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Today — 20 June 2026Main stream

HighPoint Rocket 1604L Review: Four Gen5 M.2 SSDs, One Slot, 55.6GB/s

19 June 2026 at 16:28

The HighPoint Rocket 1604L is a $399 PCIe Gen5 x16 add-in card that carries four M.2 NVMe SSDs, each on a dedicated Gen5 x4 connection. In our testing with four Samsung 9100 PRO 4TB drives installed, the card sustained 55.6GB/s of 128K sequential read bandwidth and 10.1 million 4K random write IOPS, numbers that are within a few percent of what the four drives are rated to deliver on native motherboard slots. That is the entire pitch of this card: it adds drive bays without subtracting performance.

HighPoint Rocket 1604L front view.

The 1604L takes a different architectural path than most quad-M.2 cards we have looked at. It is not a passive bifurcation riser, nor is it a PCIe switch card. Instead, it is built around an Astera Labs PT5161LRS retimer, which sits in the data path at the physical layer, re-clocking and regenerating the Gen5 signal between the host slot and each M.2 connector. At Gen4 speeds, passive cards that simply route traces from the slot to the connectors are usually fine. At Gen5’s 32GT/s signaling rate, trace length and connector transitions start eating into the signal budget, and marginal links train down to Gen4 or throw correctable errors under load. The retimer approach addresses that without the cost, power, and latency of a full PCIe switch. The trade-off is that the host platform must support x4/x4/x4/x4 bifurcation on the slot, since the retimer does not perform any lane virtualization of its own.

This card joins a HighPoint Gen5 family we have covered previously, which includes the switch-based Rocket 1604A, which works in any x16 slot regardless of bifurcation support, and the Rocket 7604A, which adds bootable RAID on top. The 1604L is the leanest of the three. There is no RAID stack and no driver; the operating system simply enumerates four native NVMe devices, and anything beyond that (mdadm, Storage Spaces, ZFS) is up to the user. HighPoint positions the card heavily toward servers hosting M.2 accelerator modules like the Hailo-8 series, but for our purposes, the storage use case is the more universal one. The card is a full-height, half-length design that HighPoint claims is roughly 40% shorter than typical four-bay M.2 cards, with a full-length anodized aluminum heatsink, thermal padding for the drives, an integrated low-decibel fan, and a ventilated bracket. Firmware-level monitoring exposes per-port lane allocation, power draw, and board health, with present and activity LEDs for each SSD.

The bifurcation requirement is the caveat to settle before buying. Most mainstream consumer boards either cannot split a x16 slot four ways or steal those lanes from the primary GPU slot. Where the 1604L makes immediate sense is on platforms with PCIe lanes to spare: Threadripper TRX50 and WRX90, Xeon W, and EPYC or Xeon server boards, where x4/x4/x4/x4 is a BIOS toggle and a spare x16 slot is not a sacrifice. That describes our test rig, so the fit was natural.

HighPoint Rocket 1604L Specifications

Specification Rocket 1604L (R1604L)
Bus Interface PCIe 5.0 x16
Chipset Astera Labs PT5161LRS retimer
Working Mode 4 x 4-lane (host bifurcation x4/x4/x4/x4 required)
Ports 4x M.2 NVMe (dedicated PCIe 5.0 x4 per port)
Device Support M.2 NVMe SSDs or M.2 PCIe accelerator modules
SSD Form Factors M.2 2242, 2260, 2280
Data Transfer Rate Up to 64GB/s
RAID Support None (OS-level software RAID optional)
Form Factor Full-height, half-length
Cooling Full-length aluminum heatsink, integrated fan, thermal pads, ventilated bracket
Monitoring Per-port lane allocation, power, and health via smart firmware; present and activity LEDs
OS Support Native NVMe support in mainstream operating systems, x86 Intel/AMD and ARM
Price $399 (HighPoint eStore)

Build and Design

HighPoint Rocket 1604L top heatsink removed with 4 M.2 drives installed.

The 1604L’s compact footprint is the visible difference from the sprawling four-bay cards of the Gen4 era. Drive installation is conventional: heatsink off, drives into the four sockets, thermal pads aligned, heatsink back on. The single fan exhausts through the ventilated bracket, which matters in workstation towers where slot airflow is unpredictable. We did not observe thermal throttling from any of the four drives during sustained 60-second test runs.

HighPoint Rocket 1604L heatsink removed from card.

Testing Setup

We tested the Rocket 1604L in our consumer Threadripper platform, the same water-cooled rig that has handled our recent high-end GPU and HEDT CPU reviews. The card was installed in a Gen5 x16 slot configured for x4/x4/x4/x4 bifurcation.

