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AMD’s Threadripper Halo Station & Ryzen AI MAX PCs Take The Spotlight at IFA, As They Bring Powerful & Local AI Capabilities Close To Everyone

5 September 2026 at 21:10

A sleek black PC case with clear side paneling, featuring visible AMD branding on multiple components inside, against a dark background.

AMD presented its most powerful AI solutions for local developers and professionals: the Threadripper Halo Station & various Ryzen AI MAX PCs. Here's How AMD's Threadripper Halo Station Stacks Up Against NVIDIA's DGX Station, Bringing The World's Most Powerful AI Capabilities In A Desktop Form Factor The demand for fast local AI is increasing tenfold. As models become larger & agents see huge popularity among the AI masses, the need for powerful hardware is growing at an exponential scale. This demand requires solutions with powerful hardware, and AMD is rolling out its most powerful AI system to date, the Threadripper […]

Read full article at https://wccftech.com/amd-threadripper-halo-station-ryzen-ai-max-pcs-bring-powerful-local-ai-capabilities/

SK Hynix Unpacks Advanced Packaging Technologies, Including Intel EMIB, For Its Next-Gen HBM Memory As It Eyes 3D Structures For The Future

23 August 2026 at 20:30

A slide titled 'Advanced PKG Future Direction' illustrates three structures: '2D Structure' with 'PKG to PKG on Board,' '2.5D Structure' with 'Die to Die on Interposer,' and '3D Structure' with 'Die on Die,' each depicted with different chip designs and connections.

SK Hynix is leveraging advanced packaging technologies such as Intel's EMIB for its next-gen HBM solutions, which will eventually enter the 3D packaging stage. Scaling HBM Comes With Big Challenges & SK Hynix Is Leveraging Advanced Packaging Solutions To Address Them As It Ventures Into The 3D Era At Hot Chips 2026, Jaesik Lee (VP Package Engineering at SK Hynix) presented the "Advanced Packaging for High-Bandwidth Memory" brief, which talks about how the company plans to leverage advanced packaging tech to accelerate its HBM roadmap. The company started by presenting how HBM is currently built. The HBM structure consists of […]

Read full article at https://wccftech.com/sk-hynix-advanced-packaging-technologies-intel-emib-next-gen-hbm-memory/

Why Memory Performance Is More Important Than Ever In Modern Computing

20 August 2026 at 22:38

An infographic with the title 'Memory Performance Is The Real Bottleneck In Modern Computing' shows a flow from a CPU to RAM labeled 'MEMORY BANDWIDTH & LATENCY Can't Keep Up,' then to an 'NVMe SSD' noting 'DATA MOVEMENT Becomes The Limiting Factor.'

For decades, computing performance was easy to reduce to a few headline specifications. CPUs were sold on clock speed and core count, GPUs on shader throughput and later teraFLOPS, memory on frequency, and storage on sequential transfer rates. Those numbers still have value, but modern processors have become so extraordinarily capable of performing arithmetic that another problem increasingly dictates how much of that theoretical performance can actually be used: getting data where it needs to go, when it needs to be there. A modern CPU core can execute multiple instructions every clock cycle. A high-end GPU contains thousands of arithmetic […]

Read full article at https://wccftech.com/why-memory-performance-is-more-important-than-ever-in-modern-computing/

SK Hynix Samples HBM4E With 48 GB Capacity and 16 Gbps as AI Chip Demand Forces DRAM Makers Into Overdrive

18 June 2026 at 01:35

A gold-framed silicon wafer by SK hynix and NVIDIA is displayed, with inscription Please Make and signed by Jensen Huang at GT Computex 2023, alongside specifications for 'HBM4E 48GB 12Hi'.

SK Hynix has commenced sampling of its next-gen HBM4E memory, offering up to 16 Gbps speeds and 48 GB capacities. SK Hynix Races Samsung In Sampling First HBM4E DRAM Modules For Next-Gen AI Solutions The acceleration in AI has pushed DRAM manufacturers to dial up their development plans. As such, SK Hynix is racing its rival Samsung to deliver the first HBM4E memory solutions to partners who will be using it to power their next-generation datacenters. The HBM4E memory will play a crucial role for next-gen datacenters as it will power some heavy-weight chips, NVIDIA Rubin Ultra, and AMD Instinct […]

Read full article at https://wccftech.com/sk-hynix-samples-hbm4e-memory-48-gb-capacity-16-gbps-speeds/

