Panel-Level Packaging (FOPLP) and Glass Substrates are going to drive the next chapter in advanced packaging, with the market exceeding $8 Billion by 2030. The AI & HPC Segments Want To Move Beyond Organic Substrates & Wafer Packages To Meet Their Growing Compute Needs, & That's Where Panel-level Packaging & Glass Substrates Come In TSMC & Intel are the two major semiconductor firms that are accelerating next-gen glass core substrates for panel-level packages. These two technologies go hand in hand in powering the next generation of semiconductors and come with major advantages over traditional organic substrates and wafer-level packages. The […]

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TSMC is aggressively working on CoPoS (Panel-Level) packaging to replace CoWoS for growing compute demand as Glass Core Substrates take center stage. Panel-Level Packaging Is The Next Logical Step for TSMC As It Eyes CoPoS "Glass Core Substrate" Technology Over CoWoS The ever-growing AI and compute demand requires next-generation packaging technologies. Intel and TSMC are aggressively working towards that goal, and glass core substrates are going to be a major part of their trajectories moving forward. In a recent report by Commercial Times Taiwan, it is reported that TSMC is now aggressively moving towards CoPoS (Chip-On-Panel-on-Substrate) as a replacement to […]

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The Taiwan Semiconductor Manufacturing Company (TSMC) is expanding its supply chain for glass substrates as part of the first step of establishing a supply chain for the chip-on-panel-on-substrate (CoPoS) packaging technology, according to supply chain sources. The glass substrates will be used in the firm's advanced versions of the chip-on-wafer-on-substrate (CoWoS) packaging technology, and TSMC is working with Innolux and Ibiden as part of these efforts. TSMC Gears Up For Glass Substrate Development By Sharing Plan With Suppliers According to the details, the two companies that TSMC is in touch with are its suppliers for Ajinomoto Buildup Film (ABF) and […]

Read full article at https://wccftech.com/tsmc-bets-on-glass-for-cowos-as-silicon-mimicking-thermals-beat-organic-substrates-yet-mass-production-stays-distant/