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China’s DFSX Offers 2x The Memory Bandwidth Of NVIDIA’s GB200 NVL72 System With a 14nm SuperNode That Skips Microbumps for Vertical Compute-Memory Towers

2 August 2026 at 17:34

China Develops Its First 3.5D "Infinity Chiplet" & 3D DRAM Tech As It Tackles External HBM Constraints Through Domestic AI Supply Chain

China's Dongfang Suanxin (DFSX) is on a quest to prove that memory bandwidth, and not an incessant obsession with node miniaturization, is the key to unlocking sizable economies of scale for AI workloads, as demonstrated by its DF1000 and the upcoming DF2000 chips, typically arrayed within TY64 SuperNodes to give NVIDIA's GB200 NVL72 system a run for its money. A DFSX TY64 SuperNode, made up of 14nm DF2000 chips, will offer a memory bandwidth of 960TB/s vs. just 576TB/s for NVIDIA GB200 NVL72 systems For the benefit of those who might not be aware, DFSX's DF1000 chip is fabricated using […]

Read full article at https://wccftech.com/chinas-dfsx-offers-2x-the-memory-bandwidth-of-nvidias-gb200-nvl72-system-with-a-14nm-supernode-that-skips-microbumps-for-vertical-compute-memory-towers/

China Develops Its First 3.5D β€œInfinity Chiplet” & 3D DRAM Tech As It Tackles External HBM Constraints Through Domestic AI Supply Chain

15 July 2026 at 11:20

China Develops Its First 3.5D "Infinity Chiplet" & 3D DRAM Tech As It Tackles External HBM Constraints Through Domestic AI Supply Chain

China's DFSX is working on fueling its domestic AI supply chain with next-gen 3.5D "Infinity Chiplet" architectures & 3D DRAM technologies. DFSX Is Working on China's First DF1000 AI Accelerator With 3D DRAM Technology, Also Unveils 3.5D+ Packaging DFSX recently hosted a presentation where they announced China's first 3D AI chip that is built entirely using China's domestic supply chain. There is a lot to unpack here, but the key product is the DF1000, which is a software-defined near-in-memory computing AI accelerator that will be used by domestic AI and tech firms. DF1000 - China's First 3D DRAM-Powered AI Accelerator […]

Read full article at https://wccftech.com/china-develops-first-3-5d-infinity-chiplet-3d-dram-tech-as-it-tackles-external-constraints/

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