❌

Normal view

There are new articles available, click to refresh the page.
Before yesterdayMain stream

NVIDIA Vera Rubin NVL72 Enters The Stage With A Monstrous 10x Uplift In Token Throughput Versus Blackwell, Achieves 800,000 Tokens/s Vs GB200’s 80,000 at The Same 150MW

21 July 2026 at 15:00

NVIDIA Confirms Vera Rubin Launch In Q3 With Volume Ramp by Q4, As Blackwell Continues To See Massive Demand

NVIDIA's Vera Rubin is finally here, delivering unimaginable amounts of AI performance versus Blackwell as the first systems power on. NVIDIA Vera Rubin Now Deployed & Pumps Out 800,000 Tokens/s In DeepSeek-R1, Crushing Blackwell At The Same Wattage Well, it's here: the most powerful AI platform that the world has seen so far, Vera Rubin. Part of NVIDIA's Extreme Co-Design initiative, which aims to deliver a full-fledged stack of AI-ready hardware and software, enabling unprecedented levels of performance per watt & delivering the lowest token cost, Vera Rubin ushers in a new era of AI. The NVIDIA Vera Rubin platform […]

Read full article at https://wccftech.com/nvidia-vera-rubin-nvl72-enters-the-stage-with-a-monstrous-10x-uplift-in-ai-vs-blackwell/

Samsung Postpones HBM5E Memory Production Indefinitely After D1d DRAM Yields Fall Short of Internal Targets

22 April 2026 at 02:55

Samsung chip labeled HBM and Logic on a circuit board background.

Samsung's 1d DRAM (7th Gen 10nm) for next-generation HBM solutions might not undergo production soon due to failure to meet yields. Samsung's Next-Gen DRAM Tech For Future HBM5E Memory May Not Be Ready For Production A report published by Korean outlet, IT Chosun, suggests that due to less than ideal yields of its 1d "D1d" DRAM based on the 10nm process technology, Samsung might be pulling the plug on mass producing its next-gen HBM solutions. The DRAM technology had already received a pre-production approval (PRA), but concerns have been raised regarding the ROI of initiating a trial run, let alone […]

Read full article at https://wccftech.com/samsung-postpones-hbm5e-memory-production-indefinitely-d1d-dram-yields-fall-short/

130,000 Rubin GPUs Are Being Deployed at Nscale For Microsoft, Further Showing Massive Interest In NVIDIA’s Next-Gen AI Chips

21 April 2026 at 13:45

130,000 NVIDIA Rubin GPUs Are Being Deployed at Nscale For Microsoft, Further Showing Massive Interest In Next-Gen AI Chips 1

Nscale will be adding 30,000 NVIDIA Rubin GPUs in addition to the 100,000 chips that are already being deployed at its facilities in 2027. Nscale Scales Up Its AI Datacenters With 30,000 Additional NVIDIA Rubin GPUs, Bringing The Total Count To 130,000 NVIDIA's Vera Rubin AI chips are hot in demand, and the reason behind this is simple: they are aiming to be the fastest solution for AI inferencing, fueling the race towards Agentic AI. Josh Payne, Founder and CEO at Nscale said:Β β€œCustomer demand for advanced AI infrastructure continues to accelerate across markets, and our focus is on bringing the […]

Read full article at https://wccftech.com/130000-nvidia-rubin-gpus-deployed-at-nscale-for-microsoft-showing-massive-interest-in-next-gen-ai-chips/

Micron Begins Volume Production of 36GB HBM4, 28 Gbps PCI Gen6 SSDs, & 192 GB SOCAMM2 Memory For NVIDIA Vera Rubin Platform

16 March 2026 at 21:00

Micron HBM4 memory chip displayed next to its exposed circuitry on a black background.

