With TSMC's CoWoS advanced capacity egregiously constrained, and Intel's more nimble EMIB attracting a growing volume of orders, the Taiwan-based chipmaker has realized that it needs to change course to retain its competitive edge. And, it has chosen to do so by attempting to clone some elements of Intel's novel approach to advanced packaging, as per the reporting by The Information. Apparently, the new packaging project is referred to internally at TSMC as a "quasi-EMIB," borrowing heavily from Intel's novel approach For the benefit of those who might not be aware, TSMC's Chip-on-Wafer-on-Substrate (CoWoS-S) packaging solution uses large, expensive silicon […]

Read full article at https://wccftech.com/tsmc-concedes-intels-emib-packaging-is-a-potent-contender-starts-building-quasi-emib-as-cowos-remains-choked-through-2026/

Intel has completed its RAMP-C program, which now aims to enable customers to move from test chips to domestic high-volume manufacturing. Intel RAMP-C Leads To Successful Development of a Strong "Design Enablement Infrastructure" Which Enables Commercial & Defense Customers To Design & Fabricate Chips Within the US Press Release: Intel Foundry has completed the Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) program. Launched in September 2021, the program supported development of domestic, leading-edge CMOS technology and manufacturing in the United States, establishing a foundation for expanded trusted domestic semiconductor manufacturing. “The collaboration between the DoW and Intel on the Trusted […]

Read full article at https://wccftech.com/intel-emerges-as-americas-only-leading-edge-chipmaker-as-ramp-c-hands-domestic-18a-production/

Cadence has announced its new AuraStack AI Super Agent, which aims to solve PCB & advanced packaging bottlenecks by leveraging Agentic AI. Cadence's AuraStack AI Super Agent Brings The World's First Agentic AI Platform To PCB & Advanced Packaging Manufacturing, Solving One of The Biggest Bottlenecks That The Tech Industry Faces Right Now The Cadence AuraStack AI Super Agent runs on the company's Allegro AI Studio and is the first Agentic AI platform that is built for PCB and Advanced Packaging design. The stack allows PCB designers to take planned systems into a final product through a single AI-native environment. […]

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China's DFSX is working on fueling its domestic AI supply chain with next-gen 3.5D "Infinity Chiplet" architectures & 3D DRAM technologies. DFSX Is Working on China's First DF1000 AI Accelerator With 3D DRAM Technology, Also Unveils 3.5D+ Packaging DFSX recently hosted a presentation where they announced China's first 3D AI chip that is built entirely using China's domestic supply chain. There is a lot to unpack here, but the key product is the DF1000, which is a software-defined near-in-memory computing AI accelerator that will be used by domestic AI and tech firms. DF1000 - China's First 3D DRAM-Powered AI Accelerator […]

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Panel-Level Packaging (FOPLP) and Glass Substrates are going to drive the next chapter in advanced packaging, with the market exceeding $8 Billion by 2030. The AI & HPC Segments Want To Move Beyond Organic Substrates & Wafer Packages To Meet Their Growing Compute Needs, & That's Where Panel-level Packaging & Glass Substrates Come In TSMC & Intel are the two major semiconductor firms that are accelerating next-gen glass core substrates for panel-level packages. These two technologies go hand in hand in powering the next generation of semiconductors and come with major advantages over traditional organic substrates and wafer-level packages. The […]

Read full article at https://wccftech.com/tsmc-intel-race-to-replace-organic-substrates-with-glass-panel-level-packaging-8-billion-market-by-2030/

TSMC is aggressively working on CoPoS (Panel-Level) packaging to replace CoWoS for growing compute demand as Glass Core Substrates take center stage. Panel-Level Packaging Is The Next Logical Step for TSMC As It Eyes CoPoS "Glass Core Substrate" Technology Over CoWoS The ever-growing AI and compute demand requires next-generation packaging technologies. Intel and TSMC are aggressively working towards that goal, and glass core substrates are going to be a major part of their trajectories moving forward. In a recent report by Commercial Times Taiwan, it is reported that TSMC is now aggressively moving towards CoPoS (Chip-On-Panel-on-Substrate) as a replacement to […]

Read full article at https://wccftech.com/tsmc-accelerates-copos-packaging-replace-cowos-as-glass-core-substrates-cut-costs-boost-wafer-utilizatio/

