SPHBM4 is a new JEDEC standard that aims to solve the high cost and packaging concerns with existing HBM technologies. HBM Demand Keeps on Surging, But The High-Cost Might Make JEDEC's Upcoming SPHBM4 A Better Alternative Almost all AI & HPC accelerators rolling out these days feature some form of HBM memory. The highest-end solutions are leveraging the latest HBM4 designs, and HBM4E is being sampled to the top chipmakers. But as demand continues to rise, and shortages persist in the premium DRAM segment, HBM has become a major bottleneck. The cost is one issue, but price surges are a […]

Read full article at https://wccftech.com/jedec-approves-sphbm4-to-break-hbm-costs-retain-hbm4-speeds-standard-packages/

SanDisk is looking for more innovative solutions to address memory limitations, such as stacking NAND Flash within chips. Memory Limitations Push DRAM/NAND Maker To Get More Innovative, SanDisk Proposes The Stacking of NAND Flash Within Chips The rapid rise of AI & the proportional demand for compute has led to the exposure of bottlenecks, which are pushing DRAM and NAND manufacturers into going with the out-of-the-box approach. In the past, chipmakers called it a day by introducing new memory technologies, and DRAM was the primary component. But the rise in costs, development/yield drawbacks, & increased power have led to a […]

Read full article at https://wccftech.com/sandisk-bets-on-stacking-nand-and-compute-on-one-chip/

CPUs or GPUs, but require lots of memory for running Agentic AI, and this demand is spiraling to unseen levels as DRAM constraints persist. CPUs Running Agentic AI Will Be Equipped With Up to 400 GB of Memory, Further Crushing The DRAM Supply Chain Memory makers are earning big profits but are also unable to meet the demand. We have seen reports on how major manufacturers are rapidly expanding their production facilities, but these are yet to become operational, and Samsung itself has stated that 2027 will be worse for the DRAM industry than 2026, so it's looking like a […]

Read full article at https://wccftech.com/agentic-ai-pushes-cpus-to-pack-400-gb-of-memory-4x-more-than-today/