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China’s CXMT Now Charges More Than Samsung For DRAM As Memory Demand Skyrockets, Even Denying Relief To Huawei

24 July 2026 at 11:45

A CXMT DDR5 memory module is displayed against a blurred background.

CXMT is now charging more for memory than the big three DRAM makers as demand swells in China's domestic AI markets. CXMT Benefits Big Time From DRAM Crisis By Charging Hefty Premium For Its Memory Products Most global media outlets were under the impression that CXMT was going to be the "Cheaper Alternative" to Samsung, SK Hynix, and Micron, who are asking big sums of cash for their DRAM products, but that wasn't the case. In our exclusive, we reported that CXMT's advantage was not in its price, but in its supply, and that remained true; demand skyrocketed 10-fold, and […]

Read full article at https://wccftech.com/china-cxmt-charges-more-than-samsung-for-dram-as-memory-demand-skyrockets/

CXMT Evicted Huawei-Linked Engineers From Its R&D Facility, As The Once-Humble Memory Maker Has Acquired A Taste Of Newfound Power Amid The AI Boom

24 July 2026 at 10:45

CXMT and Huawei engaged in a power struggle as memory maker keeps introducing price hikes to cement its power

Memory chips were previously a low-margin business, with customers like Apple and other companies dictating prices that often allowed them to acquire shipments at pennies on the dollar. However, times have changed since late 2025, as AI datacenters have gobbled up the majority of the DRAM supply, leaving manufacturers like CXMT and YTMC to flex some might of their own, introducing hikes on the likes of Huawei of all companies. Apparently, a situation materialized between CXMT and Huawei where engineers linked to the former Chinese giant were forced to pack up their tools and exit the premises of the memory […]

Read full article at https://wccftech.com/cxmt-removed-huawei-linked-engineers-from-its-facility-as-it-begins-flexing-its-power/

Kirin 9030 In-Depth Analysis Proves SMIC Can Create Denser SoCs Than Intel Has With Its 18A Node, But The Attributes That Require Improvements Are Left Out

20 July 2026 at 21:09

SMIC proves it can make denser SoCs with the Kirin 9030, but there's more to a chipset than density

The lack of access to EUV paraphernalia in any way, shape, or form has forced China’s SMIC to come up with ingenious ways to leverage its existing DUV equipment to gradually improve its 7nm manufacturing process, and with Huawei’s Kirin 9030, the semiconductor manufacturer has proven that it can stand ‘toe to toe’ with TSMC, or can it? An in-depth look at the chipset powering the Mate 80 flagship series shows some impressive feats, such as achieving higher density than Intel’s 18A node through a smaller metal pitch, but that’s not the only metric worth comparing. In fact, SMIC and […]

Read full article at https://wccftech.com/kirin-9030-is-proof-that-smic-can-make-denser-socs-without-euv/

CXMT Debuts With $8.6 Billion IPO As Its DRAM Surge Chips Away At Samsung’s Market Dominance By 2028

17 July 2026 at 10:35

A large, modern building with reflective glass and the 'GSMT' logo on the upper left corner.

CXMT is all set to tackle the "Big Three" in a significant way in the DRAM segment as it accelerates its memory product roadmap. DRAM Demand Turns CXMT Into A Major Memory Player, Gunning The Big Three With An Accelerated Roadmap Yesterday, CXMT made its stock market debut on the Shanghai STAR Board with an $8.6 billion IPO. While the company is valued at around $80-$85 billion, which puts it far below the $1.0 trillion that its competitors are valued at, the company is all set to tackle the "Big Three" big time with a roadmap that includes various products […]

Read full article at https://wccftech.com/cxmt-debuts-8-6-billion-ipo-as-dram-surge-chips-away-at-samsungs-dominance-by-2028/

Huawei Aims To Reduce The DRAM Supply Shortage With An Approach Only The Brave And The Bold Can Execute; Building Its Own Fabrication Plant

11 July 2026 at 21:21

Huawei is building its own DRAM manufacturing plant

A smart tactic currently employed by companies to minimize the DRAM shortage risk is bringing in as many suppliers as possible, just like how Apple is doing by testing CXMT’s memory chips. However, Huawei has formed a different strategy, and with the help of various entities, the Chinese firm aims to circumvent the U.S. trade sanctions and the pitfalls of the AI boom by establishing its own memory manufacturing facility. With the help of the government and Swaysure, Huawei could introduce its own DRAM manufacturing plant with a capacity of 140,000 wafers per month Crucial details shared by @SemiconductorsX reveal that […]

Read full article at https://wccftech.com/huawei-building-its-own-dram-fabrication-plant-to-curb-shortages/