Intel's Z-Angle Memory (ZAM) is approaching completion as it races towards taking a bite at the AI boom while challenging HBM as a viable alternative. Intel's ZAM Challenges HBM As A Big Memory Innovation In the High-Bandwidth, High-Capacity Segment Offering 2x The Speed of HBM4 Z-Angle Memory or ZAM has been stirring up a lot of talk in the memory segment. The upcoming memory standard is being developed by Intel and SoftBank & aims to offer a low-power, high-density replacement to HBM. Now, new details have been shared that provide more insight into ZAM memory. For starters, the new memory […]

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TSMC's key supplier has stated that no technology was leaked to China, but it also filed a lawsuit against its former General Manager. TSMC Supplier Denies That Key Technology Was Leaked To China, But Files A Lawsuit Against Its Former General Manager GPTC (Grand Process Technology Corporation), which is a key supplier for TSMC's Advanced Packaging solutions such as CoWoS, has denied recent reports that key TSMC technology was leaked to China. In a recent press release, the company confirmed that no technology leaks were observed after recent rumors emerged. However, at the same time, the company has filed a […]

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Intel Foundry has welcomed its newest member, Shawn Han, from Samsung Foundry, as the company continues to build its A-Team in the semiconductor business. Shawn Han of Samsung Foundry Joins Intel Foundry, Bringing Years of Semiconductor Experience The announcement was made by Intel Executive Vice President, Naga Chandrasekaran, on LinkedIn, and shared by the Intel Foundry handle on X. In the post, Naga announced that Shawn Han has joined Intel & will serve in a leadership position as the Senior Vice President and General Manager of Foundry Services. Shawn begins his role from May this year, and the important part […]

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One of the biggest supply constraints the AI industry faces is with advanced packaging, and given that every entity relies on TSMC, it appears the firm is gearing up to add significant capacity. TSMC's Advanced Packaging Supply Constraints Force the Firm to Rapidly Add New Capacity, or Risk Losing Customers We have discussed advanced packaging (AP) bottlenecks extensively on the website, but it is important to note that without adding new capacity, there is no other way to solve this bottleneck in the future. Based on a new report by Taiwan's CNA, it appears that TSMC is now ready to […]

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Well, you read the headline right, and we are talking about a critical element in AI chips that is not only in tremendous shortage but also originally comes from an MSG maker. Ajinomoto, the MSG Maker, Controls the Production of ABF That Is Absolutely Crucial For Advanced Packaging The aggressiveness of the AI demand cycle has left almost every supply chain entity involved facing shortages, whether in semiconductors, advanced packaging, OSAT services, and more. Traditionally, the computing industry has an idea of demand cycles, given how they have historically evolved, but with the AI datacenter buildout, the scale of customer […]

Read full article at https://wccftech.com/the-seasoning-company-behind-your-food-flavors-could-control-the-future-of-ai-chips/

Intel's advanced packaging services have been a significant opportunity for the foundry division in recent times, and now it seems customer interest is flowing in. Intel's Advanced Packaging Has Already Seen "Billions" In Customer Commitments This Year Advanced packaging has become a commodity for the tech industry, as significant as semiconductors in today's market, given that manufacturers like NVIDIA have resorted to using it to scale performance without entirely relying on Moore's Law. Right now, TSMC entirely sources advanced packaging demand, with customers looking at products like CoWoS-L for their AI architectures. The important point to note here is that […]

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Intel's packaging services are being considered a viable alternative to TSMC's CoWoS, as supply constraints are forcing US fabless customers to seek other options. Intel's EMIB Packaging Orders Could Reach 'Billions in Revenue' Moving Into H2 2026; a New Prospect For the Foundry Business Advanced packaging has emerged as a major driver of computing power in modern-day AI architectures, and alongside semiconductors, solutions like CoWoS are seen as vital for firms like NVIDIA and AMD. With the start of the AI frenzy, advanced packaging has been dominated by TSMC, but as demand for CoWoS and derivatives ramps up, a supply […]

Read full article at https://wccftech.com/intel-emib-challenges-tsmcs-cowos-as-america-answer-to-the-ai-packaging-bottleneck/