StorageReview Threadripper Test Platform

  • CPU: AMD Ryzen Threadripper 7980X (64C/128T)
  • Motherboard: ASUS Pro WS TRX50-SAGE WIFI
  • RAM: 128GB DDR5-6400
  • Storage: 1TB Gen4 Boot SSD, 4x Samsung 9100 PRO 4TB (FW 0B2QNXH7) on the Rocket 1604L
  • OS: Ubuntu Server 24.04

The four Samsung 9100 PRO drives are each rated at 14,800MB/s sequential read, 13,400MB/s sequential write, 2,200K random read IOPS, and 2,600K random write IOPS, which puts the theoretical aggregate at 59.2GB/s read and 8.8 million random read IOPS. Since a Gen5 x16 slot tops out at roughly 63GB/s of usable bandwidth, the drives, not the slot, are the ceiling in this configuration. That is the right way around; a card like this should never be the bottleneck.

All workloads were run with FIO 3.36 using the io_uring engine against the raw block devices, with a 5% LBA span per drive, 60-second runtimes with a 5-second ramp, and one job per drive at QD64 for sequential transfers or 16 jobs per drive at QD32 (64 total) for 4K random. These are burst-oriented consumer test parameters rather than enterprise steady-state methodology, consistent with how we evaluate client platform accessories.

HighPoint Rocket 1604L Performance

Sequential Bandwidth

Workload (4 drives aggregate) IOPS Bandwidth Avg Latency 99th % Latency
128K Sequential Read, QD64 424K 55.6GB/s 604µs 906µs
128K Sequential Write, QD64 279K 36.5GB/s 918µs 1,303µs
64K Sequential Read, QD64 668K 43.8GB/s 383µs 570µs
64K Sequential Write, QD64 462K 30.3GB/s 553µs 914µs

The headline number is the 128K sequential read result of 55.6GB/s, which works out to 13.9GB/s per drive, or about 94% of Samsung’s 14,800MB/s rating for the 9100 PRO. Getting four Gen5 drives to within striking distance of their individual spec sheets, simultaneously, through a single add-in card is the result that validates the retimer architecture. Average latency held at 604µs with the 99th percentile at 906µs, and per-drive utilization stayed pinned above 99% for the duration of the run. The 64K read result of 43.8GB/s trails the 128K figure as expected, since larger transfers amortize protocol overhead more efficiently.

Sequential writes landed at 36.5GB/s at 128K and 30.3GB/s at 64K. That is below the four drives’ combined 53.6GB/s write rating, which is a drive behavior rather than a card limitation: vendor write specs reflect short bursts into pSLC cache, while our 60-second sustained runs push past that window. The write latency profile stayed orderly, with the 128K test averaging 918µs and holding 1,303µs at the 99th percentile.

4K Random Performance

Workload (4 drives aggregate) IOPS Bandwidth Avg Latency 99th % Latency
4K Random Read, QD32 x 64 jobs 8.83M 36.2GB/s 231µs 553µs
4K Random Write, QD32 x 64 jobs 10.1M 41.5GB/s 202µs 461µs

The random results are the cleanest evidence that the 1604L’s data path is transparent. Samsung rates the 9100 PRO 4TB at 2,200K random read IOPS, and four of them behind the 1604L produced 8.83 million, which is the rated aggregate almost to the decimal. Random write reached 10.1 million IOPS against a theoretical ceiling of 10.4 million, about 97% of spec. Writes-outrunning-reads looks odd at first glance but matches the drives’ own ratings, helped along by the 5% working set, which keeps the controllers operating in their happiest caching range.

Latency under these loads stayed tight, averaging 231µs for reads and 202µs for writes, with 99th percentile figures of 553µs and 461µs, respectively. The other observation worth passing along is host cost: driving nearly 10 million IOPS through 64 FIO jobs consumed roughly 60% of the system CPU time over the run. The card will hand a workstation more storage performance than most applications can absorb, and feeding it is a workload in its own right.

Conclusion

The Rocket 1604L does one job, and our test data shows it doing that job with effectively no overhead. Four Samsung 9100 PRO 4TB drives delivered 55.6GB/s of sequential read bandwidth, 8.83 million random read IOPS, and 10.1 million random write IOPS through the card, figures that sit at 94 to 100% of the drives’ combined ratings. For a device whose value proposition is invisibility, that is a clean sweep.

HighPoint Rocket 1604L rear view.

The buyer’s question is whether the $399 ask is justified, given that passive bifurcation cards sell for a fraction of that price. At Gen4 and below, it often is not. At Gen5, the signal integrity margin is thin enough that the retimer earns its keep, particularly for users planning to load the card with drives that each move 14GB/s. Worked out per bay, $100 per Gen5 M.2 slot with cooling and monitoring included is reasonable against the alternative of unstable link training on a passive card, and it undercuts switch-based options while preserving the full bandwidth of every port.

