Supermicro has introduced three new compact edge computing systems based on AMD’s EPYC 4005 series processors, expanding its push into AI workloads beyond the traditional data center. The new lineup includes the AS-E300-14GR, AS-1116R-FN4, and AS-3015TR-i4.

The systems are designed for deployments where space is tight, power is limited, and dedicated IT support may not be readily available. That makes them a good fit for settings such as retail stores, manufacturing sites, healthcare environments, and branch offices, where companies increasingly process data locally rather than sending it back to centralized infrastructure.

Supermicro says the systems are built for real-time inference and other business-critical edge workloads, with a focus on keeping power consumption and operating costs in check. Use cases include loss prevention, frictionless checkout, and in-store analytics, as well as other applications that rely on fast on-site processing.

All three systems include security features that are becoming standard requirements in edge and distributed IT environments. They support TPM 2.0 and AMD Secure Encrypted Virtualization (SEV) to help protect workloads and data. Those features are paired with IPMI 2.0 remote management, which simplifies monitoring and administration for systems deployed far from centralized IT teams.

The platforms also include four GbE ports, enabling connections to point-of-sale infrastructure, cameras, and enterprise networks. This capability is important in edge environments where a single system may need to interface with multiple devices and applications simultaneously, particularly in retail and industrial settings.

At the processor level, the new systems are built around AMD’s EPYC 4005 series, based on the company’s Zen 5 architecture. The chips support DDR5 memory and PCIe Gen 5, with TDPs starting at 65W. Some models also feature AMD’s 3D V-Cache, which can boost performance in data-intensive workloads by improving access to frequently used data.

Supermicro AS-E300-14GR

First is the AS-E300-14GR, a compact 1U mini box system housed in a 2.5-liter enclosure. It supports up to 16-core processors and up to 192GB of DDR5 memory, and is designed for embedded or space-constrained environments. Supermicro said it is suited to point-of-sale applications via HDMI and MiniDisplay connectivity, as well as network gateway roles. It includes a dedicated out-of-band management port alongside four GbE ports.

The AS-E300-14GR is a Mini-1U embedded system that supports up to 192GB of DDR5-5600 memory across four DIMM slots, a substantial amount for a compact edge box.

On the storage side, it includes one internal 2.5-inch SATA bay, two M.2 PCIe 5.0 x4 NVMe slots, and a low-profile PCIe 5.0 x16 slot for expansion or accelerator support. Connectivity is a strong point, with four 1GbE LAN ports, a dedicated BMC management port, rear USB 3.2 ports, HDMI 2.1, and Mini-DP. All of that fits inside a fan-based embedded chassis measuring just 264.8 x 43 x 225.8mm, making it a practical option for edge deployments where space is limited but performance, networking, and remote management still matter.

Supermicro AS-E300-14GR Specifications

Specification	AS-E300-14GR
Overview
Model	IoT SuperServer AS -E300-14GR
System Type	Mini-1U embedded system with AMD EPYC 4004/4005 Series Processor up to 65W TDP
Key Applications	Healthcare, Surveillance Security Server, AI Inference, Digital Signage / PoS,
Form Factor	Fan-based Embedded
Chassis	CSE-E300
Motherboard	Super H14SRV-HLN4F
Processor and Memory
Processor	Single Socket AM5 (LGA-1718) AMD EPYC 4005/4004 Series Processor 16C/32T; 64MB Cache
System Memory	Slot Count: 4 DIMM slots Max Memory (1DPC): 192GB 5600MT/s ECC/non-ECC DDR5 UDIMM
Storage and Expansion
Drive Bays Configuration	Default: Total 1 bay 1 internal fixed 2.5″ SATA* drive bay (*SATA support may require additional storage controller and/or cables)
M.2	1 M.2 PCIe 5.0 x4 NVMe slot (M-key 2280) 1 M.2 PCIe 5.0 x4 NVMe slot (M-key 22110)
Expansion Slots	Default* 1 PCIe 5.0 x16 (in x16) LP slot (*Requires additional parts, please see the optional parts list for details. For more details on PCIe slot configuration options, please refer to the system callout images above.)
Networking and I/O
LAN	4 RJ45 1 GbE LAN ports (Intel I350-AM4) 1 RJ45 1 GbE Dedicated BMC LAN port (ASPEED AST2600)
USB	2 USB 3.2 Gen2 Type-A ports(Rear) 1 USB 3.2 Gen1 Type-A port(Rear) 1 USB 3.2 Gen1 Type-C port(Rear)
Video	1 HDMI 2.1 port(Rear) 1 Mini-DP port(Rear)
TPM	1 TPM header 1 TPMOnboardd/port 80Onboard
d Devices	AMD B650
Power, Cooling, and Management
System Cooling	Fans: Up to 1 CPU heatsink with 70x70x15mm Fan(s) Up to 2x 4-PIN PWM 40x40x28mm Fan(s)
Power Supply	1 x 180W power supply
System BIOS	BIOS Type: AMI 32MB UEFI BIOS Features: ACPI 6.5 SMBIOS 3.7 or later UEFI 2.9
Management	SuperCloud Composer; Supermicro Server Manager (SSM); Super Diagnostics Offline (SDO); Supermicro Thin-Agent Service (TAS); SuperServer Automation Assistant (SAA) New!; Plug-ins for 3rd Party Software
PC Health Monitoring	FAN: Status monitor for speed control
Physical and Environmental
Enclosure	264.8 x 43 x 225.8mm (10.43″ x 1.69″ x 8.89″)
Package	381 x 276 x 142mm (15″ x 10.87″ x 5.59″)
Weight	Gross Weight: 7.5 lbs (3.4 kg) Net Weight: 3.7 lbs (1.6 kg)
Available Color	Black
Operating Environment	Operating Temperature: 0°C to 40°C (32°F to 104°F) with 0.7 m/s airflow Non-operating Temperature: -40°C to 70°C (-40°F to 158°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing)

Supermicro AS-1116R-FN4

The AS-1116R-FN4 is a compact 1U rackmount system designed for installations where storage density and rack efficiency are priorities. It is geared toward branch offices and retail back-end consolidation, where organizations may want to consolidate multiple workloads into a smaller physical footprint.

The AS-1116R-FN4 takes a more rack-focused approach while keeping the footprint compact. It is also a Mini-1U system with a 249mm short-depth chassis and support for up to 192GB of DDR5-5600 memory. Storage is more flexible than in the smaller box system, with support for either two internal 2.5-inch NVMe bays or one internal 3.5-inch SATA bay, plus two M.2 PCIe 5.0 slots.

It also includes a low-profile PCIe 5.0 x16 expansion slot, four 1GbE LAN ports, a dedicated BMC management port, rear USB connectivity, HDMI 2.1, and Mini-DP. With a 200W Gold power supply, three counter-rotating fans, and remote management support, it is well-suited for branch, retail back-end, and other edge deployments that require server-class features in a very compact rackmount chassis.

Supermicro AS-1116R-FN4 Specifications

Specification	AS-1116R-FN4
Overview
Model	IoT SuperServer AS -1116R-FN4
System Type	H14 1U Ultra-short depth 249mm chassis with AMD EPYC 4005/4004 65W server
Key Applications	AI Inference and Machine Learning, Cloud Computing, Healthcare, Surveillance Security Server
Form Factor	Mini-1U
Chassis	CSE-505-203B
Motherboard	Super H14SRV-HLN4F
Processor and Memory
Processor	Single Socket AM5 (LGA-1718) AMD EPYC 4005/4004 Series Processor 16C/32T; 64MB Cache
System Memory	Slot Count: 2 DIMM slots Max Memory (1DPC): 192GB 5600MT/s ECC/non-ECC DDR5 UDIMM
Storage and Expansion
Drive Bays Configuration	Default: Total 2 bays 2 internal fixed 2.5″ NVMe drive bays Option A: Total 1 bay 1 internal fixed 3.5″ SATA drive bay
M.2	1 M.2 PCIe 5.0 x4 slot (M-Key 2280) 1 M.2 PCIe 5.0 x4 NVMe slot (M-key 22110)
Expansion Slots	1 PCIe 5.0 x16 (in x16) LP slot
Networking and I/O
LAN	4 RJ45 1 GbE LAN ports (Intel I350-AM4) 1 RJ45 1 GbE Dedicated BMC LAN port (ASPEED AST2600)
USB	1 USB 3.2 Gen2 Type-C port(Rear) 2 USB 3.2 Gen2 Type-A ports(Rear) 1 USB 3.0 Gen2 Type-A port(Rear)
Video	1 HDMI 2.1 port(Rear) 1 Mini-DP port(Rear)
TPM	1 TPM header 1 TPOnboardrd/port 8Onboard
rd Devices	AMD B650
Power, Cooling, and Management
System Cooling	Fans: 3 counter-rotating 40x40x28mm Fan(s) Air Shroud: 1 Air Shroud
Power Supply	1x 200W Gold Level (91%) power supply
System BIOS	BIOS Type: AMI 32MB UEFI BIOS Features: ACPI 6.5 SMBIOS 3.7 or later UEFI 2.9
Management	SuperCloud Composer; Supermicro Server Manager (SSM); Super Diagnostics Offline (SDO); Supermicro Thin-Agent Service (TAS); SuperServer Automation Assistant (SAA) New!; Plug-ins for 3rd Party Software
PC Health Monitoring	FAN: Status monitor for speed control
Physical and Environmental
Enclosure	437 x 43 x 249mm (17.2″ x 1.7″ x 9.8″)
Package	655 x 155 x 465mm (25.8″ x 6.1″ x 18.3″)
Weight	Gross Weight: 10 lbs (4.54 kg)
Available Color	Black
Operating Environment	Operating Temperature: 0°C to 40°C (32°F to 104°F) Non-operating Temperature: -40°C to 70°C (-40°F to 158°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing)

Supermicro AS-3015TR-i4

Lastly, the AS-3015TR-i4 is a slim tower system designed for quieter environments and for easier installation in edge locations without dedicated server rooms. The data sheet was unavailable; however, the tower can accommodate a dual-slot GPU measuring 2.7 inches high by 6.6 inches long, including support for a dual-slot GPU such as the NVIDIA RTX PRO 2000 Blackwell. The 9-liter chassis also includes options for a slim optical drive and a 3.5-inch disk drive, providing additional flexibility for edge deployments that still require local media or storage.

Supermicro AMD EPYC 4000 Systems

The post Supermicro Unveils Three New Edge AI Systems Built on AMD EPYC 4005 appeared first on StorageReview.com.

Backblaze has published its Q1 2026 Performance Stats report, a quarterly series comparing cloud storage performance across Backblaze B2, AWS S3, Cloudflare R2, and Wasabi Object Storage. The report covers testing in US-East and EU-Central and includes both the results and the methodology used, with the stated goal of letting others review, reproduce, and compare the findings. As with any vendor-produced benchmark, the data comes from the company running the tests, so the results should be read with that context in mind.

Backblaze says its early Q1 2026 testing showed faster average upload and download times in US-East for most providers and file sizes than in Q4 2025, while results in EU-Central followed a different pattern. The data also showed wider variation in sustained throughput than in average transfer times, especially in multithreaded tests, and Backblaze noted that some of its own larger-file throughput tests hit rate limits, which it disclosed in the methodology update.

Backblaze Cloud Storage Performance Results Q1 2026: US-East

US-East was one of two regions included in Backblaze’s Q1 2026 testing, alongside EU-Central. The upload test measures average time, in milliseconds, to upload files of 256KiB, 2MiB, and 5MiB, using averages collected across a month. Lower times indicate better results. Based on Backblaze’s test data, Backblaze B2 posted the lowest average upload time for 256KiB files at 7.08 ms and for 5MiB files at 87.62 ms, while Wasabi recorded the lowest result for 2MiB files at 56.74 ms.

The quarter-over-quarter comparison indicates lower average upload times across all providers that had prior-quarter data in US-East. Backblaze, AWS S3, and Cloudflare R2 each posted lower averages than in Q4 2025 across the three file sizes shown. Wasabi was not included in the earlier quarter’s chart, so there is no direct Q4 comparison for that provider in this section.

In US-East multithreaded upload testing over five minutes, higher totals indicated more data transferred during the test window. Backblaze included two sets of results for its own service: one under standard conditions and one marked rate-limited. The 256KiB and 5MiB figures were identical in both cases at 80.00 and 324.00, while the larger file sizes diverged after rate limits were triggered.

For 50MiB files, Backblaze B2 was listed at 1,194.80, versus 544.70 for the rate-limited account. For 100MiB files, it was 1,726.10 versus 563.50. Backblaze says these larger-size results reflect bandwidth caps encountered during testing and notes that other providers may apply different limits under their own policies.

Across the same test, Wasabi posted the highest figures in all four file-size categories shown: 157.30 for 256KiB, 815.80 for 5MiB, 2,488.50 for 50MiB, and 3,030.90 for 100MiB. AWS S3 was listed at 84.40, 774.70, 2,238.90, and 2,947.20, while Cloudflare R2 was listed at 28.40, 366.30, 510.10, and 1,450.40.

Backblaze also notes that quarter-over-quarter comparisons in this test are limited because the methodology changed, so these figures are best read as part of an early dataset produced under the company’s test setup.

US-East Five Minute Single-Threaded Upload Test

The five-minute single-threaded upload test measures sustained upload throughput with a single thread across four file sizes. In US-East, Backblaze posted the highest result for 256KiB at 9.40, 50MiB at 119.20, and 100MiB at 164.00. AWS S3 led the 5MiB category at 44.70, just ahead of Wasabi at 44.60. Cloudflare R2 trailed the other providers across all four sizes, with results of 1.20, 15.00, 50.90, and 64.20.

The spread between the highest and lowest results widened as file sizes increased. At 256KiB, the gap ran from 1.20 to 9.40. At 100MiB, it ranged from 64.20 to 164.00. Based on Backblaze’s test setup, the single-threaded results show a narrower contest among Backblaze, AWS, and Wasabi at 5MiB and above. At the same time, Cloudflare R2 posted materially lower figures in this set of US-East upload measurements.

US-East Download Testing

In US-East download testing, AWS S3 had lower average times and lower TTFB for 256KiB and 5MiB downloads, while Backblaze posted the lowest average download time for 2MiB files. The quarter-over-quarter view showed lower download times across many categories for providers with prior data, but the dataset remains limited, and Wasabi had no Q4 comparison in these charts.

In the five-minute multithreaded download benchmark, Backblaze led at 256KiB; AWS S3 led at 5MiB and 50MiB; and Cloudflare R2 led at 100MiB, with Backblaze also reporting separate rate-limited results for its own service. In the five-minute single-threaded download test, Wasabi led at 256KiB and 5MiB, while Backblaze led at 50MiB and 100MiB. Across these download results, rankings varied by test type and file size, making the data more useful as a snapshot of the Backblaze test environment than as a definitive measure of overall provider performance.

Five-minute single-threaded download throughput

In US-East single-threaded download throughput over five minutes, Wasabi posted the top result for smaller files, leading at 256KiB with 11.20 and at 5MiB with 55.70. Backblaze led the larger file sizes, recording 95.90 at 50MiB and 164.00 at 100MiB. AWS S3 stayed close to the leaders in each category, with 5.60, 47.00, 87.90, and 138.10, while Cloudflare R2 trailed on all four file sizes at 2.70, 28.40, 78.10, and 64.20. The spread was narrower at the smallest file sizes and wider at 100MiB, where Backblaze posted the highest result.

Backblaze Cloud Storage Performance Results Q1 2026: EU-Central

Upload Averages

In the EU-Central average upload times, Cloudflare R2 posted the lowest results for 256KiB files at 8.94 ms, while Backblaze posted the lowest times for 2MiB at 47.32 ms and 5MiB at 87.54 ms. AWS S3 recorded 17.14 ms, 68.93 ms, and 87.98 ms across the three file sizes, and Wasabi posted 11.48 ms, 63.24 ms, and 98.89 ms. These results differed from the US-East pattern, with provider rankings changing by region in Backblaze’s test setup.

Upload Throughput

In the EU-Central five-minute multithreaded upload throughput, higher results favored Wasabi at 256KiB with 147.10 and at 100MiB with 2,990.60, while AWS S3 led at 5MiB with 848.10 and at 50MiB with 2,515.00. Backblaze listed 104.70, 216.40, 843.40, and 896.70 for its standard account, alongside separate rate-limited results of 104.70, 216.40, 561.00, and 500.70.

In the five-minute single-threaded upload test, Wasabi led all four file sizes at 8.20, 47.40, 113.60, and 169.60, ahead of Backblaze at the smallest size and AWS S3 at the larger sizes. Across both throughput tests, Cloudflare R2 trailed the other providers in EU-Central.

Download Averages and TTFB

In the EU-Central average download testing, lower times favored Cloudflare R2 in three categories. It posted the lowest time to first byte at 108.84 ms, the lowest 256KiB average at 76.97 ms, and the lowest 2MiB average at 110.79 ms. AWS S3 led the 5MiB category at 141.63 ms. The spread across providers was wide in several categories. Backblaze recorded 284.61 ms for TTFB and 230.01 ms, 318.20 ms, and 407.49 ms for average downloads of 256KiB, 2MiB, and 5MiB, which were the highest figures in this EU-Central set.

Download Throughput

In the EU-Central five-minute multithreaded download throughput, Backblaze led the 256KiB category at 198.30, while AWS S3 led the 5MiB category at 1,382.80, the 50MiB category at 1,761.00, and the 100MiB category at 1,665.10. Backblaze also showed a separate rate-limited line for its own service, with materially lower figures at the larger file sizes.

In the five-minute single-threaded download test, Wasabi led 256KiB at 9.20, while AWS S3 led 5MiB at 50.10, 50MiB at 90.10, and 100MiB at 91.40. Across these EU-Central download tests, the top result varied by file size and test type, while Cloudflare R2 was strongest in average download latency rather than sustained download throughput.

What to Make of the Data

Backblaze says it ran these benchmarks using repeatable synthetic tests from a Vultr-hosted Ubuntu virtual machine in each region, with traffic routed through Catchpoint to each provider’s object storage service. The testing looked at average upload times for 256KiB, 2MiB, and 5MiB files, along with download time to first byte and average download times for those same file sizes. It also ran separate five-minute throughput tests for uploads and downloads using both single-threaded and 20-thread workloads, with file sizes of 256KiB, 5MiB, 50MiB, and 100MiB. Since Backblaze designed and ran the tests itself, it’s important to note that the figures should be viewed as vendor-published benchmark data rather than as an independent third-party study.

Backblaze also lays out several limitations, noting that synthetic testing does not capture the full range of real production workloads, global network conditions, concurrency patterns, or data locality. Backblaze also said that they cannot control routing and peering once traffic leaves the test node, and that caching, traffic shaping, or rate limiting may have affected some results. Moreover, its current setup still has some limitations regarding large-file testing. It points to Wasabi temporarily blacklisting test IPs during high-volume testing as one example of how provider policies can influence the numbers.

The results also varied depending on region, file size, and test type, which is why they described the dataset as directional rather than definitive. Backblaze says it plans to expand the testing over time to cover more regions, workloads, and conditions.

For anyone comparing cloud storage options, these results are most useful as one reference point alongside testing in their own environment.

Backblaze Performance Stats Q1 2026 full report

The post Backblaze Publishes Q1 2026 Cloud Storage Performance Results appeared first on StorageReview.com.

Veeam has launched the Veeam Intelligence MCP Server, designed to bring backup, recovery, malware, and compliance information into broader enterprise IT operations. The server is built to give teams a single conversational interface for day-to-day operations, planned infrastructure changes, and incident response, with customer control over deployment, data exposure, and integration with AI clients.

Veeam states that the server is designed for environments where operational signals cover backup solutions, monitoring tools, ticketing systems, security platforms, and other systems. Veeam says it is designed to reduce the manual work of checking multiple consoles, correlating alerts across platforms, and moving information between teams during an outage or investigation. Instead of requiring staff to work through separate interfaces, the system is designed to make Veeam Intelligence available within broader operational workflows through the Model Context Protocol, or MCP.

Through MCP, the server enables organizations to integrate Veeam’s data protection and recovery with information from external systems into a single workflow. That includes the ability to compare Veeam’s protection, recovery, malware, and compliance signals with events from IT service management platforms, cloud environments, security products, storage systems, and monitoring tools. The goal is to make it easier for operators to ask natural-language questions, investigate issues that span multiple systems, and get a consolidated operational view without switching between separate products.

In its current form, the server focuses on read-only access, cross-system visibility, and investigation workflows. No destructive or configuration-changing actions are enabled by default. Queries are described as authenticated, authorized, and fully auditable, with a separation between present-day intelligence features and any future action-based capabilities. It is deployed locally as a Docker container and is fully operated and governed by the customer or their service provider.

Veeam also says customers can choose which MCP-compatible AI clients to use, including local or self-hosted large language models such as ChatGPT and Claude, depending on their own security and data sovereignty requirements.

Use Cases

Veeam highlights morning health checks, pre-change validation, ransomware triage, and root cause analysis as use cases for the server. These scenarios focus on giving teams a prioritized view of health and recoverability; confirming that backup jobs, repositories, and configuration backups are resilient to upcoming changes; correlating malware events with affected workloads and clean restore points; and consolidating information such as session histories, repository health, and proxy states when jobs fail.

It will launch with support for Veeam Backup & Replication, Veeam ONE, and Veeam Service Provider Console. The server is open source and available on GitHub.

The post Veeam Releases Open-Source MCP Server for Backup and Recovery Intelligence appeared first on StorageReview.com.

Dell has introduced a broad refresh of its commercial portfolio, covering notebooks, desktops, monitors, and peripherals, with the update centered on the new Dell Pro family across Premium, Pro 7, Pro 5, and Pro 3 tiers. The announcement covers Intel and AMD notebook options, a new Pro 5 Micro desktop, expanded Pro P monitor offerings with built-in conferencing and hub features, and new accessories focused on security and daily office use. This gives the launch a broader scope than a typical PC refresh.

Dell Pro 3 14/16 (Intel)

First up is the Dell Pro 3 14/16, a business laptop line available in 14-inch (P314260) and 16-inch (P316260) models. The Intel version uses Series 3 Intel Core Ultra and Series 3 Intel Core configurations, paired with integrated Intel Graphics, support for Windows 11 Pro, Windows 11 Home, selected Windows 11 Pro Education configurations, and Ubuntu Linux 24.04. Memory goes up to 64GB of DDR5 at 5600 MT/s, and storage reaches 2 TB of SSD, which gives the system enough capacity for standard office workloads, heavier multitasking, and users working across large numbers of browser tabs and business apps at once.

Screen options are one of the main differences between the two sizes: The 14-inch model includes multiple 1920×1200 panels, including a 400-nit non-touch option, a 400-nit touch display with 100% sRGB and ComfortView Plus, and a 500-nit non-touch panel with 1-120Hz VRR, 100% sRGB, ComfortView Plus, Super Low Power, and a lightweight design. The 16-inch version keeps 1920×1200 resolution and offers non-touch and touch options in a larger format. Battery options range from 45 Wh to 70 Wh, and ExpressCharge and ExpressCharge Boost capabilities across the lineup. Regarding weight, the 14-inch model begins at 2.89 lb / 1.31 kg, while the 16-inch version starts at 4.21 lb / 1.91 kg.

Port selection surpasses many current thin business notebooks, offering both sizes with 2 x Type-C Thunderbolt 4/USB4 ports, 2 x Type-A USB 3.2 Gen1 ports, HDMI 2.1, RJ45 Ethernet, a headset port, an optional external nano SIM tray, and a Kensington Wedge-Shaped Lock Slot. Wireless options include Wi-Fi 7 BE211 or Wi-Fi 6E AX211, with optional 5G and 4G LTE on supported Series 3 Intel Core Ultra configurations. Dell also includes Intel vPro Manageability with Intel AMT, TPM 2.0 FIPS-140-3 Certified / TCG Certified, Quantum-resistant BIOS, a chassis intrusion switch, camera shutter, and optional fingerprint reader and IR camera features for environments where deployment, device control, and login security are key.

Features	Dell Pro 3 14	Dell Pro 3 16
Specifications
Model Number	P314260	P316260
Processor Options	Series 3 Intel Core Ultra – CoPilot+ PC Series 3 Intel Core – AI PC Availability coming soon	Series 3 Intel Core Ultra – CoPilot+ PC Series 3 Intel Core – AI PC Availability coming soon
Graphics	Intel Graphics	Intel® Graphics
Memory	16 GB DDR5, 5600 MT/s, single or dual-channel 32 GB DDR5, 5600 MT/s, single or dual-channel 64 GB DDR5, 5600 MT/s, dual-channel	16 GB DDR5, 5600 MT/s, single or dual-channel 32 GB DDR5, 5600 MT/s, single or dual-channel 64 GB DDR5, 5600 MT/s, dual-channel
Storage	256 GB SSD, TLC 512 GB SSD, TLC, SED 512 GB SSD, TLC 512 GB SSD 1 TB SSD, TLC 1 TB SSD 2 TB SSD	256 GB SSD, TLC 512 GB SSD, TLC, SED Ready 512 GB SSD, TLC 512 GB SSD 1 TB SSD, TLC 1 TB SSD 2 TB SSD
Display	14″ WUXGA (1920×1200), Non-Touch, 60Hz, 400 nits, 62.5% sRGB, Anti-Glare 14″ WUXGA (1920×1200), Touch, 60Hz, 400 nits, 100% sRGB, Anti-Glare, ComfortView Plus (Low Blue Light) 14″ WUXGA (1920×1200), Non-Touch, 1-120Hz (VRR), 500 nits, 100% sRGB, Anti-Glare, ComfortView Plus (Low Blue Light), Super Low Power, Lightweight	16″ WUXGA (1920×1200), Non-Touch, 60Hz, 400 nits, 62.5% sRGB, Anti-Glare 16″ WUXGA (1920×1200), Touch, 60 Hz, 400 nits, 62.5% sRGB, Anti-Glare
Wireless / Mobile Broadband	Intel Wi-Fi 7 BE211, 2×2, Bluetooth 6.0 wireless card Intel Wi-Fi 6E AX211, 2×2, Bluetooth 5.3 Wireless Card 5G – MediaTek T700 (DW5933e), eSIM capable 4G LTE – Qualcomm Snapdragon X12 Global LTE-Advanced (DW5826e), eSIM capable	Intel Wi-Fi 7 BE211, 2×2, Bluetooth® 6.0 wireless card Intel Wi-Fi 6E AX211, 2×2, Bluetooth® 5.3 Wireless Card 5G – MediaTek T700 (DW5933e), eSIM capable 4G LTE – Qualcomm Snapdragon X12 Global LTE-Advanced (DW5826e), eSIM capable
Ports and Slots	2 x Type-C Thunderbolt 4/USB4 (40 Gbps) port with Power Delivery and DisplayPort 2.1 1 x Type-A USB 3.2 Gen1 (5 Gbps) 1 x Type-A USB 3.2 Gen1 (5 Gbps) with PowerShare 1 x RJ45 Ethernet port (1 Gbps) 1 x HDMI 2.1 port	2 x Type-C Thunderbolt 4/USB4 (40 Gbps) port with Power Delivery and DisplayPort 2.1 1 x Type-A USB 3.2 Gen1 (5 Gbps) 1 x Type-A USB 3.2 Gen1 (5 Gbps) with PowerShare 1 x RJ45 Ethernet port (1 Gbps) 1 x HDMI 2.1 port
Battery	3-cell, 45 Wh, ExpressCharge, ExpressCharge Boost Capable 3-cell, 57 Wh, ExpressCharge, ExpressCharge Boost Capable 3-cell, 70 Wh, ExpressCharge, ExpressCharge Boost Capable	3-cell, 45 Wh, ExpressCharge, ExpressCharge Boost Capable 3-cell, 57 Wh, ExpressCharge, ExpressCharge Boost Capable 3-cell, 70 Wh, ExpressCharge, ExpressCharge Boost Capable
Security	TPM 2.0 FIPS-140-3 Certified / TCG Certified Quantum-resistant BIOS Chassis intrusion switch Camera Shutter Optional Fingerprint Reader (in Power Button) (Windows Hello compliant) Optional FHD IR Camera (Windows Hello compliant)	TPM 2.0 FIPS-140-3 Certified / TCG Certified Quantum-resistant BIOS Chassis intrusion switch Camera Shutter Optional Fingerprint Reader (in Power Button) (Windows Hello compliant) Optional FHD IR Camera (Windows Hello compliant)
Starting Weight	starting from 2.89 lb / 1.31 kg	starting from 4.21 lb / 1.91 kg

Dell Pro 3 14/16 (AMD)

Dell Pro 3 14/16 (AMD) comes in 14-inch (P314265) and 16-inch (P316265) versions. These systems use AMD Series 400 processors with Ryzen AI NPU across both sizes. These systems offer Ryzen AI 7 PRO 450, Ryzen AI 7 450, and Ryzen AI 5 PRO 435 options, paired with Radeon 860M or Radeon 840M graphics, depending on configuration, and support Windows 11 Pro, Windows 11 Home, and Ubuntu Linux 24.04 LTS. Memory runs up to 64GB of DDR5 at 5600 MT/s, and storage goes up to 2 TB of SSD storage, which gives it enough headroom for general business use, heavy multitasking, and users who keep many apps and tabs open throughout the day.

The two sizes share most of the same platform, but the 14-inch version has a wider display range and a lower starting weight. Dell offers 1920×1200 panels across its lineup, including a 14-inch 500-nit variable-refresh display with 20-120Hz VRR, 100% sRGB, ComfortView Plus, and Super Low Power. The 16-inch model provides non-touch and touch 1920×1200 options at 400 nits. Battery options range from 45 Wh to 70 Wh, including long-cycle variants. Weight-wise, the 14-inch system starts at 2.95 lbs, and the 16-inch model at 4.21 lbs.

Dell has also kept the business features intact rather than stripping the system back to the bare minimum. Both sizes include two Thunderbolt 4 ports, two USB-A ports, HDMI 2.1, RJ45 Ethernet, a headset port, an optional nano SIM tray for WWAN models, and support for Wi-Fi 6E, Wi-Fi 7, and optional 4G LTE. On the management side, the AMD PRO configurations support AMD DASH and AIM-T for out-of-band remote management, and the security list includes TPM 2.0, Quantum-resistant BIOS, chassis intrusion detection, a camera shutter, plus optional fingerprint reader and IR camera support.

