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NVIDIA’s First Made-In-America GB300 GPUs Roll Off TSMC’s Arizona-Based Fab 21, But Still Fly To Taiwan for Packaging

27 July 2026 at 16:07

NVIDIA and TSMC have just achieved a major milestone that significantly bolsters the prospects of on-shore chip fabrication, insulating the US against geopolitical shocks. Even so, there is still quite a lot left to be done, including on the advanced packaging front. TSMC has just fabricated some of the first NVIDIA GB300 GPUs in its Arizona facility, taking a significant step towards fulfilling the demands of the US to onshore chip manufacturing According to the Commercial Times, TSMC has just fabricated some of the first NVIDIA GB300 AI GPUs on its 4nm node in Arizona's Fab 21. Even so, the […]

Read full article at https://wccftech.com/nvidias-first-made-in-america-gb300-gpus-roll-off-tsmcs-arizona-based-fab-21-but-still-fly-to-taiwan-for-packaging/

AMD Prepares For Zen 6 EPYC CPUs Launch For July 22nd-23rd, Confirms AMD’s Mark Papermaster

9 July 2026 at 13:06

A close-up of two processors shows the AMD EPYC chip and a chip labeled with 'Zen 6' on a blue circuit background.

One of the biggest server CPU stacks is about to officially launch soon, as AMD prepares for new EPYC Venice CPUs. AMD to Introduce Zen 6-Based EPYC Venice CPUs at Advancing AI Event on July 22nd and 23rd, While Mainstream Chips Should Launch Much Later AMD's CTO and EVP, Mark Papermaster, has just confirmed that the next-generation Zen 6-based AMD EPYC "Venice" CPUs are going to get officially introduced this month. We knew from previous reports that the company had planned a launch this year, but we never knew the exact date. However, in a recent interview, Mark has confirmed […]

Read full article at https://wccftech.com/amd-prepares-for-zen-6-epyc-cpus-launch-for-july-22nd-23rd-confirms-amds-mark-papermaster/

TSMC Accelerates CoPoS Packaging to Replace CoWoS, as Glass Core Substrates Cut Costs 30% and Boost Wafer Utilization Past 90%

20 June 2026 at 17:40

Samsung To Initiate Pilot Production Of Glass Substrates Semiconductor This Year

TSMC is aggressively working on CoPoS (Panel-Level) packaging to replace CoWoS for growing compute demand as Glass Core Substrates take center stage. Panel-Level Packaging Is The Next Logical Step for TSMC As It Eyes CoPoS "Glass Core Substrate" Technology Over CoWoS The ever-growing AI and compute demand requires next-generation packaging technologies. Intel and TSMC are aggressively working towards that goal, and glass core substrates are going to be a major part of their trajectories moving forward. In a recent report by Commercial Times Taiwan, it is reported that TSMC is now aggressively moving towards CoPoS (Chip-On-Panel-on-Substrate) as a replacement to […]

Read full article at https://wccftech.com/tsmc-accelerates-copos-packaging-replace-cowos-as-glass-core-substrates-cut-costs-boost-wafer-utilizatio/

Foxconn Pegs NVIDIA Vera Rubin AI Datacenter at $47 Billion Per Gigawatt, as Power Bills Hit $1.3B Yearly

20 June 2026 at 16:45

A presenter on stage is holding a chip in front of large computer servers and a backdrop showing a microarchitecture diagram with '2X' and '1.6X' text.

NVIDIA's Vera Rubin is entering data centers soon, and the rise of Agentic AI also comes with a mammoth rise in costs. NVIDIA Vera Rubin AI Data Centers Will Be Expensive To Build & Will Consume Lots of Power, A Single GigaWatt Installation Could Cost Roughly $50 Billion The Vera Rubin era is upon us. The first systems are already being shipped to major cloud providers who are validating and testing them before bringing them up on scale. With the full volume production already going on, NVIDIA is eyeing an even bigger success than Blackwell. But as these systems are […]

Read full article at https://wccftech.com/foxconn-pegs-nvidia-vera-rubin-ai-datacenter-at-47-billion-per-gigawatt/

AMD’s EPYC Venice Becomes Industry’s First 2nm HPC CPU To Achieve Volume Ramp As It Races Towards Agentic AI Leadership

21 May 2026 at 14:25

AMD's EPYC Venice Becomes Industry's First 2nm HPC CPU To Achieve Volume Ramp As It Races Towards Agentic AI Leadership

