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Intel’s 18A-P Debuts Power Boost, an Industry-First Dual-Contact Transistor That Squeezes More Frequency From the Same Chip Footprint

16 June 2026 at 23:20

Intel Intros Diamond Rapids "Xeon 7" CPUs Built On 18A-P: Packing Up To 192 Cores, 16-Channel Memory, PCIe Gen6 Support, Launching In 2027

Intel is sharing more details of its 18A-P process technology, which is expected to see some major customer momentum. Intel's 18A-P Process Tech Is Just As Key To Its Foundry Business As 14A, And Chipzilla Is Further Sharing Its Benefits Over 18A Semiconductor manufacturing is a super-hard business, and Intel is working really hard to get its Foundry up to standards through the accelerated development of advanced process nodes and packaging technologies. Given its immense progress with 18A and the buzz surrounding its next process technologies, such as 14A, Intel Foundry is shaping up well. But they have a lot […]

Read full article at https://wccftech.com/intel-18a-p-debuts-power-boost-industry-first-dual-contact-transistor-more-frequency-same-chip-footprint/

Intel Foundry’s Rio Rancho Facility To Become Its Crown Jewel In Production of Next-Gen Glass Substrates

25 May 2026 at 12:10

Intel Foundry's Rio Rancho Facility To Become Its Crown Jewel In Production of Next-Gen Glass Substrates

Intel Foundry is leading the race towards Glass Substrates with its Rio Rancho facility, aiming to become the world's first to initiate mass production. Glass Substrates Are The Future of Semiconductors & Intel Foundry is Well on Its Way To Become The First To Initiate Mass Production Glass Core substrates have been gaining interest, as they have several benefits over traditional organic substrate solutions. The current substrates are also facing shortages due to the AI supercycle, leading one of the biggest substrate suppliers, Ajinomoto, to raise prices. These supply constraints are pushing the industry to look into new advanced packaging solutions, and […]

Read full article at https://wccftech.com/intel-foundry-rio-rancho-facility-crown-jewel-in-production-of-glass-substrates/

Apple Has Handed Intel A ‘Once-In-A-Generation’ Foundry Lifeline, Claims Analyst, But 80% Of The Orders Hinge On A Single iPhone Chip

14 May 2026 at 19:55

Intel and Apple logos displayed side by side.

Apple has given Intel "a once-in-a-generation window to rebuild its foundry," even if the initial order flow is quite tentative in its nature, claims the famous Apple-focused analyst, Ming-Chi Kuo. Around 80 percent of Apple's orders for Intel's 18A-P process reportedly consist of iPhone chips, "mirroring Apple's end-device sales mix" As we noted last week, Apple has now reached a preliminary chip fabrication deal with Intel. While the specifics of this agreement are not known at this time, it is likely to resemble the one between Apple and TSMC, where the former designs custom chips based on ARM's intellectual property, while the […]

Read full article at https://wccftech.com/apple-has-handed-intel-a-once-in-a-generation-foundry-lifeline-claims-analyst-but-80-of-the-orders-hinge-on-a-single-iphone-chip/

Apple Taps Intel 18A-P For M7 Chip By 2027 & 14A For iPhone Chip By 2028, Claims Rumor

13 May 2026 at 15:20

Apple Taps Intel 18A-P For M7 Chip By 2027 & 14A For iPhone Chip By 2028, Claims Rumor

TSMC's constraints have pushed Apple to make a chip-making deal with Intel, & is likely to produce two chips on 18A-P & 14A process technologies, as per rumors. Apple's Next-Gen MacBook & iPhone Chips Rumored To Be Made At Intel Using 18A-P & 14A Process Technologies Last week, it was revealed that Apple and Intel have signed a preliminary chipmaking agreement in which Apple would tap into Intel's Foundry business to produce its chips. The agreement is said to have been signed back in December 2025, as per GF Holdings, and plenty of other factors also forced Apple to go […]

Read full article at https://wccftech.com/apple-taps-intel-18a-p-for-m7-chip-by-2027-14a-for-iphone-chip-by-2028-rumor/

Trump Touted The “Tens Of Billions Of Dollars” The Government Has Made From Intel, While Selling A Deal To Apple That Undercuts TSMC By 25% On Wafer Pricing

9 May 2026 at 17:02

An Apple logo and an Intel chip are placed side by side on a blue circuit board.

Whatever else one might think of President Trump, it is plain as day that he is a connoisseur at shaping narratives. And, apparently, the President seems to have played a material role in selling an Intel deal to Apple, one that might accrue sizable short- and long-term benefits to the Cupertino-based tech giant. Apple's chip fabrication deal with Intel entails sizable margin benefits, reduces supply chain risks, and weakens TSMC's monopoly Apple has reached a preliminary chip fabrication deal with Intel, according to the Wall Street Journal. While the specifics of this agreement are not known at this time, it […]

Read full article at https://wccftech.com/trump-touted-the-tens-of-billions-of-dollars-the-government-has-made-from-intel-while-selling-a-deal-to-apple-that-undercuts-tsmc-by-25-on-wafer-pricing/

Intel’s Comeback Had A Trump & Musk Factor, But CEO Lip-Bu Tan’s Biggest Oppurtunity Lies Ahead

8 May 2026 at 14:40

President Trump wants Intel's CEO to resign

Intel's recent comeback has been spearheaded by CEO Lip-Bu Tan, who has turned around the company & made it the center of tech conversation. Winning Over President Trump & Elon Musk Was Just The Start, The Real Opportunity of Intel Lies Ahead As CEO Lip-Bu Tan Focuses on "Leadership Through Execution" Intel's success didn't come overnight. Just a year ago, the company's share was a mess, and it was facing internal and external crises at the same time. However, decisions made by former CEO Pat Gelsinger on the Foundry front and a solid roadmap framework, along with current CEO Lip-Bu […]

Read full article at https://wccftech.com/intel-comeback-trump-musk-factor-ceo-lip-bu-tan-biggest-oppurtunity-lies-ahead/

Intel’s 18A-P Goes Beyond a 9% Speed Bump, Adding 50% Better Thermal Conductivity and Tighter Skew Corners to Win Foundry Customers

30 April 2026 at 17:45

Intel's 18A-P Goes Beyond a 9% Speed Bump, Adding 50% Better Thermal Conductivity and Tighter Skew Corners to Win Foundry Customers

As Intel primes its 18A-P process technology at external customers, the company is sharing new insights into its enhanced performance & features. Intel's External Customer-Focused 18A-P Process Node Offers 9% Performance Boost or 18% Power Savings Versus 18A Intel's 18A process technology is ramping up well, with Panther Lake volume being increased significantly in the months ahead. As 18A becomes the standard for Intel's in-house chips, the company is also tuning its enhanced 18A-P node, which is a key technology aimed at attracting external Foundry customers. At VLSI, Intel will be sharing some more details about the features and enhancements […]

Read full article at https://wccftech.com/intel-18a-p-goes-beyond-speed-bump-adding-better-thermal-conductivity-to-win-foundry-customers/

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