Intel’s Crescent Island PCB Leaks, Showing a Massive Xe3P GPU, 16-Pin Connector, 160GB LPDDR5X as Intel Sidesteps the HBM Shortage

19 May 2026 at 16:42

Intel's Crescent Island PCB Leaks, Showing a Massive Xe3P GPU and 160GB of LPDDR5X as Intel Sidesteps the HBM Shortage

Intel's next-generation Crescent Island PCIe graphics card has been pictured in the first PCB leak, giving us a look at the large Xe3P GPU & support for LPDDR5X memory. Intel Xe3P-Powered Crescent Island "Inference" AI Accelerator Pictured In First PCB Leak With 20 LPDDR5X Modules The first pictures of Intel's Crescent Island PCIe accelerator's PCB have been leaked by YuuKi_AnS. Crescent Island is the latest and upcoming Inference accelerator designed for AI workflows, offering competitive value. The leaked PCB gives us an idea of what the graphics card will look like. Starting first with the GPU itself, which looks massive […]

Read full article at https://wccftech.com/intel-crescent-island-pcb-leaks-massive-xe3p-gpu-160gb-lpddr5x/

AMD Launches MI350P, Its First PCIe β€œInstinct” In Four Years – Packs CDNA 4 GPU With 4.6 PFLOPs AI Compute, 144 GB HBM3E at 600W

7 May 2026 at 14:45

The image shows an AMD Instinct MI350P graphics card against a dark, abstract background.

AMD has announced its brand new Instinct MI350P PCIe GPU accelerator, which is the first PCIe design in years and is aimed at AI workloads. The Instinct MI350P PCIe GPU Takes The MI350X Chips, Cuts It Into Half For 128 CUs, 144 GB HBM3E & 600W Power With the Instinct MI350P PCIe GPU, AMD gives enterprise users an option to expand their AI computing capabilities without having to invest in expensive infrastructure. The PCIe design of the MI350P makes it an easy-to-use and drop-in solution that brings lots of performance in a standard dual-slot and server-focused design. Designed to help […]

Read full article at https://wccftech.com/amd-mi350p-first-pcie-instinct-in-four-years-cdna-4-gpu-4-6-pflops-ai-144-gb-hbm3e-600w/

Agentic AI Pushes CPUs to Pack 400 GB of Memory, 4x More Than Today, as DRAM Shortage Spirals Toward 2027

2 May 2026 at 10:10

CPUs or GPUs, but require lots of memory for running Agentic AI, and this demand is spiraling to unseen levels as DRAM constraints persist. CPUs Running Agentic AI Will Be Equipped With Up to 400 GB of Memory, Further Crushing The DRAM Supply Chain Memory makers are earning big profits but are also unable to meet the demand. We have seen reports on how major manufacturers are rapidly expanding their production facilities, but these are yet to become operational, and Samsung itself has stated that 2027 will be worse for the DRAM industry than 2026, so it's looking like a […]

Read full article at https://wccftech.com/agentic-ai-pushes-cpus-to-pack-400-gb-of-memory-4x-more-than-today/

Korean AI Startup Upstage Is in Talks to Buy 10,000 AMD MI355X Accelerators

23 March 2026 at 15:37

South Korean AI startup Upstage is in discussions with AMD to purchase 10,000 MI355X accelerators, according to Bloomberg, and the story is worth paying attention to for reasons that go beyond the headline number.

Upstage CEO Sung Kim confirmed the talks after meeting AMD CEO Lisa Su in Seoul last week. The quote he gave Bloomberg is the most interesting part of the whole thing: β€œWe have a lot of Nvidia chips in Korea, but we want to diversify to other chips, including AMD’s.” That is not a complaint about Nvidia. It is a deliberate infrastructure strategy, and it is one that more organisations are starting to think seriously about as GPU supply constraints and vendor concentration risk become real operational concerns.

AMD is already an investor in Upstage, having participated in its Series B funding round. So this is not a cold commercial negotiation. It is a deepening of an existing relationship, with Upstage looking to put AMD silicon to work on its Solar language model and on Korea’s national AI foundation model programme. That programme, which the press has taken to calling the β€œAI Squid Game” after the Netflix series, pits four teams against each other in a government-backed competition evaluated every six months by the Ministry of Science and ICT. Two finalists will be selected by early next year, with the winners receiving additional allocations of Nvidia GPUs. Upstage is currently preparing a model with around 200 billion parameters for the upcoming summer evaluation round.

