❌

Normal view

There are new articles available, click to refresh the page.
Today β€” 28 July 2026Main stream

Google’s β€˜Frozen V2’ TPU hardwires SRAM onto silicon, ditching TSMC’s CoWoS packaging for Gemini

27 July 2026 at 18:10

A close-up of a circuit board showing multiple 'TPU v4' chips with cooling components attached.

With the AI race in full swing, big tech is constantly on the lookout to make custom chips that are able to compete with or offer alternatives to NVIDIA's pricey and short-in-supply GPUs. Google's Tensor Processing Units (TPUs) and Amazon's Trainium chips are among several that rely on less power consumption and costs to augment NVIDIA's products in AI computing. Now, a report from Morgan Stanley claims that Google's new TPU chips will be tailored to its Gemini models and eliminate the need for TSMC's chip-on-wafer-on-substrate (CoWoS) chip packaging technology. Google Is Considering To Place New TPU Chip's RAM Directly […]

Read full article at https://wccftech.com/googles-frozen-v2-tpu-hardwires-sram-onto-silicon-ditching-tsmcs-cowos-packaging-for-gemini/

Before yesterdayMain stream

Google Just Released Gemini 3.6 Flash, And It Might Be Its Worst Model To-Date

21 July 2026 at 16:43

Google is working on Gemini 2.0

Google could not have picked a worse time to deliver a chronically underpowered Gemini 3.6 Flash, coming right on the heels of stunning open-source AI models from China, such as Moonshot's Kimi K3, which employs novel architectural feats to deliver notable cost savings, all the while offering frontier-level performance. Google's Gemini 3.6 Flash performs worse than Meta Spark 1.1, GLM-5.2, GPT-5.6 Luna, Sonnet 5, Grok 4.5, and GPT-5.6 Terra Google has just released the all-new Gemini 3.6 Flash, sporting a context window of 1 million tokens, which is equivalent to 1,500 A4 pages of text, 30,000 lines of code, or […]

Read full article at https://wccftech.com/google-just-released-gemini-3-6-flash-and-it-might-be-its-worst-model-to-date/

Samsung Reportedly Outsources Google’s TPU I/O Late-Stage Design, Says Report

15 July 2026 at 18:12

Korean chip giant Samsung is reportedly considering outsourcing orders to design a portion of Google's Tensor Processing Unit (TPU) AI chips. Samsung is believed to be Google's manufacturing partner for the TPU chip's input/output (I/O) die. While the TPU's compute tile is expected to be manufactured by TSMC, the part on which the tile will be connected, called the I/O, is said to be Samsung's responsibility. For the I/O, Samsung is considering outsourcing the back-end design for the chip in order to ensure that Google's design is fit for its manufacturing facilities, says the Korean press. Several Korean Firms in […]

Read full article at https://wccftech.com/samsung-reportedly-outsources-googles-tpu-i-o-late-stage-design-says-report/

❌
❌