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Yesterday β€” 30 July 2026Technology

Apacer CEO Warns That Commodity DRAM Supply Will Fall By 70% In 2027, Echoing A Doomsday Take From The CEO Of SK hynix

29 July 2026 at 18:05

SK hynix working on a new DRAM architecture to bring the real on-device AI to smartphones

It seems hell hath no fury like a commodity DRAM chip spurned. As HBM continues to hog DDR wafers, the supply of DRAM might plummet as much as 70 percent in 2027, according to the CEO of Apacer, which echoes recent pronouncements from the CEO of SK hynix. The CEO of Apacer expects the supply of commodity DRAM to fall off the proverbial roof in 2027, echoing pronouncements from the CEO of SK hynix, who thinks "next year will be the worst year in the industry's history from the supply perspective" According to the CEO of Apacer, C.K. Chang, DRAM […]

Read full article at https://wccftech.com/apacer-ceo-warns-that-commodity-dram-supply-will-fall-by-70-in-2027-echoing-a-doomsday-take-from-the-ceo-of-sk-hynix/

Before yesterdayTechnology

China Develops Its First 3.5D β€œInfinity Chiplet” & 3D DRAM Tech As It Tackles External HBM Constraints Through Domestic AI Supply Chain

15 July 2026 at 11:20

China Develops Its First 3.5D "Infinity Chiplet" & 3D DRAM Tech As It Tackles External HBM Constraints Through Domestic AI Supply Chain

China's DFSX is working on fueling its domestic AI supply chain with next-gen 3.5D "Infinity Chiplet" architectures & 3D DRAM technologies. DFSX Is Working on China's First DF1000 AI Accelerator With 3D DRAM Technology, Also Unveils 3.5D+ Packaging DFSX recently hosted a presentation where they announced China's first 3D AI chip that is built entirely using China's domestic supply chain. There is a lot to unpack here, but the key product is the DF1000, which is a software-defined near-in-memory computing AI accelerator that will be used by domestic AI and tech firms. DF1000 - China's First 3D DRAM-Powered AI Accelerator […]

Read full article at https://wccftech.com/china-develops-first-3-5d-infinity-chiplet-3d-dram-tech-as-it-tackles-external-constraints/

China’s YMTC Fires Back at US Chip Restrictions with Three New Fabs Set to Double Its Wafer Output

14 April 2026 at 22:55

An aerial view of the Yangtze Memory Technologies factory with a large logo and the text 'YANGTZE MEMORY' in the top left corner.

As the United States continues to hammer down trade restrictions on China, YMTC has decided to uplift the chipmaking capacity by building new fabs. China & US Trade Wars Continue, In the Midst, YMTC Decides To Double Its Production Capacity With Two Brand New Chipmaking Factories The semiconductor industry is currently facing a trade war between two giants. On one hand, there's the United States, and on the other, there's China. From export restrictions to the banning of necessary tools that are required for making chips, the United States is trying to ensure that China doesn't get bleeding-edge materials and […]

Read full article at https://wccftech.com/china-to-double-chip-making-capacity-with-three-new-ymtc-fabs-tackle-us-restrictions/

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