Features	Dell Pro 3 14	Dell Pro 3 16
Specifications
Model Number	P314265	P316265
Processor Options	AMD Series 400 Processors with Ryzen AI NPU – CoPilot+ PC AMD Ryzen AI 7 PRO 450 (8 cores, 16 threads) AMD Ryzen AI 7 450 (8 cores, 16 threads) AMD Ryzen AI 5 PRO 435 (6 cores, 12 threads)	AMD Series 400 Processors with Ryzen AI NPU – CoPilot+ PC AMD Ryzen AI 7 PRO 450 (8 cores, 16 threads) AMD Ryzen AI 7 450 (8 cores, 16 threads) AMD Ryzen AI 5 PRO 435 (6 cores, 12 threads)
Graphics	AMD Radeon 860M with AMD Ryzen AI 7 450 / PRO 450 AMD Radeon 840M with AMD Ryzen AI 5 PRO 435	AMD Radeon 860M with AMD Ryzen AI 7 450 / PRO 450 AMD Radeon 840M with AMD Ryzen AI 5 PRO 435
Memory	16GB DDR5, 5600 MT/s, single or dual-channel 32GB DDR5, 5600 MT/s, single or dual-channel 64GB DDR5, 5600 MT/s, dual-channel	16GB DDR5, 5600 MT/s, single or dual-channel 32GB DDR5, 5600 MT/s, single or dual-channel 64GB DDR5, 5600 MT/s, dual-channel
Storage Options	256 GB SSD, TLC 512 GB SSD, TLC, SED 512 GB SSD, TLC 512 GB SSD 1 TB SSD, TLC 1 TB SSD 2 TB SSD	256 GB SSD, TLC 512 GB SSD, TLC, SED 512 GB SSD, TLC 512 GB SSD 1 TB SSD, TLC 1 TB SSD 2 TB SSD
Display	14″ WUXGA (1920×1200), Non-Touch, 60Hz, 400 nits, 62.5% sRGB, Anti-Glare 14″ WUXGA (1920×1200), Touch, 60Hz, 400 nits, 100% sRGB, Anti-Glare, ComfortView Plus (Low Blue Light) 14″ WUXGA (1920×1200), Non-Touch, 20-120Hz (VRR), 500 nits, 100% sRGB, Anti-Glare, ComfortView Plus (Low Blue Light), Super Low Power, Lightweight	16″ WUXGA (1920×1200), Non-Touch, 60Hz, 400 nits, 62.5% sRGB, Anti-Glare 16″ WUXGA (1920×1200), Touch, 60 Hz, 400 nits, 62.5% sRGB, Anti-Glare
Connectivity Options	MediaTek Wi-Fi 6E MT7922, 2×2, 802.11ax, Bluetooth 5.2 wireless card MediaTek Wi-Fi 7 MT7925, 2×2, 802.11be, Bluetooth 5.4 wireless card 4G LTE – Qualcomm Snapdragon X12 Global LTE-Advanced (DW5826e), eSIM capable	MediaTek Wi-Fi 6E MT7922, 2×2, 802.11ax, Bluetooth 5.2 wireless card MediaTek Wi-Fi 7 MT7925, 2×2, 802.11be, Bluetooth 5.4 wireless card 4G LTE – Qualcomm Snapdragon X12 Global LTE-Advanced (DW5826e), eSIM capable
Ports and Slots	2x Thunderbolt 4 (40 Gbps) port with DisplayPort 2.1 / USB Type-C / USB4 / Power Delivery 1x USB 3.2 Gen 1 (5 Gbps) Type-A port 1x USB 3.2 Gen 1 (5 Gbps) Type-A port with PowerShare 1x HDMI 2.1 port 1 x RJ45 Ethernet port (1 Gbps)	2x Thunderbolt 4 (40 Gbps) port with DisplayPort 2.1 / USB Type-C / USB4 / Power Delivery 1x USB 3.2 Gen 1 (5 Gbps) Type-A port 1x USB 3.2 Gen 1 (5 Gbps) Type-A port with PowerShare 1x HDMI 2.1 port 1 x RJ45 Ethernet port (1 Gbps)
Battery	3-cell, 45 Wh, ExpressCharge, ExpressCharge Boost Capable 3-cell, 45 Wh, Long Life Cycle, ExpressCharge, ExpressCharge Boost Capable 3-cell, 57 Wh, ExpressCharge, ExpressCharge Boost Capable 3-cell, 57 Wh, Long Life Cycle, ExpressCharge, ExpressCharge Boost Capable 3-cell, 70 Wh, ExpressCharge, ExpressCharge Boost Capable 3-cell, 70 Wh, Long Life Cycle, ExpressCharge, ExpressCharge Boost Capable	3-cell, 45 Wh, ExpressCharge, ExpressCharge Boost Capable 3-cell, 45 Wh, Long Life Cycle, ExpressCharge, ExpressCharge Boost Capable 3-cell, 57Wh, ExpressCharge, ExpressCharge Boost Capable 3-cell, 57Wh, Long Life Cycle, ExpressCharge, ExpressCharge Boost Capable 3-cell, 70 Wh, ExpressCharge, ExpressCharge Boost Capable 3-cell, 70 Wh, Long Life Cycle, ExpressCharge, ExpressCharge Boost Capable
Security	TPM 2.0 FIPS-140-3 Certified / TCG Certified Quantum-resistant BIOS Chassis intrusion switch Camera Shutter Optional Fingerprint Reader (in Power Button) (Windows Hello compliant) FHD IR Camera (Windows Hello compliant)	TPM 2.0 FIPS-140-3 Certified / TCG Certified Quantum-resistant BIOS Chassis intrusion switch Camera Shutter Optional Fingerprint Reader (in Power Button) (Windows Hello compliant) FHD IR Camera (Windows Hello compliant)
Dimensions and Weights	Width: 12.42 in. (315.5 mm) Depth: 8.90 in. (226.0 mm) Height (front) starting from: 0.44 in (11.3 mm) Height (rear) starting from: 0.61 in (15.47 mm) Height (max) starting from: 0.77 in (19.45mm) Weight starting from: 2.95 lbs (1.33 kg)	Width: 14.12 in.(358.6mm) Depth: 9.98 in. (253.4mm) Height (front) starting from: 0.44 in.(11.16mm) Height (rear) starting from: 0.61 in. (15.41mm) Height (max) starting from: 0.82 in (20.85mm) Weight starting from: 4.21 lbs (1.912 kg)

Dell Pro 5 14/16 Laptop (AMD)

Dell’s AMD version of the Pro 5 14/16 is a business notebook line built around Ryzen AI PRO 400 Series processors, topping out at Ryzen AI 9 HX 470 with Radeon 890M graphics. Memory scales to 64GB of DDR5-5600, and storage goes to 2TB. Display choices range from standard WUXGA panels to higher-spec 120Hz VRR, WQXGA, and OLED options. That gives Dell a nice range of configurations for both standard office use and more demanding day-to-day workloads.

Lower- and mid-tier models suit general business roles, web-heavy work, communications, and hybrid staff who need solid battery life and full business connectivity. Higher-end Ryzen AI and Radeon 890M versions are better suited to heavier multitasking, large spreadsheets, frequent video meetings, and light creative workloads. Optional 4G or 5G, Wi-Fi 7, RJ45, HDMI 2.1, USB-A, and dual USB-C ports also keep it flexible for travel, docked use, and mixed office setups.

Dell also gives the AMD model the enterprise features most larger deployments look for, including TPM 2.0, chassis intrusion detection, optional fingerprint and smart card authentication, optional IR camera support, and AMD DASH and AIM-T manageability. The chassis is built with service life in mind, featuring modular parts and customer-replaceable batteries. For organizations buying in volume, that adds up to a laptop family that is easier to maintain over time.

Features	Dell Pro 5 14/16 (AMD)
Dell Pro 5 14/16 Laptop (AMD)
Model Numbers	P514265 P516265
Processor Options	AMD Ryzen AI 9 HX 470 (12 cores, 24 threads) AMD Ryzen AI 9 PRO 465 (10 cores, 20 threads) AMD Ryzen AI 7 PRO 450 (8 cores, 16 threads) AMD Ryzen AI 7 450 (8 cores, 16 threads) AMD Ryzen AI 5 PRO 435 (6 cores, 12 threads)
Graphics	AMD Radeon 890M AMD Radeon 860M AMD Radeon 840M
Memory	16GB DDR5, 5600 MT/s, single or dual-channel 32GB DDR5, 5600 MT/s, single or dual-channel 64GB DDR5, 5600 MT/s, dual-channel
Storage	256 GB SSD, TLC 512 GB SSD, TLC, SED 512 GB SSD, TLC 512 GB SSD 1 TB SSD, TLC 1 TB SSD 2 TB SSD
Display Options	14-inch and 16-inch options Up to WQXGA (2560×1600), 48-120 Hz (VRR), 500 nits, 100% sRGB Up to WUXGA OLED (1920×1200), 60 Hz, 500 nits, DCI-P3 90% on 14-inch Optional touch, low power, super low power, and Intelligent Privacy options
Wireless and WWAN	MediaTek Wi-Fi 7 MT7925, 2×2, Bluetooth 5.4 MediaTek Wi-Fi 6E MT7922, 2×2, Bluetooth 5.2 Optional 5G Mediatek T700, eSIM capable Optional 4G LTE Qualcomm Snapdragon X12 Global LTE-Advanced, eSIM capable
Ports	2x Thunderbolt 4 (40 Gbps) with DisplayPort 2.1 / USB-C / USB4 / Power Delivery 1 USB 3.2 Gen 1 port 1 USB 3.2 Gen 1 port with PowerShare 1 HDMI 2.1 port 1 RJ45 Ethernet port (1 Gbps) 1 global headset jack Optional nano-SIM card slot Optional smart card reader slot
Camera and Audio	FHD RGB HDR camera, 1080p at 30 fps FHD RGB HDR + IR camera, 1080p at 30 fps 8MP RGB HDR + IR camera, 1440p at 30 fps 2 x 2W speakers 2 x noise-canceling microphones
Battery and Adapter	3-cell 45 Wh, 57 Wh, or 70 Wh options ExpressCharge and ExpressCharge Boost Capable 65W USB-C GaN Slim Adapter 65W USB-C Adapter 100W USB-C Adapter
Size and Weight	14-inch: starting at 2.96 lb (1.34 kg) 16-inch: starting at 4.02 lb (1.82 kg)

Dell Pro 5 14/16 Laptop (Intel)

The Intel version of the Pro 5 14/16 covers much of the same ground, but with a broader range of performance across the lineup. Dell pairs it with Intel Core Ultra Series 3 processors, integrated Intel graphics, and, on higher-end configurations, LPCAMM2 memory at up to 8533 MT/s and PCIe Gen 5 SSDs. It is still a mainstream business notebook, but it gives buyers more room for faster memory and storage than a base fleet system typically offers.

Entry and mid-tier versions work well for everyday office use, shared deployments, communications, and remote or hybrid staff. Systems configured with higher-end Core Ultra chips, faster memory, and faster storage are a better fit for users with denser multitasking loads, larger spreadsheets, and heavier browser and collaboration workflows. Optional Wi-Fi 7, 4G or 5G broadband, and a port selection that still includes RJ45 and HDMI help keep it useful across office, travel, and hot-desk environments.

Dell rounds out the Intel model with the features IT teams usually want at the shortlist stage, including Intel vPro with AMT, TPM 2.0, chassis intrusion detection, optional fingerprint and smart card authentication, and camera options up to an 8MP RGB HDR + IR unit. The result is a business laptop family that works for standard fleet rollouts while still offering enough higher-end options for users who need more headroom.

Features	Dell Pro 5 14/16 (Intel)
Dell Pro 5 14/16 Laptop (Intel)
Model Numbers	P514260 P516260
Processor Options	Intel Core Ultra Series 3 processor family Scalable options, including prior generations on select configurations
Graphics	Intel Graphics, 2Xe processor with 6 cores Intel Graphics, 4Xe processor with 8 cores Intel Graphics, 4Xeprocessor with 12/16 cores Intel Arc B370 GPU, 10Xe with 12 cores Intel Core Ultra 5 338H Intel Arc B390 GPU, 12Xe with 16 cores Intel Core Ultra X7 368H
Memory	8 GB DDR5, 5600 MT/s, single-channel 16 GB DDR5, 5600 MT/s, single or dual-channel 32 GB DDR5, 5600 MT/s, single or dual-channel 64 GB DDR5, 5600 MT/s, dual-channel 16 GB LPCAMM2, 8533 MT/s, dual-channel 32 GB LPCAMM2, 8533 MT/s, dual-channel 64 GB LPCAMM2, 8533 MT/s, dual-channel
Storage	256 GB SSD, TLC 512 GB SSD, TLC, SED Ready 512 GB SSD, TLC, Gen 5 512 GB SSD, TLC 512 GB SSD 1 TB Performance SSD, Gen5, SED Ready 1 TB SSD, TLC 1 TB SSD 2 TB Performance SSD, Gen5, SED Ready 2TB SSD
Display Options	14-inch and 16-inch options Up to WQXGA (2560×1600), 48-120 Hz (VRR), 500 nits, 100% sRGB Up to WUXGA OLED (1920×1200), 60 Hz, 300 nits, DCI-P3 90% on 14-inch Optional touch, low power, super low power, and Intelligent Privacy options
Wireless and WWAN	Intel Wi-Fi 7 BE211, 2×2, Bluetooth 6.0 Intel Wi-Fi 6E AX211, 2×2, Bluetooth 5.3 Optional 5G Mediatek T700, eSIM capable Optional 4G LTE Qualcomm Snapdragon X12 Global LTE-Advanced, eSIM capable
Ports	2 Thunderbolt 4 (40 Gbps) with DisplayPort 2.1 / USB-C / USB4 / Power Delivery 1 Type-A USB 3.2 Gen1 port (5Gbps) 1 Type-A USB 3.2 Gen1 port (5Gbps) with PowerShare 1 HDMI 2.1 port 1 RJ45 Ethernet port (1 Gbps) 1 global headset port Optional external nano SIM card tray An optional contact smart card reader 1 wedge-shaped lock slot
Camera and Audio	FHD RGB HDR camera, 1080p at 30 fps FHD RGB HDR + IR camera, 1080p at 30 fps 8MP RGB HDR + IR camera, 1440p at 30 fps 2 x 2W speakers, Cirrus Logic codec 2 x noise-canceling microphones
Battery and Adapter	3-cell 45 Wh, 57 Wh, or 70 Wh options ExpressCharge and ExpressCharge Boost Capable 65W USB-C GaN Slim Adapter 65W USB-C Adapter 100W USB-C Adapter
Size and Weight	14-inch: starting at 2.96 lb (1.34 kg) 16-inch: starting at 4.02 lb (1.82 kg)

Dell Pro 7 13/14 Laptops and 2-in-1s (Intel)

Dell’s Intel-based Pro 7 family is the slimmer, more premium side of this business lineup, with 13-inch and 14-inch clamshells plus matching 2-in-1 models. Across the range, Dell is pairing thin aluminum-heavy designs with Series 3 Intel Core Ultra processors, LPDDR5x memory at up to 8533 MT/s, and optional Gen5 SSDs. The result is a set of systems built for buyers who want a lighter commercial notebook without sacrificing modern business features, current AI PC hardware, or higher-end display options.

The clamshell models look best suited to executives, hybrid staff, frequent travelers, and office users who want a thinner laptop with a more refined chassis than a mainstream fleet machine. The 2-in-1 versions broaden that to users who will actually use touch, pen input, and tablet mode for note-taking, presentations, markup, fieldwork, or client-facing meetings. Dell is also giving the family a strong display stack, including brighter 500-nit panels, OLED options, VRR on select screens, optional privacy displays, and up to 8MP HDR camera options for conferencing.

This line also reads like a more premium deployment option for larger organizations, not just a style-first machine. Intel vPro manageability with AMT is available. The systems support optional WWAN, and Dell includes its usual suite of commercial security features, such as TPM 2.0, a quantum-resistant BIOS, chassis intrusion detection, a camera shutter, and optional fingerprint or smart card readers. Modular USB-C ports and customer-replaceable batteries also give IT teams a better service story than many thin-and-light systems in this class.

Features	Dell Pro 7 13/14 Laptops and 2-in-1s (Intel)
Specifications
Models	Dell Pro 7 13 Dell Pro 7 13 2-in-1 Dell Pro 7 14 Dell Pro 7 14 2-in-1
Processor	Series 3 Intel Core Ultra Up to Intel Core Ultra 7 366H vPro
Graphics	Intel Graphics Up to 4Xe on higher-end processor options
Memory	16 GB / 32 GB / 64 GB LPDDR5x, 8533 MT/s, dual-channel
Storage	Up to 2 TB SSD Optional Gen5 Performance SSD, SED Ready
Display	13.3-inch and 14-inch options Up to WQXGA Up to 120 Hz VRR OLED on select 14-inch models Touch and active pen support on 2-in-1 models
Wireless / WWAN	Intel Wi-Fi 7 BE211, Bluetooth 6.0 Intel Wi-Fi 6E AX211, Bluetooth 5.3 Optional 5G or 4G LTE
Camera	Up to 8MP HDR camera options
Manageability	Intel vPro Manageability with Intel Active Management Technology (Intel AMT)
Security / Business Features	TPM 2.0 Chassis intrusion detection Optional fingerprint reader Optional smart card support Optional privacy display

Dell Pro 7 13/14 Laptops and 2-in-1s (AMD)

Dell’s AMD version of the Pro 7 family follows the same premium 13-inch and 14-inch formula, but swaps in Ryzen AI PRO 400 Series processors with Ryzen AI NPU support. At the top end, this line reaches Ryzen AI 9 HX 470, with integrated Radeon 890M graphics and up to 55 TOPS of NPU performance. Memory again goes to 64GB of LPDDR5X-8533, storage reaches 2TB with Gen5 options, and the overall package is still built around thin commercial designs rather than bulkier performance notebooks.

The AMD versions make a lot of sense for buyers who want stronger integrated graphics than a basic business laptop typically offers, along with current on-device AI support and the same high-end display options as the Intel models. Standard clamshell versions are ideal for mobile professionals, managers, and general productivity users who want a lighter, premium system. At the same time, the 2-in-1 variants are a better match for pen input, flexible viewing modes, presentations, markup, and hands-on work away from a desk. Optional Wi-Fi 7, 5G or 4G broadband, and a third USB-C port are also included on select configurations.

Dell is also keeping the AMD Pro 7 models in the commercial space rather than treating them as consumer hardware in a nicer shell. Remote management support includes AMD DASH and AIM-T, and the security stack includes TPM 2.0, quantum-resistant BIOS, chassis intrusion detection, camera shutter, and optional fingerprint, smart card, and NFC or CSC features. Overall, these are great for organizations that want a thinner premium system but still care about repair, fleet management, and longer service life.

Features	Dell Pro 7 13/14 Laptops and 2-in-1s (AMD)
Specifications
Models	Dell Pro 7 13 Dell Pro 7 13 2-in-1 Dell Pro 7 14 Dell Pro 7 14 2-in-1
Processor	AMD Ryzen AI PRO 400 Series Up to AMD Ryzen AI 9 HX 470
Graphics	AMD Radeon integrated graphics Up to Radeon 890M
NPU / AI	Ryzen AI NPU Up to 55 TOPS
Memory	16 GB / 32 GB / 64 GB LPDDR5X, 8533 MT/s, dual-channel
Storage	Up to 2 TB SSD Optional Gen5 SSD on select configurations
Display	13.3-inch and 14-inch options Up to WQXGA Up to 120 Hz VRR OLED on select 14-inch models Touch and active pen support on 2-in-1 models
Wireless / WWAN	Wi-Fi 7 Optional 5G or 4G LTE
Camera	Up to 8MP HDR camera options
Manageability	AMD DASH and AIM-T

Dell Pro 5 Micro

Dell Pro 5 Micro is an ultracompact desktop with a 1.2L chassis built around Intel Core Ultra Series 3 processors. Options include Intel Core Ultra 7 366H vPro and Intel Core Ultra 5 335 vPro, with integrated Intel Graphics and support for Windows 11 Home, Windows 11 Pro, and Ubuntu Linux 24.04 LTS. Memory supports up to 64 GB DDR5, with speeds up to 7200 MT/s on supported configurations, and storage includes up to two M.2 Gen4 SSDs.

The small chassis is designed for desks with limited space, with optional stands and mounts for under-desk, wall, monitor-arm, and all-in-one setups. Dell also includes a built-in USB-C port with up to 100W Power In, allowing the system to connect to a USB-C hub monitor while being powered over the same cable. Multi-display support goes further than most micro desktops in this class, with up to 5 displays when paired with the optional 2-port DisplayPort video expansion module.

Ports and management are set up for business deployments rather than stripped down for size. The system includes front USB-C and USB-A, rear HDMI 2.1, DisplayPort 1.4a, RJ-45, multiple USB-A ports, and a configurable rear module that can add options such as DisplayPort 2.1, HDMI 2.1, USB-C, serial, or 1 GbE Optical Fiber. Dell also offers Intel vPro options, Wi-Fi 7, tool-less chassis access, and a range of stand and mounting options, which make it easier to fit the system into fixed desk setups, shared workspaces, and monitored IT fleets.

Features	Dell Pro 5 Micro
Specifications
Product	Dell Pro 5 Micro
Model ID	PCM1260
Processor Options	Intel Core Ultra 7 366H vPro (50 TOPS, 16 cores, up to 4.80 GHz) Intel Core Ultra 5 335 vPro (47 TOPS, 8 cores, up to 4.60 GHz)
Chipset	Intel Q870
Graphics	Integrated Graphics Intel Graphics
Memory	Up to 64 GB DDR5 5600 MT/s, 6400 MT/s, and up to 7200 MT/s on supported configurations
Storage	256 GB SSD, TLC 512 GB SSD 512 GB SSD, TLC 512 GB SSD, SED Ready 1 TB SSD 1 TB Performance SSD, SED Ready Up to two M.2 2230/2280 slots for solid-state drive
Wireless Options	Intel Wi-Fi 7 BE211, 2×2, 802.11be, MU-MIMO, Bluetooth 6.0 wireless card Intel Wi-Fi 7 BE213, 2×2, 802.11be, MU-MIMO, Bluetooth 6.0 wireless card MediaTek Wi-Fi 6E MT7922, 2×2, 802.11ax, MU-MIMO, Bluetooth 5.3 wireless card
Ports	Front: USB 3.2 Gen 2 (10 Gbps) Type-C port Front: USB 3.2 Gen 1 (5 Gbps) Type-A port Rear: RJ-45 Ethernet Port (1 Gbps) Rear: 2 x USB 2.0 Type-A Ports (480 Mbps) with SmartPower On Rear: 2 x USB 3.2 Gen1 (5 Gbps) Type-A Port Rear: HDMI 2.1, up to 4096 x 2160 @60Hz Rear: DisplayPort 1.4a, up to 5120 x 3200 @60Hz Rear: USB Full-Featured Type-C Port with up to 100W Power In, DP Alt Mode up to 5120 x 3200 @60Hz
Optional Module	Choose 1: HDMI 2.1 (FRL), up to 5120 x 3200 @60Hz DisplayPort 2.1 (UHBR20), up to 7680 x 4320 @60Hz VGA, up to 1920 x 1200 @60 Hz 2 x USB 3.2 Gen 2 (10 Gbps) Type-A Ports USB Type-C with DisplayPort Alt mode (DP 1.4a HBR3), up to 5120 x 3200 @60 Hz PS/2 and Serial Ports Serial Port 2 x DisplayPort (DP 1.4a HBR2) Video Expansion Module, each up to 4096 x 2304 @60Hz 1 GbE Optical Fiber
Dimensions and Weight	Height: 7.17 in. (182.00 mm) Width: 1.42 in. (36.00 mm) Depth: 7.01 in. (178.00 mm) Weight (minimum): 2.42 lbs (1.10 Kg) Weight (maximum): 2.92 lbs (1.32 Kg)

Dell Pro 14 Premium

Dell Pro 14 Premium is a 14-inch business notebook, model PA14260, built around Intel Core Ultra Series 3 processors in a magnesium chassis. Dell offers Core Ultra 5 335 vPro, Core Ultra 7 365 vPro, Core Ultra 5 336H vPro, and Core Ultra 7 366H vPro options, with integrated Intel Graphics, up to 64GB of LPDDR5x memory at 8533 MT/s, and SSDs up to 2TB. Operating system support includes Windows 11 Pro, Windows 11 Home, and Ubuntu Linux 24.04.

Display and mobility are central to this system. There are several 14-inch panels, including WUXGA non-touch options at 400 nits and 500 nits, a WQXGA touch panel, and a WQXGA Tandem OLED touch option with 100% DCI-P3. Weight starts at 2.54 lbs, chassis height starts at 16.78 mm. The system includes battery options up to 60 Wh, along with an 8MP HDR plus IR camera, quad speakers, and an optional Collaboration Touchpad.

Ports and management stay focused on business deployment. There are two Thunderbolt 4/USB4 Type-C ports, one USB 3.2 Gen1 Type-A port, HDMI 2.1, a headset port, optional 5G connectivity, Intel vPro manageability with Intel AMT, TPM 2.0, Quantum-resistant BIOS, a chassis intrusion switch, and optional fingerprint reader configurations. The system also uses modular components such as the USB-C port, mainboard, and customer-replaceable battery, and Dell includes recycled materials across the chassis, battery, adapter, and packaging.

Features	Dell Pro 14 Premium
Specifications
Product	Dell Pro 14 Premium
Model Number	PA14260
Chassis	Ultralight Magnesium (All covers)
Processor Options	Series 3 Intel Core Ultra – CoPilot+ PC Intel Core Ultra 5 335 vPro (8 cores) Intel Core Ultra 7 365 vPro (8 cores) Intel Core Ultra 5 336H vPro (12 cores) Intel Core Ultra 7 366H vPro (16 cores)
Graphics	Intel Graphics
Memory	16 GB LPDDR5x, 8533 MT/s, dual-channel 32 GB LPDDR5x, 8533 MT/s, dual-channel 64 GB LPDDR5x, 8533 MT/s, dual-channel
Storage Options	256 GB SSD, TLC 512 GB SSD, TLC 512 GB SSD, TLC, SED 1 TB SSD, TLC 2TB SSD, TLC
Display Options	14” WUXGA non-touch, 16:10, 400 nits, 45% NTSC, AG, no pen support, no cover glass 14” WUXGA non-touch,16:10, 500 nits, SLP, LBL,100% sRGB, AG, no pen support, no cover glass 14” WQXGA touch 400nits, 16:10, 400 nits, LBL, SLP, 100% sRGB, AG, no pen support, no cover glass 14” WQXGA Tandem OLED touch with Gorilla cover glass,16:10, 400 nits, LBL, DCI-P3 100%, AR/AS no pen support
Connectivity	Intel Wi-Fi 7 BE211, 2×2, Bluetooth 6.0 wireless card 5G – Qualcomm Snapdragon X72 Global 5G Modem (DW5934e), eSIM, WW 5G – Qualcomm Snapdragon X72 Global 5G Modem (DW5934e), Non-eSIM, China only
Camera / Audio	8MP MIPI+ IR camera,1440p at 30 fps, Presence Detection, Temporal Noise Reduction, Camera Shutter 2 x 2W Speakers, Cirrus Logic codec, and smart amp 2 x Noise-Canceling Microphones
Ports and Slots	2 x Type-C Thunderbolt 4 / USB4 (40 Gbps) port with Power Delivery and DisplayPort 2.1 (USB Type-C ) 1 x Type-A USB 3.2 Gen1 (5 Gbps) 1x HDMI 2.1 port 1 x Global headset port 1 x Optional external nano SIM card tray (WWAN only) 1 x Optional Touch Fingerprint Reader in Power Button 1 x Wedge Shaped Lock Slot
Battery	2-cell, 40 Wh, Long Life Cycle, ExpressCharge, and ExpressCharge Boost Capable 3-cell, 60 Wh, ExpressCharge and ExpressCharge Boost Capable 3-cell, 60 Wh, Long Life Cycle, ExpressCharge, and ExpressCharge Boost Capable
Manageability / Security	Intel vPro Manageability with Intel Active Management Technology (Intel AMT) Dell SafeConnect IR Camera (Windows Hello compliant) TPM 2.0 FIPS-140-3 Certified / TCG Certified Quantum-resistant BIOS Chassis intrusion switch Camera Shutter Optional Fingerprint Reader (in Power Button) (Windows Hello compliant) Fingerprint Reader (in Power Button) (Windows Hello compliant) with ControlVault 3+
Dimensions and Weight	Width: 12.25 in. / 311.2 mm Depth: 8.53 in. / 216.7 mm Height (front) starting from: 0.66 in. / 16.78mm to 0.78 in. / 19.85mm Weight: starting from 2.54 lbs. (1.15 kg)

Dell Pro P 34 USB-C Hub Webcam Monitor

Dell Pro P 34 USB-C Hub Webcam Monitor, model P3426WEV, is a 34.1-inch curved WQHD display with a 3440 x 1440 resolution, an IPS panel, a 21:9 aspect ratio, and a refresh rate up to 100 Hz. The 99% sRGB coverage, 1,500:1 contrast ratio, 350 cd/m2 brightness, and a 3800R curve make it ideal for wide-screen multitasking rather than basic office display use.

The primary hardware feature is the built-in camera. Dell offers a 4 Megapixel RGB camera at 30 fps, along with Windows Hello support and features like KVM, Picture-in-Picture, and Picture-by-Picture, making the display more versatile for users switching between meetings and dual-PC setups workflows. The stand also supports height, tilt, swivel, and slant adjustments, and the monitor is TÜV Rheinland 4-Star certified for eye comfort with hardware-based low-blue-light technology.

As a hub display, it covers the basics most desk setups need on a single screen. The port layout includes HDMI, DisplayPort 1.4, USB-C upstream with DisplayPort 1.4 Alt Mode and up to 90 W power delivery, USB-B upstream, multiple USB-A ports, front USB-C with up to 15 W, and RJ45 Ethernet at 1GbE. Dell offers support for Dell Display and Peripheral Manager, a 3-year warranty, Advanced Exchange Service, and Premium Panel Exchange.

Features	Dell Pro P 34 USB-C Hub Webcam Monitor
Specifications
Model	Dell Pro P 34 USB-C Hub Webcam Monitor – P3426WEV
Screen Size / Panel	86.7 cm (34.1″) In-Plane Switching (IPS) Technology 3800R Curvature
Resolution / Refresh Rate	3440 x 1440 Up to 100 Hz
Color / Image	sRGB 99% (CIE 1931) (typical) 1.07 billion colors 10-bit (8-bit+FRC) 1,500:1 (typical) 350 cd/m2 (typical)
Response Time	8 ms (gray to gray normal mode) 5 ms (gray to gray fast mode)
Camera / Features	4 Megapixel RGB camera at 30 fps Windows Hello Picture by Picture (PbP) / Picture in Picture (PiP) / USB Keyboard Video Mouse (USB KVM)
Connectivity	1 x HDMI port/s (HDCP 1.4) 1 x DisplayPort 1.4 (HDCP 1.4) port/s 1 x USB-C 5Gbps upstream port/s (DisplayPort 1.4 Alt Mode, Power Delivery up to 90 W) 1 x USB Type-B 5Gbps upstream port/s 2 x USB Type-A 5Gbps downstream port/s 1 x USB Type-A 5Gbps downstream port/s with Battery Charging 1.2 1 x USB-C 5Gbps downstream port/s, Power Delivery up to 15 W 1 x RJ45 Ethernet port/s, 1GbE
Eye Comfort	TÜV RHEINLAND EYE COMFORT CERTIFICATION 4-Star Hardware Solution Category II Ficker Free Yes
Ergonomics	Stand Height Range 150 mm Tilt Angle -5° to 21° Swivel Angle -30° to 30° Slant Adjust -4° to +4°
Warranty	3 year 3-Year Advanced Exchange Service and Premium Panel Exchange

Dell Pro P 34 USB-C Hub Conferencing Monitor

Dell Pro P 34 USB-C Hub Conferencing Monitor, model P3426WEB, uses the same 34.1-inch curved WQHD IPS panel as the webcam version, with 3440 x 1440 resolution, up to 100 Hz refresh rate, 99% sRGB, 1,500:1 contrast ratio, and 350 cd/m2 brightness. It is another wide-screen work display, but this one adds more of the meeting hardware directly into the monitor.

Dell includes a 4-megapixel RGB camera at 30 fps, dual 5 W speakers, microphone support, Windows Hello, and front-facing call controls. This hub conferencing monitor also offers Microsoft Teams touch controls, AI auto framing, and AI noise cancellation, so it is designed more for regular video calls than the standard webcam-focused model.

The hub setup is otherwise similar, with HDMI, DisplayPort 1.4, USB-C upstream with up to 90 W power delivery, USB-B upstream, multiple USB-A ports, front USB-C with up to 15 W, and RJ45 Ethernet. Dell also offers KVM, Picture-in-Picture, Picture-by-Picture, TÜV Rheinland 4-Star eye comfort certification, and the same 3-year warranty with Advanced Exchange Service and Premium Panel Exchange.

Features	Dell Pro P 34 USB-C Hub Conferencing Monitor
Specifications
Model	Dell Pro P 34 USB-C Hub Conferencing Monitor – P3426WEB
Screen Size / Panel	86.7 cm (34.1″) In-Plane Switching (IPS) Technology 3800R Curvature
Resolution / Refresh Rate	3440 x 1440 Up to 100 Hz
Color / Image	sRGB 99% (CIE 1931) (typical) 1.07 billion colors 10-bit (8-bit+FRC) 1,500:1 (typical) 350 cd/m2 (typical)
Response Time	8 ms (gray to gray normal mode) 5 ms (gray to gray fast mode)
Conference Hardware	4 Megapixel RGB camera at 30 fps 2 x 5 W speakers Microphone Yes Windows Hello
Connectivity	1 x HDMI port/s (HDCP 1.4) 1 x DisplayPort 1.4 (HDCP 1.4) port/s 1 x USB-C 5Gbps upstream port/s (DisplayPort 1.4 Alt Mode, Power Delivery up to 90 W) 1 x USB Type-B 5Gbps upstream port/s 2 x USB Type-A 5Gbps downstream port/s 1 x USB Type-A 5Gbps downstream port/s with Battery Charging 1.2 1 x USB-C 5Gbps downstream port/s, Power Delivery up to 15 W 1 x RJ45 Ethernet port/s, 1GbE
Eye Comfort	TÜV RHEINLAND EYE COMFORT CERTIFICATION 4-Star Hardware Solution Category II Ficker Free Yes
Ergonomics	Stand Height Range 150 mm Tilt Angle -5° to 21° Swivel Angle -30° to 30° Slant Adjust -4° to +4°
Warranty	3 year 3-Year Advanced Exchange Service and Premium Panel Exchange

Dell Pro P 27 USB-C Hub Monitor

The last of the new displays is the Dell Pro P 27 USB-C Hub Monitor (model P2726HE), a 27-inch FHD display with a 1920 x 1080 resolution, IPS panel, and refresh rate of up to 120 Hz. Dell claims 99% sRGB and 99% BT.709 coverage, a 1,500:1 contrast ratio, and 300 cd/m² brightness, positioning it as a standard productivity monitor with a slightly greater emphasis on smoother motion and connectivity than typical entry-level office screens.