DeepSeek Looks To Sidestep Huawei As It Begins In-House AI Chip Journey While Dodging Development Complications, Trade Sanctions, Delays & More

7 July 2026 at 13:28

AI chips from Huawei and NVIDIA are currently being leveraged to train and run DeepSeek’s popular models, but the days of this arrangement could be numbered as the Chinese startup has plans in motion to launch its in-house inference silicon. According to people familiar with the firm’s plans, the chip won’t be utilized for training new models, but for generating responses for users on a pre-trained one. Of course, the journey will be arduous because not only does it take years to launch a viable solution, but DeepSeek also has to contend with being limited to existing chip manufacturing equipment […]

Read full article at https://wccftech.com/deepseek-developing-custom-ai-chip-to-reduce-dependency-on-huawei-and-nvidia/

Huawei Reveals Hybrid Bonding Process For The Kirin 2026’s 3D Stacking Design In New Paper To Intensify Competition; Perks Include Better Efficiency & Bandwidth

4 July 2026 at 14:40

Huawei's hybrid bonding technology showcased for the Kirin 2026

Being limited to older-generation DUV equipment hasn’t deterred Huawei’s efforts to develop and mass produce competitive chipsets, as the Kirin 2026 will be a prime example of the company’s next-generation packaging. Now, in the latest paper, the Chinese giant has detailed how a hybrid bonding process will allow for SoCs to flaunt a 3D stacking approach, which is the first step of removing one of the major obstacles of mobile silicon innovation; lack of access to advanced lithography. Despite having no access to advanced chipmaking equipment, Huawei’s mastery in smartphone chipset packaging for the Kirin 2026 looks promising During Huawei’s […]

Read full article at https://wccftech.com/huawei-kirin-2026-paper-shows-hybrid-bonding-for-3d-stacking-to-boost-competition/

The U.S. Trade Sanctions Are Harming Everyone Else Except Huawei, With A Foreign Company Slapped With A Multi-Million Dollar Fine Due To Supplying Parts

18 June 2026 at 15:26

Other companies are being harmed due to their business relationship with Huawei

Through one way or another, Huawei manages to source its goods from overseas manufacturers, despite the U.S. trade ban in place. Sadly, while the Chinese firm has successfully circumvented these sanctions, its other partners are suffering, with one of them agreeing to pay a $36 million fine due to its business alliance with the technology giant. German titan Bosch will pay $36 million to U.S. authorities because it was learned that Huawei purchased a truckload of smartphone parts It has been nearly seven years since Huawei was placed on the U.S. Export Control list, but efforts are still being made […]

Read full article at https://wccftech.com/us-trade-sanctions-are-having-everyone-else-except-huawei/

Huawei’s HarmonyOS Can Be Further Optimized To Run On 64KB RAM While Running On A Single Dry Cell Battery For A Year, Says Executive Director

12 June 2026 at 16:07

HarmonyOS can further be optimized to run on just 64KB of RAM

The U.S. ban hammer pushed Huawei into a corner, and with no way to run Android on its devices, the company that was once poised to become the largest smartphone manufacturer in the world was now limited to its home turf in China. Not wanting to accept its fate, Huawei introduced HarmonyOS, its microkernel-based platform capable of running on different classes of products, and during the company’s keynote, an executive mentioned that the operating system can be optimized to run on measly 64KB of RAM. That’s not even an entire megabyte. HarmonyOS can currently operate on just 128KB of memory, […]

Read full article at https://wccftech.com/huawei-executive-says-harmonyos-can-be-optimized-to-run-on-64kb-ram/

Cut Off From EUV By US Sanctions, Huawei Is Redefining Moore’s Law Itself — And A Top Chip Analyst Isn’t Buying It

27 May 2026 at 13:39

A close-up of a glowing semiconductor chip with intricate circuitry patterns suspended above a blue-lit circuit board.

After Huawei made a big announcement earlier this week about its Tau scaling technology, through which it aims to achieve a transistor density similar to the 14 Angstrom (14A) manufacturing process technologies from leading chip manufacturers such as TSMC and Intel, semiconductor analyst Dr. Ian Cutress believes that the announcement compares unrelated aspects of a chip's performance specifications. He discussed the announcement in detail in the TechTechPotato podcast and added that the firm's research paper outlining its Tau scaling technology appeared to be written with AI. Huawei's Tau Scaling Technology Has Been Researched For Decades, Says Chip Expert Cutress started […]

Read full article at https://wccftech.com/cut-off-from-euv-by-us-sanctions-huawei-is-redefining-moores-law-itself-and-a-top-chip-analyst-isnt-buying-it/

Huawei’s Kirin 9050 Is Rumored To Outperform Apple’s A18 Pro, Will Utilize A New “Stacking” Technology To Bypass Older Node Limitations

