-Production Push – Report

1 August 2026 at 08:08

Chinese memory chip manufacturer ChangXin Memory Technologies, or CXMT, is reportedly closing in on mass-producing LPDDR6 memory chips. CXMT is a frequent feature of media coverage due to the ongoing shortage in the memory market, which, despite its limited global presence, has been speculated to disrupt the role of Samsung and SK hynix in the industry. The firm's IPO created fireworks as it became the latest in Asia and saw the shares surge by a whopping 466% to close at CNY49 after opening at CNY8.66 per share. CXMT's LPDDR6 Memory Chips About To Complete R&D Verification, Says Report Today's report […]

Read full article at https://wccftech.com/cxmts-lpddr6-clears-rd-verification-at-12-8-gbps-inching-closer-to-a-full-mass-production-push-report/

Innosilicon’s LPDDR6 Memory IP Lands at Major Korean DRAM Maker, as It Unveils GDDR7, HBM4, & PCIe 6.0 Technologies Spanning 28nm to 3nm

28 July 2026 at 13:05

A computer chip labeled 'LPDDR6' is positioned above a circuit board, illuminated with a blue glow.

Innosilicon has confirmed that a major Korean DRAM maker will be utilizing its LPDDR6 memory IP as it showcases the full range of memory & storage solutions. Innosilicon Aims To Break The Memory Wall With a Fully-Domestic Produced DRAM/Storage IP, With Its LPDDR6 IP Landing In Korea Earlier this year, Innosilicon announced that its LPDDR6/5X memory controller IP was delivered to the first customers. Today, at a conference in Shanghai, China, the company announced that one of the customers is a major DRAM manufacturer based in Korea. During the event, Innosilicon unveiled its broad range of memory and storage controller […]

Read full article at https://wccftech.com/innosilicon-lpddr6-memory-ip-lands-at-major-korean-dram-maker/

Tensor G7 Could Arrive With A Key Upgrade That’ll Make Nearly Everything Better About The Pixel 12, Assuming You’re Incredibly Patient

9 July 2026 at 10:03

Tensor G7 is being tested with LPDDR5X and LPDDR6 memory packaging

The Tensor G6 won’t be a remarkable upgrade over the Tensor G5, but we’ve pretty much grown accustomed to Google’s practices for the past few generations. Fortunately, the Tensor G7 is where this streak may be broken because a rumor claims that it’s being tested with an upgrade that could boost the Pixel 12’s overall capabilities. Here are more details for you. Both LPDDR5X and LPDDR6 RAM packaging are being tested with the Tensor G7, with Google likely to use the faster memory with the ‘Pro’ models Aside from mentioning that Samsung is preparing three generations of Exynos chipsets, Reptalica also […]

Read full article at https://wccftech.com/tensor-g7-key-upgrade-that-will-considerably-improved-pixel-12/

Apple’s A20 Pro To Break A 13-Year Convention With The 96-Bit LPDDR6, But Pinches Pennies On The iPhone 18 Pro Duo’s NAND As A Counter

4 July 2026 at 19:14

A close-up of a chip labeled 'LPDDR6' with intricate circuitry details in a dark, purple-themed setting.

In what might come as a surprise, especially given Apple's ballooning memory-related costs, the A20 Pro chip that is slated to power the upcoming iPhone 18 Pro and Pro Max will likely use the cutting-edge 96-bit LPDDR6, departing from the 64-bit bandwidth that Apple has used for around 13 years now. Apple's A20 Pro chip that powers the iPhone 18 Pro and Pro Max is apparently eschewing a 64-bit LPDDR5X for a 96-bit LPDDR6 While leveraging the scoop provided by Reptalica, the tipster INIYSA noted recently that the A20 Pro chip appeared to be moving away from the 64-bit memory […]

Read full article at https://wccftech.com/apples-a20-pro-to-break-a-13-year-convention-with-the-96-bit-lpddr6-but-pinches-pennies-on-the-iphone-18-pro-duos-nand-as-a-counter/

DDR6 Memory Development Kicks off As Samsung, SK Hynix & Micron Race Towards Commercialization By 2028-2029

4 May 2026 at 13:00

JEDEC Confirms CAMM2 Memory For Desktop PCs: DDR6 Up To 17.6 Gbps & LPDDR6 Up To 14.4 Gbps 1

DDR6 memory development is in full swing with major DRAM makers including Samsung, SK Hynix & Micron all racing towards completion to meet growing AI demands. The Next Chapter of DRAM Just Kicked off With Samsung, SK Hynix & Micron All In The Race To Complete DDR6 Development & Deployment By 2028-2029 As AI continues to demand speedier and higher-capacity memory, DRAM makers are now initiating the development plan for next-gen standards. Last year, JEDEC announced the LPDDR6 standard, bringing improved performance and efficiency versus LPDDR5. LPDDR memory has already become the favorite of the AI industry, offering faster speeds, […]

Read full article at https://wccftech.com/ddr6-memory-development-kicks-off-samsung-sk-hynix-micron-race-to-commercialization-by-2028-2029/

Tesla Pulls 2nm AI Chip Production Onto US Soil, Splitting AI6 and AI6.5 Between Samsung Texas and TSMC Arizona

19 April 2026 at 11:05

Tesla Pulls 2nm AI Chip Production Onto US Soil, Splitting AI6 and AI6.5 Between Samsung Texas and TSMC Arizona 1

Elon Musk lays out the plans for Tesla's future AI ecosystem, utilizing both Samsung & TSMC 2nm tech for AI6 & AI6.5 chips. Tesla's 2nm Duo Confirmed: AI6 Goes Samsung With LPDDR6 & AI6.5 Goes TSMC With Improved Performance A few days ago, Tesla announced the successful tape out of its AI5 chip, made at Samsung. The chip is just one of the many custom silicon designs that Elon Musk and his enterprises are making to fulfill their in-house AI demand. Musk also talked about the next-generation chips, such as AI6 and the Dojo3 supercomputer project. The company is aiming […]

Read full article at https://wccftech.com/tesla-pulls-2nm-ai-chip-production-onto-us-soil-splits-ai6-ai6-5-between-samsung-tsmc/

AMD Adds RDNA 4m GPU Targets “GFX1171” And “GFX1172”, Hinting At Next-Gen Zen 6 APU Graphics

24 March 2026 at 17:36

A close-up of an AMD processor labeled 'Zen 6' with the text 'Medusa Point' in the background.

New LLVM patches confirm additional RDNA 4m variants alongside GFX1170 with similar instruction capabilities. AMD Quietly Expands Next-Gen iGPU Roadmap by Adding New RDNA 4m Graphics Targets, GFX1171 and GFX1172 Earlier compiler patches showed that RDNA 4m incorporates several RDNA 4-style instruction-set upgrades, such as support for FP8 and BF8 data formats, along with WMMA matrix instructions used in AI workloads. Now, AMD is further expanding its next-gen integrated GPU roadmap, as new Linux compiler patches unveil two additional RDNA 4m graphics targets. These are the GFX1171 and GFX1172. These targets are now joining the recently discovered GFX1170, confirming that […]

Read full article at https://wccftech.com/amd-adds-rdna-4m-gpu-targets-gfx1171-and-gfx1172-hinting-at-next-gen-zen-6-apu-graphics/

❌
❌