This model is more conventional than the two 34-inch displays. It does not include a built-in camera or speaker system, but it does have a more flexible stand. Dell includes height, tilt, swivel, and pivot adjustments, plus TÜV Rheinland 4-Star eye comfort certification and low-blue-light hardware. The 120Hz refresh rate is also higher than on many 27-inch business monitors in this class.

Its main selling point is the USB-C hub functionality. The USB-C upstream port delivers up to 100 W of power delivery. There’s a DisplayPort-out for daisy-chaining, an RJ45 port with PXE boot, MAC address pass-through, and Wake-on-LAN support, plus two quick-access USB-C downstream ports that provide up to 15 W of charging. Dell also includes a 3-year warranty, Advanced Exchange Service, and Premium Panel Exchange coverage.

Features	Dell Pro P 27 USB-C Hub Monitor
Specifications
Model	Dell Pro P 27 USB-C Hub Monitor – P2726HE
Screen Size / Panel	686.0 mm (27″) In-Plane Switching (IPS) Technology
Resolution / Refresh Rate	1920 x 1080 Up to 120 Hz
Color / Image	sRGB 99% (CIE 1931) (typical) BT.709 99% (CIE 1931) (typical) 16.70 million colors 8-bit (6-bit+FRC) 1,500:1 (typical) 300 cd/m2 (typical)
Response Time	8 ms (gray to gray normal mode) 5 ms (gray to gray fast mode)
Connectivity	1 HDMI port/s (HDCP 1.4) 1 DisplayPort 1.4 (HDCP 1.4) port/s 1 DisplayPort Out 1.4 port/s 1 USB-C 5Gbps upstream port/s (DisplayPort 1.4 Alt Mode, Power Delivery up to 100W (for Dell compatible notebook)) 2 USB Type-A 5Gbps downstream port/s 2 USB-C 5Gbps downstream port/s (Power Delivery up to 15 W) 1 RJ45 Ethernet port/s, 1GbE
Networking / Management	RJ45 that comes with PXE boot, MAC Address pass-thru, and Wake on LAN features Dell Display and Peripheral Manager (DDPM)
Eye Comfort	4-Star Hardware Solution Category II Ficker Free Yes
Ergonomics	Stand Height Range 150 mm Tilt Angle -5° to 21° Swivel Angle -45° to 45° Pivot Angle -90° to + 90°
Warranty	3 year 3-Year Advanced Exchange Service and Premium Panel Exchange

Availability

The Dell Pro P 34 USB-C Hub Conferencing Monitor at $779.99, the Dell Pro P 34 USB-C Hub Webcam Monitor at $729.99, the Dell Pro P 27 USB-C Hub Monitor at $379.99, and the Dell Pro 5 Wired Fingerprint ESS Mouse at $44.99 are all available now.

The next wave starts on March 31, 2026, with the Dell Pro 14 Premium and Dell Pro 5 Micro.

Dell Pro 3 14/16 is scheduled for May 2026. The Dell Pro 5 14/16, Dell Pro 7 13/14, and Dell Pro 7 13/14 2-in-1 will also be available in May. Dell notes that pricing, availability, and configurations can vary by retailer and country.

The post Dell Expands Commercial Lineup With New Pro Notebooks, Desktop, Monitors And Peripherals appeared first on StorageReview.com.

HP introduced a new round of Z workstations and AI systems at HP Imagine 2026, expanding its high-performance computing lineup for engineers, architects, designers, AI developers, and other professional users working with heavier local compute demands. The update covers desktop and mobile workstations, GPU-sharing tools, and new systems intended to support hybrid AI infrastructure across cloud and edge environments.

The announcement includes an upgraded HP Z8 Fury G6i desktop workstation, new ZBook mobile systems, updates to HP Z Boost, and additional focus on the ZGX Nano and ZGX Fury as part of HP’s Advanced Compute Solutions portfolio. These new releases center on giving organizations more flexibility in where demanding workloads run, while addressing performance, security, manageability, and cost.

Desktop and Mobile Systems Expand the Core Workstation Portfolio

At the top of the desktop lineup, the HP Z8 Fury G6i is built for AI development, simulation, and visual effects workloads, with support for up to four NVIDIA RTX PRO 6000 Blackwell Max-Q Workstation Edition GPUs and next-generation Intel workstation processors. The system is also positioned as a host platform for HP Z Boost, enabling GPU resources to be shared among users.

HP also introduced the HP Max Side Panel for Z8 Fury and Z4 workstations, a chassis expander that increases internal volume by 15%. The add-on is designed to enable the installation of larger graphics cards tool-free while maintaining thermal performance and serviceability.

On the mobile side, new versions of the HP ZBook X G2i, HP ZBook 8 G2i, and ZBook 8 G2a extend workstation-class performance to users who need to work away from a desk. These systems include AMD and Intel options, integrated or discrete graphics, scalable memory, and a lighter form factor intended to preserve battery life while supporting more demanding applications.

HP positions the ZBook X as its most powerful 16-inch mainstream mobile workstation, with 3000-level graphics and up to 128GB of RAM. That hardware is designed to reduce rendering bottlenecks and speed up photorealistic rendering and real-time project reviews for architects, engineers, and designers. In an Autodesk Inventor example, the ZBook 8 G2i delivered rendering speeds up to 3.3 times faster for a mobile engineer. The ZBook 8 line also includes a new GaN adapter that is up to 40% smaller and 50% lighter.

Z Boost Adds Shared GPU Power for AI and Rendering Workflows

HP Z Boost, first introduced for AI workloads, is also being extended to rendering workloads. The platform turns workstations into shared, on-demand GPU resources, allowing users to tap into additional graphics power without moving files off their local systems. According to the announcement, customers using Z Boost for AI have enabled hundreds of additional training runs through shared GPU access. At the same time, early rendering deployments showed up to 5.7 times faster rendering in applications including Catia and Siemens NX. In that configuration, HP’s mobile ZBook systems connect as client devices, while desktop Z systems provide the host GPU resources.

Several of the new systems are set to launch on HP.com in the coming months. The HP ZBook 8 G2i and G2a, the HP Z4 G6i Desktop, and the HP Z8 Fury G6i are expected to become available starting in April, while the HP ZBook X G2i is slated for Spring 2026. Pricing has not yet been announced.

ZGX Fury Extends HP’s Push Into Local AI Infrastructure

HP has also unveiled the ZGX Fury, a deskside AI system built for data-center-class AI development and inference in on-premises environments. The system is intended for organizations seeking production-grade compute outside the cloud, as AI inference moves closer to where data is created due to latency, privacy, cost, and data gravity concerns. As cloud infrastructure continues to play a role in AI at scale, the growing use of agentic AI is increasing token consumption and overall compute demand, leading to higher costs and added latency for some real-world workloads.

Powered by NVIDIA’s GB300 Grace Blackwell Ultra Desktop Superchip and 748GB of coherent memory, the ZGX Fury supports trillion-parameter inference and fine-tuning for models with more than 100 billion parameters. The platform is built to support large teams while avoiding the specialized infrastructure, cooling requirements, and facility demands associated with traditional data center deployments. It also allows teams to move from development to production on the same machine, giving users a single system for developing, validating, and deploying AI workloads locally with more direct control over data and workflows.

The broader software stack includes the HP ZGX Toolkit, a free, open-source collection of AI tools preconfigured for rapid startup and free of licensing fees, as well as hardware-level protections, isolated pipelines, and sovereign deployment options for sensitive data. The system also supports autonomous AI agents via NVIDIA OpenShell. This open-source runtime governs agent operations and inference routing while allowing agents to run in isolated sandboxes with privacy and security controls. HP is also collaborating on NVIDIA NemoClaw, an open-source stack for running OpenClaw always-on assistants with a single command, as part of the NVIDIA Agent Toolkit, which combines the OpenShell runtime with open-source models such as NVIDIA Nemotron.

The post HP Expands Z Workstation Lineup With New Systems for AI, Mobile Work, and Hybrid IT appeared first on StorageReview.com.

Dell’s UltraSharp U5226KW is built around a simple premise: replace your entire multi-monitor setup with one massive 52-inch 6K display. Spanning 6144 × 2560 across a single uninterrupted panel, it offers the kind of workspace normally reserved for dual 4K screens, but without bezels, gaps, or the constant window juggling that comes with them.

As a 52-inch 6K display, it sits in a niche segment of the professional monitor market. At around $2,900, it is aimed at users who can actually take advantage of that scale, whether that’s dense multi-window workflows, large datasets, or timeline-heavy content creation.

Beyond the panel itself, the U5226KW serves as a full docking hub, making the display the center of your entire setup. A single Thunderbolt 4 connection handles display output, up to 140W power delivery, networking via 2.5GbE, and KVM control, effectively consolidating your desk into one cable.

The real question is how that combination of docking functionality, size, and pixel density holds up in day-to-day work. So, let’s take a closer look.

Screen Layout and Multi-Window Flexibility

Dell provides a range of screen partitioning options that allow the panel to function like several displays at once. Horizontal splits, vertical slices, large primary windows with smaller secondary panels, and various multi-window layouts are supported.

On a workstation or desktop operating system, these regions simply appear as custom resolutions, which works well for arranging multiple applications. External devices with fixed resolution options (such as consoles) are less flexible because they rely on specific aspect ratios.

The panel supports 1.07 billion colors, 99% coverage of the DCI-P3 and Display P3 color spaces, and full sRGB and BT.709. In use, this means smoother gradients with minimal visible banding. Dell also factory calibrates the display to a Delta E below 1.5, which is accurate enough for most professional workflows out of the box.

On the physical side, this is a large and heavy display, measuring just over 48 inches wide and weighing more than 40.2 pounds with the stand attached, so desk space and mounting matter. The stand allows for 3.54 inches of height adjustment, along with tilt and swivel, providing flexibility in positioning. There is no pivot support, which lines up with the size and ultrawide format. For those planning to mount it, the display supports multiple VESA patterns, including 100 × 100, 200 × 100, and 200 × 200, so it will work with heavier-duty arms or wall mounts.

Dell’s UltraSharp 52 Thunderbolt Hub Monitor (U5226KW) Specifications

Specifcations	Dell UltraSharp 52 Thunderbolt Hub Monitor
General
Number of Screens	1
Screen Size Class	52″
Viewable Screen Size	51.5″
Screen Mode	6K
Panel Technology	In-Plane Switching (IPS) Black Technology
Curved Screen	Yes
Curvature	4200R
HDCP Supported	Yes
Mount Type	Panel Mount
Display Specifications
Maximum Resolution	6144 x 2560 at 120Hz
Standard Refresh Rate	120 Hz
Aspect Ratio	21:9
Pixel Pitch	0.19644 mm x 0.19644 mm
Pixel Per Inch (PPI)	129
Horizontal Viewing Angle	178°
Vertical Viewing Angle	178°
Native Contrast Ratio	2,000:1
Brightness	400 cd/m²
Color Supported	1.07 Billion Colors
Color Gamut	99% DCI-P3 (CIE 1976) 100% sRGB (CIE 1931) 100% BT.709 (CIE 1931) 99% Display P3
Calibration Accuracy	E < 1.5
Response Time Details	5 ms GTG (Fast) 8 ms GTG
HDMI Feature Support	Variable Refresh Rate (VRR)
Surface Treatment	Anti-glare Low Reflectance
Glass Hardness	3H
Flicker Free	Yes
Ergonomics
Maximum Adjustable Height	3.54″
Tilt Angle	-5° to 10°
Swivel Angle	-20° to 20°
Slant Angle	-2°/2°
Pivot	No
Audio
Speakers	Yes
Number of Speakers	2
Speaker Output Power	2 x 9 W
Microphone	No
Connectivity
Connectivity	2 HDMI port/s (HDCP 2.2) (Supports up to 6144 x 2560, 120 Hz, VRR, as specified in HDMI 2.1 (FRL)) 2 DisplayPort 1.4 (HDCP 2.2) port/s 4 USB Type-A 10Gbps downstream port/s 3 USB-C 10Gbps upstream port/s 1 Thunderbolt 4 40Gbps upstream port/s (DisplayPort 1.4 Alt Mode, Power Delivery up to 140 W EPR) 1 RJ45 Ethernet port/s, 2.5GbE 1 USB Type-A 10Gbps downstream port/s with Battery Charging 2 USB-C 10Gbps downstream port/s, Power Delivery up to 27 W
Power
Input Voltage Range	100V AC to 240V AC
Voltage Current	5.50 A
Operating Power Consumption	63.60 W
Standby Power Consumption	0.5 W
Off-Mode Power Consumption	0.3 W
Maximum Power Consumption	430 W
Physical Characteristics
Width	48.16″
Height	20.83″
Depth	4.41″

Panel Technology and Image Performance

Dell uses IPS Black panel technology here, where a typical IPS panel has a 1000:1 contrast ratio, and IPS Black brings that closer to 2000:1. The difference shows up most in darker content, with blacks appearing deeper instead of slightly gray. For work in darker interfaces, video timelines, or dense dashboards, this helps keep elements more distinct and easier to separate.

With a rated brightness of 400 cd/m², the panel is better suited to productivity than HDR use, and in practice, it holds up well in bright environments. Under the strong overhead lighting in our lab, the display remained bright enough to be comfortable for extended sessions.

An ambient light sensor mounted along the top edge monitors room lighting and can automatically adjust both brightness and color temperature. In a controlled office environment where lighting rarely changes (like ours most of the time), the feature doesn’t have much impact on day-to-day use. However, in home offices where sunlight and ambient light vary throughout the day, the adjustments help keep brightness levels and color temperature balanced as conditions change.

The panel also uses a matte anti-glare surface, which significantly reduces reflections from overhead lights or windows. Combined with the large surface area of the display, the matte coating helps maintain readability across the entire panel.

For setups that require more control, Dell Display and Peripheral Manager allows profiles to be created and stored directly on the monitor, making it easier to keep color consistent across multiple displays in the same workspace.

Living With a 52-Inch Monitor

After using a display this large for a week or so, it introduced different ergonomic considerations compared to traditional 27- or 34-inch productivity monitors. At native scaling and closer viewing distances, the full width of the panel can require noticeable head movement when scanning across applications. Some users may prefer to position the display farther back on the desk and increase OS scaling to keep everything within a more relaxed field of view. That setup can make the screen easier to view since your eyes and neck do not have to move as much, but increasing scaling also means icons and text become larger. This reduces some of the extra workspace provided by 6K resolution.

The panel uses a 21:9 aspect ratio with a 4200R curve, and at this size, I found that the curve helps bring the edges of the screen in a bit so you are not constantly looking side to side as much. With pixel density at around 129 PPI, it is very similar to a 27-inch 4K display, so text and UI elements look sharp when running at native scaling.

Motion, Eye Comfort, and Long-Session Usability

Large productivity monitors often operate at 60 Hz, but the U5226KW runs at 120 Hz, which improves cursor tracking and scrolling across a screen this wide. The difference becomes more noticeable when navigating large spreadsheets, timelines, or long documents that stretch across the full width of the display. The U5226KW also includes HDMI 2.1 with Variable Refresh Rate (VRR) support. While gaming is not really what this display is built for, VRR helps keep motion smooth by matching the screen’s refresh rate to your system’s output when frame rates vary.

The U5226KW carries two separate TÜV Rheinland certifications: a 5-star eye comfort rating and a Category I hardware low-blue-light certification, and it is the first monitor to achieve the latter. The Category I certification means blue light emissions are reduced to no more than 20% of typical output, and unlike software filters, there is no noticeable shift in color balance during use. With flicker-free backlighting, the display held up well during long work periods without causing strain.

Design, Build, and Hub Connectivity

The U5226KW operates as a full docking hub for modern workstations and laptops. A Thunderbolt 4 upstream connection provides 40 Gbps bandwidth, DisplayPort 1.4 Alt Mode support, and up to 140W of power delivery using the Extended Power Range (EPR) specification. That power level is more than enough for mobile workstations and high-performance laptops that draw over 100W under sustained workloads.

Video inputs include two HDMI 2.1 ports and two DisplayPort 1.4 inputs, allowing multiple systems to remain connected simultaneously. The monitor also integrates a 2.5GbE Ethernet port with enterprise management features including PXE boot, MAC address pass-through, and Wake-on-LAN, allowing the display to integrate directly into managed IT environments.

The USB configuration is extensive as well, with several 10 Gbps USB-A and USB-C ports available both upstream and downstream, along with 27 W USB-C charging outputs and BC1.2 support on one USB-A port for higher-current charging.

For multi-system environments, Picture-by-Picture supports multiple input sources on the display simultaneously, with the monitor’s five available inputs (two HDMI, two DisplayPort, and one Thunderbolt 4) allowing several systems to remain connected at once. The monitor also includes an Auto USB KVM function with Ethernet switching, allowing one keyboard and mouse to control multiple connected systems while maintaining network connectivity through the monitor.

Integrated audio consists of dual 9 W speakers. In professional environments, monitor speakers are often secondary to external audio systems or headsets. The output level here is higher than that of most integrated display speakers and works well enough for conferencing, training materials, or temporary setups.

The monitor’s size becomes noticeable when accessing the on-screen display controls. Reaching around the side of a 52-inch panel takes a little more effort compared to finding the edge of a smaller monitor. The interface itself follows the same layout Dell uses across its UltraSharp lineup, but the experience changes slightly because of the screen’s sheer width.

Conclusion

Ultimately, your experience with the U5226KW depends on how well your workflow can leverage a single, massive canvas. The 52-inch 6K display can cleanly replace a dual-monitor setup, but it does require some adjustment. Sitting closer gives you access to the full workspace, while pulling the display back improves comfort at the cost of usable density.

Once dialed in, the benefits become clear. The ability to organize everything on one continuous screen removes the friction of multi-monitor layouts, especially for PC workflows where window management and screen partitioning are flexible.

Image quality is strong, brightness holds up well in bright environments, and the matte finish keeps reflections under control across the full panel. The integrated hub adds real value, turning the display into a single-cable connection point for power, networking, and peripherals.

At $2,900, this is not a general-purpose upgrade. It makes the most sense for users who can fully utilize the space, whether that is multi-window productivity, large datasets, or timeline-based work. In the right setup, the U5226KW does something few displays can: it replaces not just multiple monitors, but the complexity that comes with them.

Product Page – Dell UltraSharp 52 Thunderbolt Hub Monitor

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At NVIDIA GTC 2026, Intel announced that its Intel Xeon 6 processors are being used as the host CPUs for NVIDIA DGX Rubin NVL8 systems. This design win extends the established use of Xeon within NVIDIA’s GPU platforms and underscores the processor’s role in orchestrating large-scale, GPU-accelerated AI infrastructure. As AI workloads transition toward massive, real-time inference, the host CPU remains a critical component for system-level scalability and architectural continuity.

The Evolving Role of the Host CPU in AI Inference

The shift from large-scale model training to real-time, agentic AI and reasoning systems has elevated the importance of the host CPU. In these environments, the CPU is no longer a secondary component but a mission-critical engine that governs orchestration, memory access, and model security. Intel states the Xeon 6 is engineered to deliver the throughput and efficiency required to manage these complex GPU-accelerated systems while maintaining compatibility with the extensive x86 software ecosystem that enterprise customers rely on for scaling inference.

Inference performance is increasingly defined by CPU-led system orchestration rather than by raw GPU throughput alone. The host CPU directly shapes overall cluster efficiency and total cost of ownership by managing critical functions such as memory management and workload scheduling. By ensuring operational continuity and reliability, Xeon 6 provides the foundation necessary for modern AI infrastructure across data centers, the cloud, and edge environments.

Technical Advantages of Xeon 6 in DGX Rubin Systems

The integration of Intel Xeon 6 into DGX Rubin NVL8 systems builds upon the architectural foundation established with the Intel Xeon 6776P in current NVIDIA Blackwell-based platforms, including DGX B300 systems. This continuity allows organizations to carry forward existing performance optimizations and system-level expertise into the next generation of AI hardware. According to Intel, Xeon is engineered to maximize GPU utilization through features such as Priority Core Turbo, which maintains a consistent data flow to accelerators.

Memory capacity and bandwidth are central to the Xeon 6 value proposition for AI. The platform supports up to 8 TB of system memory to accommodate large models and expanding KV caches. Furthermore, the implementation of MRDIMM technology delivers 2.3 times higher memory bandwidth generation over generation, significantly improving the rate at which data is fed to GPUs. This is complemented by a high count of PCIe 5.0 lanes, providing the high-bandwidth, low-latency I/O required to support multiple AI accelerators and high-speed networking.

Security and Confidential Computing

As AI inference scales, end-to-end confidential computing has become essential for protecting sensitive data and proprietary models. Intel Xeon 6 addresses these requirements through Intel Trust Domain Extensions (TDX), which provide hardware-based isolation and attestation. This creates a secure foundation for modern AI clusters by ensuring that data remains protected as it moves through the system.

Security is further enhanced across the CPU-to-GPU data paths. Features such as the Encrypted Bounce Buffer enable confidential computing throughout the entire processing pipeline, safeguarding AI data and models during use. This hardware-rooted isolation is critical for maintaining the integrity of mission-critical environments and protecting intellectual property in heterogeneous inference workloads.

Ecosystem Integration and Efficiency

Intel Xeon 6 offers optimized support throughout the AI software stack, including new compatibility with NVIDIA Dynamo. This enables more efficient heterogeneous inference across both CPUs and GPUs, allowing for better resource allocation. The platform’s focus on efficient performance per watt helps organizations manage the power density of modern AI clusters, reducing long-term TCO without sacrificing the single-thread performance needed for effective orchestration and scheduling.

By providing orchestration of GPU-accelerated systems, Intel Xeon 6 ensures that even as inference workloads grow in complexity, data movement remains fluid and efficient. The combination of proven reliability, mature software support, and advanced I/O capabilities reinforces Xeon’s position as a cornerstone of modern AI infrastructure, enabling the deployment of secure and scalable AI solutions at a global scale.

The post NVIDIA DGX Rubin NVL8 Supports Intel Xeon 6 as Host CPU Option for x86-Based AI Inference appeared first on StorageReview.com.

KIOXIA has announced the GP Series, a new SSD designed for AI systems that would allow GPUs to directly access flash memory as an extension of high-bandwidth memory, or HBM. They’ve dubbed this drive a “Super High IOPS SSD” built for AI and high-performance computing workloads. According to Kioxia, the drive is designed to expand the amount of memory accessible to GPUs and improve data access for AI applications.

The announcement is tied to Nvidia’s Storage-Next initiative, which aims to address growing demand for GPU-accessible memory as AI workloads become more data-intensive. In current systems, GPU memory is limited by HBM capacity. Storage-Next is intended to extend usable memory space by allowing GPUs to access flash-based storage more directly.

KIOXIA said the GP Series uses its XL-FLASH storage-class memory and is being designed for GPU-initiated AI workloads. The new drives are intended to deliver lower latency, higher input/output performance, 512-byte data access granularity, and lower power consumption per I/O than its conventional TLC SSDs.

KIOXIA also discussed its previously announced CM9 Series PCIe 5.0 SSDs, including a 25.6TB E3.S configuration aimed at AI inference systems, where larger models and longer context windows are increasing demand for key-value cache capacity. The company said the TLC-based drive, rated for 3 drive writes per day endurance, is designed to support architectures that extend the memory hierarchy beyond GPU memory using high-performance storage, including Nvidia’s Context Memory Storage, or CMX. Samples are expected to begin shipping in the third quarter of 2026.

KIOXIA GP Series Availability

KIOXIA will demonstrate a Super High IOPS SSD emulator and other technologies at Nvidia GTC at booth 3522. Evaluation samples of the GP Series are expected to be available to select customers by the end of 2026.

 

The post KIOXIA GP Series SSD Extends GPU Memory with XL-FLASH for NVIDIA Storage-Next AI Workloads appeared first on StorageReview.com.

Micron announced a suite of high-volume production AI memory and storage products at NVIDIA GTC 2026, headlined by its HBM4 36GB 12-high stack, its 192GB SOCAMM2 module, and the Micron 9650 PCIe Gen6 data center SSD.

Micron HBM4

The HBM4 36GB 12H product entered volume shipment in the first quarter of calendar 2026 and is designed for NVIDIA Vera Rubin. Micron lists pin speeds exceeding 11 Gb/s and bandwidth exceeding 2.8 TB/s. Compared with its HBM3E, the company reports a 2.3× bandwidth gain and more than 20% improved power efficiency.

Micron also indicated progress on a higher-capacity HBM4 part: Samples of its HBM4 48GB 16H have already been shipped to customers, using a 16-die stack. That increases capacity per HBM placement by 33% compared with the HBM4 36GB 12H version.

Alongside HBM4, Micron’s SOCAMM2 products are now part of the rollout around NVIDIA Vera Rubin systems. The 192GB SOCAMM2 is in high-volume production, and it sits within a broader portfolio ranging from 48GB to 256GB. These modules are designed for NVIDIA Vera Rubin NVL72 systems and standalone NVIDIA Vera CPU platforms. Micron says this setup enables up to 2TB of memory and 1.2 TB/s of bandwidth per CPU.

Micron 9650

On the storage side, Micron has moved its PCIe Gen6 data center SSD into high-volume production. The Micron 9650 is described as the first mass-produced PCIe Gen6 data center SSD. It is built for AI training and inference workloads on the NVIDIA BlueField-4 STX reference architecture and is also intended for liquid-cooled environments.

The drive delivers up to 28 GB/s of sequential read throughput and 5.5 million random read IOPS. Micron also says it offers up to twice the read performance of Gen5 SSDs and 100% higher performance per watt.

Two Variants: PRO and MAX

The Micron 9650 is offered in two configurations: PRO and MAX. Both models use G9 TLC NAND and are available in E1.S and E3.S form factors, supporting modern data center deployment standards.

Micron 9650 PRO

• Capacities: 7.68 TB to 30.72 TB
• Sequential read/write: 28,000 / 14,000 MB/s
• Random read: 5.4–5.5 million IOPS
• Random write: 500,000–570,000 IOPS
• Endurance: 1 drive write per day (DWPD) for five years

Micron 9650 MAX

• Capacities: 6.4 TB to 25.6 TB
• Sequential read/write: 28,000 / 14,000 MB/s
• Random read: 5.4–5.5 million IOPS
• Random write: up to 900,000 IOPS
• Endurance: 3 DWPD for five years

Both models operate at a maximum of 25 watts, offer a mean time to failure rating of 2.5 million hours at 50°C, and support advanced security and compliance features. The drives are also designed to be compatible with GPU-direct technologies and liquid-cooled environments.

Micron’s Gen5 lineup continues alongside that product, with the Micron 7600 and 9550 SSDs listed as additional options for customers designing data center systems.

The post Micron Begins Volume Production of HBM4, PCIe Gen6 SSD and 192GB SOCAMM2 for NVIDIA Vera Rubin appeared first on StorageReview.com.

Dell Technologies has introduced a broad refresh of its professional workstation lineup, spanning large tower systems, mobile workstations, and AI-focused developer systems. The announcement includes several additions across the Dell Pro Precision family, as well as two systems in the Pro Max line, covering workloads ranging from engineering and design to AI development and high-performance computing.

Across the lineup, Dell is emphasizing hardware configurations designed for demanding professional applications, including high-core-count CPUs, NVIDIA RTX PRO Blackwell graphics options, large memory capacities, and fast PCIe storage. Many systems also include features intended for enterprise deployment, such as ISV certification, device management tools, and security features built into firmware and system management layers.

The release covers eight systems in total. At the top of the stack are two large tower workstations designed for expansion and high-end workloads, followed by an AI-focused desk-side development system. The remainder of the lineup consists of mobile workstations in 16-inch and 14-inch form factors across two different performance tiers.

Dell Pro Precision 9 Series T6

First up is the Dell Pro Precision 9 Series T6 workstation, designed as a high-capacity tower for large-scale engineering, simulation, and AI workloads. The system supports Intel Xeon 600 processors for workstations, with configurations offering up to 86 CPU cores, enabling parallel workloads such as complex modeling, rendering, and large-dataset analysis. This is the most scalable tower workstation in Dell’s lineup.

Graphics capabilities center on NVIDIA RTX Pro 6000 Blackwell GPUs, with configurations that support multiple GPU layouts based on power requirements. The system can accommodate up to two 600-watt GPUs, five 300-watt GPUs, or seven 50-watt GPUs for specialized workloads. Memory capacity scales up to 4TB of DDR5 ECC memory distributed across 16 DIMM slots, providing headroom for applications that rely on large in-memory datasets.

For expansion, the tower supports up to 15 PCIe slots across PCIe Gen4 and Gen5 standards, allowing additional GPUs, networking hardware, or specialized accelerator cards to be installed. Storage capacity can reach up to 316TB through configurations of M.2, E3.S, SATA, and SAS drives, while optional Wi-Fi 7 connectivity and a 2400W power supply round out the system’s infrastructure for demanding workstation environments.

Specification	Dell Pro Precision 9 T6-PW9T6260
Overview
Model Number	Dell Pro Precision 9 T6-PW9T6260
System Type	T6 Tower design
Chipset	Intel W890
Case Color	Dark Cres Dell Standard Black
Processor
Supported Processors	Intel Xeon 698X (336 MB cache, 86 cores, up to 4.8 GHz, 350 W) Intel Xeon 696X (336 MB cache, 64 cores, up to 4.8 GHz, 350 W) Intel Xeon 678X (192 MB cache, 48 cores, up to 4.9 GHz, 300 W) Intel Xeon 676X (144 MB cache, 32 cores, up to 4.9 GHz, 275 W) Intel Xeon 674X (144 MB cache, 28 cores, up to 4.9 GHz, 270 W) Intel Xeon 658X (144 MB cache, 24 cores, up to 4.9 GHz, 250 W) Intel Xeon 656 (72 MB cache, 20 cores, up to 4.8 GHz, 210 W) Intel Xeon 654 (72 MB cache, 18 cores, up to 4.8 GHz, 200 W)
Operating System
Operating Systems	Windows 11 Pro Ubuntu Linux 24.04 LTS
Memory
Memory Type	RDIMM
Memory Speed	Up to 6400 MT/s
Memory Capacity	16 GB 32 GB 64 GB 96 GB 128 GB 192 GB 256 GB 384 GB 512 GB 768 GB 1024 GB 1152 GB 1536 GB 2048 GB 3072 GB 4096 GB
Maximum Memory	4096 GB (4 TB)
Graphics
NVIDIA GPUs	NVIDIA A800 Active, 40 GB HBM2 NVIDIA RTX PRO 6000 Blackwell Workstation Edition, 96 GB GDDR7, 600 W NVIDIA RTX PRO 6000 Blackwell Max-Q Workstation Edition, 96 GB GDDR7, 300 W NVIDIA RTX PRO 5000 Blackwell, 48 GB GDDR7 NVIDIA RTX PRO 4500 Blackwell, 32 GB GDDR7 NVIDIA RTX PRO 4000 Blackwell, 24 GB GDDR7 NVIDIA RTX PRO 2000 Blackwell, 16 GB GDDR7 NVIDIA RTX A1000, 8 GB GDDR6 NVIDIA RTX A400, 4 GB GDDR6 NVIDIA GeForce GTX 5090, 32 GB GDDR7 NVIDIA GeForce GTX 5080, 16 GB GDDR7 NVIDIA GeForce GTX 5070, 12 GB GDDR7 NVIDIA GeForce GTX 5060, 8 GB GDDR7
AMD GPUs	AMD Radeon PRO W7400 Professional Graphics, 8 GB GDDR6
Storage
SSD Options	512 GB SSD, TLC, SED 1 TB SSD, TLC, SED 2 TB SSD, TLC, SED 4 TB SSD, TLC, SED
3.5-inch HDD Options	4 TB, 7200 RPM, SATA Enterprise HDD 8 TB, 7200 RPM, SATA Enterprise HDD 12 TB, 7200 RPM, SATA Enterprise HDD 16 TB, 7200 RPM, SATA Enterprise HDD 20 TB, 7200 RPM, SATA Enterprise HDD 24 TB, 7200 RPM, SATA Enterprise HDD
2.5-inch HDD Options	1.2 TB, 10000 RPM, SAS Enterprise HDD 2.4 TB, 10000 RPM, SAS Enterprise HDD
Internal Storage Slots	2 SATA 3.5-inch HDD 3 M.2 2230/2280 Gen5 PCIe NVMe SSD 1 M.2 2230/2280 Gen4 PCIe NVMe SSD
External Storage Slots	Up to 12 NVMe drives + optional slim ODD Up to 8 externally facing SATA/SAS 3.5″ HDD Flexbay
Expansion
PCIe Slots	1 full height Gen5 PCIe x8 slot – Slot1 (open ended) 1 full height Gen5 PCIe x16 slot – Slot2 1 full height Gen4 PCIe x8 slot (x4 electrical) – Slot3 (open ended) 1 full height Gen4 PCIe x8 slot – Slot4 (open ended) 1 full height Gen5 PCIe x16 slot – Slot5 1 full height Gen4 PCIe x8 slot (x4 electrical) – Slot6 (open ended)
Ports
Front Ports	1 Global headset audio jack 2 USB 3.2 Gen 2 (10 Gbps) ports 1 USB 3.2 Gen 2×2 (20 Gbps) Type-C port with PowerShare 1 USB 3.2 Gen 2 (10 Gbps) Type-C port 1 SD-card 7.0+ slot (Optional)
Rear Ports	1 line-out port 2 PS2 ports 1 Serial port 1 RJ45 Ethernet port, 10GbE 1 RJ45 Ethernet port, 1GbE 2 USB 3.2 Gen 2 (10 Gbps) ports 2 USB 3.2 Gen 2 (10 Gbps) ports with SmartPower 2 USB 3.2 Gen 2 (10 Gbps) Type-C port 1 USB 3.2 Gen 2×2 (20 Gbps) Type-C port
Networking
Ethernet	1 RJ-45 Ethernet port, 10GbE 1 RJ-45 Ethernet port, 1GbE
Wireless	MediaTek Wi-Fi 7 MT7925, 2×2, 802.11be, MU-MIMO, Bluetooth® 5.4 wireless card
Audio
Audio Controller	Realtek Audio Controller, ALC3246
Internal	Speaker
Front	Global headset audio jack
Rear	Single 3.5 mm line-out
Power
Power Supply	2400 W PSU 1200 W @100~114Vac 1500 W @115~199Vac 2400 W @200~240Vac
Dimensions
Height	449.80 mm (17.70 in.)
Width	294.10 mm (11.57 in.)
Depth	617.50 mm (24.31 in.)
Weight (minimum)	31.00 kg (68.34 lb)
Weight (maximum)	52.90 kg (116.62 lb)

Dell Pro Precision 9 Series T4

The Dell Pro Precision 9 Series T4 is another expandable tower workstation, offering a more compact configuration than the larger T6. It uses Intel Xeon 600 processors for workstations and supports up to 86 cores, allowing for high-performance computing for engineering workloads, simulations, and complex data processing tasks.

