Normal view

There are new articles available, click to refresh the page.
Before yesterdayMain stream

Cut Off From EUV By US Sanctions, Huawei Is Redefining Moore’s Law Itself — And A Top Chip Analyst Isn’t Buying It

27 May 2026 at 13:39

A close-up of a glowing semiconductor chip with intricate circuitry patterns suspended above a blue-lit circuit board.

After Huawei made a big announcement earlier this week about its Tau scaling technology, through which it aims to achieve a transistor density similar to the 14 Angstrom (14A) manufacturing process technologies from leading chip manufacturers such as TSMC and Intel, semiconductor analyst Dr. Ian Cutress believes that the announcement compares unrelated aspects of a chip's performance specifications. He discussed the announcement in detail in the TechTechPotato podcast and added that the firm's research paper outlining its Tau scaling technology appeared to be written with AI. Huawei's Tau Scaling Technology Has Been Researched For Decades, Says Chip Expert Cutress started […]

Read full article at https://wccftech.com/cut-off-from-euv-by-us-sanctions-huawei-is-redefining-moores-law-itself-and-a-top-chip-analyst-isnt-buying-it/

Huawei’s Kirin 9050 Is Rumored To Outperform Apple’s A18 Pro, Will Utilize A New “Stacking” Technology To Bypass Older Node Limitations

25 May 2026 at 16:35

Huawei is preparing the Kirin 9050 and it's reported to beat the A18 Pro

China’s largest semiconductor manufacturer, SMIC, is currently hindered by its failure to acquire advanced EUV machinery to mass produce wafers on the 5nm lithography or below. With no alternative to scale past this limitation, the need for innovation and creativity is absolutely vital, so a new 3D IC stacking solution is rumored to be incorporated on Huawei’s upcoming Kirin 9050 to improve performance. The one positive to take away from the latest rumor is that the SoC can beat Apple’s older A18 Pro. New packaging technology will enable the Kirin 9050 to stack components vertically to increase transistor density and […]

Read full article at https://wccftech.com/huawei-kirin-9050-breakthrough-3d-ic-design-beats-a18-pro/

NVIDIA’s CEO Jensen Huang Draws a Hard Line on China: No Blackwell, No Rubin, But US Firms Must Still Fight In Global Markets

5 May 2026 at 17:30

A person is holding NVIDIA server hardware at a presentation, showcasing multiple circuit boards with visible chipsets.

NVIDIA CEO has said that China should not have access to its most advanced AI chips, such as Blackwell or Rubin. Blackwell or Rubin AI Chips are a no-go for China, but NVIDIA's CEO Wants US Firms To Continue To Compete In Global Markets The US AI policy shift towards China has been ongoing since NVIDIA's Hopper generation of chips. Export controls restricted NVIDIA from selling its bleeding-edge chips to Chinese firms & this ban has extended into the Blackwell generation. Reaffirming the US-first policy, NVIDIA CEO Jensen Huang has stated that the company's most advanced AI chips, Blackwell and […]

Read full article at https://wccftech.com/nvidia-ceo-jensen-huang-draws-a-hard-line-on-china-no-blackwell-no-rubin/

Huawei Is The Biggest Winner In China’s AI Market After NVIDIA Pullout, AI Share To Reach 60% This Year

1 May 2026 at 12:40

A close-up of a chip with intricate circuitry and orange and gold components, positioned above a motherboard in a dark, futuristic environment.

NVIDIA pulling out from China's AI market has boosted the share of domestic firms, with Huawei winning the biggest chunk. Huawei's China Market Share in AI to Reach 60% as NVIDIA CEO Confirms Zero Chip Share in China After US Policy Shift The US Government has moved to ban all leading-edge AI chip sales in China. NVIDIA, being the biggest name in the AI industry, has seen its share drop to zero after the policy shift, prompting an increased reliance on domestically produced chips in China. Currently, the situation has prompted China's AI chipmakers to double down on production and […]

Read full article at https://wccftech.com/huawei-biggest-winner-in-china-ai-market-after-nvidia-pullout-60-percent-ai-share-2026/

TSMC Has Enabled Smartphone SoCs To Approach 5GHz Frequencies Thanks To Advanced Lithography; Huawei The Biggest Loser In All Of This

9 April 2026 at 23:40

TSMC has allowed smartphone chipset manufacturers to nearly touch the 5.00GHz barrier

Companies like Apple, Qualcomm, and MediaTek have benefited greatly from extending their partnership with TSMC, as not only have they developed the most cutting-edge smartphone chipset technology, but the level of performance is uncanny and would likely not be possible without the Taiwanese semiconductor behemoth providing its advanced nodes. Later this year, we shall bear witness to SoCs reaching clock speeds of 5.00GHz, making it the first time in history, with Huawei sadly unable to keep up with its rivals as it doesn’t have access to the foundry giant’s technology. Huawei didn’t jump into EUV lithography fast enough, as its […]

Read full article at https://wccftech.com/tsmc-advanced-lithography-allows-smartphone-socs-to-reach-5ghz-huawei-missing-out/

TSMC & Huawei Are Far From Exploring 3D Packaging For Smartphone SoCs, Instead Focusing On Improving Manufacturing Processes Due To Thermal Constraints

23 February 2026 at 20:04

TSMC and Huawei aren't focused on moving on 3D packaging technology anytime

The biggest hindrance to smartphone chipsets unlocking their potential is heat dissipation, and while TSMC’s 2nm process is expected to introduce some efficiency improvements, the ever-growing complexity and size of these SoCs mean that newer packaging needs to be adopted to break through the performance ceiling. One tipster notes that the industry has been discussing companies like TSMC and Huawei exploring 3D packaging for the smartphone category, but the reality is that this technology offers far too many drawbacks for it to be adopted for this specific sector. Instead, these firms appear to focus solely on improving manufacturing processes. Apple […]

Read full article at https://wccftech.com/tsmc-and-huawei-focused-on-improving-node-than-3d-packaging-due-to-heat-generation/

❌
❌