Micron has commenced volume production of HBM4 DRAM, PCIe Gen6 SSDs & SOCAMM2 memory for NVIDIA's Vera Rubin platform. NVIDIA Vera Rubin Gets Full Support From Micron With Volume Production Beginning On HBM4 DRAM, PCIe Gen6 SSDs & SOCAMM2 Memory Press Release: Micron Technology has begun volume shipment of its HBM4 36GB 12H in the first quarter of calendar year 2026, and it is designed for NVIDIA Vera Rubin. With HBM4, Micron achieves over 11 Gb/s pin speeds, enabling a bandwidth greater than 2.8 TB/s, representing a 2.3 times bandwidth and greater than 20% power efficiency2 improvement over its HBM3E. […]

Read full article at https://wccftech.com/micron-volume-production-hbm4-gen6-ssds-socamm2-nvidia-vera-rubin-platform/

NVIDIA Vera Rubin Achieves 40 Million Times More Compute In 10 Years: 288 GB HBM4, 22 TB/s Bandwidth, 50 PFLOPs of AI Horsepower

16 March 2026 at 20:12

A lineup of NVIDIA hardware including 'Rubin,' 'Vera,' 'CX9,' 'BlueField-4,' 'NVLink-6 Switch,' 'Spectrum-X CPO,' 'Groq 3 LPU,' and various compute trays and servers displayed against a black background.

NVIDIA has officially unveiled its next-gen AI data center platform called Vera Rubin, powered by the Rubin GPU and Vera CPU architectures. NVIDIA Vera Rubin AI Data Center Offers A Stunning 40,000,000x Compute Growth Within A Decade The NVIDIA Vera Rubin platform is designed with a total of 7 chips and six different racks, each serving a singular purpose, to power next-gen AI datacenters. Those seven chips that have been announced today are: First up, we have the Vera Rubin Compute tray, and what has changed is the mounting system, with which AI data centers now take just 2 hours […]

Read full article at https://wccftech.com/nvidia-vera-rubin-achieves-40-million-times-more-compute-in-10-years/

Micron Ships Out the β€œWorld’s First” 256GB SOCAMM2 Modules Targeted Toward the Agentic AI Frenzy

3 March 2026 at 15:34

A close-up of a circuit board featuring Micron SOCAMM2 and LPDDR5X memory chips.

Micron's latest breakthrough in the memory industry is the debut of the more capable SOCAMM2 memory modules, featuring leading capacity and power efficiency. Micron's Newer SOCAMM2 Focuses On Reducing Bottlenecks With KV-Cache, Leading to Lower Latency Workloads With the 'applications' layer of AI, the memory bottleneck is growing as workloads continue to scale, which is why DRAM manufacturers have paid special attention to advancements being made with HBM and other AI-specific memory products. In Micron's latest announcement, the firm has set a "new benchmark" with SOCAMM2 memory modules, as they ramp up the per-module capacity to 256 GB, marking a […]

Read full article at https://wccftech.com/micron-ships-out-the-worlds-first-256gb-socamm2-modules/

NVIDIA’s CEO to Unveil Chips the β€œWorld Has Never Seen Before” at This Year’s GTC, Likely Pointing Toward Rubin or Next-Gen Feynman AI Lineups

18 February 2026 at 11:52

A person in a shiny jacket gestures with a pen against a backdrop of Earth viewed from space, connected by glowing lines.

NVIDIA's CEO has spoken about what we could see next at the company's GTC 2026 event, hinting that we could see chips that the "world has never seen before". NVIDIA's Next Stage at GTC Could Feature Next-Gen Feynman Chips, Possibly Showcasing Groq's LPU Integration NVIDIA has been at the forefront of the AI technological revolution, mainly through its compute portfolio and its ability to keep up with its product cycles. At CES 2026, we saw Team Green showcase its Vera Rubin AI lineup, revealing it was in full production and included six newly designed chips, including the Vera CPUs and […]

Read full article at https://wccftech.com/nvidia-ceo-to-unveil-chips-that-the-world-has-never-seen-before/

❌
❌