GPU options include NVIDIA RTX Pro 6000 Blackwell graphics cards, with configurations supporting a single 600-watt GPU, dual 300-watt GPUs, or up to four smaller 50-watt GPUs. Memory capacity also reaches up to 4TB of DDR5 ECC memory across 16 DIMM slots, allowing large workloads to run locally without frequent reliance on disk storage.

For storage and expansion capabilities, the workstation supports up to nine storage slots with combinations of M.2, E3.S, and SATA drives, enabling configurations up to 124TB. Six PCIe slots across PCIe Gen4 and Gen5 provide additional room for expansion cards, while power supplies of up to 2400W support configurations built for demanding compute tasks.

Specification	Dell Pro Precision 9 T4
Overview
Model Number	Dell Pro Precision 9 T4
Chassis	T4 Tower design
Chipset	Intel W890
Case Color	Dark Cres Dell Standard Black
Processor
Supported Processors	Intel Xeon 698X (336 MB cache, 86 cores, up to 4.8 GHz, 350 W) Intel Xeon 696X (336 MB cache, 64 cores, up to 4.8 GHz, 350 W) Intel Xeon 678X (192 MB cache, 48 cores, up to 4.9 GHz, 300 W) Intel Xeon 676X (144 MB cache, 32 cores, up to 4.9 GHz, 275 W) Intel Xeon 674X (144 MB cache, 28 cores, up to 4.9 GHz, 270 W) Intel Xeon 658X (144 MB cache, 24 cores, up to 4.9 GHz, 250 W) Intel Xeon 656 (72 MB cache, 20 cores, up to 4.8 GHz, 210 W) Intel Xeon 654 (72 MB cache, 18 cores, up to 4.8 GHz, 200 W) Intel Xeon 638 (72 MB cache, 16 cores, up to 4.8 GHz, 180 W) Intel Xeon 636 (48 MB cache, 12 cores, up to 4.7 GHz, 170 W) Intel Xeon 634 (48 MB cache, 12 cores, up to 4.7 GHz, 150 W)
Operating System
Operating Systems	Windows 11 Pro Ubuntu Linux 24.04 LTS
Memory
Memory Type	RDIMM
Memory Speed	6400 MT/s
Maximum Memory	4096 GB (4 TB)
DIMM Slots	16 DIMM slots
Graphics
NVIDIA GPUs	NVIDIA A800 Active, 40 GB HBM2 NVIDIA RTX PRO 6000 Blackwell Workstation Edition, 96 GB GDDR7, 600 W NVIDIA RTX PRO 6000 Blackwell Max-Q Workstation Edition, 96 GB GDDR7, 300 W NVIDIA RTX PRO 5000 Blackwell, 48 GB GDDR7 NVIDIA RTX PRO 4500 Blackwell, 32 GB GDDR7 NVIDIA RTX PRO 4000 Blackwell, 24 GB GDDR7 NVIDIA RTX PRO 2000 Blackwell, 16 GB GDDR7 NVIDIA RTX A1000, 8 GB GDDR6 NVIDIA RTX A400, 4 GB GDDR6 NVIDIA GeForce GTX 5090, 32 GB GDDR7 NVIDIA GeForce GTX 5080, 16 GB GDDR7 NVIDIA GeForce GTX 5070, 12 GB GDDR7 NVIDIA GeForce GTX 5060, 8 GB GDDR7
AMD GPUs	AMD Radeon PRO W7400 Professional Graphics, 8 GB GDDR6
Storage
SSD Options	512 GB SSD, TLC, SED-Ready 1 TB SSD, TLC, SED-Ready 2 TB SSD, TLC, SED-Ready 4 TB SSD, TLC, SED-Ready
HDD Options	4 TB, 7200 RPM, 3.5-inch, SATA, Enterprise HDD 8 TB, 7200 RPM, 3.5-inch, SATA, Enterprise HDD 12 TB, 7200 RPM, 3.5-inch, SATA, Enterprise HDD 16 TB, 7200 RPM, 3.5-inch, SATA, Enterprise HDD 20 TB, 7200 RPM, 3.5-inch, SATA, Enterprise HDD 24 TB, 7200 RPM, 3.5-inch, SATA, Enterprise HDD
Expansion Slots
PCIe Slots	1 full height Gen5 PCIe x8 slot – Slot1 (open ended) 1 full height Gen5 PCIe x16 slot – Slot2 1 full height Gen4 PCIe x8 slot (x4 electrical) – Slot3 (open ended) 1 full height Gen4 PCIe x8 slot – Slot4 (open ended) 1 full height Gen5 PCIe x16 slot – Slot5 1 full height Gen4 PCIe x8 slot (x4 electrical) – Slot6 (open ended)
Internal Storage Slots	2 SATA 3.5-inch HDD 3 M.2 2230/2280 Gen5 PCIe NVMe SSD 1 M.2 2230/2280 Gen4 PCIe NVMe SSD
External Storage Slots	Up to 4 NVMe drives + optional slim ODD Up to 2 externally facing SATA 3.5-inch HDD Flexbay
Ports
Front Ports	1 Global headset audio jack 2 USB 3.2 Gen 2 (10 Gbps) ports 1 USB 3.2 Gen 2×2 (20 Gbps) Type-C® port with PowerShare 1 USB 3.2 Gen 2 (10 Gbps) Type-C® port 1 SD-card 7.0+ slot (Optional)
Rear Ports	1 line-out port 2 PS2 ports 1 Serial port 1 RJ45 Ethernet port, 10GbE 1 RJ45 Ethernet port, 1GbE 2 USB 3.2 Gen 2 (10 Gbps) ports 2 USB 3.2 Gen 2 (10 Gbps) ports with SmartPower 2 USB 3.2 Gen 2 (10 Gbps) Type-C port 1 USB 3.2 Gen 2×2 (20 Gbps) Type-C port
Networking
Ethernet	1 RJ-45 Ethernet port, 10GbE 1 RJ-45 Ethernet port, 1GbE
Wireless	MediaTek Wi-Fi 7 MT7925, 2×2, 802.11be, MU-MIMO, Bluetooth® 5.4 wireless card
Audio
Audio Controller	Realtek Audio Controller, ALC3246
Internal Audio	Speaker
Front Audio	Global headset audio jack
Rear Audio	Single 3.5 mm line-out
Power
Power Supply Options	1500 W PSU 1000 W @100~114Vac 1200 W @115~179Vac 1500 W @180~240Vac2400 W PSU 1200 W @100~114Vac 1500 W @115~199Vac 2400 W @200~240Vac
Dimensions
Height	449.80 mm (17.70 in.)
Width	203.70 mm (8.01 in.)
Depth	617.50 mm (24.31 in.)
Weight (minimum)	24.10 kg (53.13 lb)
Weight (maximum)	33.60 kg (74.10 lb)

Dell Pro Max with GB300

The Dell Pro Max with GB300 targets AI development workflows with a desk-side system built around the NVIDIA Grace Blackwell Ultra GB300 superchip. This architecture combines a Grace CPU with a 72-core Arm-based design and advanced AI acceleration, enabling the system to process intensive machine-learning workloads locally.

Performance capabilities are designed for large-scale AI experimentation. The system delivers up to 20,000 TFLOPS of FP4 computing power and includes 748GB of coherent memory, as well as support for up to 16TB of NVMe storage. These specifications enable developers to run local inference, train models, and experiment with large datasets without relying exclusively on remote compute infrastructure.

The workstation also supports collaborative workflows through features such as MIG Personal Cloud, which allows up to seven users to access the system with isolated memory environments. Systems can also be connected via ConnectX-8 networking hardware to expand performance and scale workloads. The platform runs Ubuntu with NVIDIA AI development tools preinstalled, providing a preconfigured software stack designed for AI development and data science.

Specification	Dell Pro Max with GB300
Overview
Model	Dell Pro Max with GB300
System Type	Desk-side AI development workstation
Architecture	NVIDIA Grace Blackwell Ultra GB300 Superchip platform
Case Color	Magnetite
Processor
CPU	NVIDIA Grace 72 Core Neoverse V2
Operating System
Operating System	Ubuntu Linux with NVIDIA AI Developer Tools
Memory
System Memory	496 GB LPDDR5X, 6400 MT/s, SOCAMM
AI Coherent Memory	Up to 748 GB coherent memory
Graphics / AI Acceleration
Integrated GPU	NVIDIA DGX B300, 252 GB HBM3e (onboard)
Discrete GPU	NVIDIA RTX PRO 2000 Blackwell, 16 GB GDDR7 (PCIe card)
AI Compute Performance	Up to 20,000 TFLOPS FP4 computing power
Storage
Primary Storage	16 TB (4 × 4 TB) SSD, Gen4, SED Ready
Maximum NVMe Storage	Up to 16 TB NVMe storage
Ports
Top Ports	2 USB 3.2 Gen 2 (10 Gbps) ports 2 USB 3.2 Gen 2 (10 Gbps) Type-C ports
Rear Ports	2 QSFP112 (400 Gbps) ports 4 USB 3.2 Gen 2 (10 Gbps) ports 1 RJ-45 Ethernet port, 1 GbE 1 RJ-45 Ethernet port, 10 GbE 1 line-out port 1 line-in port 1 audio input/microphone port
Display Outputs	4 mDP ports
Networking
Ethernet	1 RJ-45 Ethernet port (1 Gbps) 1 RJ-45 Ethernet port (10 Gbps)
High-Speed Interconnect	2 QSFP112 (400 Gbps) ports (ConnectX-8 Smart NIC)
Audio
Audio Controller	Realtek high-performance Audio chip ALC4080
Security
Security Slot	1 Kensington security-cable slot
Trusted Platform Module	TPM 2.0 discrete FIPS 140-2 certification FIPS 140-3 certification TCG Certification for TPM
Power
Power Supply	1600 W Titanium internal power supply unit (C19 inlet)
Dimensions
Height	569 mm (22.40 in.)
Width	231.60 mm (9.12 in.)
Depth	610.50 mm (24.04 in.)
Weight (maximum)	38.67 kg (85.25 lb)

Dell Pro Max 16

The Dell Pro Max 16 extends Dell’s workstation lineup into a mobile system built for intensive workloads. It incorporates AMD Ryzen AI PRO series processors, with configurations reaching the Ryzen AI 9 HX PRO 475 processor alongside NVIDIA RTX PRO Blackwell graphics options. The Dell Pro Max 16 focuses on a mobile workstation platform built around AMD Ryzen AI Pro processors and discrete NVIDIA RTX Pro graphics, while the Dell Pro Max with GB300 targets AI development workloads with NVIDIA GB300 infrastructure designed for large-scale AI model training and inference.

Memory and storage configurations are designed for on-the-go workstation applications. The system supports LPDDR5x memory running at up to 8000MT/s and offers storage capacities up to 4TB. These specifications enable workloads such as design, rendering, and engineering applications to run on a portable system without relying heavily on external compute resources.

The laptop features a 16-inch display with a 16:10 aspect ratio and options reaching QHD+ resolution. Connectivity includes Wi-Fi 7 and Bluetooth 5.4, while a 96 Whr six-cell battery supports extended mobile use. ISV certification and MIL-STD testing are included to help ensure compatibility with professional applications and durability under everyday use conditions.

Specification	Dell Pro Max 16 MC16255
Overview
Model Number	Dell Pro Max 16 MC16255
System Type	16-inch mobile workstation laptop
Platform	Copilot+ AI PC
Case Color	Magnetite
Processor
Supported Processors	AMD Ryzen AI 5 PRO 340 with PRO technologies (6 cores, 12 threads, up to 4.8 GHz Max Boost Clock) up to 50 TOPS NPU AMD Ryzen AI 7 PRO 350 with PRO technologies (8 cores, 16 threads, up to 5.0 GHz Max Boost Clock) up to 50 TOPS NPU AMD Ryzen AI 9 HX PRO 370 with PRO technologies (12 cores, 24 threads, up to 5.1 GHz Max Boost Clock) up to 50 TOPS NPU AMD Ryzen AI 5 PRO 440 with PRO technologies (6 cores, 12 threads, up to 4.8 GHz Max Boost Clock) up to 50 TOPS NPU AMD Ryzen AI 7 PRO 450 with PRO technologies (8 cores, 16 threads, up to 5.1 GHz Max Boost Clock) up to 50 TOPS NPU AMD Ryzen AI 9 HX PRO 475 with PRO technologies (12 cores, 24 threads, up to 5.2 GHz Max Boost Clock) up to 60 TOPS NPU
Operating System
Operating Systems	Windows 11 Home Windows 11 Pro Ubuntu Linux 24.04 LTS, 64-bit
Memory
Memory Type	LPDDR5x
Memory Speed	8000 MT/s
Memory Options	16 GB LPDDR5x dual-channel (onboard) 32 GB LPDDR5x dual-channel (onboard) 64 GB LPDDR5x dual-channel (onboard)
Graphics
Integrated Graphics	AMD Radeon 840M Graphics AMD Radeon 860M Graphics AMD Radeon 890M Graphics
Discrete Graphics	NVIDIA RTX PRO 500 Blackwell, 6 GB GDDR7 NVIDIA RTX PRO 1000 Blackwell, 8 GB GDDR7
Storage
Storage Options	256 GB SSD, Gen4 512 GB SSD, Gen4 1 TB Performance SSD, Gen4, SED Ready 2 TB Performance SSD, Gen4, SED Ready
Display
Display Options	16-inch FHD+ (1900 × 1200), 16:10, 60 Hz, WVA, Anti-Glare, 400 nits 16-inch FHD+ Touch (1900 × 1200), 16:10, 60 Hz, WVA, Anti-Glare, 400 nits 16-inch QHD+ (2560 × 1600), 120 Hz, WVA, Anti-Glare, 300–400 nits, 100% sRGB, ComfortView Plus
Ports
USB / Thunderbolt	2 Thunderbolt 4 ports (40 Gbps) with Power Delivery and DisplayPort
Additional Ports	USB 3.2 Gen 1 (5 Gbps) with PowerShare USB 3.2 Gen 1 (5 Gbps) HDMI 2.1 RJ45 (1 Gbps) Ethernet Global headset port
Slots	MicroSD card slot Smart-card reader slot (optional) Wedge-shaped lock slot
Camera
Camera Options	1080p FHD RGB HDR camera, dual-array microphones, TNR 1080p FHD RGB HDR + IR camera, dual-array microphones, TNR
Audio
Audio Controller	Realtek ALC1708
Speakers	Stereo speakers, 2 W × 2 (4 W total)
Networking
Wireless	MediaTek Wi-Fi 7 MT7925, 2×2, 802.11be, MU-MIMO, Bluetooth 5.4
Battery
Battery Options	4-cell, 64 Wh Lithium Ion Polymer, ExpressCharge 6-cell, 96 Wh Lithium Ion Polymer, ExpressCharge
Dimensions
Height (rear)	0.72 in (18.36 mm)
Height (peak)	0.97 in (24.70 mm)
Height (front)	0.54 in (13.78 mm)
Width	14.09 in (358 mm)
Depth	10.08 in (256 mm)
Starting Weight	4.64 lb (2.1 kg)

Dell Pro Precision 7 Series 16

The Dell Pro Precision 7 Series 16 mobile workstation targets creators and professionals who work with large-scale design and engineering applications. It uses Intel Core Ultra Series 3 processors with integrated neural processing units capable of up to 50 TOPS, alongside NVIDIA RTX PRO Blackwell graphics options.

Memory configurations up to 64GB of LPDDR5x operate at 8533 MT/s, while storage capacity extends to 8TB via PCIe Gen5 drives. High-speed connectivity includes Thunderbolt 4 and Thunderbolt 5 ports along with HDMI 2.1, enabling fast data transfer and compatibility with external displays and devices.

The system includes several features focused on user experience. Display options include a 16-inch panel with up to 4K Tandem OLED resolution, a 120Hz variable refresh rate, and support for 100% DCI-P3 color accuracy. Additional hardware includes an 8MP camera with presence detection and ambient light sensing, as well as a redesigned keyboard and haptic touchpad for professional workflows.

Specification	Dell Pro Precision 7 Series 16 Laptop, PW716260
Overview
Model Number	Dell Pro Precision 7 Series 16 Laptop, PW716260
System Type	16-inch mobile workstation laptop
Chassis Materials	Aluminum and magnesium
Case Color	Magnetite
Processor
Supported Processors	Series 3 Intel Core Ultra 9 386H vPro (50 TOPS NPU, 16 cores, 16 threads, up to 4.9 GHz, 50W) Series 3 Intel Core Ultra X7 368H vPro (50 TOPS NPU, 16 cores, 16 threads, up to 5.0 GHz, 50W) Series 3 Intel Core Ultra 7 366H vPro (50 TOPS NPU, 16 cores, 16 threads, up to 4.8 GHz, 50W) Series 3 Intel Core Ultra 7 356H (50 TOPS NPU, 16 cores, 16 threads, up to 4.7 GHz, 50W)
Operating System
Operating Systems	Windows 11 Pro Windows 11 Home Ubuntu Linux 24.04, 64-bit
Memory
Memory Type	LPDDR5X
Memory Speed	8533 MT/s
Memory Options	16 GB (onboard), LPDDR5X, dual-channel 32 GB (onboard), LPDDR5X, dual-channel 64 GB (onboard), LPDDR5X, dual-channel
Graphics
Integrated Graphics	Intel Graphics Intel Arc B390 Intel Arc Pro B390
Discrete Graphics	NVIDIA RTX PRO 1000 Blackwell, 8 GB GDDR7 NVIDIA RTX PRO 2000 Blackwell, 8 GB GDDR7 NVIDIA RTX PRO 3000 Blackwell, 12 GB GDDR7
Storage
Storage Options	512 GB SSD, TLC, Gen4 1 TB SSD, TLC, Gen4 512 GB SSD, TLC, Gen5, SED Ready 1 TB SSD, TLC, Gen5, SED Ready 2 TB SSD, TLC, Gen5, SED Ready 4 TB SSD, TLC, Gen5, SED Ready
Maximum Storage	Up to 8 TB PCIe Gen 5 storage
Display
FHD+ Display Option	16-inch Non-Touch FHD+ 120Hz Variable Refresh Rate 100% DCI-P3 Anti-Glare 500 nits 8MP + IR Camera
4K OLED Display Option	16-inch Touch 4K UHD+ Tandem OLED 120Hz Variable Refresh Rate 500 nits 100% DCI-P3 VESA DisplayHDR True Black 1000 Anti-Reflection 8MP + IR Camera
Ports
USB / Thunderbolt	2 Thunderbolt 5 ports (80/120 Gbps) with Power Delivery and DisplayPort 2.1 1 Thunderbolt 4 port (40 Gbps) with Power Delivery and DisplayPort 2.1
Additional Ports	HDMI 2.1 Universal headset port
Slots	SD card slot Wedge-shaped lock slot
Camera
Camera	8 MP RGB + IR camera with dual-array microphones
Audio
Speakers	Stereo woofer 2.5 W × 2 and stereo tweeter 2.5 W × 2 (10 W total peak)
Audio Technology	Cirrus Logic audio with Dolby Atmos
Networking
Wireless	Intel Wi-Fi 7 BE211, 2×2, 802.11be, MIMO, Bluetooth 6.0
Battery
Battery	6-cell 96 Wh lithium-ion battery ExpressCharge Long Life Cycle battery option
Power Adapter
Power Adapter Options	100 W USB-C AC adapter (for systems with integrated graphics) 165 W USB-C AC adapter
Input
Keyboard	Zero-Lattice spill-resistant keyboard with mini-LED backlighting
Touchpad	Haptic touchpad
Dimensions
Starting Weight	2.17 kg (4.78 lb)
Width	353.80 mm (13.93 in.)
Depth	240.28 mm (9.46 in.)
Height (OLED model)	Rear: 20.24 mm (0.80 in.) Peak: 21.05 mm (0.83 in.) Front: 20.24 mm (0.80 in.)
Height (FHD model)	Rear: 20.85 mm (0.82 in.) Peak: 22 mm (0.87 in.) Front: 20.85 mm (0.82 in.)

Dell Pro Precision 7 Series 14

The Dell Pro Precision 7 Series 14 provides a smaller mobile workstation alternative built around Intel Core Ultra Series 3 processors and NVIDIA RTX PRO Blackwell graphics. The system is designed for creators and professionals who need workstation performance in a more compact form factor.

Hardware configurations include up to 64GB of LPDDR5x memory running at 8533MT/s and up to 4TB of storage. Graphics options include NVIDIA RTX PRO 2000 Blackwell GPUs, allowing the system to run professional applications such as design tools, visualization software, and engineering platforms.

Mobility plays a significant role in the design. The system weighs approximately 3.51 pounds and supports Wi-Fi 7 and Bluetooth 6.0 connectivity. Battery capacity reaches 72Whr, while features such as an OLED display option, haptic touchpad, and 8MP camera with presence detection support collaboration and mobile productivity.

Specification	Dell Pro Precision 7 Series 14 Laptop, PW714260
Overview
Model Number	Dell Pro Precision 7 Series 14 Laptop, PW714260
System Type	14-inch mobile workstation laptop
Chassis	Aluminum and magnesium
Case Color	Magnetite
Processor
Supported Processors	Series 3 Intel Core Ultra 9 386H vPro (50 TOPS NPU, 16 cores, 16 threads, up to 4.9 GHz, 45W) Series 3 Intel Core Ultra X7 368H vPro (50 TOPS NPU, 16 cores, 16 threads, up to 5.0 GHz, 45W) Series 3 Intel Core Ultra 7 366H vPro (50 TOPS NPU, 16 cores, 16 threads, up to 4.8 GHz, 45W) Series 3 Intel Core Ultra 7 356H (50 TOPS NPU, 16 cores, 16 threads, up to 4.7 GHz, 45W)
Operating System
Operating Systems	Windows 11 Pro Windows 11 Home Ubuntu Linux 24.04, 64-bit
Memory
Memory Type	LPDDR5X
Memory Speed	8533 MT/s
Memory Options	16 GB (onboard), LPDDR5X, dual-channel 32 GB (onboard), LPDDR5X, dual-channel 64 GB (onboard), LPDDR5X, dual-channel
Graphics
Integrated Graphics	Intel Graphics Intel Arc B390 Intel Arc Pro B390
Discrete Graphics	NVIDIA RTX PRO 1000 Blackwell, 8 GB GDDR7 NVIDIA RTX PRO 2000 Blackwell, 8 GB GDDR7
Storage
Storage Options	256 GB SSD, TLC, Gen4 512 GB SSD, TLC, Gen4 1 TB SSD, TLC, Gen4 512 GB SSD, TLC, Gen5, SED Ready 1 TB SSD, TLC, Gen5, SED Ready 2 TB SSD, TLC, Gen5, SED Ready 4 TB SSD, TLC, Gen5, SED Ready
Display
FHD+ Display Option	14-inch Non-Touch FHD+ 60Hz Variable Refresh Rate 100% sRGB Anti-Glare 400 nits 8MP + IR Camera
QHD+ OLED Display Option	14-inch Touch QHD+ Tandem OLED 60Hz Variable Refresh Rate 100% DCI-P3 Anti-Reflection 400 nits VESA DisplayHDR True Black 500 8MP + IR Camera
Ports
USB / Thunderbolt	2 Thunderbolt 5 ports (80/120 Gbps) with Power Delivery and DisplayPort 2.1 2 Thunderbolt 4 ports (40 Gbps) with Power Delivery and DisplayPort 2.1
Additional Ports	Global headset port
Slots	MicroSD-card slot Wedge-shaped lock slot
Camera
Camera	8 MP RGB + IR Camera, dual-array microphones
Audio
Speakers	Stereo woofer 2.5 W x 2 and stereo tweeter 2.5 W x 2 (10 W total peak)
Audio Technology	Cirrus Logic audio with Dolby Atmos
Networking
Wireless	Intel Wi-Fi 7 BE211, 2×2, 802.11be, MIMO, Bluetooth 6.0 wireless card
Battery
Battery	4-cell, 72 Wh Lithium Ion battery, ExpressCharge 4-cell, 72 Wh Lithium Ion Polymer battery, ExpressCharge, Long Life Cycle
Power Adapter
Power Adapter Options	100 W AC adapter, USB Type-C (for systems with integrated graphics) 130 W AC adapter, USB Type-C
Input
Keyboard	Zero-Lattice spill-resistant keyboard with mini-LED backlighting
Touchpad	Haptic touchpad
Dimensions
Starting Weight	1.59 kg (3.51 lb)
Width	310.60 mm (12.23 in.)
Depth	212.45 mm (8.36 in.)
Height (OLED model)	Rear: 18.91 mm (0.74 in.) Peak: 19.72 mm (0.78 in.) Front: 18.91 mm (0.74 in.)
Height (FHD model)	Rear: 19.32 mm (0.76 in.) Peak: 20.12 mm (0.79 in.) Front: 19.32 mm (0.76 in.)

Dell Pro Precision 5 Series 16

The Dell Pro Precision 5 Series 16 mobile workstation is positioned as an entry point for professional users who require workstation-class hardware. The system uses Intel Core Ultra Series 3 processors with integrated NPUs delivering up to 50 TOPS for AI workloads. It supports NVIDIA RTX PRO Blackwell graphics cards up to the RTX PRO 2000.

Memory configurations use LPDDR5x at 8533 MT/s and support up to 64GB, while storage capacities reach up to 4 TB with PCIe Gen5 drives. These specifications enable the system to run common design and engineering applications while maintaining mobility.

The device features a 16-inch display with a 16:10 aspect ratio and resolution options reaching QHD+. A full-size keyboard, large clickpad, and 8MP infrared camera are included for collaboration and everyday work. Connectivity includes Wi-Fi 7 and Bluetooth 6.0, while a 96Wh battery supports extended mobile use.

Specification	Dell Pro Precision 5 Series 16 Laptop, PW516261
Overview
Model Number	Dell Pro Precision 5 Series 16 Laptop, PW516261
System Type	16-inch mobile workstation laptop
Case Color	Magnetite
Processor
Supported Processors	Series 3 Intel Core Ultra 5 Processor 336H (18 MB cache, 12 cores, up to 4.60 GHz), up to 50 TOPS NPU Series 3 Intel Core Ultra 7 Processor 366H (18 MB cache, 16 cores, up to 4.80 GHz), up to 50 TOPS NPU Series 3 Intel Core Ultra 9 Processor 386H (18 MB cache, 16 cores, up to 4.90 GHz), up to 50 TOPS NPU
Operating System
Operating Systems	Windows 11 Home Windows 11 Pro Ubuntu Linux 22.04 LTS, 64-bit
Memory
Memory Type	LPCAMM LPDDR5x
Memory Speed	8533 MT/s
Memory Options	16 GB: 1 x 16 GB, LPCAMM LPDDR5x, 8533 MT/s, dual-channel 32 GB: 1 x 32 GB, LPCAMM LPDDR5x, 8533 MT/s, dual-channel 64 GB: 1 x 64 GB, LPCAMM LPDDR5x, 8533 MT/s, dual-channel
Graphics
Integrated Graphics	Intel Graphics
Discrete Graphics	NVIDIA RTX PRO 500 Blackwell Generation graphics, 6 GB GDDR7 NVIDIA RTX PRO 1000 Blackwell Generation graphics, 8 GB GDDR7 NVIDIA RTX PRO 2000 Blackwell Generation graphics, 8 GB GDDR7
Storage
Storage Options	256 GB, M.2 2230, Gen4 PCIe NVMe SSD 512 GB, M.2 2230, Gen4 PCIe NVMe SSD 1 TB, M.2 2230, Gen4 PCIe NVMe SSD 1 TB, M.2 2280, Gen5 PCIe NVMe SSD, Self-Encrypting 2 TB, M.2 2280, Gen5 PCIe NVMe SSD, Self-Encrypting
Display
FHD+ Display Option	16-inch, Touch, 16:10 1920 x 1200, 60 Hz WVA, Anti-Glare 400 nit, 45% NTSC No Pen Support
QHD+ Display Option	16-inch, Non-Touch, 16:10 2560 x 1600, 120 Hz WVA, Anti-Glare 400 nit 100% sRGB ComfortView Plus
Ports
USB / Thunderbolt	2 Thunderbolt 4 (40 Gbps) ports with Power Delivery and DisplayPort
Additional Ports	USB 3.2 Gen 1 (5 Gbps) port with PowerShare USB 3.2 Gen 1 (5 Gbps) port HDMI 2.1 port RJ45 (1 Gbps) Ethernet port Global headset port
Slots	MicroSD-card slot Nano-SIM card slot (optional) Smart-card reader slot (optional) Wedge-shaped lock slot
Camera
Camera Options	1080p at 30 fps widescreen FHD RGB HDR camera, dual-array microphones, TNR 8 MP HDR + IR camera, dual-array microphones, TNR, ambient light sensor
Audio
Audio Controller	Realtek ALC1718B
Speakers	Stereo speakers, 2 W × 2 (4 W total)
Networking
Wireless LAN	Intel Wi-Fi 6E AX211, 2×2, 802.11ax, MU-MIMO, Bluetooth 5.3 Intel Wi-Fi 7 BE211, 2×2, 802.11be, MU-MIMO, Bluetooth 6.0
Mobile Broadband	5G – Mediatek T700 (DW5933e), eSIM capable
Battery
Battery Options	4-cell, 64 Wh Lithium Ion Polymer, ExpressCharge capable 6-cell, 96 Wh Lithium Ion Polymer, ExpressCharge capable
Power Adapter
Power Adapter Options	100 W AC adapter, USB Type-C 130 W AC adapter, USB Type-C
Dimensions
Height (rear)	0.72 in (18.36 mm)
Height (peak)	0.97 in (24.7 mm)
Height (front)	0.54 in (13.78 mm)
Width	14.09 in (358 mm)
Depth	10.08 in (256 mm)
Starting Weight	2.16 kg (4.77 lb)

Dell Pro Precision 5 Series 14

The Dell Pro Precision 5 Series 14 rounds out the lineup as a compact mobile workstation intended for lighter design workloads and everyday professional tasks. The system uses Intel Core Ultra Series 3 processors with an integrated NPU capable of up to 50 TOPS, enabling local AI features and modern productivity tools.

