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Intel Cracks The Encapsulation Wall Blocking Hyper-Large Chips, Pushing Advanced Packaging To 24x Reticle Size and Beyond

29 July 2026 at 21:40

A close-up of a semiconductor wafer with visible circuitry patterns on a manufacturing machine.

Intel has overcome one big challenge that will lead to the creation of hyper-large chips beyond 12x reticle size through advanced packaging technologies. Intel Is Creating The World's Most Advanced & Largest Chips in the US at Its New Mexico "Rio Rancho" Facility, Leveraging Next-Gen Packaging Innovations Modern-day chips don't rely on a single piece of silicon, and instead utilize a range of silicon dies, interconnected together using the latest packaging solutions. The terminology used for such designs is chiplets, and chiplets were made to overcome scaling bottlenecks and the growing demand for compute. Inside Intel's Rio Rancho, New Mexico […]

Read full article at https://wccftech.com/intel-cracks-encapsulation-wall-blocking-hyper-large-chips-using-advanced-packaging/

Intel Emerges as America’s Only Leading-Edge Chipmaker as RAMP-C Hands the Department of War Domestic 18A Production

28 July 2026 at 16:10

Intel Emerges as America's Only Leading-Edge Chipmaker as RAMP-C Hands the Department of War Domestic 18A Production

Intel has completed its RAMP-C program, which now aims to enable customers to move from test chips to domestic high-volume manufacturing. Intel RAMP-C Leads To Successful Development of a Strong "Design Enablement Infrastructure" Which Enables Commercial & Defense Customers To Design & Fabricate Chips Within the US Press Release: Intel Foundry has completed the Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) program. Launched in September 2021, the program supported development of domestic, leading-edge CMOS technology and manufacturing in the United States, establishing a foundation for expanded trusted domestic semiconductor manufacturing. “The collaboration between the DoW and Intel on the Trusted […]

Read full article at https://wccftech.com/intel-emerges-as-americas-only-leading-edge-chipmaker-as-ramp-c-hands-domestic-18a-production/

Intel 18A-P and 14A gain Cadence’s full EDA toolchain, tightening the ecosystem push to challenge TSMC’s foundry lead

27 July 2026 at 15:20

A presenter speaks on stage in front of screens displaying 'Delivering On Our Silicon Commitments' and 'intel 14A' at an Intel Foundry event.

Cadence has announced that its AI-driven digital and custom reference flows, tools, and solutions are now Intel 18A-P & 14A certified. Intel's Next-gen 18A-P & 14A Technologies Are Certified & Ready For Deployment At Cadence Press Release: Cadence's AI-driven digital and custom reference flows, tools, and solutions are now certified on Intel 18A-P and Intel 14A technologies, based on the latest Intel Foundry process design kits (PDKs). Building on the companies' recent expansion of design IP optimized for Intel 18A and 18A-P and their multi-year Design Technology Co-Optimization (DTCO) agreement targeting Intel 14A, this new certification provides customers with a […]

Read full article at https://wccftech.com/intel-18a-p-14a-gain-cadence-full-eda-toolchain-tightening-the-ecosystem-push/

Intel Foundry Securing Packaging & Wafer Deal With NVIDIA To Make Next-Gen Feynman GPUs Could Be Its Biggest Customer Win Yet

24 July 2026 at 01:50

Two executives shake hands in front of a chip, with 'intel' and 'NVIDIA' logos prominently displayed in the background.

Intel Foundry might be heading into a big deal with NVIDIA, as the company is expected to offer packaging and wafer support for next-gen Feynman GPUs. NVIDIA Feynman GPUs Could Be Intel Foundry's Biggest Win To Date With Chipzilla Providing Both Packaging & Wafer Supply A deal between Intel and NVIDIA won't be a major surprise for those following our previous reports, but it is definitely a big win for Intel's Foundry business. Earlier this year, we reported that NVIDIA might be looking into Intel's upcoming process & advanced packaging technologies for its next-generation GPUs, codenamed Feynman. Well, according to […]

Read full article at https://wccftech.com/intel-foundry-nvidia-feynman-gpu-wafer-packaging-deal/

Intel Breaks Ground On New Manufacturing Facility In Santa Clara, As Foundry Business Brings Back Semiconductor Leadership Right In The Heart of Silicon Valley

