Imitation remains the highest form of flattery. After Samsung won plaudits for the Exynos 2600's novel Heat Path Block (HPB) thermal technology, Qualcomm, whose recent chips iterations have resembled a veritable inferno when it comes to their runaway heat issues, now appears to be flattering Samsung by copying its HPB tech for the upcoming Snapdragon 8 Elite Gen 6 Pro, albeit sloppily so. Qualcomm appears to be trying to tame the furnace-like credentials of its Snapdragon chips by emulating Samsung's most innovative thermal solution While clarifying that Qualcomm has prepared two and not six versions of its Snapdragon 8 Elite […]

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Samsung made a generational leap by introducing a novel heat sink within the Exynos 2600 chip, substantially improving its thermal stability in the process. Even so, with the upcoming Exynos 2700 chip, Samsung intends to build on its budding momentum by opting for an innovative side-by-side (SBS) architecture alongside a more refined heat sink, unlocking a significant jump in memory bandwidth. Samsung is banking on a novel SBS architecture and a more refined heat sink to improve the real-world performance of its upcoming Exynos 2700 chip As a refresher, the Exynos 2700 chip is expected to leverage Samsung's SF2P process, […]

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