AMD's EPYC Venice CPUs have entered volume production, making them the first HPC product to achieve the milestone on TSMC's 2nm process tech. AMD & TSMC Enter Volume Production On The Industry's First 2nm HPC Chip, 6th Gen EPYC Venice The Agentic AI boom is driving the CPU market up, unlike anything that came before. High-Performance CPUs are seeing massive demands, and AMD, being a leader in HPC, has just achieved volume ramp of its next-generation EPYC Venice CPUs based on the Zen 6 core architecture. The volume ramp was achieved on TSMC's cutting-edge 2nm process technology. Looking ahead, AMD […]

Read full article at https://wccftech.com/amd-epyc-venice-industrys-first-tsmc-2nm-hpc-chip-to-achieve-volume-ramp/

TSMC Doubles Down on 2nm With Five Fabs Ramping at Once, Output Set to Eclipse 3nm by 2x

29 April 2026 at 13:30

TSMC is all set to double its 2nm production capacity through five state-of-the-art fabrication plants to meet global AI and chip demand. TSMC's 2nm Output To Be 45% Higher Than 3nm At The Same Stage As Production Ramps Up Recently, we shared how TSMC is gearing up to boost its 2nm and 3nm wafer output aggressively by the end of 2026. Now, the company is reportedly going to double its 2nm capacity output to meet "explosive" demand for AI and compute. As such, TSMC has set up five wafer fabs, all entering ramp-up phase this year towards 2 nano-meter proceses. […]

Read full article at https://wccftech.com/tsmc-doubles-down-on-2nm-five-fabs-ramping-at-once-output-eclipse-3nm-by-2x/

TSMC’s US Expansion Plans Grow More Aggressive With Twelve Planned Arizona Fabs, as Sole Reliance on Taiwan Appears to Be a ‘Dead End’

2 April 2026 at 14:25

Silicon wafer inside a semiconductor manufacturing machine.

TSMC's US fab network is growing at an unprecedented pace, and according to a new report, the chip giant is eager to build a 'GigaFab' cluster in Arizona that rivals Taiwan's output. TSMC's Arizona Is Expected To Turn Out To Be a Taiwan-Level Fab Network, Driven by Gigantic Investments The Taiwan chip giant has managed to pivot towards America's semiconductor industry, and several factors have influenced this shift, which we'll discuss later. However, according to a new report by DigiTimes, it is disclosed that TSMC's plans for the US have already "exceeded expectations", and that now, the firm has plans […]

Read full article at https://wccftech.com/tsmc-us-expansion-plans-grow-more-aggressive-with-twelve-planned-arizona-fabs/

TSMC’s Arizona Plant Finally Turns a Profit After Four Years of Struggle, But Money Was Never the Real Goal

28 February 2026 at 17:28

TSMC could surpass Apple in market value by 2030, predicts analyst

TSMC's US operations have struggled since their initial launch in 2021, and after four 'rough' years, the Arizona plant has now reported profitability. TSMC's Expansion Towards the US Has Been a Costly Venture, But The Chip Giant Is Playing the 'Long Ball' Game TSMC's expansion into America isn't just driven by political motives; instead, the chip giant recognizes that diversifying production is becoming a 'must' amid the geopolitical risks it faces. The CHIPS Act initially catalyzed the Biden administration's pivot towards Arizona, which laid out initial investment plans. Since 2021, TSMC Arizona has reported operating losses totaling $1.25 billion over […]

Read full article at https://wccftech.com/tsmc-arizona-plant-finally-turns-a-profit-after-four-years-of-struggle/

Apple’s ‘Make In America’ Push Gains Steam, With Server Production Now Hitting 10 Units Per Hour, As CIA Warns Of A 2027 Taiwan Attack

24 February 2026 at 14:07

The image shows a large Apple logo on a glass storefront with a Chinese flag prominently displayed in the foreground.

Apple is very clearly ramping up its US-based manufacturing footprint, as evidenced by its soaring server production capacity at its Houston plant, coupled with plans to relocate the manufacturing of Mac mini devices to that same Texas-based facility. These moves not only serve to broadcast Apple's commitment to the pledges that it gave to the Trump administration in the past few months to win tariff-related reprieve, but also now form the bedrock of a dedicated risk-mitigating strategy for tail-end geopolitical shocks, including a possible invasion of Taiwan by China. Apple's Houston facility is rapidly becoming its 'make in America' manufacturing […]

Read full article at https://wccftech.com/apples-make-in-america-push-gains-steam-with-server-production-now-hitting-10-units-per-hour-as-cia-warns-of-a-2027-taiwan-attack/

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