Intel Foundry is leading the race towards Glass Substrates with its Rio Rancho facility, aiming to become the world's first to initiate mass production. Glass Substrates Are The Future of Semiconductors & Intel Foundry is Well on Its Way To Become The First To Initiate Mass Production Glass Core substrates have been gaining interest, as they have several benefits over traditional organic substrate solutions. The current substrates are also facing shortages due to the AI supercycle, leading one of the biggest substrate suppliers, Ajinomoto, to raise prices. These supply constraints are pushing the industry to look into new advanced packaging solutions, and […]

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Amkor says that Glass Substrates, a packaging technology replacement for CoWoS spearheaded by Intel, is set for commercialization within 3 years. Intel-Partner, Amkor, Says Glass Substrates Will See First Commercialization Within Three Years Advanced Packaging is key to any major foundry business as chips are getting more and more complex to meet growing compute and memory demands. TSMC is the single-most important advanced packaging provider in the world thanks to its CoWoS 2.5D technology. Current chip requirements involve integration of HBM and logic chips in a single package & the number of HBM chips is expanding aggressively. Recently, OpenAI showcased […]

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