Graphics configurations include optional NVIDIA RTX PRO 500 Blackwell-generation GPUs with up to 64GB of memory, running at 8533 MT/s. Storage options extend up to 2TB using PCIe Gen5 drives, offering space for project files and professional software installations.

The laptop weighs approximately 3.98 pounds and includes connectivity options such as Wi-Fi 7 and Bluetooth 6.0. Display options include a 14-inch panel with a 16:10 aspect ratio and up to QHD+ resolution. At the same time, the system also supports an optional 8MP infrared camera and a redesigned chassis with an aluminum top cover.

Specification	Dell Pro Precision 5 Series 14 Laptop, PW514261
Overview
Model Number	Dell Pro Precision 5 Series 14 Laptop, PW514261
System Type	14-inch mobile workstation laptop
Case Color	Magnetite
Processor
Supported Processors	Series 3 Intel Core Ultra 5 Processor 336H (18 MB cache, 12 cores, up to 4.60 GHz), up to 50 TOPS NPU Series 3 Intel Core Ultra 7 Processor 366H (18 MB cache, 16 cores, up to 4.80 GHz), up to 50 TOPS NPU Series 3 Intel Core Ultra 9 Processor 386H (18 MB cache, 16 cores, up to 4.90 GHz), up to 50 TOPS NPU
Operating System
Operating Systems	Windows 11 Home Windows 11 Pro Ubuntu Linux 24.04 LTS, 64-bit
Memory
Memory Type	LPCAMM LPDDR5x
Memory Speed	8533 MT/s
Memory Options	16 GB: 1 x 16 GB, LPCAMM LPDDR5x, 8533 MT/s, dual-channel 32 GB: 1 x 32 GB, LPCAMM LPDDR5x, 8533 MT/s, dual-channel 64 GB: 1 x 64 GB, LPCAMM LPDDR5x, 8533 MT/s, dual-channel
Graphics
Integrated Graphics	Intel Graphics
Discrete Graphics	NVIDIA RTX PRO 500 Blackwell Generation graphics, 6 GB GDDR7
Storage
Storage Options	256 GB, M.2 2230, Gen4 PCIe NVMe SSD 512 GB, M.2 2230, Gen4 PCIe NVMe SSD 1 TB, M.2 2230, Gen4 PCIe NVMe SSD 1 TB, M.2 2280, Gen5 PCIe NVMe SSD, Self-Encrypting 2 TB, M.2 2280, Gen5 PCIe NVMe SSD, Self-Encrypting
Display
FHD+ Display Option	14-inch, Non-Touch, 16:10 1920 x 1200, 60 Hz WVA, Anti-Glare 400 nits 45% NTSC
FHD+ Touch Display Option	14-inch, Touch, 16:10 1920 x 1200, 60 Hz WVA, Anti-Glare 400 nits 100% sRGB No Pen Support
QHD+ Display Option	14-inch, Non-Touch, 16:10 2560 x 1600, 90 Hz WVA, Anti-Glare 400 nits 100% sRGB ComfortView Plus
Ports
USB / Thunderbolt	2 Thunderbolt 4 (40 Gbps) ports with Power Delivery and DisplayPort
Additional Ports	USB 3.2 Gen 1 (5 Gbps) port with PowerShare USB 3.2 Gen 1 (5 Gbps) port HDMI 2.1 port RJ45 (1 Gbps) Ethernet port Universal headset port
Slots	Wedge-shaped lock slot Smart-card reader slot (optional)
Camera
Camera Options	1080p at 30 fps widescreen FHD RGB HDR camera, dual-array microphones, TNR 8 MP HDR + IR camera, dual-array microphones, TNR, ambient light sensor
Audio
Audio Controller	Realtek ALC1718B
Speakers	Stereo speakers, 2 W × 2 (4 W total)
Networking
Wireless LAN	Intel Wi-Fi 6E AX211, 2×2, 802.11ax, MU-MIMO, Bluetooth 5.3 Intel Wi-Fi 7 BE211, 2×2, 802.11be, MU-MIMO, Bluetooth 6.0
Battery
Battery	4-cell, 72 Wh Lithium Ion Polymer battery, ExpressCharge capable, Long Life Cycle
Power Adapter
Power Adapter Options	65 W AC adapter, USB Type-C 100 W AC adapter, USB Type-C
Dimensions
Height (rear)	0.72 in (18.33 mm)
Height (peak)	0.93 in (23.65 mm)
Height (front)	0.55 in (13.97 mm)
Width	12.32 in (313 mm)
Depth	8.95 in (227.30 mm)
Starting Weight	3.98 lb (1.81 kg)

Availabilty

Dell plans to release the new Pro Precision and Pro Max systems in phases beginning in March 2026, with additional workstation models arriving later in the spring.

• March 24, 2026
  • Dell Pro Max 16 (AMD Ryzen AI Pro)
• March 31, 2026
  • Dell Pro Precision 7 Series 14 mobile workstation (Intel integrated graphics)
  • Dell Pro Precision 7 Series 16 mobile workstation (Intel integrated graphics)
• May 2026
  • Dell Pro Precision 9 Series T2
  • Dell Pro Precision 9 Series T4
  • Dell Pro Precision 9 Series T6
  • Dell Pro Precision 5 Series 14 mobile workstation
  • Dell Pro Precision 5 Series 16 mobile workstation
  • Additional Dell Pro Precision 7 Series 14 and 16 mobile workstation configurations
• Dell Pro Max with GB300
  • Shipped to select customers in March 2026
  • Broader availability planned in the coming months

The post Dell Expands Professional Workstation Portfolio with New Precision and Pro Max Systems appeared first on StorageReview.com.

The Corsair MP700 MICRO 4TB SSD delivers next-generation storage bandwidth in a more compact form factor. Built around the compact M.2 2242 form factor using a PCIe Gen5 x4 interface, this drive is designed for thin and light laptops as well as small-form-factor workstations that need serious storage throughput on a much shorter PCB. With a hefty 4TB capacity, it also addresses a common limitation in this segment, where higher capacities in 2242 SSDs are still relatively rare.

The MP700 MICRO supports the NVMe 2.0 interface over PCIe Gen5 x4 and is rated for up to 10,000 MB/s read and 8,500 MB/s write speeds. For systems with only a single 2242 slot, 4TB lets you keep everything internal instead of managing external drives, while still leaving room for large game libraries or creative projects.

The storage is based on 3D TLC NAND, which remains the preferred choice for performance-oriented consumer and workstation SSDs due to its balance of endurance and cost-efficiency compared to QLC. The drive also supports S.M.A.R.T. monitoring for health and diagnostics. The drive also supports DEVSLP and low-power NVMe PS4 idle states below 3 mW, which is important for mobile systems where idle power consumption affects battery life.

Corsair MP700 MICRO Features and Market Positioning

With a listed price of $1,034.99, the MP700 MICRO 4TB is in the premium tier of this segment, with costs driven mainly by its Gen5 interface and 4TB capacity in a 2242 form factor. Corsair backs the drive with a 5-year warranty, which is normal for most other high-end NVMe SSDs.

In terms of positioning, the MP700 MICRO 4TB targets a very specific segment of buyers. There are not many 2242 drives offering Gen5 speeds, and even fewer that go all the way to 4TB. This makes it less of a general upgrade option and more of a specific solution for compact systems where space is fixed, but performance is important.

What makes the MP700 MICRO particularly interesting is how it fits into the class of compact AI workstations and Spark systems, including those we recently reviewed. These platforms rely exclusively on the shorter M.2 2242 form factor, which imposes tighter limits on storage options than traditional 2280 deployments. Because of that constraint, finding a drive that combines high capacity with modern Gen5 bandwidth in this size becomes much more challenging.

Corsair MP700 MICRO Specifications

Specification	Detail
Overview
Storage Form Factor	M.2 2242
SSD Package Contents	MP700 MICRO M.2 SSD
SSD Compatibility	M.2 2242 Interface Connector Windows 11, Windows 10, Mac OS X
Interface & Features
Interface	PCIe Gen 5 x 4
NAND Technology	3D TLC
SSD Smart Support	Yes
DEVSLP	PS4: <3mW
Environmental
SSD Operating Temperature	0°C to +65°C
Storage Temperature	-40°C to +85°C
Storage Humidity	93% RH (40° C)
Durability
Vibration	20Hz~80Hz/1.52mm, 80Hz~2000Hz/20G
SSD Shock	1,500 G
Physical
Weight	0.024kg

Corsair MP700 MICRO Performance

Peak Synthetic Performance

The FIO test is a flexible and powerful benchmarking tool for measuring the performance of storage devices, including SSDs and HDDs. It evaluates metrics such as bandwidth, IOPS, and latency under different workloads, like sequential and random read/write operations. This test helps to assess the peak performance of storage systems, making it useful for comparing different devices or configurations. We measured the peak burst performance for this test, limiting the workload to a 10GB footprint on both SSDs.

In the FIO synthetic benchmarks, the Corsair MP700 MICRO shows a performance profile that demonstrates the constraints of its compact 2242 design. Its sequential read speed reaches 9,169 MB/s with an average latency of 0.91ms, placing it below most full-size Gen5 drives that exceed 13,000 MB/s, though it remains competitive with high-end Gen4 drives such as the WD SN850X and Samsung 990 Pro. Sequential writes reach 7,948 MB/s with 1.06ms latency, again trailing larger Gen5 models but remaining competitive with high-end Gen4 drives.

For random performance, the Corsair MP700 MICRO posts 1.277M IOPS in 4K reads and 1.540M IOPS in 4K writes, which places it slightly ahead of drives like the Crucial P510 and Samsung 990 Pro in some cases but below the stronger Gen5 performers that push past the 2M IOPS mark. While the MP700 MICRO does not compete with the fastest desktop-class Gen5 SSDs, it still delivers decent performance for a drive built around the much smaller M.2 2242 form factor.

FIO Test (higher MB/s/IOPS is better)	Sequential 128K Read (1T/64Q)	Sequential 128K Write (1T/64Q)	Random 4K Read (16T/32Q)	Random 4K Write (16T/32Q)
SanDisk SN8100	15,000 MB/s (0.56ms avg latency)	14,100 MB/s (0.59ms avg latency)	2.312M IOPS (0.22ms avg latency)	2.144M IOPS (0.24ms avg latency)
Kingston FURY Renegade G5	14,600 MB/s (0.57ms avg latency)	14,100 MB/s (0.59ms avg latency)	2.028M IOPS (0.25ms avg latency)	2.028M IOPS (0.25ms avg latency)
Samsung 9100 Pro	14,600 MB/s (0.57ms avg latency)	13,300 MB/s (0.63ms avg latency)	2.734M IOPS (0.18ms avg latency)	2.734M IOPS (0.19ms avg latency)
SK hynix Platinum P51	14,500 MB/s (0.58ms avg latency)	13,500 MB/s (0.62ms avg latency)	2.369M IOPS (0.22ms avg latency)	2.669M IOPS (0.19ms avg latency)
Crucial T705	14,400 MB/s (0.58ms avg latency)	12,300 MB/s (0.68ms avg latency)	1.585M IOPS (0.32ms avg latency)	2.703M IOPS (0.19ms avg latency)
TEAMGROUP GE Pro 2TB	13,900 MB/s (0.60ms avg latency)	12,800 MB/s (0.65ms avg latency)	2.585M IOPS (0.23ms avg latency)	1.818M IOPS (0.28ms avg latency)
Lexar Professional NM1090 PRO	13,800MB/s (0.61ms avg latency)	13,600 MB/s (0.62ms avg latency)	2.251M IOPS (0.23ms avg latency)	1.818M IOPS (0.28ms avg latency)
TEAMGROUP GC Pro 2TB	13,600 MB/s (0.62ms avg latency)	12,700 MB/s (0.66ms avg latency)	2.110M IOPS (0.24ms avg latency)	1.686M IOPS (0.28ms avg latency)
PNY CS2150	10,400MB/s (0.80ms avg latency)	8,801MB/s (0.95ms avg latency)	1.379M IOPS (0.371ms avg latency)	1.623M IOPS (0.32ms avg latency)
Corsair MP700 MICRO 4TB	9,169 MB/s (0.91ms avg latency)	7,948 MB/s (1.06ms avg latency)	1.277M IOPS (0.40ms avg latency)	1.540M IOPS (0.33ms avg latency)
Crucial P510	8,835 MB/s (0.90 ms avg latency)	9,961 MB/s (0.80 ms avg latency)	1.163M IOPS (0.44ms avg latency)	1.196M IOPS (0.51ms avg latency)
Micron 3610 2TB	6,839 MB/s (1.23ms avg latency)	9,673 MB/s (0.87ms avg latency)	1.523M IOPS (0.34ms avg latency)	1.871M IOPS (0.27ms avg latency)
Samsung 990 Pro	7,483 MB/s (1.12ms avg latency)	7,197 MB/s (1.16ms avg latency)	1.400M IOPS (0.36ms avg latency)	1.403M IOPS (0.36ms avg latency)
Crucial P310 2TB	7,197 MB/s (1.16ms avg latency)	6,376 MB/s (1.31ms avg latency)	1.163M IOPS (0.44ms avg latency)	1.196M IOPS (0.43ms avg latency)
WD SN850X 2TB	6,632 MB/s (0.76ms avg latency)	7,235 MB/s (0.92ms avg latency)	1.2M IOPS (0.43ms avg latency)	825K IOPS (0.62ms avg latency)
Micron 2600 2TB	5,702 MB/s (1.47ms avg latency)	6,612 MB/s (1.27ms avg latency)	1.11M IOPS (0.46ms avg latency)	1.36M IOPS (0.38ms avg latency)

Average LLM Load Time

The Average LLM Load Time test evaluated the load times of three different LLMs: DeepSeek R1 7B, Meta Llama 3.2 11B, and DeepSeek R1 32B. Each model was tested 10 times, and the average load time was calculated. This test measures the drive’s ability to load large language models (LLMs) into memory quickly. LLM load times are critical for AI-related tasks, especially for real-time inference and processing large datasets. Faster loading enables the model to process data more quickly, thereby improving AI responsiveness and reducing wait times.

When it comes to loading Large Language Models into memory, the Corsair MP700 MICRO 4TB places near the bottom of the chart despite its Gen5 interface. Since LLM loading is almost entirely read-bound, the drive’s more modest sequential throughput compared to full-size Gen5 SSDs shows up quickly in this test. The MP700 MICRO posts 3.47 seconds for the DeepSeek R1 7B model, 5.21 seconds for the Meta Llama 3.2 11B Vision model, and 5.39 seconds for the larger DeepSeek R1 32B model.

Across the board, those results trail most of the Gen5 drives in the comparison, with many of them loading the 7B model closer to the mid-2-second range and completing the 32B model in roughly 4 to 4.8 seconds. While the MP700 MICRO still edges out the Micron 3610 in every model test, it cannot compete with the fastest desktop-class Gen5 drives for AI model loading.

Average LLM Load Time (lower is better)	DeepSeek R1 7B	Meta Llama 3.2 11B Vision	DeepSeek R1 32B
SK hynix Platinum P51	2.5481s	3.5809s	4.1790s
SanDisk SN8100	2.5702s	3.5856s	4.2870s
Samsung 9100 Pro 4TB	2.6173s	3.6017s	4.3735s
PNY CS2150	2.8107s	3.6820s	4.8962s
Crucial T705 2TB	2.8758s	3.6312s	5.1080s
Samsung 990 Pro 2TB	2.8758s	3.6312s	5.1080s
Crucial P510 1TB	2.8817s	3.6631s	5.0594s
TEAMGROUP GE Pro 2TB	2.9092s	3.9136s	4.8974s
TEAMGROUP GC Pro 2TB	2.9379s	3.9267s	4.8188s
WD SN850X 2TB	3.0082s	3.6543s	5.4844s
Kingston FURY Renegade G5	3.1843s	4.8009s	4.6523s
Crucial P310 2TB	3.1889s	3.7083s	5.4844s
Lexar Professional NM1090 PRO	3.2135s	4.9504s	7.2108s
Micron 2600 2TB	3.3178s	3.9174s	5.9060s
Corsair MP700 MICRO 4TB	3.4694s	5.2106s	5.3990s
Micron 3610 2TB	3.5348s	5.3853s	5.5731s

GPU Direct Storage

One of the tests we conducted on this testbench was the Magnum IO GPU Direct Storage (GDS) test. GDS is a feature developed by NVIDIA that allows GPUs to bypass the CPU when accessing data stored on NVMe drives or other high-speed storage devices. Instead of routing data through the CPU and system memory, GDS enables direct communication between the GPU and the storage device, significantly reducing latency and improving data throughput.

How GPU Direct Storage Works

Traditionally, when a GPU processes data stored on an NVMe drive, the data must first travel through the CPU and system memory before reaching the GPU. This process introduces bottlenecks because the CPU acts as a middleman, adding latency and consuming valuable system resources. GPU Direct Storage eliminates this inefficiency by enabling the GPU to access data directly from the storage device via the PCIe bus. This direct path reduces data-movement overhead, enabling faster, more efficient data transfers.

AI workloads, especially those involving deep learning, are highly data-intensive. Training large neural networks requires processing terabytes of data, and any delay in data transfer can lead to underutilized GPUs and longer training times. GPU Direct Storage addresses this challenge by ensuring that data is delivered to the GPU as quickly as possible, minimizing idle time and maximizing computational efficiency.

In addition, GDS is particularly beneficial for workloads that involve streaming large datasets, such as video processing, natural language processing, or real-time inference. By reducing the reliance on the CPU, GDS accelerates data movement and frees up CPU resources for other tasks, further enhancing overall system performance.

For comparison in these tests, we are using several Spark systems that we recently reviewed, each equipped with a different NVMe SSD configuration. These platforms provide a useful cross-section of both Gen4 and Gen5 storage implementations, allowing us to see how the Corsair MP700 MICRO behaves relative to drives in real-world GPU compute environments:

• Dell Pro Max with GB10 (Phison 4TB Gen4)
• Acer Veriton GN100 (Samsung 4TB Gen5)
• ASUS Ascent GX10 (Phison 1TB Gen4)

GDSIO Read Throughput 1M

In the 1MB sequential read test using GPU Direct Storage, the Corsair MP700 MICRO shows solid scaling early on, then levels off as thread counts increase. With a single thread, the drive delivers 3.93 GiB/s, quickly climbing to 5.23 GiB/s with two threads and peaking at about 6.19 GiB/s with four threads. Past that point, throughput stabilizes in the 5.7-6.1 GiB/s range up to 128 threads.

GDSIO Read Latency 1M

Latency trends follow the expected pattern as queue depth increases. On a single thread, average latency is about 248µs, which gradually increases to roughly 381µs with two threads and 636µs with four threads as additional parallel requests are introduced. As concurrency increases, latency rises more noticeably, reaching about 1,315µs at 8 threads, 2,535µs at 16 threads, and eventually climbing to roughly 27,807µs at 128 threads.

GDSIO Write Throughput 1M

In the 1MB sequential write test using GPU Direct Storage, the Corsair MP700 MICRO ramps up quickly, then settles into a stable throughput range as concurrency increases. With a single thread, the drive posts 6.04GiB/s, climbing to 7.09GiB/s at two threads and 7.21GiB/s at four threads. Performance continues to inch upward as thread counts increase, peaking at about 7.37GiB/s around the 16 to 32 thread range before flattening out. Beyond that point, throughput holds steady through 64 threads before dropping slightly to 6.48 GiB/s at 128 threads. Compared with the other drives in the chart, the MP700 MICRO trails the full-size Samsung Gen5 drive that exceeds 12GiB/s, though it maintains a lead over the Gen4 Phison-based models throughout most of the test.

GDSIO Write Latency 1M

Latency increases as thread counts rise due to the greater queue depth on the drive during the GDS workload. At one thread, the MP700 MICRO records an average latency of about 162µs, increasing to roughly 276µs at two threads and 542µs at four threads. As concurrency grows, latency scales upward to about 1,075µs at eight threads, 2,120µs at sixteen threads, and 4,240µs at thirty-two threads. Higher thread counts increase latency, reaching roughly 8,500 µs at 64 threads and about 19,749 µs at 128 threads. Even with this increase, the MP700 MICRO still has lower latency than the slower Gen4 configuration shown in the chart. It tracks relatively close to the higher-performing Samsung drive across most of the test range.

GDSIO Read Throughput 16K

In the 16K read test using GPU Direct Storage, the Corsair MP700 MICRO shows steady scaling as thread counts increase, gradually building throughput. Starting at 0.27GiB/s with a single thread, performance climbs to 0.58GiB/s at two threads and 1.04GiB/s at four threads. The drive continues to scale efficiently with higher queue depths, reaching 1.94GiB/s at eight threads and 2.56GiB/s at sixteen threads. Throughput continues rising to 3.77GiB/s at thirty-two threads and 5.31GiB/s at sixty-four threads, eventually topping out around 5.92GiB/s at 128 threads. Compared to the other drives in the chart, the MP700 MICRO performs particularly well at moderate thread counts, leading the group through much of the midrange before the Samsung Gen5 drive overtakes it at the highest thread count.

GDSIO Read Latency 16K

Latency for the 16K read workload starts relatively low and increases gradually as concurrency builds. At one thread, the Corsair MP700 MICRO records an average latency of about 55.5µs, improving slightly to around 52.6µs with two threads before rising to 59.0µs at four threads and 62.9µs at eight threads. As the queue depth increases further, latency grows more noticeably, reaching about 95.2µs at sixteen threads and 129.6µs at thirty-two threads. Higher thread counts continue this upward trend, with latency measuring roughly 184.0 µs at 64 threads and 330.0 µs at 128 threads. Even as the thread count increases, latency remains relatively controlled through the midrange of the test, only climbing more sharply once the workload reaches the highest thread counts.

GDSIO Write Throughput 16K

In the 16K write workload using GPU Direct Storage, the MP700 MICRO scales aggressively as thread counts increase, quickly climbing into its steady-state performance range. Starting at 1.03GiB/s with a single thread, throughput rises to 1.56GiB/s at two threads and 2.70GiB/s at four threads. Performance continues ramping with higher thread counts, reaching 4.97GiB/s at eight threads and peaking around 7.33GiB/s at sixteen threads. Beyond that point, the drive effectively plateaus, maintaining roughly 7.31 to 7.32GiB/s through 32, 64, and 128 threads. Compared with the other drives in the chart, the MP700 MICRO reaches its maximum throughput much earlier and maintains that level for the rest of the test, maintaining its lead throughout.

GDSIO Write Latency 16K

Latency begins very low in the 16K write test and stays that way as the leader. At a single thread, the Corsair MP700 MICRO records an average latency of about 14.7µs, rising to 19.6µs at two threads and 22.8µs at four threads. Even as throughput scales rapidly, latency remains relatively controlled by moderate queue depths, measuring 24.8 µs at eight threads and 33.3 µs at sixteen threads. As the number of threads increases, latency rises to 66.8µs at 32 threads, 133.3µs at 64 threads, and eventually about 267.2µs at 128 threads.

Conclusion

Overall, the Corsair MP700 MICRO 4TB delivers strong performance in a compact M.2 2242 form factor, offering a high-capacity option for systems that need serious storage throughput in a very limited physical footprint. Systems such as the Spark-class AI workstations rely entirely on that shorter module length, which narrows the range of drives that can be installed. In that environment, a drive that combines PCIe Gen5 bandwidth with 4TB of TLC NAND provides a nice upgrade path for local storage capacity and throughput. Other compact platforms, including high-end laptops that rely on a single 2242 slot, benefit from sufficient internal capacity for large datasets, AI models, and project files while still maintaining the high transfer speeds expected of modern NVMe storage.

Compared with the OEM Phison Gen4 drives used in the Dell Pro Max with GB10 and the ASUS Ascent GX10, the Corsair drive delivers stronger overall performance across several workloads, including GPU Direct Storage tests, where throughput scales quickly and remains steady at higher thread counts. Read-heavy scenarios still favor the Samsung Gen5 drive (which was used inside the Acer Veriton GN100), particularly in tests such as LLM model loading and peak sequential throughput. Ultimately, the Corsair drive primarily serves as an upgrade over Gen4 configurations, but it falls behind the faster Samsung Gen5 implementation.

The value of the MP700 MICRO becomes most apparent when the form-factor constraint is taken into account. Delivering PCIe Gen5 speeds alongside a full 4TB capacity within a 2242 module is still relatively uncommon. That combination gives compact compute platforms significantly more local storage headroom than many alternatives in this size class. Systems built around the Spark ecosystem, compact AI workstations, and thin mobile platforms all benefit from that added capacity and bandwidth when working with large datasets or model files. Priced at $1,034.99 on Corsair’s website and backed by a 5-year warranty, the MP700 MICRO is a premium option for users who require both high capacity and modern interface performance in a 2242 storage slot.

Product Page – Corsair MP700 MICRO 4TB

The post Corsair MP700 MICRO 4TB Review: PCIe Gen5 Performance in a Compact 2242 SSD appeared first on StorageReview.com.

Silicon Motion has introduced the SM8008, a PCIe Gen5 x4 NVMe enterprise SSD controller developed specifically for data center boot drives and other power-sensitive enterprise storage applications.

As AI and cloud infrastructure continue to expand, data centers are deploying servers at a much larger scale. Every one of those systems depends on a boot drive to start and run the operating environment. In hyperscale environments where thousands or even millions of systems operate simultaneously, the power consumption of these drives becomes a significant portion of overall data center energy use.

Silicon Motion SM8008 Features and Support

The SM8008 was developed with that in mind. Built on TSMC’s 6 nm process technology, the controller delivers up to 14 GB/s of sequential throughput and more than 2.3 million random IOPS for 4 KB workloads while maintaining active power consumption under 5 watts. It uses an eight-channel NAND architecture supporting ONFI and Toggle DDR 5.0 interfaces at speeds up to 3,600 MT/s.

The controller connects through a PCIe Gen5 x4 interface and supports the NVMe 2.0a protocol, providing bandwidth for next-generation server platforms. Depending on the SSD configuration, the architecture can support capacities up to 16TB.

To help manage system power and deployment costs at scale, the design supports a single DDR4-3200 or LPDDR4-3200 DRAM interface with inline ECC. This architecture helps reduce system power requirements and bill-of-materials cost for hyperscale deployments where thousands of drives may be installed across large server clusters.

Silicon Motion SM8008 Security

Security features are integrated directly into the controller. These include TCG Opal 2.0 encryption along with hardware-accelerated AES-256, SHA-512, and RSA-3072 cryptographic functions. The controller also supports secure boot and firmware authentication to help protect system integrity during operation.

Additional support for security frameworks such as DICE and SPDM is included, along with readiness for the CNSA 2.0 cryptographic standard. This aligns the controller with future compliance requirements expected for certain government and enterprise environments beginning in 2027.

Silicon Motion SM8008 Storage Capabilities

On the storage side, the controller incorporates Silicon Motion’s NANDCommand technology and an advanced LDPC error-correction engine. These technologies provide end-to-end data path protection and improve endurance across modern NAND flash configurations, including TLC and QLC memory. Hardware engines in the controller’s channel processors also support NAND processing techniques that improve performance and efficiency.

The SM8008 also supports standards used across hyperscale and enterprise infrastructure. It is compatible with the NVMe 2.0a protocol and aligns with the OCP Hyperscale NVMe Boot SSD Specification Version 1.0. The controller can be integrated into several enterprise SSD form factors, including M.2, U.2, E1.S, and E3.S, allowing vendors to deploy it across different server and storage platforms.

Silicon Motion SM8008 Specifications

Category	Details
Host Interface	PCIe Gen5 x4
Specifications	NVMe 2.0a protocol support OCP Hyperscale NVMe Boot SSD Specification Version 1.0 compliant (partial)
NAND Interface	8 NAND channels supporting ONFI and Toggle DDR 5.0 up to 3,600MT/s
DRAM Interface	DDR4-3200 and LPDDR4-3200 with inline ECC support
Performance	Up to 14GB/s sequential performance with active power under 5W 2.3M IOPS (4K) random IOs
Security Features	TCG Opal 2.0, AES 256, SHA2 512, RSA-3072b, DICE, SPDM, Secure Boot NANDCommand maximizing enterprise performance of next-generation NAND geometries with LDPC error correction and endurance extension for QLC and beyond
Enterprise Features	Supports NVMe Management Interface Basic Management Command (NVMe-MI v1.2) Supporting Advanced Data Placement Technologies: SR-IOV with 64 Virtual Functions CNSA 2.0 support Up to 16TB

Silicon Motion SM8008 Availability

Interest in controllers built specifically for boot storage is growing as hyperscale infrastructure evolves. Early deployments of the SM8008 are underway, with companies such as ATP and Exascend integrating the controller into new enterprise SSD platforms for large server environments.

The post Silicon Motion Introduces SM8008 PCIe Gen5 Controller for Enterprise Boot Drives and Ultra-Low-Power Storage appeared first on StorageReview.com.

Lenovo’s ThinkPad P16 Gen 3 is a high-end mobile workstation built around Intel’s Core Ultra 9 275HX and NVIDIA’s RTX PRO 5000, paired with a 16-inch 3200 x 2000 Tandem OLED touchscreen. It is a 5.6-pound workstation-replacement system built for users who rely on GPU acceleration, high-core-count CPUs, large memory pools, and PCIe Gen5 storage, all of which are ideal for demanding professional workflows. This makes it ideal for engineers working in CAD and simulation, visualization specialists, AI developers running local inference pipelines, and content creators dealing with high-resolution media.

The Core Ultra 9 275HX brings 24 cores to the P16 Gen 3, split into eight Performance cores clocking up to 5.4 GHz and 16 efficiency cores clocking up to 4.6 GHz, backed by 36 MB of L3 cache. The addition of Intel’s AI Boost NPU, rated at 13 TOPS, introduces another layer of acceleration for AI-assisted software, enabling workload distribution across CPU, GPU, and NPU resources.

The system ships with 32 GB of DDR5-5600 in a 2 x 16 GB configuration across four SO-DIMM slots, supporting expansion up to 192 GB, which is more than enough for simulation workloads, large assemblies, and virtualized development environments. Storage consists of a 1 TB M.2 NVMe SSD installed in a PCIe 5.0 x4 slot, with two additional PCIe 4.0 x4 M.2 2280 slots available.

For graphics, the P16 Gen 3  is powered by the mobile version of the NVIDIA RTX PRO 5000 based on the Blackwell 2.0 (GB203) architecture, built on TSMC’s 5nm 4N process. The chip packs 45.6 billion transistors into a 378 mm² die and has a 95W TDP. It features 24GB of GDDR7 memory on a 256-bit interface, delivering 896GB/s of bandwidth at an effective 28 Gbps. The base clock is rated at 1095 MHz, with a boost up to 1740 MHz, and it connects via PCIe 5.0 x16. For a mobile workstation, 24GB of VRAM is fairly substantial, especially in rendering, simulation, and AI-assisted workflows where memory limits often define project size.

The GPU includes 10,496 shading units across 82 streaming multiprocessors, along with 328 Tensor Cores and 82 RT cores. L1 cache is provisioned at 128 KB per SM, backed by a sizable 64 MB L2 cache. Theoretical compute throughput is rated at 36.53 TFLOPS for FP32 and FP16, with 570.7 GFLOPS for FP64. API support spans DirectX 12 Ultimate, Shader Model 6.8, OpenGL 4.6, Vulkan 1.4, OpenCL 3.0, and CUDA 12.0, aligning it with current professional rendering engines, simulation platforms, and CUDA-driven compute tools.

For connectivity and I/O, the big highlight is its two Thunderbolt 5 ports (up to 80 Gb/s) and a Thunderbolt 4 port (40 Gb/s). This will make it easy for high-speed external storage arrays, multi-display docking setups, and future high-bandwidth peripherals. HDMI 2.1 offers direct display output, and the inclusion of an SD Express card reader is great for media workflows. On the networking side, it is equipped with Wi-Fi 7 (2×2 MU-MIMO) and a 2.5 GbE RJ45 port.

