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SK Hynix Samples HBM4E With 48 GB Capacity and 16 Gbps as AI Chip Demand Forces DRAM Makers Into Overdrive

18 June 2026 at 01:35

A gold-framed silicon wafer by SK hynix and NVIDIA is displayed, with inscription Please Make and signed by Jensen Huang at GT Computex 2023, alongside specifications for 'HBM4E 48GB 12Hi'.

SK Hynix has commenced sampling of its next-gen HBM4E memory, offering up to 16 Gbps speeds and 48 GB capacities. SK Hynix Races Samsung In Sampling First HBM4E DRAM Modules For Next-Gen AI Solutions The acceleration in AI has pushed DRAM manufacturers to dial up their development plans. As such, SK Hynix is racing its rival Samsung to deliver the first HBM4E memory solutions to partners who will be using it to power their next-generation datacenters. The HBM4E memory will play a crucial role for next-gen datacenters as it will power some heavy-weight chips, NVIDIA Rubin Ultra, and AMD Instinct […]

Read full article at https://wccftech.com/sk-hynix-samples-hbm4e-memory-48-gb-capacity-16-gbps-speeds/

NVIDIA’s Rubin Ultra Reportedly Scaled Back to Dual-Die Design, Instead of the Ambitious Four-Die One, Amid Supply Chain Concerns

1 April 2026 at 13:56

A circuit board features two NVIDIA chips at its center with four large yellow components in a row above them.

NVIDIA's Rubin Ultra GPU has undergone a significant design revision, according to reports from Taiwanese media, which claim that Team Green wants to ensure supply chain complexities are minimal with the new generation. NVIDIA's Rubin Ultra Will Not Feature Four Dies On One Package, But Rather On a Single Board NVIDIA operates with a highly aggressive product cadence, and while the firm's official disclosure is to be at an annual cycle, the supply chain partners need to act a lot more quickly, which is why the timeline is shorter for them, likely at eight to ten months. With that, we […]

Read full article at https://wccftech.com/nvidias-rubin-ultra-reportedly-scaled-back-to-dual-die-design-instead-of-the-ambitious-four-die-one-amid-supply-chain-concerns/

Rambus Intros Industry’s Fastest HBM4E Memory Controller: 60% Faster Vs HBM4 at 4.1 TB/s Per IC

4 March 2026 at 22:00

A close-up image of Rambus semiconductor chips labeled 'Rambus HBM4E'.

Rambus has announced the development of its fastest HBM controller yet, based on the HBM4E standard, offering up to 16 Gbps transfer speeds per pin. Ready For Next-Gen AI Data Center Superchips, Rambus Intros HBM4E Memory Controller As expected, Rambus has developed the world's fastest HBM4E memory controller, offering a 60% boost over its HBM4 controller with up to 16 Gbps pin speeds (vs 10 Gbps on HBM4) and up to 4.1 TB/s of total bandwidth per module (vs 2.56 GB/s on HBM4). The HBM4E standard will be utilized by NVIDIA's Rubin Ultra GPUs and AMD's MI500 series accelerators. Press […]

Read full article at https://wccftech.com/rambus-hbm4e-memory-controller-60-percent-faster-vs-hbm4-at-4-1-tbps/

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