China's DFSX is working on fueling its domestic AI supply chain with next-gen 3.5D "Infinity Chiplet" architectures & 3D DRAM technologies. DFSX Is Working on China's First DF1000 AI Accelerator With 3D DRAM Technology, Also Unveils 3.5D+ Packaging DFSX recently hosted a presentation where they announced China's first 3D AI chip that is built entirely using China's domestic supply chain. There is a lot to unpack here, but the key product is the DF1000, which is a software-defined near-in-memory computing AI accelerator that will be used by domestic AI and tech firms. DF1000 - China's First 3D DRAM-Powered AI Accelerator […]

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Intel's Z-Angle Memory (ZAM) is approaching completion as it races towards taking a bite at the AI boom while challenging HBM as a viable alternative. Intel's ZAM Challenges HBM As A Big Memory Innovation In the High-Bandwidth, High-Capacity Segment Offering 2x The Speed of HBM4 Z-Angle Memory or ZAM has been stirring up a lot of talk in the memory segment. The upcoming memory standard is being developed by Intel and SoftBank & aims to offer a low-power, high-density replacement to HBM. Now, new details have been shared that provide more insight into ZAM memory. For starters, the new memory […]

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