Snapdragon 8 Elite Gen 6 Pro Live Chipset Die Leak Shows A Massive SoC Thanks To The New Heatsink Implementation That’s Meant To Cool The DRAM Effectively
The first design glimpse of Qualcomm’s upcoming flagship SoC, the Snapdragon 8 Elite Gen 6 Pro, revealed that the chipset has a Heat Pass Block similar to Samsung’s Exynos 2600. Now, we get to see this solution live because a real-life chipset die has been pictured, showing a significantly bigger area than the Snapdragon 8 Elite Gen 5, indicating that we could bear witness to exceptional thermals in the future. Snapdragon is finally prioritizing thermals with the Snapdragon 8 Elite Gen 6 Pro, with a new cooling solution The traditional PoP (Package-on-Package) implementation is expected to be retired with the arrival […]
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