Lenovo’s ThinkPad P16 Gen 3 Specifications

Specification	Lenovo ThinkPad P16 Gen 3
Performance
Processor	Intel Core Ultra 9 275HX
CPU	24-Core: 2.7 to 5.4 GHz Performance (8 Cores) 2.1 to 4.6 GHz Efficiency (16 Cores)
Dedicated AI Cores	Yes: 13 TOPS
L3 Cache	36 MB
GPU	NVIDIA RTX PRO 5000 with 24 GB GDDR7 VRAM
Installed RAM	32 GB
RAM Type	5600 MT/s DDR5
RAM Configuration / Capacity	2x User-Replaceable 16 GB Module / 4 Slots Supporting up to 192 GB (SO-DIMM)
vPro Support	No
Display
Panel Type	OLED
Size	16″
Aspect Ratio	16:10
Native Resolution	3200 x 2000
Touchscreen	Yes
Finish	Anti-Glare
Maximum Brightness	600 nits/cd/m2
Color Gamut	100% DCI-P3
Refresh Rate	120 Hz
Variable Refresh Technology	Variable Refresh Rate (VRR)
Storage and Expansion
Total Installed Storage	1 TB
Storage Drive Type	1x 1 TB / M.2 NVMe SSD
Storage Expansion	1x M.2 Slot 2280 (PCIe 5.0 x4) [Occupied] 2x M.2 Slot 2280 (PCIe 4.0 x4) [Available]
Inputs / Outputs
Inputs/Outputs	2x USB-C (Thunderbolt 5) / Supports Power Delivery 1x USB-C (Thunderbolt 4) / Supports Power Delivery 1x USB-A 3.1/3.2 Gen 2 / Supports Power Delivery 1x USB-A 3.1/3.2 Gen 2
Display I/O	1x HDMI 2.1 Output
Audio I/O	1x 1/8″ / 3.5 mm Headphone/Microphone Input/Output
Network I/O	1x RJ45 (2.5 GbE)
Built-In Speakers	Yes: 2x 2 W
Built-In Microphones	Yes: 2
Media/Memory Card Slot	Single Slot: SD (Unspecified Type)
Communications
Wi-Fi	Wi-Fi 7 (802.11be) with MU-MIMO Support (2 x 2)
Bluetooth	Bluetooth 5.4
Cellular Support	No
GPS	No
Webcam	Yes: User-Facing 5 MP
Battery
Battery Chemistry	Lithium-Ion Polymer (LiPo)
Capacity	99.9 Wh
Keyboard & Mouse
Keyboard	Built-In Full-Size Keyboard with Backlight
Pointing Device	TouchPad
General
Security	Dedicated Hardware TPM Security Chip, Facial Recognition, Fingerprint Reader, Kensington Lock Slot, Webcam Blocker
Power Supply	180 W with USB-C
Input Power	100 to 240 VAC, 50 / 60 Hz
Certifications	ENERGY STAR 9.0, EPEAT Gold, RoHS, TCO Certified Gen 10
Dimensions	14.25 x 9.92 x 1.17″ / 36.2 x 25.2 x 2.97 cm
Weight	5.6 lb / 2.5 kg

Lenovo ThinkPad P16 Gen 3 Build and Design

The ThinkPad P16 Gen 3 is a full-size 16-inch mobile workstation built to replace a desktop for professional users who need serious compute power on the go. At 5.6 pounds (2.5 kg), it’s not a lightweight machine, but it’s still more manageable than many 17- or 18-inch workstation systems. The design follows Lenovo’s familiar ThinkPad approach, focusing on durability, structure, and serviceability rather than an ultra-thin build. This laptop is designed for everyday use in real-world work environments.

Display and Front

The P16 Gen 3 features a 16-inch 3200 × 2000 Tandem OLED panel in a 16:10 aspect ratio. Resolution and vertical workspace are very important in use cases such as CAD, timeline editing, and coding environments, and the 2000-pixel height provides more usable screen area than traditional 16:9 panels. The display supports multi-touch input and features a peak brightness rating of 600 nits, 100% DCI-P3 color coverage, DisplayHDR 600 certification, and a variable refresh rate up to 120 Hz. Tandem OLED means the panel uses two light-emitting layers instead of one, which helps it reach higher brightness levels and reduces the workload for each layer.

There’s also a 5MP user-facing webcam above the display, accompanied by dual microphones.

Keyboard and Input

The P16 features a full-size backlit keyboard (as usual for the ThinkPad workstation lineup), including a dedicated numeric keypad.

It follows Lenovo’s usual workstation layout, built around a full 6-row design with a dedicated numeric keypad. For engineering applications, financial modeling, and CAD input, having a physical numpad is very important. Key travel is rated at 1.5 mm, giving the deck a deeper feel compared to thinner productivity systems. The keyboard is also spill-resistant, which is definitely a nice safeguard to have in studio and lab environments where employees have longer work sessions.

Lenovo also retains the TrackPoint with its dedicated three-button arrangement above the touchpad (including the red track button), allowing precise cursor control without leaving the home row. LED backlighting is standard, and the layout now includes the Copilot key.

Internal Hardware and Expandability

As we discussed earlier, the P16 Gen 3 integrates Intel’s Core Ultra 9 275HX processor, featuring 24 cores divided into eight Performance cores operating up to 5.4 GHz and sixteen Efficiency cores up to 4.6 GHz, supported by 36 MB of L3 cache. Memory is configured with 32 GB of DDR5-5600 in a 2 x 16GB arrangement across four SO-DIMM slots, with support for expansion up to 192GB. Storage consists of a 1TB M.2 NVMe SSD installed in a PCIe 5.0 ×4 slot. Two additional PCIe 4.0 ×4 M.2 2280 slots are available for expansion.

Left, Right, and Rear Side I/O

The P16 has enough ports so users don’t need external hubs for the most common tasks:

• Two Thunderbolt 5 ports supporting up to 80Gb/s and Power Delivery
• One Thunderbolt 4 port supporting up to 40Gb/s and Power Delivery
• Two USB-A 3.2 Gen 2 ports
• One HDMI 2.1 output
• One 2.5 GbE RJ45 Ethernet port
• One SD Express 8.0 card reader
• One 3.5 mm headset jack

As discussed earlier, Thunderbolt 5’s increased bandwidth over Thunderbolt 4 makes it easier to run multiple high-resolution displays, connect to fast external NVMe storage, and use a single-cable dock without worrying too much about bandwidth limits.

Wireless connectivity includes Wi-Fi 7 (802.11be) with 2×2 MU-MIMO support and Bluetooth 5.4.

Bottom and Power

Power comes from a 99.9 Wh lithium-ion polymer battery, which is just under the 100 Wh limit most airlines allow in carry-on luggage. In a system built around an HX-class processor and a workstation-grade GPU, that battery is meant for travel, meetings, and short bursts away from the desk, while sustained heavy workloads will still rely on a plugged-in power adapter.

Integrated speakers are rated at 2 x 2 W, which is sufficient for conferencing and general media use. Professional audio work will most certainly rely on professional headsets.

Lenovo’s ThinkPad P16 Gen 3 Performance

To evaluate the ThinkPad P16 Gen 3, we ran a collection of workstation, AI, rendering, storage, and general compute benchmarks designed to stress both CPU and GPU performance across professional workloads.

Our review configuration was equipped with an Intel Core Ultra 9 275HX processor featuring 24 cores and a boost speed of up to 5.38 GHz, paired with NVIDIA’s RTX PRO 5000 Blackwell Laptop GPU with 24GB of GDDR7 memory. The system was also configured with 128GB of system memory and a 4TB Samsung NVMe SSD.

In these tests, we compared the ThinkPad P16 Gen 3 to the following systems:

• Dell Pro Max 18 Plus configured with an Intel Core Ultra 9 285HX processor and NVIDIA RTX PRO 5000 GPU
• HP ZBook Fury G1i configured with an Intel Core Ultra 9 285HX processor and NVIDIA RTX PRO 5000 GPU

While the CPU and GPU baselines remain largely aligned between the Dell and HP systems, the Lenovo ThinkPad P16 Gen 3 introduces a slightly different tuning profile that reflects its own design priorities. Dell configures its RTX PRO 5000 with a 175 W ceiling and a graphics clock of 1807 MHz, while HP sets the same GPU at a 150 W maximum TDP with a 1740 MHz clock. Lenovo, by comparison, runs the RTX PRO 5000 with a noticeably lower GPU TDP of 105W, prioritizing thermals and sustained runtime.

On the CPU side, both the Dell and HP configurations rely on the Intel Core Ultra 9 285HX, whereas the Lenovo system steps down slightly to the Intel Core Ultra 9 275HX. Memory configuration also reflects different platform approaches. Dell utilizes its CAMM2 implementation rated for 7200 MT/s but operating at 6400 MT/s in this system, while HP sticks with traditional SODIMM memory rated at 5600 MT/s but running at 4400 MT/s. Lenovo follows a similar SODIMM approach, also operating at 4400 MT/s.

Procyon AI Computer Vision

The Procyon AI Computer Vision Benchmark measures AI inference performance across CPUs, GPUs, and dedicated accelerators using a range of state-of-the-art neural networks. It evaluates tasks such as image classification, object detection, segmentation, and super-resolution using models including MobileNet V3, Inception V4, YOLO V3, DeepLab V3, Real ESRGAN, and ResNet 50. Tests are run on multiple inference engines, including NVIDIA TensorRT, Intel OpenVINO, Qualcomm SNPE, Microsoft Windows ML, and Apple Core ML, providing a broad view of hardware and software efficiency. Results are reported for float- and integer-optimized models, providing a consistent, practical measure of machine vision performance for professional workloads.

In the Procyon AI Computer Vision benchmark, the ThinkPad P16 Gen 3 delivers solid but slightly behind-the-leader CPU results, posting an overall score of 160 compared to 195 on the Dell system and 185 on the HP. This difference is largely due to the newer Core Ultra 9 285HX processor used in the competing systems. Interestingly, the P16 performs well in certain models, such as YOLO V3, where it achieves faster inference times than both comparison systems. On the GPU side, results are much closer overall, with the P16’s RTX PRO 5000 remaining competitive across most models, suggesting that GPU-driven computer vision workloads will perform similarly across these high-end mobile workstation platforms.

CPU Results (average time in ms)	Lenovo ThinkPad P16 Gen 3 (Intel Ultra 9 275HX)(NVIDIA RTX PRO 5000)	Dell Pro Max 18 Plus (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)	HP ZBook Fury G1i (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)
AI Computer Vision Overall Score	160	195	185
MobileNet V3	1.06 ms	1.00 ms	0.94 ms
ResNet 50	8.82 ms	6.98 ms	7.46 ms
Inception V4	23.17 ms	19.53 ms	20.47 ms
DeepLab V3	29.73 ms	24.15 ms	25.74 ms
YOLO V3	29.73 ms	44.53 ms	45.50 ms
REAL-ESRGAN	2697.37 ms	1,934.18 ms	2,281.80 ms

GPU Results (average time in ms)	Lenovo ThinkPad P16 Gen 3 (Intel Ultra 9 275HX)(NVIDIA RTX PRO 5000)	Dell Pro Max 18 Plus (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)	HP ZBook Fury G1i (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)
AI Computer Vision Overall Score	863	1,032	890
MobileNet V3	0.56 ms	0.55 ms	0.57 ms
ResNet 50	1.49 ms	1.20 ms	1.54 ms
Inception V4	4.19 ms	3.00 ms	4.11 ms
DeepLab V3	13.78 ms	13.05 ms	12.78 ms
YOLO V3	7.11 ms	5.63 ms	6.78 ms
REAL-ESRGAN	110.63 ms	88.56 ms	100.18 ms

TensorRT Results (average time in ms)	Lenovo ThinkPad P16 Gen 3 (Intel Ultra 9 275HX)(NVIDIA RTX PRO 5000)	Dell Pro Max 18 Plus (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)	HP ZBook Fury G1i (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)
Overall Score	1,010	1,609	1,014
MobileNet V3	0.43 ms	0.26 ms	0.43 ms
ResNet 50	1.65 ms	0.98 ms	1.69 ms
Inception V4	6.08 ms	3.01 ms	5.26 ms
DeepLab V3	5.03 ms	3.97 ms	5.89 ms
YOLO V3	5.83 ms	3.22 ms	5.76 ms
REAL-ESRGAN	116.46 ms	90.17 ms	110.30 ms

UL Procyon: AI Text Generation

The Procyon AI Text Generation Benchmark streamlines AI LLM performance testing by providing a concise and consistent evaluation method. It allows for repeated testing across multiple LLM models while minimizing the complexity of large model sizes and variable factors. Developed with AI hardware leaders, it optimizes the use of local AI accelerators to deliver more reliable, efficient performance assessments. The results measured below were tested using TensorRT.

For local LLM inference in the Procyon AI Text Generation benchmark, the ThinkPad P16 Gen 3 delivers strong results, but again slightly trails systems using the newer 285HX processor. Across models such as Phi, Mistral, Llama3, and Llama2, the P16 maintains consistent performance, though token generation rates fall slightly behind those of the Dell and HP systems. Time-to-first-token remains competitive, ensuring inference startup times are responsive. Overall, the system still provides capable local LLM performance, and with the RTX PRO 5000’s 24GB of VRAM.

UL Procyon: AI Text Generation	Lenovo ThinkPad P16 Gen 3 (Intel Ultra 9 275HX)(NVIDIA RTX PRO 5000)	Dell Pro Max 18 Plus (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)	HP ZBook Fury G1i (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)
Phi
Phi Overall Score	3,482	4,475	3,904
Phi Output Time To First Token	0.298 s	0.237 s	0.265 s
Phi Output Tokens Per Second	141.217 tokens/s	185.118 tokens/s	157.446 tokens/s
Phi Overall Duration	21.262 s	16.314 s	19.025 s
Mistral
Mistral Overall Score	3,432	4,295	3,823
Mistral Output Time To First Token	0.418 s	0.347 s	0.379 s
Mistral Output Tokens Per Second	108.118 tokens/s	140.546 tokens/s	121.511 tokens/s
Mistral Overall Duration	27.881 s	21.665 s	24.843 s
Llama3
Llama3 Overall Score	3,115	3,763	3,418
Llama3 Output Time To First Token	0.387 s	0.344 s	0.357 s
Llama3 Output Tokens Per Second	92.363 tokens/s	119.741 tokens/s	102.637 tokens/s
Llama3 Overall Duration	32.204 s	25.165 s	29.068 s
Llama2
Llama2 Overall Score	3, 407	4,155	3,711
Llama2 Output Time To First Token	0.627 s	0.546 s	0.566 s
Llama2 Output Tokens Per Second	53.8924 tokens/s	69.709 tokens/s	57.620 tokens/s
Llama2 Overall Duration	54.436 s	42.506 s	50.608 s

UL Procyon: AI Image Generation

The Procyon AI Image Generation Benchmark provides a consistent and accurate method for measuring AI inference performance across a range of hardware, from low-power NPUs to high-end GPUs. It includes three tests: Stable Diffusion XL (FP16) for high-end GPUs, Stable Diffusion 1.5 (FP16) for moderately powerful GPUs, and Stable Diffusion 1.5 (INT8) for low-power devices. The benchmark uses the optimal inference engine for each system, ensuring fair and comparable results.

The Procyon AI Image Generation results show a similar pattern, with the ThinkPad P16 Gen 3 performing well again but still behind the systems using the newer processor. For Stable Diffusion 1.5 FP16 workloads, the P16 generates images at roughly 2.3 seconds per image, while INT8 workloads improve throughput to just over one second per image. Stable Diffusion XL remains significantly heavier, with generation times exceeding 16 seconds per image, but this remains typical for mobile GPUs even at the high end. Overall, the P16 offers strong generative AI performance for development and experimentation with local diffusion models.

UL Procyon: AI Image Generation	Lenovo ThinkPad P16 Gen 3 (Intel Ultra 9 275HX)(NVIDIA RTX PRO 5000)	Dell Pro Max 18 Plus (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)	HP ZBook Fury G1i (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)
Stable Diffusion 1.5 (FP16)
Stable Diffusion 1.5 (FP16) – Overall Score	2,702	3,687	3,120
Stable Diffusion 1.5 (FP16) – Overall Time	37.005 s	27.119 s	32.043 s
Stable Diffusion 1.5 (FP16) – Image Generation Speed	2.313 s/image	1.695 s/image	2.003 s/image
Stable Diffusion 1.5 (INT8)
Stable Diffusion 1.5 (INT8) – Overall Score	30,210	44,101	32,824
Stable Diffusion 1.5 (INT8) – Overall Time	8.275 s	5.669 s	7.616 s
Stable Diffusion 1.5 (INT8) – Image Generation Speed	1.034 s/image	0.709 s/image	0.952 s/image
Stable Diffusion XL (FP16)
Stable Diffusion XL (FP16) – Overall Score	2,310	3,170	2,701
Stable Diffusion XL (FP16) – Overall Time	256.640 s	189.260 s	222.133 s
Stable Diffusion XL (FP16) – Image Generation Speed	16.228 s/image	11.829 s/image	13.883 s/image

SPECworkstation 4

The SPECworkstation 4.0 benchmark is a comprehensive tool for evaluating all key aspects of workstation performance. It offers a real-world measure of CPU, graphics, accelerator, and disk performance, ensuring professionals have the data to make informed decisions about their hardware investments. The benchmark includes a dedicated set of tests focusing on AI and ML workloads, including data science tasks and ONNX runtime-based inference tests, reflecting the growing importance of AI/ML in workstation environments. It encompasses seven industry verticals and four hardware subsystems, providing a detailed, relevant measure of today’s workstation performance.

Here, the ThinkPad P16 Gen 3 delivers balanced workstation performance across a range of professional workloads (though it generally trails the other two systems). Scores such as 2.14 in AI & Machine Learning and 1.99 in Energy place it slightly behind the Dell and HP systems, showing the modest CPU performance advantage those platforms hold in this benchmark. It performs particularly well in Life Sciences with a score of 2.31, outperforming the Dell configuration and coming close to the HP system. Overall, the results keep the P16 Gen 3 in the same performance class across most workstation workloads, offering solid capability for engineering, media, and data-focused applications (even if it doesn’t lead the group).

SPECworkstation 4.0.0 (higher is better)	Lenovo ThinkPad P16 Gen 3 (Intel Ultra 9 275HX)(NVIDIA RTX PRO 5000)	Dell Pro Max 18 Plus (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)	HP ZBook Fury G1i (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)
Industry Verticals
AI & Machine Learning	2.14	2.48	2.26
Energy	1.99	2.49	2.20
Financial Services	1.41	1.66	1.63
Life Sciences	2.31	1.50	2.46
Media & Entertainment	2.37	2.66	2.51
Product Design	2.02	2.35	2.16
Productivity & Development	1.10	1.35	1.19

SPECviewperf 15

SPECviewperf 15 is the industry-standard benchmark for evaluating 3D graphics performance across OpenGL, DirectX, and Vulkan APIs. It introduces new workloads, including blender-01 (Blender 3.6), unreal_engine-01 (Unreal Engine 5.4, DirectX 12), and enscape-01 (Enscape 4.0, Vulkan ray tracing), along with updated traces for 3ds Max, CATIA, Creo, Maya, and SolidWorks. With its redesigned GUI, modern application support, and advanced rendering workloads, SPECviewperf 15 provides consistent, real-world insights into professional graphics performance.

SPECviewperf 15 results show the ThinkPad P16 Gen 3 performing competitively across professional graphics workloads. The system stands out in particular in the Blender trace, where it achieves the highest score among the tested systems. Performance in CAD and design-focused workloads such as CATIA, Creo, and Solidworks trails slightly behind the Dell system but remains within the same performance tier. Overall, the P16 demonstrates strong GPU viewport performance.

SPECviewperf (higher is better)	Lenovo ThinkPad P16 Gen 3 (Intel Ultra 9 275HX)(NVIDIA RTX PRO 5000)	Dell Pro Max 18 Plus (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)	HP ZBook Fury G1i (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)
3dsmax-08	82.16	98.71	87.03
blender-01	95.53	83.23	78.03
catia-07	92.60	113.18	100.55
creo-04	192.46	247.79	238.38
energy-04	125.66	170.27	153.43
enscape-01	68.15	86.70	77.57
maya-07	200.26	232.48	217.67
medical-04	173.61	210.51	183.39
solidworks-08	114.57	145.56	110.66
unreal_engine-01	69.74	93.46	79.85

LuxMark

LuxMark is a GPU benchmark that uses LuxRender, an open-source ray-tracing renderer, to evaluate a system’s performance with highly detailed 3D scenes. This benchmark is relevant for assessing the graphical rendering capabilities of servers and workstations, especially for visual effects and architectural visualization applications, where accurate light simulation is crucial.

Here, the ThinkPad P16 Gen 3 again lands between the two other systems. With a score of 25,640 in the Hallbench test and 10,754 in the Food scene, the RTX PRO 5000 in the P16 delivers strong ray-tracing throughput. While the Dell system posts higher numbers, the P16 remains competitive and ahead of the HP system in some cases. This means the P16 Gen 3 has some solid GPU compute capability for rendering and lighting simulation workloads.

LuxMark (higher is better)	Lenovo ThinkPad P16 Gen 3 (Intel Ultra 9 275HX)(NVIDIA RTX PRO 5000)	Dell Pro Max 18 Plus (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)	HP ZBook Fury G1i (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)
Hallbench	25,640	29,605	26,594
Food	10,754	13,042	11,500

7-Zip Compression

The 7-Zip Compression Benchmark evaluates CPU performance during compression and decompression tasks, measuring ratings in GIPS (Giga Instructions Per Second) and CPU usage. Higher GIPS and efficient CPU usage indicate superior performance.

Compression and decompression results place it slightly behind the Dell system, though it maintains competitive performance overall with a total rating of 127.8 GIPS. CPU utilization levels indicate that the processor effectively leverages its available cores under heavy workloads, resulting in strong performance for tasks such as file archiving, software compilation, and data compression.

7-Zip Compression Benchmark (higher is Better)	Lenovo ThinkPad P16 Gen 3 (Intel Ultra 9 275HX)(NVIDIA RTX PRO 5000)	Dell Pro Max 18 Plus (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)	HP ZBook Fury G1i (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)
Compression
Current CPU Usage	1,973%	1,905%	1,796%
Current Rating/Usage	5.766 GIPS	7.275 GIPS	5.692 GIPS
Current Rating	113.740 GIPS	138.244 GIPS	102.234 GIPS
Resulting CPU Usage	1,965%	1,891%	1,780%
Resulting Rating/Usage	5.776 GIPS	7.270 GIPS	5.731 GIPS
Resulting Rating	113.457 GIPS	137.459 GIPS	102.012 GIPS
Decompression
Current CPU Usage	1,997%	2,226%	2,208%
Current Rating/Usage	6.628 GIPS	7.175 GIPS	6.411 GIPS
Current Rating	132.359 GIPS	159.735 GIPS	141.545 GIPS
Resulting CPU Usage	2,040%	2,242%	2,213%
Resulting Rating/Usage	6.933 GIPS	7.276 GIPS	6.608 GIPS
Resulting Rating	142.143 GIPS	163.149 GIPS	146.208 GIPS
Total Rating
Total CPU Usage	2,007%	2,067%	1,997%
Total Rating/Usage	6.355 GIPS	7.273 GIPS	6.170 GIPS
Total Rating	127.800 GIPS	150.304 GIPS	124.110 GIPS

Blackmagic RAW Speed Test

The Blackmagic RAW Speed Test is a performance benchmark that measures a system’s capabilities for video playback and editing with the Blackmagic RAW codec. It evaluates how well a system can decode and playback high-resolution video files, reporting frame rates for CPU- and GPU-based processing.

The ThinkPad P16 Gen 3 performs well in the Blackmagic RAW Speed Test, demonstrating strong capabilities for video editing workloads. In the CPU decoding test, the system reaches 104 FPS for 8K playback, which is competitive for a mobile workstation. GPU acceleration further improves performance, achieving 143 FPS with OpenCL. Though the Dell and HP systems post higher GPU numbers, the P16 still provides more than enough throughput for high-resolution video editing workflows.

Blackmagic RAW Speed Test	Lenovo ThinkPad P16 Gen 3 (Intel Ultra 9 275HX)(NVIDIA RTX PRO 5000)	Dell Pro Max 18 Plus (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)	HP ZBook Fury G1i (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)
8K CPU	104	128	112
8K OPENCL	143	168	182

Blackmagic Disk Speed Test

The Blackmagic Disk Speed Test evaluates storage performance by measuring read and write speeds, providing insights into a system’s ability to handle data-intensive tasks, such as video editing and large file transfers.

Performance here is excellent, with nearly 8GB/s sequential read speeds and just under 6GB/s write speeds. These results slightly surpass the Dell system’s read performance and noticeably outperform the HP system in this test. Such throughput is typical of high-end PCIe Gen5 NVMe drives and ensures the P16 can handle large datasets, high-resolution media files, and demanding project workloads without storage bottlenecks.

Disk Speed Test (higher is better)	Lenovo ThinkPad P16 Gen 3 (Intel Ultra 9 275HX)(NVIDIA RTX PRO 5000)	Dell Pro Max 18 Plus (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)	HP ZBook Fury G1i (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)
Read	7,926.1 MB/s	7,776.1 MB/s	6,554.2 MB/s
Write	5,932.1 MB/s	6,022.0 MB/s	5,728.0 MB/s

Blender 4.5

Blender is an open-source 3D modeling application. This benchmark was run using the Blender Benchmark utility. The score is measured in samples per minute, with higher values indicating better performance.

CPU rendering performance is slightly behind the Dell system, but generally on par with or ahead of the HP system (depending on the scene). GPU rendering shows the RTX PRO 5000 withstrong throughput, although the Dell system again maintains a lead. For creators working with Blender, the P16 has enough performance for both viewport work and GPU rendering.

Blender CPU (samples per minute, higher is better)	Lenovo ThinkPad P16 Gen 3 (Intel Ultra 9 275HX)(NVIDIA RTX PRO 5000)	Dell Pro Max 18 Plus (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)	HP ZBook Fury G1i (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)
Monster	210.22	237.1	203.91
Junkshop	126.17	150.7	132.23
Classroom	93.70	94.5	88.19

 

Blender GPU (samples per minute, higher is better)	Lenovo ThinkPad P16 Gen 3 (Intel Ultra 9 275HX)(NVIDIA RTX PRO 5000)	Dell Pro Max 18 Plus (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)	HP ZBook Fury G1i (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)
Monster	3,361.80	3,928.6	3,710.99
Junkshop	1,866.04	2,150.1	2,056.19
Classroom	1,694.35	2010.2	1,888.38

y-cruncher

y-cruncher is a multithreaded and scalable program that can compute Pi and other mathematical constants to trillions of digits. Since its launch in 2009, it has become a popular benchmarking and stress-testing application for overclockers and hardware enthusiasts.

Here, the ThinkPad P16 Gen 3 consistently trails the Dell system but remains very close to the HP configuration in several tests. As the workload size increases from one billion to ten billion digits, the system maintains consistent scaling behavior. This means stable, sustained CPU performance under heavy computational loads.

Y-Cruncher (Lower time is better)	Lenovo ThinkPad P16 Gen 3 (Intel Ultra 9 275HX)(NVIDIA RTX PRO 5000)	Dell Pro Max 18 Plus (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)	HP ZBook Fury G1i (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)
1 Billion	23.067 s	20.081 s	22.042 s
2.5 Billion	67.517 s	59.228 s	64.911 s
5 Billion	156.655 s	142.822 s	161.295 s
10 Billion	356.414 s	311.805 s	359.489 s

Geekbench 6

Geekbench 6 is a cross-platform benchmark that measures overall system performance.

Results here show an interesting balance for the ThinkPad P16 Gen 3. In single-core performance, the system actually posts the highest score among the three systems tested, indicating excellent per-core performance and responsiveness. Multi-core performance trails the Dell system somewhat, reflecting the generational differences between the processors. GPU OpenCL results place the P16 between the two competing systems, showing off strong compute performance from the RTX PRO 5000.

Geekbench 6 (higher is better)	Lenovo ThinkPad P16 Gen 3 (Intel Ultra 9 275HX)(NVIDIA RTX PRO 5000)	Dell Pro Max 18 Plus (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)	HP ZBook Fury G1i (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)
CPU
CPU Single-Core	3,024	2,977	3,010
CPU Multi-Core	17,860	20,717	18,694
GPU
GPU OpenCL	220,751	240,530	194,740

V-Ray

The V-Ray Benchmark measures rendering performance for CPUs, NVIDIA GPUs, or both using advanced V-Ray 6 engines. It uses quick tests and a simple scoring system to let users evaluate and compare their systems’ rendering capabilities. It’s an essential tool for professionals seeking efficient performance insights.

The ThinkPad P16 Gen 3 scored 7,182, placing it just behind the Dell and HP systems. While the difference is noticeable, the system remains well within the same performance class. This indicates that the P16 can handle professional ray-traced rendering workloads effectively, particularly when leveraging GPU acceleration.

Vray (higher is better)	Lenovo ThinkPad P16 Gen 3 (Intel Ultra 9 275HX)(NVIDIA RTX PRO 5000)	Dell Pro Max 18 Plus (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)	HP ZBook Fury G1i (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)
Score	7,182	8,191	7,820

Topaz Video AI

Topaz Video AI is a professional application for enhancing and restoring video using advanced AI models. It supports tasks such as upscaling footage to 4K or 8K, sharpening blurry content, reducing noise, improving facial details, colorizing black-and-white footage, and interpolating frames for smoother motion. The suite includes an onboard benchmark that measures system performance across its different video-enhancing algorithms, giving a clear view of how well hardware platforms handle demanding AI video processing workloads.

While the Dell system generally leads in raw throughput, the ThinkPad still delivers strong performance across models such as Artemis, Iris, and Proteus. Frame rates decrease significantly as scaling factors increase, which is expected for these computationally intensive models. Overall, the system can handle AI-driven video enhancement and upscaling tasks, though heavier workloads will benefit from faster GPUs or CPUs.

Topaz Video AI Benchmark (Frames per second, higher is better)	Lenovo ThinkPad P16 Gen 3 (Intel Ultra 9 275HX)(NVIDIA RTX PRO 5000)			Dell Pro Max 18 Plus (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)			HP ZBook Fury G1i (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)
Model	1X	2X	4X	1X	2X	4X	1X	2X	4X
Artemis	18.29	10.12	3.33	31.10	16.94	4.22	25.22	10.87	3.42
Iris	22.26	11.63	3.13	27.77	16.07	4.16	23.31	12.85	3.43
Proteus	18.02	11.48	3.03	28.56	18.70	4.70	24.45	13.22	3.68
Gaia	5.67	4.48	2.70	38.53	5.88	4.27	27.18	5.06	3.21
Nyx	9.55	–	–	0.86	–	–	0.78	–	–
Nyx Fast	17.94	–	–	19.64	–	–	17.39	–	–
Rhea	–	–	2.76	–	–	3.20	–	–	2.81
RXL	–	–	3.00	–	–	3.06	–	–	2.74
Hyperion HDR	18.96	–	–	19.39	–	–	18.76	–	–
Apollo	20.65	–	–	33.49	–	–	28.35	–	–
Aion	25.12	–	–	25.06	–	–	22.73	–	–
APFast	30.71	–	–	43.90	–	–	38.21	–	–
Chronos	14.10	–	–	20.43	–	–	18.25	–	–
CHFast	21.45	–	–	30.88	–	–	26.17	–	–

PCMark 10

PCMark 10 is an industry-standard benchmark designed to measure complete system performance for modern office environments. It features updated workloads for Windows 10 and evaluates everyday tasks, including productivity, web browsing, video conferencing, and content creation. The benchmark is easy to run, delivers multi-level scoring (from high-level overall to detailed workload scores), and includes dedicated battery life and storage tests. While UL Solutions now recommends Procyon for newer, application-based testing, PCMark 10 remains a reliable and widely-used tool for assessing general PC performance.

PCMark 10 results show the ThinkPad P16 Gen 3 delivering the highest overall system score among the tested systems, with a score of 10,618. This suggests excellent responsiveness across everyday workloads, including productivity applications, content creation, and web tasks.

PCMark 10 (higher is better)	Lenovo ThinkPad P16 Gen 3 (Intel Ultra 9 275HX)(NVIDIA RTX PRO 5000)	Dell Pro Max 18 Plus (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)	HP ZBook Fury G1i (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)
Score	10,618	8,581	8,667

3DMark CPU

The 3DMark CPU Profile evaluates processor performance across six threading levels: 1, 2, 4, 8, 16, and max threads. Each test runs the same boid-based simulation workload to assess how well the CPU scales under different thread counts, with minimal GPU involvement. The benchmark helps identify single-thread efficiency as well as multithreaded potential for tasks like gaming, content creation, and rendering. Scores across eight threads often align with modern DirectX 12 gaming performance, while 1–4-thread results reflect older or esports game scenarios.

The Lenovo ThinkPad P16 Gen 3 performs particularly well on mid-range thread workloads, such as 8-thread and 16-thread tests, where it either matches or exceeds competing systems. At maximum thread count, the Dell system pulls ahead slightly, again reflecting the advantage of the newer processor. Overall, the P16 still delivers strong CPU scalability across different workloads.