30 June 2026 at 20:15

Intel Foundry is expanding its manufacturing capabilities with state-of-the-art facilities in the heart of Silicon Valley in Santa Clara, US. Intel Foundry Expanding Its Manufacturing Strength on US Soil As CEO Lip-Bu Tan Breaks Ground On New Facility Today, in Santa Clara, California, US, Intel's CEO, along with several other executives, broke ground on the company's latest expansion of its Santa Clara facility. The ground is all set for the expansion of manufacturing capabilities of the Foundry division, which is at an all-time high as the confidence in Intel's current and upcoming nodes continues to grow among external customers. Pictures […]

Read full article at https://wccftech.com/intel-foundry-breaks-ground-on-new-manufacturing-facility-in-santa-clara-silicon-valley/

SK Hynix’s Former CEO Returns to Intel After Years Away, Taking Charge as EVP of Foundry Business & Advanced Packaging Technologies

18 June 2026 at 22:10

SK Hynix's Former CEO Returns to Intel After Years Away, Taking Charge as EVP of Foundry Business & Advanced Packaging Technologies

Intel has hired Seok-Hee Lee as EVP of its Foundry's Advanced Packaging & Back-End Technology, bringing years of experience from SK Hynix, where he served as President and CEO. Intel Foundry Gets SK Hynix's Ex-CEO, Seok-Hee Lee, Bringing Years of Experience In The Advanced Packaging & Back-End Technology Segment Press Release: Intel Corporation today announced the appointment of Seok-Hee Lee as executive vice president of Intel Foundry, reporting directly to CEO Lip-Bu Tan. In this role, Lee will lead all advanced packaging, system integration, back-end technology development, and back-end manufacturing, strengthening Intel’s ability to deliver differentiated, system-level innovation for customers. […]

Read full article at https://wccftech.com/sk-hynix-former-ceo-returns-to-intel-taking-charge-as-evp-of-foundry-business-advanced-packaging-technologies/

Intel Foundry’s Rio Rancho Facility To Become Its Crown Jewel In Production of Next-Gen Glass Substrates

25 May 2026 at 12:10

Intel Foundry's Rio Rancho Facility To Become Its Crown Jewel In Production of Next-Gen Glass Substrates

Intel Foundry is leading the race towards Glass Substrates with its Rio Rancho facility, aiming to become the world's first to initiate mass production. Glass Substrates Are The Future of Semiconductors & Intel Foundry is Well on Its Way To Become The First To Initiate Mass Production Glass Core substrates have been gaining interest, as they have several benefits over traditional organic substrate solutions. The current substrates are also facing shortages due to the AI supercycle, leading one of the biggest substrate suppliers, Ajinomoto, to raise prices. These supply constraints are pushing the industry to look into new advanced packaging solutions, and […]

Read full article at https://wccftech.com/intel-foundry-rio-rancho-facility-crown-jewel-in-production-of-glass-substrates/

Intel CEO Lip-Bu Tan Calls Foundry a “National Treasure” as External Customers Knock on His Door After 18A Yield Turnaround

19 May 2026 at 01:55

A person in a suit stands on stage with a large semiconductor wafer image displayed behind them, and the word 'Welcome' visible on a screen.

Intel CEO, Lip-Bu Tan, says that its Foundry Business is a National Treasure, and continues to see more customers line up for its advanced packaging and process technologies. Intel Foundry Sees Massive Interest From Several External Customers, Many Already Prepaying For Substrates During today's Mad Money Show with Jim Cramer of CNBC, Intel's CEO, Lip-Bu Tan, talked about the company's Foundry business and how the AI buzz is pushing more customers towards it. Right off the bat, Lip-Bu said that the "Foundry is very important", calling it a national treasure. He says that currently, 90% of the most advanced processors […]

Read full article at https://wccftech.com/intel-ceo-lip-bu-tan-calls-foundry-a-national-treasure-as-external-customers-knock-on-his-door-after-18a-yield-turnaround/

Intel Just Had One Of Their Biggest Earnings Calls Ever – Here’s What You Need To Know

24 April 2026 at 14:00

Intel Just Had One Of Their Biggest Earnings Calls Ever - Here's What You Need To Know 1

