Intel's Foundry business will soon house some big names by the end of this year as its 14A technology gains huge momentum. Intel 14A Technology Will Be A Game Changer For Chipzilla As It Hopes To Get Some Big Names Onboard By The End of This Year Intel's Foundry success relies a lot of it's upcoming 14A process technology. The 14A node is designed to attract external customers more so than it is designed for internal use. That's something that 18A is built for. So far, Intel hasn't publicly named any big customers for its 14A technology, but it makes […]

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Well, you read the headline right, and we are talking about a critical element in AI chips that is not only in tremendous shortage but also originally comes from an MSG maker. Ajinomoto, the MSG Maker, Controls the Production of ABF That Is Absolutely Crucial For Advanced Packaging The aggressiveness of the AI demand cycle has left almost every supply chain entity involved facing shortages, whether in semiconductors, advanced packaging, OSAT services, and more. Traditionally, the computing industry has an idea of demand cycles, given how they have historically evolved, but with the AI datacenter buildout, the scale of customer […]

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Intel's advanced packaging services have been a significant opportunity for the foundry division in recent times, and now it seems customer interest is flowing in. Intel's Advanced Packaging Has Already Seen "Billions" In Customer Commitments This Year Advanced packaging has become a commodity for the tech industry, as significant as semiconductors in today's market, given that manufacturers like NVIDIA have resorted to using it to scale performance without entirely relying on Moore's Law. Right now, TSMC entirely sources advanced packaging demand, with customers looking at products like CoWoS-L for their AI architectures. The important point to note here is that […]

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Intel's packaging services are being considered a viable alternative to TSMC's CoWoS, as supply constraints are forcing US fabless customers to seek other options. Intel's EMIB Packaging Orders Could Reach 'Billions in Revenue' Moving Into H2 2026; a New Prospect For the Foundry Business Advanced packaging has emerged as a major driver of computing power in modern-day AI architectures, and alongside semiconductors, solutions like CoWoS are seen as vital for firms like NVIDIA and AMD. With the start of the AI frenzy, advanced packaging has been dominated by TSMC, but as demand for CoWoS and derivatives ramps up, a supply […]

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Intel's CFO, David Zinsner, took the stage at the Morgan Stanley conference, and based on his comments on the foundry front, Team Blue looks a lot more confident about division breakeven. Intel's 18A-P & 14A Will Prove to Be Effective Solutions For External Customers; Packaging To Bring 'Billions' In Revenue Under CEO Lip-Bu Tan, Intel has been entering the foundry market at a time when the AI frenzy significantly drives customer demand. One of the more significant achievements under Tan was the successful ramp-up of Panther Lake, and according to Zinsner, 18A has delivered on expectations, with yield rates improving […]

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