The lack of access to EUV paraphernalia in any way, shape, or form has forced China’s SMIC to come up with ingenious ways to leverage its existing DUV equipment to gradually improve its 7nm manufacturing process, and with Huawei’s Kirin 9030, the semiconductor manufacturer has proven that it can stand ‘toe to toe’ with TSMC, or can it? An in-depth look at the chipset powering the Mate 80 flagship series shows some impressive feats, such as achieving higher density than Intel’s 18A node through a smaller metal pitch, but that’s not the only metric worth comparing. In fact, SMIC and […]

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