3DMark CPU (Higher Score is Better)	Lenovo ThinkPad P16 Gen 3 (Intel Ultra 9 275HX)(NVIDIA RTX PRO 5000)	Dell Pro Max 18 Plus (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)	HP ZBook Fury G1i (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)
Max Threads	14,868	16,497	16,297
16 Threads	13,785	13,224	13,868
8 Threads	8,433	7,658	7,275
4 threads	4,758	4,583	4,865
2 threads	2,458	2,435	2,476
1 threads	1,267	1,234	1,264

3DMark Storage

The 3DMark Storage Benchmark tests your SSD’s gaming performance by measuring tasks like loading games, saving progress, installing game files, and recording gameplay. It evaluates how well your storage performs in real-world gaming scenarios and supports the latest storage technologies to provide accurate performance insights.

Here, the ThinkPad P16 Gen 3 scores 1,945, slightly behind the Dell and HP systems. Despite this difference, the score still yields high-performance NVMe storage that can easily handle demanding workloads such as game installs, large asset loading, and data streaming. The strong sequential speeds seen earlier in the Blackmagic test further confirm that storage performance on the P16 remains very fast.

3DMark Storage (higher is better)	Lenovo ThinkPad P16 Gen 3 (Intel Ultra 9 275HX)(NVIDIA RTX PRO 5000)	Dell Pro Max 18 Plus (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)	HP ZBook Fury G1i (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)
Score	1,945	2,368	2,304

PCMark battery

To measure battery life on mobile systems, we use PCMark 10. It includes a Modern Office benchmark, providing a realistic assessment of battery life during typical workday tasks. It simulates everyday office activities, such as writing documents, browsing the web, and participating in video conferences, with built-in periods of inactivity to mirror how people use their laptops. This isn’t just about peak performance; it focuses on sustained usage under a moderate workload. It is helpful for understanding how long you can expect a laptop to last through a day of office work.

The test operates in 10-minute cycles, balancing active tasks with periods of inactivity. Specifically, the Writing and Web Browsing workloads involve roughly 4.5 minutes of activity followed by 5.5 minutes of inactivity, while Video Conferencing is lighter, at 2 minutes of busy time and 8 minutes of idle time. This approach aims to provide a more accurate representation of real-world battery drain than running demanding tasks continuously, giving you a better idea of longevity for everyday productivity.

Battery testing shows strong results for the ThinkPad P16 Gen 3, which lasts roughly 7 hours on the PCMark Modern Office workload. This significantly exceeds both the Dell and HP systems, which fall under five hours in the same test. For a mobile workstation with high-end CPU and GPU hardware, this is a very respectable result and suggests Lenovo has tuned the system well for efficiency during lighter productivity tasks.

Pcmark Battery (higher is better)	Lenovo ThinkPad P16 Gen 3 (Intel Ultra 9 275HX)(NVIDIA RTX PRO 5000)	Dell Pro Max 18 Plus (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)	HP ZBook Fury G1i (Intel Core Ultra 9 285HX)(NVIDIA RTX PRO 5000)
Time Elapsed	7 Hr	3 Hr 39 Min	4 Hr 48 Min

Conclusion

The Lenovo ThinkPad P16 Gen 3 is a powerful mobile workstation that balances strong GPU performance, modern platform features, and workstation-class expandability in a relatively portable 16-inch form factor. Built around Intel’s Core Ultra 9 275HX and NVIDIA’s RTX PRO 5000 with 24GB of GDDR7 memory, the system is designed for professionals running GPU-accelerated workloads such as 3D rendering, AI inference, simulation, and high-resolution media production.

Across our benchmark suite, the P16 Gen 3 consistently performed in the same class as the Dell Pro Max 18 Plus and HP ZBook Fury G1i systems equipped with the newer Core Ultra 9 285HX processor. In many CPU-heavy tests, the newer processor holds a modest lead, evident in workloads such as AI inference, rendering, and compression. However, the differences are generally incremental rather than too noticeable, and the P16 often lands between the two competing systems. GPU-driven workloads remain highly competitive thanks to the RTX PRO 5000, and the system even leads in certain cases, such as the Blender viewport trace in SPECviewperf. The new Lenovo system also shows strong platform balance. Storage performance from the PCIe Gen5 NVMe drive approaches 8 GB/s for reads, ensuring fast handling of large project datasets and media files. Memory expandability up to 192GB across four SO-DIMM slots provides the system with ample flexibility for demanding workloads such as large CAD assemblies, simulation datasets, and virtualized development environments.

In our PCMark Modern Office test, the P16 reached roughly seven hours of runtime, noticeably exceeding both comparison systems. For a workstation-class laptop with an HX processor and high-end GPU, that efficiency is pretty impressive. It makes the system more practical for meetings, travel, and remote work between heavier workloads.

Overall, the ThinkPad P16 Gen 3 may not have claimed the top position in many of our benchmarks, but it consistently belonged in the same performance tier as its competitors. Combined with its excellent display, powerful GPU resources, ample memory, and modern I/O, it delivers a highly capable workstation platform for engineers, creators, and developers.

ThinkPad P16 Gen 3 Intel (16″) Mobile Workstation

The post Lenovo ThinkPad P16 Gen 3 Review: RTX PRO 5000 Power in a True Workstation Laptop appeared first on StorageReview.com.

QNAP has launched the TS-h1077AFU, a compact 10-bay all-flash NAS. It is built to provide enterprise-level performance in a smaller, more flexible form factor for organizations managing demanding workloads such as virtualization, high-resolution media production, database operations, and multi-site backup consolidation.

The system runs on QNAP’s ZFS-based QuTS hero operating system and is powered by AMD Ryzen PRO 7000 Series processors paired with ECC DDR5 memory. This combination is designed to balance processing performance with strong data integrity for environments where reliability and sustained workloads are critical. The new model builds on the company’s larger 30-bay all-flash platform and aims to bring similar performance capabilities to deployments where rack space, infrastructure scale, or cost considerations make a smaller system more practical while still maintaining the reliability and data protection features associated with the QuTS hero platform.

QNAP TS-h1077AFU Features and Components

The TS-h1077AFU has an 8-core, 16-thread AMD Ryzen PRO processor with integrated Radeon graphics, enabling the NAS to support virtualization, multimedia processing, and other multithreaded tasks that need both high performance and fast storage.

Memory support scales up to 192GB of ECC DDR5 RAM, providing error-correcting protection designed to maintain data accuracy and operational stability during long-term workloads or heavily virtualized environments where memory reliability is essential.

Performance optimization for solid-state storage is enabled by ZFS features such as inline deduplication and compression. QNAP’s SSD management technology improves drive endurance, maintains consistent performance, and reduces the likelihood of simultaneous SSD failures that could affect data availability.

The QNAP NAS also includes two 10-gigabit Ethernet ports and two 2.5-gigabit ports as standard, along with expansion support for 25-gigabit networking through dual PCIe Gen 4 x8 slots for organizations that require faster connectivity between storage and compute infrastructure. For organizations running critical applications, the TS-h1077AFU supports high-availability configurations. Two units can be combined into a failover cluster, ensuring workloads and services stay available if one system experiences a hardware issue.

Storage capacity can be expanded through QNAP JBOD expansion units, enabling organizations to scale the system into much larger storage architectures capable of reaching petabyte-level capacity as data requirements grow. Moreover, hardware-level reliability is supported by dual power supplies, enterprise-grade cooling, and ZFS self-healing capabilities that detect and repair data inconsistencies. At the same time, the company has also committed to maintaining product availability until 2030 to support long-term projects, deployments, and infrastructure planning.

The NAS integrates with the company’s myQNAPcloud One service for cloud backup, supporting both file and object data, and offers features such as data immutability. The platform is positioned as a cloud backup destination for the system, with free data transfer.

QNAP TS-h1077AFU Specifications

Specification	TS-h1077AFU-R7-32G
System Information
Model	TS-h1077AFU-R7-32G
Processor & Architecture
CPU	AMD Ryzen 7 7000 series 8-core/16-thread processor, burst up to 5.3 GHz AMD Radeon Graphics
CPU Architecture	64-bit x86
Graphic Processors	AMD Radeon Graphics
Floating Point Unit	Yes
Encryption Engine	(AES-NI)
Hardware-accelerated Transcoding	Yes
Memory
System Memory	32 GB ECC UDIMM DDR5
Maximum Memory	192 GB (4 x 48 GB)
Memory Slot	4 x UDIMM DDR5 For dual-DIMM configurations, you must use a pair of identical DDR5 modules.
Flash Memory	5GB (Dual boot OS protection)
Drive & Storage
Drive Bay	10 x 2.5-inch SATA 6Gb/s, 3Gb/s
Drive Compatibility	2.5-inch SATA solid state drives
Hot-swappable	Yes
Virtualization & Expansion
GPU pass-through	Yes
PCIe Slot	2 Slot 1: Gen 4 x 8 Slot 2: Gen 4 x 8
Networking
2.5 Gigabit Ethernet Port (2.5G/1G/100M)	2 (2.5G/1G/100M/10M)
10 Gigabit Ethernet Port	2 x 10GBASE-T (10G/5G/2.5G/1G/100M)
25 Gigabit Ethernet Port	Optional via an adapter
Wake on LAN (WOL)	Yes
Jumbo Frame	Yes
Ports & I/O
USB 3.2 Gen 2 (10Gbps) Port	2 x Type-A USB 3.2 Gen 2 10Gbps
Chassis & Controls
Form Factor	1U Rackmount
LED Indicators	Power Status, HDD 1-12, M.2 SSD 1-2, Status, LAN, storage expansion port status
Buttons	Power, Reset
Physical
Dimensions (HxWxD)	44 × 430 × 582 mm
Weight (Net)	9.43 kg
Weight (Gross)	12.41 kg
Environment
Operating Temperature	0 – 40 °C (32°F – 104°F)
Storage Temperature	-20 – 70°C (-4°F – 158°F)
Relative Humidity	5-95% RH non-condensing, wet bulb: 27˚C (80.6˚F)
Power & Warranty
Power Supply Unit	350 W PSU (x2), AC 100-240 V
System Warning	Buzzer
Standard Warranty	5

 

The QNAP TS-h1077AFU is available now.

QNAP TS-h1077AFU Product Page

The post QNAP Launches TS-h1077AFU: Compact All-Flash NAS for High-Performance Business Workloads appeared first on StorageReview.com.

With the initial release of NVIDIA’s DGX Spark platform, we’re now seeing different vendors package the GB10 Grace Blackwell foundation into their own compact desktop systems. While the core board and silicon remain standardized, differences emerge in chassis design, cooling behavior, storage configuration, and overall execution. In this review, we’re focusing on GIGABYTE’s implementation with the AI TOP ATOM.

Inside is the same GB10 Superchip, pairing a 20-core Arm CPU complex with Blackwell AI acceleration and 128GB of unified LPDDR5X memory. That foundation supports up to 1 petaflop of FP4 compute and models up to 200 billion parameters, positioning it firmly in workstation-class AI territory.

The AI TOP ATOM is housed in a compact 1-liter chassis measuring 150 x 150 x 50.5 mm and powered by a 240W external adapter. While the compute core is identical to that of other Spark systems, we examine how GIGABYTE’s design choices influence thermals, sustained-workload behavior, storage performance, and day-to-day usability.

Storage options scale up to 4TB of Gen5 NVMe, and the system ships with NVIDIA DGX OS based on Ubuntu, making it ready for AI workloads out of the box. In short, while the core compute hardware remains identical to that of other Spark-class systems, the user experience, thermals, acoustics, and overall presentation come down to what GIGABYTE offers in its compact box.

In this review, we’ll examine how GIGABYTE’s take on the Spark platform compares in sustained workloads, cooling behavior, and day-to-day usability, and whether its compact form factor introduces any noticeable trade-offs.

Specification	GIGABYTE AI TOP ATOM (GB10)
Dimensions & Weight
Height	2 in
Width	5.9 in
Depth	5.9 in
Weight	2.64 lb
Processor
Processor Type	NVIDIA GB10 (Grace Blackwell Superchip) (20 Cores)
Integrated Graphics	NVIDIA Blackwell GPU (integrated)
Memory
Memory Type	LPDDR5x (Unified System Memory)
Memory Configuration	128 GB LPDDR5x, unified system memory
Memory Bandwidth	273 GB/s (8533 MT/s)
Operating System
Supported OS	NVIDIA DGX OS
External Ports & Slots
Network Ports	One RJ45 (10GbE) NVIDIA ConnectX-7 NIC (200G × 2 QSFP)
USB Ports	Three USB 3.2 Gen 2×2 Type-C (20Gbps) One USB 3.2 Gen 2×2 Type-C with PD in
Video Port(s)	One HDMI 2.1a
Power Adapter Port	USB Type-C (PD IN)
Security Slot	None
Wireless
WiFi	WiFi 7 (AW-EM637, 2×2)
Bluetooth	Bluetooth 5.4
Storage
Storage Options	Up to 4 TB Gen5 NVMe (Self-Encrypting supported)
Power Adapter
Type	240 W external adapter (USB Type-C)

GIGABYTE AI TOP ATOM Design and Build

The GIGABYTE AI TOP ATOM keeps the familiar 150 x 150 mm footprint we’ve seen across these Spark-based systems, measuring 50.5 mm tall and weighing 1.2 kg. It’s compact enough to fit on a desk, but when you pick it up, it feels dense and solid. The finish has a dark, matte look, which gives it more of a workstation vibe.

Instead of a simple flat grille on the front panel, the entire face is layered with horizontal slats and a subtle wave pattern behind them, which gives it depth and texture when viewed from different angles. It’s a cooling-focused design. The GIGABYTE logo sits in the lower corner, and there are no front-facing data ports or even a power button, so the face stays clean and airflow-driven.

All of the connectivity is located on the rear panel. There are three USB 3.2 Gen 2×2 Type-C ports rated at up to 20 Gbps, along with a fourth USB Type-C port dedicated to power input. For display output, it includes a single HDMI 2.1a port. Networking features a 10 GbE RJ-45 port alongside an NVIDIA ConnectX-7 SmartNIC, which supports high-speed data transfers and linking multiple systems together if you want to build out a larger setup. Along the side panel, GIGABYTE includes a Kensington Nano lock slot.

Inside, the AI TOP ATOM runs on NVIDIA’s GB10 Grace Blackwell Superchip, combining a 20-core Arm CPU configuration with integrated Blackwell graphics. It’s backed by 128 GB of LPDDR5x unified memory on a 256-bit interface, delivering up to 273 GB/s of bandwidth. Like the other GB10 systems, the CPU and GPU share the same memory pool, which is key to how these machines are designed to handle AI workloads.

Storage support goes up to a 4TB Gen5 NVMe SSD, depending on configuration, and power is supplied via a 240 W external adapter. Wireless connectivity includes WiFi 7 and Bluetooth 5.4, alongside the integrated 10 GbE networking for wired performance.

GIGABYTE AI TOP ATOM Thermals Testing

To test the thermals of components within the GIGABYTE AI TOP ATOM, we compared them against the Founders Edition and OEMs such as Asus, Acer, and Dell. We did a deeper dive on this in our Spark Thermal Testing paper.

Across the stack, we monitored components over a given timeframe, with 3 stages to the workload, ramping up utilization over roughly an hour. This allowed us to see the device in extended use and various workload stages. We monitored CPU, GPU, network, NVMe temps, and total power consumption.

CPU Temperature

During CPU thermal testing, the GIGABYTE system reached a peak temperature of 90°C during burst-heavy Prefill transitions. This places it toward the upper bound of observed CPU peaks within the comparison group during aggressive workload ramping.

Once transitioning into Equal ISL/OSL and ultimately Decode Heavy workloads, the temperature curve stabilized rather than continuing to escalate. Under sustained load, the CPU remained in a controlled thermal band, demonstrating that the higher peak was tied to short-duration ramp activity rather than insufficient long-term cooling capacity.

At the lower end, the CPU recorded a minimum temperature of 38.7°C during idle or light-load conditions. This low baseline reflects efficient heat dissipation at rest and indicates that the cooling solution maintains adequate headroom outside of burst phases.

Overall, GIGABYTE exhibited higher burst CPU thermals but maintained stable sustained behavior once workloads normalized.

GPU Temperature

GPU thermals followed a similar pattern. During Prefill Heavy activity, the GPU reached a maximum temperature of 81°C. This places it toward the warmer side of the group during burst-heavy acceleration but still within expected operating specifications for the GB10 platform.

As the workload transitioned into Equal ISL/OSL and Decode Heavy phases, GPU temperatures leveled off rather than continuing to climb.

At idle or low utilization, the GPU recorded a minimum temperature of 37°C, indicating solid baseline thermal control when the system is not under compute stress.

Taken together, GIGABYTE’s GPU behavior reflects aggressive burst utilization paired with stable sustained thermals.

NVMe Temperature

Storage thermals remained well controlled throughout testing. The NVMe drive recorded a maximum temperature of 59.8°C during heavier phases of operation. This peak remained comfortably below common throttling thresholds, suggesting adequate airflow or favorable internal drive placement within the chassis.

During lighter workload phases, the NVMe drive dropped to a minimum of 37.8°C, reinforcing that storage thermals are not constrained at rest.

Compared to some compact desktop-oriented implementations, remaining below 60°C under load reflects solid storage thermal management.

NIC Temperature

NIC thermals peaked at 72°C during heavier-workload stages, aligning with elevated throughput during Prefill and Decode transitions. While this places the network controller in the warmer half of the stack during peak activity, the temperature remained within operational tolerances and did not exhibit spikes.

The minimum NIC temperature recorded was 41°C, reflecting normal baseline behavior during lighter phases.

Overall, the NIC tracked predictably with overall system load and did not exhibit abnormal scaling.

GPU Power Consumption

GPU power behavior helps contextualize the elevated burst thermals. GIGABYTE reached a peak GPU power draw of 75.54W during Prefill Heavy transitions. This places it at the top end of the observed power envelopes within the GB10 units tested.

Rather than artificially capping GPU power, GIGABYTE appears to allow near-ceiling burst periods, which correlate directly with its higher peak GPU temperature behavior. As workloads shifted into sustained Decode phases, power draw stabilized accordingly.

From a power perspective, the GIGABYTE system does not appear to be excessively overdriven. Instead, its higher peak thermals during burst phases align with performance-forward power-allocation decisions rather than with uncontrolled thermal design.

Thermal Summary

Across CPU, GPU, NVMe, and NIC monitoring, the GIGABYTE GB10 operated with competitive idle thermals and higher burst peaks during Prefill-heavy transitions. CPU reached 90°C and GPU 81°C under peak acceleration, while NVMe remained below 60°C and NIC reached 72°C. GPU power draw topped out at 75.54W, indicating near-ceiling bursts.

Under sustained Decode workloads, temperatures stabilized without further escalation, suggesting that while GIGABYTE permits aggressive short-duration performance, it maintains predictable, controlled thermals during extended operation.

GIGABYTE AI TOP ATOM Performance Testing

To evaluate the GIGABYTE AI TOP ATOM, we tested Spark units using the vLLM Online Serving benchmark, the most widely adopted high-throughput inference and serving engine for large language models. The vLLM online serving benchmark simulates real-world production workloads by sending concurrent requests to a running vLLM server, measuring key metrics, including total token throughput (tokens per second), time to first token, and time per output token, across varying load conditions.

Our testing spanned a range of models, from dense architectures to micro-scaling data types. It evaluated performance across three workload scenarios: Equal ISL/OSL, Prefill Heavy, and Decode Heavy. These scenarios represent distinct real-world serving patterns, from balanced input and output loads to compute-intensive prompt processing and memory-bandwidth-bound token generation.

In addition to the GIGABYTE AI TOP ATOM, we benchmarked the NVIDIA Founders Edition Spark as a reference point, alongside OEM systems from Asus, Acer, and Dell. This allowed us to place GIGABYTE’s results within the broader competitive landscape and understand where it leads, tracks with the pack, or trails across different models and workload types.

GPT-OSS-120B

In Equal ISL/OSL, GIGABYTE scales from 60.71 to 649.62 tok/s, tracking consistently in the middle of the field and closely aligning with Dell and Asus at higher batch sizes. Scaling is steady and linear through batch 32, with continued gains at batch 64, though it does not quite overtake the top performers at the upper end.

Prefill Heavy begins at 304.63 tok/s and climbs to 2,771.38 tok/s by batch size 64. Growth is strong through batch 16, where GIGABYTE briefly sits third from the top tier, before converging with the broader group at larger batch sizes. Overall scaling is aggressive and competitive, especially in mid-range batch sizes.

Decode Heavy ranges from 47.01 to 299.41 tok/s, with gradual and consistent scaling across the batch sweep.

GPT-OSS-20B

In Equal ISL/OSL, GIGABYTE scales from 641.73 to 1,587.62 tok/s, starting strong at batch size 1 before dipping at batch 2 and then progressing steadily through larger batch sizes. From batch 8 onward, scaling normalizes and tracks closely with the rest of the field, finishing near the top tier at batch 64.

Prefill Heavy begins at 1,650.32 tok/s and peaks at 4,401.27 tok/s by batch size 64. From batch 16 onward, scaling is consistent and competitive, keeping pace with Dell and Asus through the upper batch sizes.

Decode Heavy ranges from 63.18 to 688.44 tok/s, with clean linear scaling across the sweep. Gains are incremental but consistent, align closely with the other platforms, and reflect the more constrained scaling behavior typical of decode-heavy workloads.

Qwen3 coder 30B A3B FB8

In Equal ISL/OSL, GIGABYTE scales from 101.27 to 1,251.84 tok/s, showing steady linear progression across the batch sweep. Performance tracks tightly with Dell and Asus through batch 16, then continues climbing cleanly through batch 64, finishing near the upper tier without any noticeable scaling anomalies.

Prefill Heavy begins at 428.66 tok/s and scales to 2,026.94 tok/s as the batch size increases to 64. Growth is smooth and consistent across all batch sizes, with GIGABYTE remaining closely grouped with the broader field.

Decode Heavy ranges from 61.18 to 482.73 tok/s, with predictable, incremental gains as batch sizes increase.

Qwen3 coder 30B A3B Base

In Equal ISL/OSL, GIGABYTE scales from 63.42 to 721.08 tok/s, progressing steadily across the batch range. Performance here tracks closely with the broader field through batch 16 and continues scaling cleanly through batch 64, finishing competitively without any notable deviation from linear behavior.

Prefill Heavy begins at 258.11 tok/s and climbs to 1,603.74 tok/s by batch size 64.

Decode Heavy ranges from 33.57 to 349.82 tok/s, with incremental, linear scaling across the sweep.

 

Llama 3.1 8B Instruct FP4

In Equal ISL/OSL, GIGABYTE increases from 69.84 to 2,756.91 tok/s across the batch sweep. Scaling is progressive and well-balanced through batch 32, where throughput approaches the upper tier, before delivering a strong jump at batch 64, placing it among the leading systems at higher concurrency levels.

Prefill Heavy starts at 321.67 tok/s and reaches 2,493.52 tok/s by batch size 64. Growth is steady through batch 16, then begins to taper slightly at higher batch sizes relative to the top performer, indicating solid but not dominant large-batch scaling efficiency.

Decode Heavy ranges from 48.92 to 575.84 tok/s, with consistent incremental gains as batch size increases.

Llama 3.1 8B Instruct FP8

In Equal ISL/OSL, GIGABYTE scales from 54.12 to 2,314.87 tok/s, showing smooth, linear growth through batch 32 and a strong push at batch 64 that keeps it competitive at higher concurrency levels.

Prefill Heavy begins at 226.43 tok/s and reaches 2,332.19 tok/s by batch size 64. Scaling is consistent across the sweep, tracking closely with the broader field and maintaining solid efficiency at larger batch sizes.

Decode Heavy ranges from 32.88 to 522.41 tok/s, with steady incremental gains as batch size increases. As expected, scaling remains more restrained relative to Equal and Prefill workloads.

GPU Direct Storage

One of the tests we conducted on the Spark was the MagnumIO GPU Direct Storage (GDS) test. GDS is a feature developed by NVIDIA that allows GPUs to bypass the CPU when accessing data stored on NVMe drives or other high-speed storage devices. Instead of routing data through the CPU and system memory, GDS enables direct communication between the GPU and the storage device, significantly reducing latency and improving data throughput.

Gigabyte uses the 4TB Samsung PM9E1 Gen5 SSD inside the AI TOP ATOM, which to date is the fastest 2242 M.2 drive we’ve seen on the market. This is the same SSD we’ve seen used in the FE Spark and the Acer Veriton GN100.

How GPU Direct Storage Works

Traditionally, when a GPU processes data stored on an NVMe drive, the data must first travel through the CPU and system memory before reaching the GPU. This process introduces bottlenecks because the CPU acts as a middleman, adding latency and consuming valuable system resources. GPU Direct Storage eliminates this inefficiency by enabling the GPU to access data directly from the storage device via the PCIe bus. This direct path reduces data movement overhead, enabling faster and more efficient data transfers.

AI workloads, especially those involving deep learning, are highly data-intensive. Training large neural networks requires processing terabytes of data, and any delay in data transfer can lead to underutilized GPUs and longer training times. GPU Direct Storage addresses this challenge by ensuring that data is delivered to the GPU as quickly as possible, minimizing idle time and maximizing computational efficiency.

In addition, GDS is particularly beneficial for workloads that involve streaming large datasets, such as video processing, natural language processing, or real-time inference. By reducing the reliance on the CPU, GDS accelerates data movement and frees up CPU resources for other tasks, further enhancing overall system performance.

GDSIO Read Throughput 16k

Looking at GDSIO Read Throughput 16K, the GIGABYTE starts at about 0.08 GiB/s at 1 thread and climbs to 0.58 GiB/s at 8 threads. From there, it continues scaling cleanly at 16 threads (1.12 GiB/s) and 32 threads (2.14 GiB/s), before stepping up sharply at 64 threads to 4.37 GiB/s. At 128 threads, GIGABYTE continues to scale to 6.84 GiB/s, showing no sign of leveling off at the top end of the thread range.

GDSIO Read Average latency 16K

Looking at GDSIO Read Average Latency (16K), GIGABYTE holds very steady latency across most of the curve. It begins at roughly 0.201ms on 1 thread and remains tightly grouped in the ~0.21–0.23ms range from 2 threads through 64 threads (e.g., 0.211ms at 8 threads, 0.218ms at 16 threads, 0.228ms at 32 threads, and 0.223ms at 64 threads). It is only at 128 threads that latency rises more noticeably to about 0.286ms, while throughput continues to increase.

GSDIO Write Throughput 16K

Looking at GDSIO Write Throughput 16K, the GIGABYTE begins at about 0.08 GiB/s at 1 thread, scales steadily to 0.14 GiB/s at 2 threads, and 0.28 GiB/s at 4 threads. Performance continues to climb cleanly at 8 threads (0.59 GiB/s) and 16 threads (1.11 GiB/s) before stepping up more aggressively at 32 threads (2.80 GiB/s). Scaling remains strong at 64 threads (5.21 GiB/s) and peaks at 6.54 GiB/s at 128 threads, showing continued upward movement without an early plateau.

GDSIO Write Average Latency 16K

Looking at GDSIO Write Average Latency (16K), GIGABYTE maintains relatively stable latency across most of the curve. It starts at approximately 0.20ms at 1 thread and remains in the ~0.21–0.22ms range through 16 threads. At 32 threads, latency improves slightly to around 0.17ms, then rises modestly at 64 threads (0.19ms). It is only at 128 threads that latency increases noticeably, to roughly 0.30ms, corresponding to the highest throughput level.

GDSIO Read Throughput 1M

Looking at GDSIO Read Throughput 1M, the GIGABYTE begins at 2.52 GiB/s at 1 thread and scales to 5.07 GiB/s at 2 threads and 9.33 GiB/s at 4 threads. By 8 threads, throughput reaches 11.03 GiB/s, after which the platform effectively saturates. Performance remains consistent at 16 threads (11.07 GiB/s), 32 threads (11.12 GiB/s), and 64 threads (11.08 GiB/s), showing a stable plateau. At 128 threads, throughput increases slightly to 11.60 GiB/s, marking the highest observed result in the sweep.

GDSIO Read Average Latency 1M

Looking at GDSIO Read Average Latency (1M), GIGABYTE starts at approximately 0.39ms at 1 thread and remains similar at 2 threads (0.39ms) and 4 threads (0.42ms). Latency increases as concurrency increases, rising to 0.71ms at 8 threads, 1.41ms at 16 threads, and 2.81ms at 32 threads. The upward trend continues at 64 threads (5.64ms) and reaches 10.78ms at 128 threads, corresponding with peak concurrency levels, while throughput remains largely sustained.

GDSIO Write Throughput 1M

Looking at GDSIO Write Throughput 1M, the GIGABYTE starts at 2.48 GiB/s at 1 thread and scales sharply to 5.57 GiB/s at 2 threads and 10.32 GiB/s at 4 threads. By 8 threads, throughput reaches 12.21 GiB/s, effectively saturating the platform. Performance remains flat at 16 threads (12.23 GiB/s), 32 threads (12.22 GiB/s), and 64 threads (12.22 GiB/s), indicating an early plateau. At 128 threads, throughput declines to 8.82 GiB/s, suggesting the system has moved beyond its optimal concurrency range.

GDSIO Write Average Latency 1M

Looking at GDSIO Write Average Latency (1M), GIGABYTE begins at approximately 0.39ms at 1 thread and remains relatively tight through 2 threads (0.35ms) and 4 threads (0.38ms). Latency increases more noticeably at higher thread counts, rising to 0.64ms at 8 threads, 1.28ms at 16 threads, and 2.56ms at 32 threads. The trend continues upward at 64 threads (5.11ms) before spiking significantly at 128 threads to 14.16ms, aligning with the observed throughput drop at the highest concurrency level.

Conclusion

The GIGABYTE AI TOP ATOM is another implementation of NVIDIA’s GB10-based Spark platform, built on the same board and silicon we’ve tested across the lineup. As expected, core compute performance in vLLM closely mirrors the rest of the field. Across GPT-OSS, Qwen3-Coder, and Llama 3.1 models, scaling behavior remained predictable, with strong Prefill throughput and steady Equal and Decode performance as concurrency increased.

Thermally, GIGABYTE allowed slightly more aggressive burst behavior. The CPU peaked at 90°C and the GPU at 81°C during Prefill-heavy transitions, with GPU power reaching 75.54W. Once workloads normalized, temperatures stabilized without signs of sustained throttling. In practice, the higher peaks reflect short-duration power allocation decisions rather than instability.

Where this unit clearly differentiates itself is in storage. Using the 4TB Gen5 Samsung PM9E1, GIGABYTE delivered some of the strongest GDSIO results in the Spark group. Read and write throughput scaled cleanly across both 16K and 1M workloads, with early saturation at expected concurrency levels and latency increases primarily at the highest thread counts.

Because all Spark systems share the same GB10 foundation, benchmark separation in AI inference remains narrow. Real-world selection comes down to chassis design, burst thermal behavior, storage configuration, and vendor alignment rather than fundamental compute differences.

Product Page – GIGABYTE AI TOP ATOM

The post GIGABYTE AI TOP ATOM Review appeared first on StorageReview.com.

The ASUS Ascent GX10 follows the same core build around the NVIDIA GB10 Superchip, pairing an Arm v9.2-A CPU complex with integrated Blackwell graphics and 128GB of unified LPDDR5x memory. NVIDIA rates the platform at up to 1 petaFLOP of FP4 AI compute, supporting model fine-tuning up to 200 billion parameters. CPU and GPU communication is handled over NVLink-C2C, allowing coherent memory access across the system.

ASUS packages that hardware into a compact, slick 150 x 150 x 51 mm chassis, weighing 1.48 kg (slightly taller and somewhat heavier than the Dell and GIGABYTE versions), finished in Stellar Grey. Like the others, it is powered by a 240W external adapter.

Storage options range from 1TB and 2TB PCIe 4.0 NVMe configurations to a 4TB PCIe 5.0 NVMe variant. Networking includes 10G Ethernet and an integrated NVIDIA ConnectX-7 SmartNIC, along with WiFi 7 and Bluetooth 5.4 through the AW-EM637 module. Rear connectivity consists of three USB 3.2 Gen 2×2 Type-C ports with DisplayPort 2.1 alternate mode, one USB Type-C port with 180W PD input, HDMI 2.1, 10G LAN, the ConnectX-7 port, and a Kensington lock slot.

Let’s see how ASUS integrates cooling, storage, and connectivity around the GB10 platform compared to other vendors, and whether its performance differs in measurable ways under sustained workloads.