$INTC is massively up after beating revenue guidance for Q1 '26 and posting strong guidance for Q2. Foundry and DCAI both showed healthy growth over the last quarter, while Client Computing slumped slightly due to inflationary pressures and the ongoing RAM crisis. Some might say that the explosive growth in Intel's stock price isn't justified by its results this quarter. After reviewing Intel's earnings call, I personally disagree. Here are the most important quotes from the call. Intel Foundry - 18A Beating Internal Yield Projections, 14A Development Going Smoothly "We have made steady progress with Intel 4 and Intel 3, […]

Read full article at https://wccftech.com/intel-just-had-one-of-their-biggest-earnings-calls-ever-heres-what-you-need-to-know/

Intel Foundry Lands a Samsung Veteran With 30 Years of Chip Experience, Betting He Can Fill Its Customer Gap

17 April 2026 at 03:30

A person in glasses is in front of a blue dotted background with the text 'Intel Foundry' visible.

Intel Foundry has welcomed its newest member, Shawn Han, from Samsung Foundry, as the company continues to build its A-Team in the semiconductor business. Shawn Han of Samsung Foundry Joins Intel Foundry, Bringing Years of Semiconductor Experience The announcement was made by Intel Executive Vice President, Naga Chandrasekaran, on LinkedIn, and shared by the Intel Foundry handle on X. In the post, Naga announced that Shawn Han has joined Intel & will serve in a leadership position as the Senior Vice President and General Manager of Foundry Services. Shawn begins his role from May this year, and the important part […]

Read full article at https://wccftech.com/intel-foundry-lands-a-samsung-veteran-with-30-years-of-chip-experience-betting-he-can-fill-its-customer-gap/

TSMC’s Chipmaking Edge Is So Strong That Competitors Are Fighting to Work with Its Supply Chain Partners, Viewing Them as a Winning Bet

9 April 2026 at 15:46

TSMC could surpass Apple in market value by 2030, predicts analyst

TSMC's dominance over the semiconductor industry also stems from how disciplined its supply chain partners have become, and rivals are now looking to capitalize on this edge. TSMC's Supply Network Has Created a Moat For Them In The Chip Industry, After Passing Them Through Stringent QC Tests The Taiwan chip giant has been known for its work in the semiconductor industry, not just in terms of the process technology it has brought into the market, but also how it has created standards that have become industry benchmarks, whether it is customer relations, dealing with geopolitical tensions, or managing the supply […]

Read full article at https://wccftech.com/tsmc-edge-is-so-strong-that-competitors-are-racing-to-work-with-its-supply-chain-partners/

Intel’s Ex-CEO Blames Wall Street’s “Short-Termism” For America Losing the Chip Race, Saying No CEO Can Survive the Backlash

27 March 2026 at 14:21

Intel's former CEO, Pat Gelsinger, has spoken about the company during his tenure, saying that Wall Street's expectations had stalled his manufacturing ambitions. Intel's ex-CEO Pat Gelsinger Is Disappointed By Wall Street's Expectations, But He Shows Faith in Lip-Bu Tan The US semiconductor industry has seen dramatic changes over the past few years, mainly driven by government initiatives such as the CHIPS Act, which aim to produce chips on home soil. Intel's former CEO, Pat Gelsinger, has been a key advocate of America's supply chain resilience and was one of the individuals responsible for bringing an "engineering-driven" approach to the […]

Read full article at https://wccftech.com/intel-ex-ceo-blames-wall-street-for-america-losing-the-chip-race/

Intel Foundry Breakeven Target For 2027 Now Looks a Lot More Real, Driven By 18A, 14A & a Surprising Advanced Packaging Surge

4 March 2026 at 19:11

Man speaking on stage with Siemens and foundry visible in the background.

Intel's CFO, David Zinsner, took the stage at the Morgan Stanley conference, and based on his comments on the foundry front, Team Blue looks a lot more confident about division breakeven. Intel's 18A-P & 14A Will Prove to Be Effective Solutions For External Customers; Packaging To Bring 'Billions' In Revenue Under CEO Lip-Bu Tan, Intel has been entering the foundry market at a time when the AI frenzy significantly drives customer demand. One of the more significant achievements under Tan was the successful ramp-up of Panther Lake, and according to Zinsner, 18A has delivered on expectations, with yield rates improving […]

Read full article at https://wccftech.com/intel-foundry-breakeven-target-for-2027-now-looks-a-lot-more-real/

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