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AMD and Intel arm x86 against the AI gap with ACE, baking matrix-multiply engines & low-precision formats straight into future CPUs

19 June 2026 at 12:05

An Intel and AMD branded processor displays 'x86' on its surface, surrounded by a circuit board.

ACE, the upcoming set of x86 Extensions defined by both AMD & Intel, has seen the latest spec release, focusing on AI acceleration. AMD & Intel Focus on AI Acceleration Through Next-Gen x86 Architectures That Are ACE Compliant Last year, Intel and AMD partnered to strengthen the x86 ecosystem through their "x86 Ecosystem Advisory Group" initiative. The plan was to offer a standardized set of features across architectures to make x86 accessible, scalable, and compatible with future requirements. Four key features were announced: FRED, AVX10, ChkTag, and ACE. Now, the latest ACE "AI Compute Extensions" specifications have been published by AMD […]

Read full article at https://wccftech.com/amd-intel-arm-x86-with-ace-matrix-multiply-engines-low-precision-ai-formats-future-cpus/

AMD reportedly exploring new nodes and chip packaging for Zen 7

26 May 2026 at 11:00

AMD is reportedly considering TSMC's A14 lithography node for its next-generation Zen 7 processor architecture. According to a recent report, the company has begun early supply chain preparations for the next-generation CPU architecture, following the high-volume production of its 2nm-based Zen 6 EPYC “Venice” server processors.

The report originates from Taiwanese media outlet Commercial Times (via Wccftech). For physical assembly, AMD is apparently exploring alternatives to TSMC by evaluating advanced packaging technologies from outside vendors such as Powertech. The report indicates that AMD is evaluating Fan-Out Panel-Level Packaging (FOPLP) solutions. The report also adds that this evaluation is being conducted alongside the development of next-generation 3D V-Cache implementations for the flagship Zen 7 product lines.

It is claimed that Zen 7 will increase AI processing efficiency and feature up to 16-cores per CCD. Other improvements may include the integration of AVX10, which combines AVX-512 and AVX2 vector math features, and AI Compute Extensions (ACE), an industry-standard instruction set designed to accelerate matrix multiplication workloads.

There is no word yet on when the first Zen 7 CPUs will launch, but they aren't expected until 2028.

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KitGuru says: Zen 7 is still quite a way off from hitting the consumer market, so plenty can change between now and then. 

The post AMD reportedly exploring new nodes and chip packaging for Zen 7 first appeared on KitGuru.

AMD & Intel’s ACE Partnership Significantly Boosts AI Performance As The “Standard Matrix-Acceleration Architecture” For x86 Chips

29 April 2026 at 17:25

An Intel and AMD branded processor displays 'x86' on its surface, surrounded by a circuit board.

ACE or AI Compute Extensions aim to revolutionize AI by bringing faster matrix-multiply performance as Intel & AMD work toward a unified path for x86 architectures. ACE Is Part of Intel and AMD's Unified x86 Strategy, Driving The Ecosystem In The AI Era With Faster Matrix Acceleration Last year, Intel and AMD partnered to strengthen the x86 ecosystem through their "x86 Ecosystem Advisory Group" initiative. The plan was to offer a standardized set of features across architectures in a bid to make x86 accessible, scalable, and compatible with future requirements. Four key features were announced: FRED, AVX10, ChkTag, and ACE. […]

Read full article at https://wccftech.com/amd-intel-ace-partnership-boosts-ai-performance-standard-matrix-acceleration-architecture-for-x86/

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