ASUS Ascent GX10 Specifications

Specification	ASUS Ascent GX10 (GB10)
Dimensions & Weight
Height	2 in
Width	5.9 in
Depth	5.9 in
Weight	3.26 lb
Processor
Processor Type	NVIDIA GB10 (Grace Blackwell Superchip) (20 Cores)
Integrated Graphics	NVIDIA Blackwell GPU (integrated)
Memory
Memory Type	LPDDR5x (Unified System Memory)
Memory Configuration	128 GB LPDDR5x, unified system memory
Memory Bandwidth	273 GB/s (8533 MT/s)
Operating System
Supported OS	NVIDIA DGX OS
External Ports & Slots
Network Ports	One RJ45 (10GbE) NVIDIA ConnectX-7 NIC (200G × 2 QSFP)
USB Ports	Three USB 3.2 Gen 2×2 Type-C (20Gbps) One USB 3.2 Gen 2×2 Type-C with PD in
Video Port(s)	One HDMI 2.1a
Power Adapter Port	USB Type-C (PD IN)
Security Slot	One Kensington Lock
Wireless
WiFi	WiFi 7 (AW-EM637, 2×2)
Bluetooth	Bluetooth 5.4
Storage
Storage Options	M.2 NVMe PCIe 5.0: 4TB M.2 NVMe PCIe 4.0: 1TB / 2TB
Power Adapter
Type	240 W external adapter (USB Type-C)

ASUS Ascent GX10 Design and Build

The ASUS Ascent GX10 keeps the usual compact 150 x 150 mm footprint we’ve seen across other Spark-based systems, with a height of 51 mm and a weight of 1.48 kg. The enclosure is finished in stellar grey and looks more like a slick-looking desktop appliance than a lab-oriented reference unit.

The front face is dominated by closely spaced vertical vents that stretch the entire width of the unit, with a small ASUS logo and a square power button that blends into the grille pattern. It is also unique in that ASUS incorporated a power indicator into the power button. It seems odd calling it out, but many GB10 systems have no power indicator at all.

All primary connectivity is located on the back of the system, and ASUS makes good use of the available space. Three USB 3.2 Gen 2×2 Type-C ports support 20 Gbps with DisplayPort alternate mode, along with a fourth USB Type-C port dedicated to power input, which supports up to 180W via PD 3.1 EPR. For display output, it comes equipped with a single HDMI 2.1 port.

Networking options include a 10G LAN port and an NVIDIA ConnectX-7 NIC, enabling high-bandwidth data transfers and linking multiple systems. It also features the usual Kensington lock slot.

Inside, the GX10 runs on NVIDIA’s GB10 Grace Blackwell Superchip, pairing an Arm v9.2-A CPU with integrated Blackwell graphics. It’s backed by 128 GB of LPDDR5x unified memory, so the CPU and GPU share the same pool rather than working across separate memory domains. That setup is important for the kinds of AI workloads these systems are built for.

Storage comes via an M.2 2242 NVMe slot, with options ranging from 1 TB and 2 TB PCIe 4.0 drives up to a 4 TB PCIe 5.0 configuration. Power is supplied via a USB-C PD 3.1 EPR adapter rated up to 240 W, with the device drawing up to 180 W. At the same time, the wireless technology features a Wi-Fi 7 module with Bluetooth 5.4, alongside integrated 10G Ethernet for wired networking.

ASUS Ascent GX10 Thermals Testing

To test the thermals of components within the ASUS Ascent GX10, we compared them against the Founders Edition and OEMs such as Dell, Acer, and GIGABYTE. We did a deeper dive on this in our Spark Thermal Testing paper.

Across the stack, we monitored components over a given timeframe with three stages to the workload, ramping up utilization over roughly an hour. This allowed us to see the device in use over extended periods and across various workload stages. We monitored CPU, GPU, network, NVMe temps, and total power consumption.

CPU Temperature

During CPU thermal testing, the ASUS system reached a peak temperature of 87.3°C during the Prefill Heavy phase. This places ASUS in the upper-middle of the comparison stack during burst-heavy transitions, though slightly below the group’s highest peaks.

As the workload transitioned into Equal ISL/OSL and then Decode Heavy, CPU temperatures stabilized rather than continuing to climb. Sustained decoding activity remained within a controlled thermal envelope, indicating that the 87.3°C peak was associated with short-duration ramp activity rather than prolonged thermal saturation.

At the lower end, the CPU recorded a minimum temperature of 38.8°C during idle or light-load conditions. This baseline reflects effective heat dissipation when the system is not under heavy computational stress.

Overall, ASUS demonstrated elevated but controlled burst CPU thermals with stable sustained-load behavior.

GPU Temperature

GPU thermals followed a similar pattern. During Prefill Heavy acceleration, the GPU reached a maximum temperature of 82°C. This positions ASUS slightly warmer than some competitors during peak burst conditions, but still within expected operating limits for the GB10 platform.

As activity shifted into Equal ISL/OSL and Decode Heavy phases, GPU temperatures leveled off and remained stable.

The GPU recorded a minimum temperature of 38°C during lighter phases, indicating solid idle thermal characteristics consistent with the rest of the stack.

Taken together, ASUS allowed strong burst GPU utilization while maintaining predictable sustained thermals.

NVMe Temperature

Storage thermals were well managed. The NVMe drive reached a peak of 56.8°C during heavier workload phases, remaining comfortably below common throttling thresholds. This suggests effective airflow or thermal design within the chassis around the storage subsystem.

During lighter phases, the NVMe temperature dropped to a minimum of 37.8°C, aligning closely with the idle temperatures of other systems and reinforcing that storage is not thermally constrained at rest.

Overall, ASUS maintained one of the more moderate NVMe thermal profiles under load.

NIC Temperature

NIC thermals peaked at 73°C during heavier activity phases. This places ASUS in the warmer half of the stack during peak network throughput conditions, though still within normal operational tolerance.

The minimum NIC temperature recorded was 41°C during lighter workloads, reflecting expected baseline behavior.

Thermal scaling of the NIC’s tracked proportionally with system load and did not demonstrate abnormal fluctuations.

GPU Power Consumption

GPU power draw peaked at 69.77W during Prefill Heavy transitions. Compared to some higher-ceiling implementations in the group, ASUS operated slightly below the maximum observed power levels.

This power behavior helps explain the system’s balanced thermal profile. While GPU temperatures reached 82°C during burst phases, the slightly lower peak power allocation relative to the highest-drawing systems suggests ASUS is not pushing the GPU to the absolute top of the tested systems.

During sustained Decode workloads, power consumption stabilized in line with workload demand, reflecting consistent and predictable power management.

Thermal Summary

Across CPU, GPU, NVMe, and NIC monitoring, the ASUS GB10 demonstrated controlled burst thermals and competitive sustained-load stability. CPU peaked at 87.3°C and GPU at 82°C during Prefill-heavy transitions, while NVMe remained under 57°C and NIC peaked at 73°C. GPU power draw topped out at 69.77W, placing it slightly below the highest observed power ceilings in the stack.

Overall, ASUS presents a balanced thermal implementation, enabling strong burst performance while maintaining stable sustained performance and a moderate power allocation.

ASUS Ascent GX10 Performance Testing

To evaluate the ASUS Ascent GX10, we tested Spark units using the vLLM Online Serving benchmark, the most widely adopted high-throughput inference and serving engine for large language models. The vLLM online serving benchmark simulates real-world production workloads by sending concurrent requests to a running vLLM server, measuring key metrics, including total token throughput (tokens per second), time to first token, and time per output token, across varying load conditions.

Our testing spanned a range of models, from dense architectures to micro-scaling data types. It evaluated performance across three workload scenarios: Equal ISL/OSL, Prefill Heavy, and Decode Heavy. These scenarios represent distinct real-world serving patterns, from balanced input and output loads to compute-intensive prompt processing and memory-bandwidth-bound token generation.

In addition to the ASUS Ascent GX10, we benchmarked the NVIDIA Founders Edition Spark as a reference point, alongside OEM systems from Dell, Acer, and GIGABYTE. This allowed us to place ASUS’s results within the broader competitive landscape and understand where it leads, tracks with the pack, or trails across different models and workload types.

GPT-OSS-120B

In Equal ISL/OSL, the ASUS Spark scales from 70 tok/s at batch 1 to 680 tok/s at batch 64. Scaling is steady and linear across the batch sweep, with consistent gains at each doubling. There are no sharp spikes or stalls, and throughput grows predictably from batch 4 onward, maintaining close alignment with the broader OEM field across mid- and upper-batch sizes.

Prefill Heavy begins at 290 tok/s and climbs to 2,700 tok/s by batch 64. Growth is aggressive through batch 8, where throughput crosses 1,500 tok/s, and continues scaling cleanly through batch 16 and 32. The curve remains smooth with no regression points, showing strong, large-batch efficiency and stable, high-throughput behavior.

Decode Heavy ranges from 45 tok/s at batch 1 to 260 tok/s at batch 64. Lower batch sizes show minor variability between batch 1 and 2, but throughput stabilizes by batch 4 and scales consistently through batch 16 onward. The increase from batch 32 to 64 is noticeable, reflecting efficient decode scaling at higher concurrency.

Overall, ASUS tracks very closely with the broader Spark ecosystem across all three workload types.

 

GPT-OSS-20B

In Equal ISL/OSL, the ASUS Spark scales from 90 tok/s at batch 1 to 1,600 tok/s at batch 64. Throughput increases steadily across the sweep, with particularly clean linear scaling from batch 8 onward. Gains remain consistent at each doubling, and the curve shows no instability or regression as concurrency increases.

Prefill Heavy begins at 1,650 tok/s in batch 1, rises to 2,000 tok/s in batch 2, then dips in batch 4 before resuming strong upward scaling. From batch 8 onward, throughput climbs consistently, reaching 4,550 tok/s by batch 64.

Decode Heavy ranges from 60 tok/s at batch 1 to 700 tok/s at batch 64. Scaling is gradual and consistent across the sweep, with predictable gains at each doubling. The most noticeable growth occurs between batch 16 and 64, where throughput increases steadily without spikes or dips.

Qwen3 coder 30B A3B FB8

In Equal ISL/OSL, the ASUS Spark scales from 100 tok/s at batch 1 to 1,230 tok/s at batch 64. Throughput increases steadily across the sweep, with clean linear growth from batch 4 onward.

Prefill Heavy begins at 420 tok/s and climbs to 2,000 tok/s by batch 64. Scaling is smooth and highly predictable across the full batch sweep. The largest jump occurs between batch 4 and 8, where throughput moves from roughly 940 tok/s to 1,450 tok/s.

Decode Heavy ranges from 60 tok/s at batch 1 to 490 tok/s at batch 64. Scaling is gradual and consistent, with no dips or irregularities. Throughput increases predictably at each doubling, with the most noticeable gains occurring from batch 16 upward, reflecting efficient decode scaling at higher concurrency.

Qwen3 coder 30B A3B Base

In Equal ISL/OSL, the ASUS Spark scales from 60 tok/s at batch 1 to 750 tok/s at batch 64. Throughput increases steadily across the sweep, with particularly clean linear scaling from batch 8 onward.

Prefill Heavy begins at 260 tok/s and climbs to 1,680 tok/s by batch 64. Scaling is smooth and progressive throughout the batch sweep. The most noticeable acceleration occurs between batch 4 and 8, where throughput jumps from roughly 600 tok/s to 900 tok/s.

Decode Heavy ranges from 30 tok/s at batch 1 to 360 tok/s at batch 64. Scaling is gradual and consistent, with no irregular behavior at lower batch sizes.

 

Llama 3.1 8B Instruct FP4

In Equal ISL/OSL, the ASUS Spark scales from 70 tok/s at batch 1 to 2,750 tok/s at batch 64. Growth is steady across the sweep, with especially strong expansion from batch 16 onward as concurrency increases.

Prefill Heavy begins at 300 tok/s and rises to 2,550 tok/s by batch 64. Scaling is clean and linear, with consistent gains at each doubling and no instability at higher batch sizes.

Decode Heavy ranges from 40 tok/s to 580 tok/s across the batch sweep. Throughput increases gradually and predictably, with the largest gains occurring beyond batch 16.

 

Llama 3.1 8B Instruct FP8

In Equal ISL/OSL, the ASUS Spark scales from 50 tok/s at batch 1 to 2,200 tok/s at batch 64. Growth is smooth and linear, with strong acceleration beyond batch 16 as concurrency increases.

Prefill Heavy begins at 220 tok/s and rises to 2,350 tok/s by batch 64. Scaling is clean and consistent across the sweep, with predictable gains at each doubling and stable high-batch behavior.

Decode Heavy ranges from 30 tok/s to 530 tok/s. Throughput increases gradually across batch sizes, with the largest gains appearing from batch 16 onward.

GPU Direct Storage

One of the tests we conducted on the Spark was the MagnumIO GPU Direct Storage (GDS) test. GDS is a feature developed by NVIDIA that allows GPUs to bypass the CPU when accessing data stored on NVMe drives or other high-speed storage devices. Instead of routing data through the CPU and system memory, GDS enables direct communication between the GPU and the storage device, significantly reducing latency and improving data throughput.

ASUS uses the Phison ESL04TBTLCZ 1TB Gen4 SSD inside the Ascent GX10. This is the only 1TB GB10 platform we’ve tested so far, but from what we’ve seen, this particular SSD, besides being PCIe Gen4, also has the slowest write speeds.

How GPU Direct Storage Works

Traditionally, when a GPU processes data stored on an NVMe drive, the data must first travel through the CPU and system memory before reaching the GPU. This process introduces bottlenecks because the CPU acts as a middleman, adding latency and consuming valuable system resources. GPU Direct Storage eliminates this inefficiency by enabling the GPU to access data directly from the storage device via the PCIe bus. This direct path reduces data movement overhead, enabling faster and more efficient data transfers.

AI workloads, especially those involving deep learning, are highly data-intensive. Training large neural networks requires processing terabytes of data, and any delay in data transfer can lead to underutilized GPUs and longer training times. GPU Direct Storage addresses this challenge by ensuring that data is delivered to the GPU as quickly as possible, minimizing idle time and maximizing computational efficiency.

In addition, GDS is particularly beneficial for workloads that involve streaming large datasets, such as video processing, natural language processing, or real-time inference. By reducing the reliance on the CPU, GDS accelerates data movement and frees up CPU resources for other tasks, further enhancing overall system performance.

GDSIO Read Throughput 16k

Looking at GDSIO Read Throughput 16K, the ASUS begins at 0.53 GiB/s at 1 thread, though results show some variability at the lower end, with 2 threads measuring 0.23 GiB/s before recovering to 0.52 GiB/s at 4 threads. Throughput resumes steady scaling at 8 threads (0.94 GiB/s) and 16 threads (1.57 GiB/s), stepping up more aggressively at 32 threads (2.54 GiB/s). Scaling remains strong at 64 threads (3.67 GiB/s) and peaks at 4.28 GiB/s at 128 threads, showing continued upward movement without an early plateau.

GDSIO Read Average latency 16K

Looking at GDSIO Read Average Latency (16K), the ASUS starts at approximately 0.03ms at 1 thread and remains low through 2 threads (0.13ms) and 4 threads (0.12ms). Latency climbs modestly at 8 threads (0.13ms) and 16 threads (0.16ms), before rising at 32 threads (0.19ms) and 64 threads (0.27ms). At 128 threads, latency reaches 0.46ms, remaining relatively low across the full sweep, consistent with the continued scaling behavior seen in throughput.

GSDIO Write Throughput 16K

Looking at GDSIO Write Throughput 16K, the ASUS begins at 0.32 GiB/s on 1 thread, scales to 0.58 GiB/s on 2 threads, and 0.62 GiB/s on 4 threads. Performance continues to climb at 8 threads (0.65 GiB/s) and 16 threads (0.68 GiB/s), reaching a modest peak at 32 threads (0.72 GiB/s). Throughput pulls back slightly at 64 threads (0.64 GiB/s) and 128 threads (0.62 GiB/s), indicating the platform reaches its write saturation point well before the upper end of the thread sweep.

GDSIO Write Average Latency 16K

Looking at GDSIO Write Average Latency (16K), the ASUS starts at approximately 0.05ms at 1 thread and remains very low through 2 threads (0.05ms) and 4 threads (0.10ms). Latency rises modestly at 8 threads (0.19ms) and 16 threads (0.36ms), before stepping up at 32 threads (0.68ms) and 64 threads (1.52ms). At 128 threads, latency reaches 3.16ms, still relatively contained compared to the 1M results, though the upward trend aligns with the throughput plateau observed at higher thread counts.

GDSIO Read Throughput 1M

Looking at GDSIO Read Throughput 1M, the ASUS starts at 2.60 GiB/s on 1 thread and jumps sharply to 4.01 GiB/s on 2 threads. Performance continues to climb at 4 threads (4.67 GiB/s) and 8 threads (4.91 GiB/s), after which the platform effectively saturates. Throughput remains consistent at 16 threads (4.69 GiB/s), 32 threads (4.84 GiB/s), and 64 threads (4.66 GiB/s), showing a stable plateau. At 128 threads, throughput reaches 5.12 GiB/s, marking the highest observed result in the sweep.

GDSIO Read Average Latency 1M

Looking at GDSIO Read Average Latency (1M), the ASUS starts at approximately 0.38ms at 1 thread and remains low at 2 threads (0.49ms) and 4 threads (0.84ms). Latency increases with concurrency, rising to 1.59ms at 8 threads, 3.33ms at 16 threads, and 6.67ms at 32 threads. The upward trend continues at 64 threads (15.26ms) and reaches 29.54ms at 128 threads, corresponding with peak concurrency levels, while throughput remains largely sustained.

GDSIO Write Throughput 1M

Looking at GDSIO Write Throughput 1M, the ASUS begins at 0.98 GiB/s at 1 thread and declines through 2 threads (0.85 GiB/s) and 4 threads (0.82 GiB/s), before continuing to drop at 8 threads (0.77 GiB/s) and 16 threads (0.68 GiB/s). Performance falls further at 32 threads (0.57 GiB/s) before a slight recovery at 64 threads (0.61 GiB/s). At 128 threads, throughput rises to 1.99 GiB/s, though the overall write scaling pattern indicates significant contention across the sweep.

GDSIO Write Average Latency 1M

Looking at GDSIO Write Average Latency (1M), the ASUS starts at approximately 1.00ms at 1 thread, rising to 2.31ms at 2 threads and 4.78ms at 4 threads. Latency climbs steeply as concurrency increases, reaching 10.19ms at 8 threads, 23.12ms at 16 threads, and 54.67ms at 32 threads. The upward trend continues sharply at 64 threads (103.25ms), before pulling back to 62.97ms at 128 threads, consistent with the partial throughput recovery observed at maximum concurrency.

Conclusion

The ASUS Ascent GX10 is another take on NVIDIA’s GB10-based Spark platform, built around the same underlying board and silicon we’ve tested across the stack. That means core compute behavior is largely consistent, and in vLLM testing, the GX10 tracked closely with other Spark systems across GPT-OSS, Qwen3-Coder, and Llama 3.1 models. Scaling behavior remained predictable, with strong Prefill-heavy throughput and steady gains at higher batch sizes.

Thermally, the GX10 ran toward the warmer end of the group during burst phases, with the CPU peaking at 87.3°C and the GPU at 82°C before stabilizing under sustained workloads. NVMe and NIC thermals stayed within expected operating ranges, indicating the chassis is handling airflow adequately, even if it does not post the lowest peak numbers in the set.

GPU Direct Storage was the most noticeable variance point, largely influenced by the included 1TB Gen4 SSD. Read scaling was functional but landed toward the bottom of the group, and write throughput plateaued earlier with higher latency at peak concurrency. A better SSD would help considerably in this unit.

Because all Spark systems share the same board and GB10 Superchip, performance differences are incremental. In practice, the decision comes down to storage configuration, thermals, physical design, and vendor alignment rather than raw compute capability.

Product Page – ASUS Ascent GX10

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Backblaze is rolling out a new cloud object storage product aimed directly at neocloud platforms, the companies building AI-focused cloud environments for high-performance computing.

The move comes as AI workloads increasingly strain storage infrastructure. Training large models, running inference, and processing media-heavy data all require systems that can keep pace with powerful GPUs. For many neocloud providers, building that storage layer internally requires committing significant capital and engineering talent that might otherwise be used to expand compute capacity. Instead of starting from scratch, they can integrate B2 Neo behind the scenes and present it to customers as part of their own platform.

Backblaze says the offering is built on nearly 20 years of operating cloud storage at scale. The company manages more than five exabytes of data and supports a throughput of up to 1 terabit per second. B2 Neo was developed alongside several neocloud platforms already running production workloads on its infrastructure. Those early collaborations include the company’s largest total contract value commitment to date, as well as active discussions with other emerging providers seeking to strengthen their storage capabilities.

Operational Integration and Platform Control

The structure of the offering is intended to give neoclouds operational control while outsourcing the complexity of storage infrastructure. Customers of those platforms will see storage presented as a native service, complete with branded endpoints and pricing determined by the partner. Account provisioning, permission management, and billing can be handled through neocloud’s existing tools, eliminating the need for a separate administrative console.

Market forecasts suggest significant growth headroom. The neocloud segment is projected to expand from $35.22 billion in 2026 to $236.53 billion by 2031, representing a compound annual growth rate of 46.37%. As these platforms race to add GPU capacity, storage has emerged as a critical bottleneck. Engineering teams often face a trade-off: allocate resources to building scalable object storage or concentrate on expanding compute infrastructure that differentiates their offerings.

For companies running AI training pipelines, inference jobs, or large-scale media processing, storage is not just a background utility; it is central to keeping everything moving. Massive datasets, model checkpoints, and output files must be stored and accessed quickly and reliably. When object storage is not built directly into a platform, teams often end up shuttling huge volumes of data back and forth between environments. That extra movement can introduce latency, leave expensive GPUs idle, and drive up overall costs.

Strategic Focus on Compute Scaling

Backblaze positions the new offering as a way to ease that pressure. Neocloud providers are racing to add GPU capacity, and building high-performance object storage in-house can pull focus and resources away from that mission. By offering a ready-made storage layer that can be deployed in weeks rather than years, the idea is to let these platforms concentrate on scaling compute while still delivering integrated storage to customers.

Availability

Backblaze B2 Neo is now available to qualified neocloud platforms.

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Lenovo is expanding its ThinkEdge portfolio with a new wave of AI-enabled systems that bring computing power from centralized data centers into the environments where data is created. The additions include the ThinkEdge SE10n Gen 2, ThinkEdge SE30n Gen 2, ThinkEdge SE60n Gen 2, and the ThinkEdge SE50a, the company’s first industrial all-in-one panel PC. Rather than sending every workload to the cloud, more organizations are analyzing data locally to reduce latency, improve resilience, and keep sensitive information on-site.

From Entry-Level Gateways to Advanced AI Systems

The new devices are powered by Intel Core processors with scalable AI options and feature fanless, industrial-grade designs for continuous 24/7 operation. Connectivity options include Wi-Fi 6E and cellular support. Lenovo also emphasizes long-term lifecycle support, enterprise services, and global supply chain capabilities to help customers deploy and maintain systems at scale for years.

The updated ThinkEdge portfolio covers a range of deployment options.

ThinkEdge SE10n Gen 2

The ThinkEdge SE10n Gen 2 is a compact, fanless intelligent gateway designed for connectivity, data capture, and lightweight analytics. It serves as an accessible starting point for organizations looking to introduce edge intelligence without a major upfront investment.

 

ThinkEdge SE10n Gen 2
Performance
Processor	Up to Intel Core 3 Processor N355
Operating System	Win11 IoT LTSC 2024 Ubuntu Server / Ubuntu Core AWS GG / Red Hat Support Win10 driver
Memory	1x DDR5 SoDIMM, up to 16GB
Storage	1x M.2 Slot for SSD
PSU	Lockable DC 20V
Working Temperature	Up to 0°C to 50°C
Connectivity
Front I/O	2x USB2.0 2x USB3.2 Gen2 (10 Gbps) 1x Audio combo Jack 2x serial (RS-232/422/485) 1x Power Switch 1x Ext. Power Switch 1x Reset Switch 1x Power-On LED1 1x Storage LED2 1x Wi-Fi LED3 1x UDF (WWAN) LED4
Rear I/O	2x USB 3.2 Gen2 (10 Gbps) 1x DP1.4 1x HDMI 2.0b 2x 2.5G LAN AC PWR-in
Wireless	WWAN CAT6 & Wi-Fi 6/Bluetooth Combo
Software
Software	Lenovo Device Orchestration (LDO)
Design
Form Factor	0.8L Fanless
Dimensions (W x D x H)	179 x 135 x 34.5mm (7.04 x 5.3 x 1.36 in)
Weight	1.5kg / 3.31 lbs
IP Rating	IP50 (optional)
Security
Security	BitLocker NIST-compliant BIOS ThinkShield Secure Wipe TPM 2.0 Kensington Lock Smart USB Protection Tamper Switch
Certifications & Registries
Certifications & Registries	MIL-STD- 810H CE.FCC Class B BSMI.CCC.CB ErP Lot 6 Low Halogen RoHS compliant REACH TED WEEE

ThinkEdge SE30n Gen 2

The ThinkEdge SE30n Gen 2 is a rugged, AI-ready gateway built for real-time inferencing at the edge, right next to your operational equipment. Optimized for Intel Core processors, it’s engineered to streamline device orchestration and fleet-level management across distributed environments.

 

ThinkEdge SE30n Gen 2
Performance
Processor	Intel Core 7 150U Intel Core 5 120U Intel Core 3 100U
Operating System	Windows 11 IoT Enterprise LTSC Ubuntu Server Ubuntu Core No OS
Memory	1x 262-Pin SoDIMM socket up to 48GB DDR5 4800MHz memory
Storage	1x M.2 NVMe + 1x Optional M.2 SATA
PSU	Lockable DC 12V
Working Temperature	0°C to 50°C
Connectivity
Front I/O	2x USB 2.0 1x Mic in + line out 2x serial (RS-232/422/485)
Rear I/O	4x USB 3.2 Gen2 2x USB 3.2 Gen1 1x Lockable DC jack 4x HDMI 2.0b 1x Intel Ethernet connection I219-LM, 1G 1x Intel Ethernet controller I226-V, 2.5G Flexible I/O (DIDO/CAN)
Expansion Slot	1x M.2 2280 PCIe 1x M.2 2230 Wi-Fi 1x M.2 3042 (WWAN or 2nd SSD slot)
Wireless	Intel Wi-Fi 6E (Intel vPro Essential/non-vPro) Bluetooth 5.4 WWAN (4G & 5G)
Software
Software	Lenovo Device Orchestration
Design
Form Factor	0.8L Fanless
Mounting	VESA Mount (optional) DIN Rail Mount (optional)
Dimensions (W x D x H)	174 x 125 x 38.7mm
Weight	Without package: 1.1kg With package: 2kg
IP Rating	IP50
Security
Security	Intel vPro Security HW TPM 2.0 chip HW Watchdog Timer Support for Kensington Lock

ThinkEdge SE60n Gen 2

A higher-performance edge computing system aimed at more demanding AI workloads. Powered by Intel Core Ultra processors with integrated AI accelerators delivering up to 97 TOPS, it supports multi-camera computer vision, predictive analytics, and autonomous workflows across industrial automation, robotics, smart retail, healthcare, and transportation.

 

ThinkEdge SE60n Gen 2
Performance
Processor	Intel Core Ultra 7 265H Intel Core Ultra 5 235H Intel Core Ultra 5 125H
Operating System	Windows 11 IoT Enterprise LTSC Ubuntu core 24.04 Ubuntu server 24.04
Graphics	Up to Intel Arc Graphics 8Xe
Memory	2x 262-pin SODIMM socket Max. up to 64GB DDR5 5600 MT/s
Storage	1x M.2 NVMe + 1x Optional SATA
PSU	DC 12-36V
Working Temperature	-20°C to 60°C
Connectivity
Front I/O	2x USB 2.0 2x RS232/422/485 1x DIO 1x External Power Switch
Rear I/O	4x USB 3.2 Gen1 2x HDMI 2.0 1x DP 1.2 2x 2.5G LAN 12-36V DC-In 1x Mic-in + 1x line-out
Optional I/O	4x RS232 + 2x USB 2.0 IET Module 4x LAN PoE IEEE 802.3af + 2x USB 2.0 IET Module 4x LAN + 2x USB 2.0 IET Module 4x USB 3.0 + 3x USB 2.0 IET Module
Expansion Slot	1x 80-pin IET interface
Wireless	Intel Wi-Fi 6E (non-vPro) Bluetooth 5.4
Software
Software	Lenovo Device Orchestration
Design
Form Factor	2.1L Fanless 3.1L Fanless
Mounting	Wall Mount (default) DIN Rail Kit (optional)
Dimensions (W x D x H)	240 x150 x 59mm (without I/O expansion) 240 x150 x 85 mm (with I/O expansion module)
Weight	Without package: Standard (2.1L): 2.3kg Expanded I/O (3.1L): 2.6kgWith package: Standard (2.1L): 3.7kg Expanded I/O (3.1L): 4.2kg
IP Rating	IP50 (with optional dust cover)
Security
Security	Intel vPro Security TPM 2.0 chip

ThinkEdge SE50a

Lenovo’s first industrial all-in-one panel PC embeds local AI processing directly into operator stations. Available in 12.1-inch, 15.6-inch, and 21.5-inch sizes, the rugged system is designed to simplify frontline operations while improving visibility and control at the point of interaction. It can also be expanded to meet specific deployment requirements.

 

ThinkEdge SE50a
Performance
Processor	Up to Intel Core 7 processor
Operating System	Windows 11 IoT LTSC Ubuntu Desktop
Memory	1x 262-Pin SoDIMM Socket up to 32GB DDR5 (4800MHz)
Storage	1x M.2 Key M 2280 (PCI-e x4) slot for storage. 1x M.2 Key B 2242 for SATA
Graphics	Integrated Intel UHD Integrated Intel Iris Xe
Audio	Realtek ALC888S, 2×2
PSU	+12V Lockable DC jack 120W, 12V/10A 50C adaptor
Working Temperature	0°C to 50°C
Connectivity
I/O	3x USB3.2 + 1x USB2.0 1x USB-C 2x RJ-45 (Intel I225L 2.5G Ethernet) 1x RS-232/422/485
M.2	1x M.2 Key B 3042/3052/2242 for SATA 1x M.2 Key M 2280 (PCI-e x4) slot for storage 1x M.2 Key E 2230 for Wi-Fi
Expansion Slots	1x 80-pin IET interface
Wireless	Intel Wi-Fi 6E (non-vPro) Bluetooth 5.4
Design
Form Factor	All-in-one
Display	ThinkEdge SE50a-12: 12.1″ XGA 4:3; 1024 x 768 resolution; 600cd/m2 luminance; up to 10-point capacitive ThinkEdge SE50a-15: 15.6″ FHD 16:9; 1920 x 1680 resolution; 350 cd/m2 luminance; up to 10-point capacitive ThinkEdge SE50a-21: 21.5″ FHD 16:9; 1920 x 1680 resolution; 250 cd/m2 luminance; up to 10-point capacitive
Dimensions (W x D x H)	ThinkEdge SE50a-12: 293.77 x 226.31 x 54.5mm ThinkEdge SE50a-15: 391.2 x 293.2 x 61mm ThinkEdge SE50a-21: 538.05 x 341.05 x 64mm
Weight	Without package: ThinkEdge SE50a-12: 2.4 kg ThinkEdge SE50a-15: 3.7kg ThinkEdge SE50a-21: 7.3kg
IP Rating	Front panel IP65 Back cover IP41
Mounting	Wall / Stand / VESA 75mm x 75mm, 100mm x 100mm Panel mount with mounting kits
Security
Security	dTPM 2.0 chip
Software
Software	Lenovo Device Orchestration

Rather than relying solely on constant cloud connectivity, the new ThinkEdge systems are built to handle AI workloads directly on the device. This approach can reduce latency, enhance data privacy, and lower operational costs, particularly in environments where immediate response times matter. The portfolio is also designed to scale, allowing organizations to start with smaller deployments and expand as their edge use cases mature. Remote management capabilities are intended to simplify oversight of large fleets of distributed systems.

Showcase and Availability

Lenovo is showcasing the latest ThinkEdge devices at EuroShop 2026 in Düsseldorf, Germany, where the company is presenting a broader ecosystem of solutions and interactive demonstrations.

Availability timelines vary by model:

• ThinkEdge SE30n Gen 2 and ThinkEdge SE60n Gen 2 are scheduled to be available in select markets starting April 2026.
• ThinkEdge SE50n Gen 1 is expected in June 2026.
• ThinkEdge SE10n Gen 2 is scheduled to be available beginning July 2026.

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