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SK Hynix Samples HBM4E With 48 GB Capacity and 16 Gbps as AI Chip Demand Forces DRAM Makers Into Overdrive

18 June 2026 at 01:35

A gold-framed silicon wafer by SK hynix and NVIDIA is displayed, with inscription Please Make and signed by Jensen Huang at GT Computex 2023, alongside specifications for 'HBM4E 48GB 12Hi'.

SK Hynix has commenced sampling of its next-gen HBM4E memory, offering up to 16 Gbps speeds and 48 GB capacities. SK Hynix Races Samsung In Sampling First HBM4E DRAM Modules For Next-Gen AI Solutions The acceleration in AI has pushed DRAM manufacturers to dial up their development plans. As such, SK Hynix is racing its rival Samsung to deliver the first HBM4E memory solutions to partners who will be using it to power their next-generation datacenters. The HBM4E memory will play a crucial role for next-gen datacenters as it will power some heavy-weight chips, NVIDIA Rubin Ultra, and AMD Instinct […]

Read full article at https://wccftech.com/sk-hynix-samples-hbm4e-memory-48-gb-capacity-16-gbps-speeds/

Datacenters Are Outstripping the Power Grid, Forcing NVIDIA and Google Into a Radical 800V DC Overhaul by Q3 2026

15 June 2026 at 17:00

A close-up view of a server rack with multiple Nvidia hardware components stacked vertically.

The datacenter segment is preparing for the first wave of next-gen 800V HDVC systems that will power NVIDIA & Google infrastructure this year. The Next-Generation of Power-Semis Is Coming Online This Year As NVIDIA & Google Prep For 800V Systems As Datacenters continue to outstrip electricity generation, the need for more power-efficient & versatile solutions has become essential. This is why major companies like NVIDIA & Google have invested heavily in 800V DC or HVDC (High-Voltage Direct Current) infrastructure to power their upcoming platforms like Vera Rubin and TPUs. The Power-Semi market is preparing to ship the first shipments required […]

Read full article at https://wccftech.com/datacenters-outstripping-power-grid-forcing-nvidia-google-into-a-radical-800v-dc-overhaul/

NVIDIA Rubin & Rubin Ultra Platforms Facing Design/Spec Issues As Per Rumors While AMD MI500 Positioned For 2H 2027 Launch

9 May 2026 at 14:00

An individual in a leather jacket is presenting a large circuit board design next to a stack of horizontal units.

NVIDIA's Rubin platforms are rumoredly facing design/spec issues, making way for the competition, such as AMD MI500, to get the headstart with HBM4E in 2027. Will AMD Beat NVIDIA In The Race To HBM4E? Design & Spec Changes In Rubin Platforms Can Give MI500 The Lead Based on recent reports, NVIDIA's upcoming Rubin and Rubin Ultra platforms are undergoing serious design and spec changes. These changes come ahead of the expected launch of the Rubin generation, which is going to uplift AI performance miles above Blackwell with new features, efficiency upgrades & brand new architectures. As per the rumors, NVIDIA […]

Read full article at https://wccftech.com/nvidia-rubin-rubin-ultra-platforms-facing-design-spec-issues-amd-mi500-positioned-for-2h-2027/

NVIDIA Feynman GPUs Push Power Semi Content To $191,000, 17 Times Increase Over Blackwell As Industry Embraces 800V DC Architectures

4 May 2026 at 16:00

NVIDIA Feynman GPUs Push Power Semi Content To $191,000, 17 Times Increase Over Blackwell As Industry Pushes 800V DC Architectures

As compute requirements grow in AI datacenters, so do the power requirements, which are estimated to reach 17x higher with NVIDIA's Feynman. NVIDIA Feynman Racks Estimated To Feature 17x Higher Power Semi Costs Per Rack Versus Blackwell NVIDIA Feynman GPUs feature several groundbreaking features and will launch in 2028, after Rubin. The company has been working hard to deliver more efficient AI solutions, but as requirements grow, power requirements have increased tremendously. Morgan Stanley Research has published a chart that visualizes the total power semi content of three AI rack solutions from NVIDIA. Starting with the baseline Blackwell or B200, […]

Read full article at https://wccftech.com/nvidia-feynman-gpus-push-power-semi-content-17-times-higher-vs-blackwell/

NVIDIA’s Rubin Ultra Reportedly Scaled Back to Dual-Die Design, Instead of the Ambitious Four-Die One, Amid Supply Chain Concerns

1 April 2026 at 13:56

A circuit board features two NVIDIA chips at its center with four large yellow components in a row above them.

NVIDIA's Rubin Ultra GPU has undergone a significant design revision, according to reports from Taiwanese media, which claim that Team Green wants to ensure supply chain complexities are minimal with the new generation. NVIDIA's Rubin Ultra Will Not Feature Four Dies On One Package, But Rather On a Single Board NVIDIA operates with a highly aggressive product cadence, and while the firm's official disclosure is to be at an annual cycle, the supply chain partners need to act a lot more quickly, which is why the timeline is shorter for them, likely at eight to ten months. With that, we […]

Read full article at https://wccftech.com/nvidias-rubin-ultra-reportedly-scaled-back-to-dual-die-design-instead-of-the-ambitious-four-die-one-amid-supply-chain-concerns/

NVIDIA Feynman GPU Gets 3D Die-Stacking, Custom HBM, & Next-Gen Rosa CPU

16 March 2026 at 20:32

A presenter on stage with a timeline slide detailing NVIDIA technologies from Blackwell to Feynman, featuring components like 'Blackwell H100Xe' and 'BlueField-5.'

NVIDIA has revealed more details of its next-generation AI Data Center solution, Rosa Feynman, built using 3D Die-Stacking. NVIDIA Goes With 3D Die Stacking & Custom HBM Solution For Its Next-gen Rosa Feynman AI Chips NVIDIA's Feynman GPU architecture was confirmed back at GTC 2025. During the announcement, NVIDIA listed the Feynman GPU with next-gen HBM, Vera CPU, and several other connectivity chips that make up the foundation of the AI data center. Well, this year at GTC 2026, NVIDIA is revealing more information and some big changes. First up, NVIDIA is now confirming that its Feynman GPUs will adopt […]

Read full article at https://wccftech.com/nvidia-feynman-gpu-gets-3d-die-stacking-custom-hbm-next-gen-rosa-cpu/

Rambus Intros Industry’s Fastest HBM4E Memory Controller: 60% Faster Vs HBM4 at 4.1 TB/s Per IC

4 March 2026 at 22:00

A close-up image of Rambus semiconductor chips labeled 'Rambus HBM4E'.

Rambus has announced the development of its fastest HBM controller yet, based on the HBM4E standard, offering up to 16 Gbps transfer speeds per pin. Ready For Next-Gen AI Data Center Superchips, Rambus Intros HBM4E Memory Controller As expected, Rambus has developed the world's fastest HBM4E memory controller, offering a 60% boost over its HBM4 controller with up to 16 Gbps pin speeds (vs 10 Gbps on HBM4) and up to 4.1 TB/s of total bandwidth per module (vs 2.56 GB/s on HBM4). The HBM4E standard will be utilized by NVIDIA's Rubin Ultra GPUs and AMD's MI500 series accelerators. Press […]

Read full article at https://wccftech.com/rambus-hbm4e-memory-controller-60-percent-faster-vs-hbm4-at-4-1-tbps/

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