25 May 2026 at 16:35

Huawei is preparing the Kirin 9050 and it's reported to beat the A18 Pro

China’s largest semiconductor manufacturer, SMIC, is currently hindered by its failure to acquire advanced EUV machinery to mass produce wafers on the 5nm lithography or below. With no alternative to scale past this limitation, the need for innovation and creativity is absolutely vital, so a new 3D IC stacking solution is rumored to be incorporated on Huawei’s upcoming Kirin 9050 to improve performance. The one positive to take away from the latest rumor is that the SoC can beat Apple’s older A18 Pro. New packaging technology will enable the Kirin 9050 to stack components vertically to increase transistor density and […]

Read full article at https://wccftech.com/huawei-kirin-9050-breakthrough-3d-ic-design-beats-a18-pro/

NVIDIA’s CEO Jensen Huang Draws a Hard Line on China: No Blackwell, No Rubin, But US Firms Must Still Fight In Global Markets

5 May 2026 at 17:30

A person is holding NVIDIA server hardware at a presentation, showcasing multiple circuit boards with visible chipsets.

NVIDIA CEO has said that China should not have access to its most advanced AI chips, such as Blackwell or Rubin. Blackwell or Rubin AI Chips are a no-go for China, but NVIDIA's CEO Wants US Firms To Continue To Compete In Global Markets The US AI policy shift towards China has been ongoing since NVIDIA's Hopper generation of chips. Export controls restricted NVIDIA from selling its bleeding-edge chips to Chinese firms & this ban has extended into the Blackwell generation. Reaffirming the US-first policy, NVIDIA CEO Jensen Huang has stated that the company's most advanced AI chips, Blackwell and […]

Read full article at https://wccftech.com/nvidia-ceo-jensen-huang-draws-a-hard-line-on-china-no-blackwell-no-rubin/

Huawei Is The Biggest Winner In China’s AI Market After NVIDIA Pullout, AI Share To Reach 60% This Year

1 May 2026 at 12:40

A close-up of a chip with intricate circuitry and orange and gold components, positioned above a motherboard in a dark, futuristic environment.

NVIDIA pulling out from China's AI market has boosted the share of domestic firms, with Huawei winning the biggest chunk. Huawei's China Market Share in AI to Reach 60% as NVIDIA CEO Confirms Zero Chip Share in China After US Policy Shift The US Government has moved to ban all leading-edge AI chip sales in China. NVIDIA, being the biggest name in the AI industry, has seen its share drop to zero after the policy shift, prompting an increased reliance on domestically produced chips in China. Currently, the situation has prompted China's AI chipmakers to double down on production and […]

Read full article at https://wccftech.com/huawei-biggest-winner-in-china-ai-market-after-nvidia-pullout-60-percent-ai-share-2026/

TSMC Has Enabled Smartphone SoCs To Approach 5GHz Frequencies Thanks To Advanced Lithography; Huawei The Biggest Loser In All Of This

9 April 2026 at 23:40

TSMC has allowed smartphone chipset manufacturers to nearly touch the 5.00GHz barrier

Companies like Apple, Qualcomm, and MediaTek have benefited greatly from extending their partnership with TSMC, as not only have they developed the most cutting-edge smartphone chipset technology, but the level of performance is uncanny and would likely not be possible without the Taiwanese semiconductor behemoth providing its advanced nodes. Later this year, we shall bear witness to SoCs reaching clock speeds of 5.00GHz, making it the first time in history, with Huawei sadly unable to keep up with its rivals as it doesn’t have access to the foundry giant’s technology. Huawei didn’t jump into EUV lithography fast enough, as its […]

Read full article at https://wccftech.com/tsmc-advanced-lithography-allows-smartphone-socs-to-reach-5ghz-huawei-missing-out/

TSMC & Huawei Are Far From Exploring 3D Packaging For Smartphone SoCs, Instead Focusing On Improving Manufacturing Processes Due To Thermal Constraints

23 February 2026 at 20:04

TSMC and Huawei aren't focused on moving on 3D packaging technology anytime

The biggest hindrance to smartphone chipsets unlocking their potential is heat dissipation, and while TSMC’s 2nm process is expected to introduce some efficiency improvements, the ever-growing complexity and size of these SoCs mean that newer packaging needs to be adopted to break through the performance ceiling. One tipster notes that the industry has been discussing companies like TSMC and Huawei exploring 3D packaging for the smartphone category, but the reality is that this technology offers far too many drawbacks for it to be adopted for this specific sector. Instead, these firms appear to focus solely on improving manufacturing processes. Apple […]

Read full article at https://wccftech.com/tsmc-and-huawei-focused-on-improving-node-than-3d-packaging-due-to-heat-generation/

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