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Samsung bonds two 450-layer NAND cells into one chip as it chases 1000-layer SSDs that quadruple capacity by 2030

23 June 2026 at 16:10

Samsung Aims For 900+ Layer NAND SSD Storage Solutions By 2030, Uses Dual 450-Layer Cells Bonded Together

Samsung's next-generation NAND Flash for SSDs will offer over 900+ layers, with two stacks bonded together for increased storage capacities. Samsung Wants To Bond Two NAND Cells Together, Forming A Large 900-1000+ Layer Storage Solution For Future SSDs Last month, we reported that Samsung was working towards 1000-layer NAND using brand new materials and bonding technologies. At the VLSI Symposium 2026, Samsung has revealed its full plans on how they aim to achieve that goal. In its latest slide, Samsung states that there's a big demand for high-capacity SSDs, and they are working towards an accelerated roadmap that focuses on [โ€ฆ]

Read full article at https://wccftech.com/samsung-bonds-two-450-layer-nand-cells-chasing-1000-layer-ssds-quadruple-capacity-2030/

SK Hynix Races Samsung to 400+ Layer NAND, but Must Abandon Tungsten Entirely as Stacking Hits a Material Wall

11 June 2026 at 14:55

SK Hynix is expected to begin mass production of its 375-Layer NAND Flash solution by the end of 2026, offering higher storage capacities. SK Hynix Goes For 375-Layer NAND This Year & 480/604-Layer Follow-Ups In The Years Ahead SK Hynix and Samsung are in the race to reach the highest number of layers in the NAND Flash segment. While Samsung is aiming beyond 400-layers with dual stacking solutions going up to 1000-layers, Hynix will soon be commencing mass production on its 375-Layer NAND. As per sources of The Elec, it is reported that SK Hynix has completed the verification of [โ€ฆ]

Read full article at https://wccftech.com/sk-hynix-races-samsung-to-400-layer-nand-must-abandon-tungsten-as-stacking-hits-a-wall/

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