The MI355X is AMD’s latest Instinct accelerator, built on CDNA 4 architecture with 288 GB of HBM3E memory per card and 8 TB/s of memory bandwidth. Those are serious specifications, and the memory capacity, in particular, is the one that matters most for large-model inference. Running a 200B parameter model requires memory headroom that most accelerators simply cannot provide without aggressive quantisation or multi-node splitting. The MI355X’s memory capacity addresses that directly, and it is part of why AMD has been picking up large-scale enterprise AI commitments from organisations looking for alternatives to Nvidia’s HGX lineup.

The scale of this potential deal, 10,000 cards, would represent a meaningful deployment by any standard. At 288 GB per card, that is 2.88 petabytes of HBM3E accelerator memory if the full order goes through. That level of compute density requires serious infrastructure planning, and it signals that Upstage is not treating this as a trial run. Kim also confirmed that the company is targeting international expansion into markets such as Vietnam and the UAE with sovereign AI systems, which means this compute build-out is not just for domestic competition.

From AMD’s perspective, this is exactly the kind of deal the company needs to keep building momentum in a market that Nvidia still dominates by a considerable margin. AMD’s ROCm software stack has historically been the sticking point for organisations considering a switch, but the gap has narrowed enough that enterprises and startups alike are increasingly willing to run mixed deployments rather than treating Nvidia as the only viable option. The process technology underpinning the MI355X also matters here: TSMC’s capacity constraints at advanced nodes affect every major chip customer, and AMD’s ability to deliver at scale is a real consideration for any organisation planning a large procurement.

It is also worth noting the broader context AMD is operating in. The company has been under market pressure recently, with its stock declining in premarket trading on Monday despite the Upstage news, largely due to macro concerns around Middle East tensions and their effect on supply chains. But the underlying demand signal from deals like this one is clear: there is a growing pool of organisations that want high-performance AI compute, have specific memory and throughput requirements, and are actively looking beyond Nvidia to meet them. AMD’s efficiency advantage over competing x86 architectures is part of what makes its Instinct lineup credible for power-conscious deployments at scale.

The discussions are ongoing rather than finalised, and procurement at this scale involves logistics, software support commitments, and pricing negotiations that take time to close. But the direction of travel is clear. Korea is building serious AI infrastructure, Upstage is positioning itself as a competitive player in that environment, and AMD is the chip partner they are turning to for the next phase of that build-out.

Also Read: Dell XPS 13 9345 Review: Snapdragon X Elite Does the Business in Dell’s Thinnest Laptop Yet – EnosTech.com

Micron Begins Volume Production of 36GB HBM4, 28 Gbps PCI Gen6 SSDs, & 192 GB SOCAMM2 Memory For NVIDIA Vera Rubin Platform

16 March 2026 at 21:00

Micron HBM4 memory chip displayed next to its exposed circuitry on a black background.

Micron has commenced volume production of HBM4 DRAM, PCIe Gen6 SSDs & SOCAMM2 memory for NVIDIA's Vera Rubin platform. NVIDIA Vera Rubin Gets Full Support From Micron With Volume Production Beginning On HBM4 DRAM, PCIe Gen6 SSDs & SOCAMM2 Memory Press Release: Micron Technology has begun volume shipment of its HBM4 36GB 12H in the first quarter of calendar year 2026, and it is designed for NVIDIA Vera Rubin. With HBM4, Micron achieves over 11 Gb/s pin speeds, enabling a bandwidth greater than 2.8 TB/s, representing a 2.3 times bandwidth and greater than 20% power efficiency2 improvement over its HBM3E. […]

Read full article at https://wccftech.com/micron-volume-production-hbm4-gen6-ssds-socamm2-nvidia-vera-rubin-platform/

AMD’s Lisa Su Flies to South Korea Next Week to Secure Memory in a Market Where NVIDIA’s CEO Calls Scarcity β€œFantastic”

11 March 2026 at 15:03

AMD's CEO, Lisa Su, is reportedly flying to South Korea next week to meet with executives to discuss memory and supply chain matters. AMD's CEO Is Expected to Visit South Korea After More Than a Decade, Likely to Secure Supply Capacity Upfront For companies like AMD and NVIDIA, which are involved in the world's largest infrastructure buildout, it's probably in their best interests to keep their supply chain partners close, and we have already seen Jensen execute on this. NVIDIA's CEO visited Taiwan and South Korea several times last year to meet with supply chain executives, which has helped the […]

Read full article at https://wccftech.com/amd-lisa-su-flies-to-korea-next-week-to-secure-memory/

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