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Manli Announces β€œUnlimited Firepower” Series RTX 50 GPUs With A Feature That Notifies You About The GPU Sag

11 September 2026 at 14:34

A graphics card labeled UF GeForce RTX 5060 with the branding Unltd Firepwr and Mahi displayed prominently against a geometric teal and black background.

The company says the new feature can detect an abnormal GPU sag, notifying you through the app. Manli Celebrates 30th Anniversary by Launching "Unlimited Power" RTX 50 Series With Built-in G-Sensor to Detect GPU Sag NVIDIA's board partner Manli has announced a new family in its arsenal. It's called UF, or Unlimited Firepower (Unltd Firepwr), which introduces a stack of RTX 50 series GPUs. The company already has several GPU families such as Nebula, Polar Fox, Gallardo, and Stellar. The new UF family expands Manli's catalog with newer RTX 50 series GPUs, but it appears that the company has announced […]

Read full article at https://wccftech.com/manli-announces-uf-series-rtx-50-gpus/

ASUS TUF Gaming Laptop Hinge Broke When The Display Was Placed Upside Down; User Tried Mimicking Ongoing Trends Of Adopting A β€œCool” Setup, Only For It To Backfire

9 September 2026 at 18:52

ASUS TUF gaming laptop hinge broke when display was placed upside down

In a display of sheer stupidity, one ASUS TUF gaming laptop user managed to wreck the hinge of the machine when attempting to replicate one of the ongoing trends taking social media networks like Instagram by storm, showing off those β€œcool” setups. Naturally, looking at what people were attempting with their hardware, how could one resist the urge? Unfortunately, the experiment resulted in a disaster as the gaming laptop’s hinge broke, signaling a warning to those who want to keep their precious belongings intact. It was easier for the ASUS TUF to stomach the damage caused, seeing as how the […]

Read full article at https://wccftech.com/asus-tuf-gaming-laptop-hinge-breaks-upside-down-trend-setup/

SK Hynix Unpacks Advanced Packaging Technologies, Including Intel EMIB, For Its Next-Gen HBM Memory As It Eyes 3D Structures For The Future

23 August 2026 at 20:30

A slide titled 'Advanced PKG Future Direction' illustrates three structures: '2D Structure' with 'PKG to PKG on Board,' '2.5D Structure' with 'Die to Die on Interposer,' and '3D Structure' with 'Die on Die,' each depicted with different chip designs and connections.

SK Hynix is leveraging advanced packaging technologies such as Intel's EMIB for its next-gen HBM solutions, which will eventually enter the 3D packaging stage. Scaling HBM Comes With Big Challenges & SK Hynix Is Leveraging Advanced Packaging Solutions To Address Them As It Ventures Into The 3D Era At Hot Chips 2026, Jaesik Lee (VP Package Engineering at SK Hynix) presented the "Advanced Packaging for High-Bandwidth Memory" brief, which talks about how the company plans to leverage advanced packaging tech to accelerate its HBM roadmap. The company started by presenting how HBM is currently built. The HBM structure consists of […]

Read full article at https://wccftech.com/sk-hynix-advanced-packaging-technologies-intel-emib-next-gen-hbm-memory/

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