Who should buy it: TRX50, WRX90, Xeon W, and server platform owners who want 16TB or more of Gen5 flash in a single slot for media work, AI dataset staging, or scratch space, and who are comfortable with OS-level RAID or none at all. Who should not: anyone on a platform without x4/x4/x4/x4 bifurcation support, who should look at the switch-based Rocket 1604A instead, and anyone needing bootable hardware RAID, which is the Rocket 7604A’s territory. Buyers running Gen4 drives can also save money with simpler cards, since the retimer’s advantages are largely wasted below 32GT/s.

HighPoint Rocket 1604L Product Page

The post HighPoint Rocket 1604L Review: Four Gen5 M.2 SSDs, One Slot, 55.6GB/s appeared first on StorageReview.com.

Yesterday — 19 June 2026Main stream

Sandisk Expands Optimus SSD Lineup with New PS5 and ROG Xbox Ally Storage Options

18 June 2026 at 19:15
Sandisk Optimus GX Pro 850P next to PS5 Sandisk Optimus GX Pro 850P next to PS5

Sandisk has expanded its Optimus gaming SSD lineup with the new SANDISK Optimus GX PRO 850P NVMe SSD for PS5 consoles, alongside the SANDISK Optimus GX 7100X NVMe SSD for ROG Xbox Ally X and PC. The company also announced availability for several other Optimus drives.

Sandisk Optimus GX PRO 850P NVMe SSD

The Sandisk Optimus GX PRO 850P NVMe SSD is officially licensed for PlayStation 5 and PlayStation 5 Pro, with testing and certification for Sony’s console platform. It also features an exclusive heatsink design with PlayStation branding, which is built for the PS5 M.2 slot, so buyers do not need to add a separate heatsink.

Sandisk Optimus GX Pro 850P next to PS5

With game install sizes, updates, and DLC continuing to eat into console storage, the Optimus GX PRO 850P is designed for users who want to keep more titles installed and ready to play. Sandisk lists capacities up to 8TB, giving PS5 owners enough room for much larger game libraries while reducing the need to delete older titles to make space for new releases. The drive supports playing games directly from the SSD once installed, which makes it a direct expansion option rather than just a place to store inactive games.

Sandisk Optimus GX Pro 850P

Performance is based on PCIe Gen 4.0 NVMe technology, with Sandisk quoting sequential speeds of up to 7,300MB/s read and 6,600MB/s write, depending on capacity. For the 1TB model, Sandisk lists up to 7,300MB/s sequential read and 6,300 MB/s sequential write, along with 800K random read IOPS and 1.1M random write IOPS. The 1TB model is also rated for 600TBW endurance and carries a five-year limited warranty.

Although the 850P is mainly marketed as a PS5 and PS5 Pro upgrade, Sandisk also lists compatibility with computers that have an M.2 M-key slot and support the M.2 2280 form factor, along with Windows 10 and newer.

Sandisk Optimus GX 7100X NVMe SSD

The Sandisk Optimus GX 7100X NVMe SSD gives ROG Xbox Ally, ROG Xbox Ally X, and PC users an officially licensed storage upgrade built for portable gaming and larger game libraries. It supports capacities up to 4TB, giving players more room for Xbox titles, updates, DLC, and Game Pass downloads without constantly managing installs. Sandisk also includes a one-month Xbox Game Pass Ultimate trial in the box.
SanDisk Optimus GX 7100X

Performance comes from a PCIe 4.0 NVMe interface, with Sandisk listing sequential read and write speeds of up to 7,250 MB/s and 6,900 MB/s on the 2TB model. The 2TB model is also rated for up to 1M random read IOPS and 1.4M random write IOPS, uses the M.2 2280 form factor, measures 3.15 x 0.87 x 0.09 inches, and features a five-year limited warranty.

The Optimus GX 7100X is also power-efficient, which is especially relevant for handheld gaming PCs, where power draw can affect battery life. The drive is also built with SanDisk’s 8th-generation BiCS TLC 3D CBA NAND and is tested for ROG Xbox Ally, ROG Xbox Ally X, and PC use.

Metric/Field SANDISK Optimus GX PRO 850P NVMe SSD SANDISK Optimus GX 7100X NVMe SSD
Overview
Product Name SANDISK Optimus GX PRO 850P NVMe SSD for PS5 consoles SANDISK Optimus GX 7100X NVMe SSD for ROG XBOX Ally X and PC
Positioning Officially licensed for PlayStation 5 and PlayStation 5 Pro consoles Officially licensed storage for ROG XBOX Ally, ROG XBOX Ally X, and PC
Maximum Capacity Up to 8TB Up to 4TB
Form Factor M.2 2280 M.2 2280
Performance
Interface PCIe 4.0 NVMe PCIe 4.0 NVMe
Sequential Read Performance 7,300MB/s 7,250MB/s
Sequential Write Performance 6,300MB/s 6,900MB/s
Maximum Sequential Read/Write Speeds Up to 7,300/6,600 MB/s Up to 7,250/6,900 MB/s
Random Read 800K IOPS 1M IOPS
Random Write 1.1M IOPS 1.4M IOPS
Hardware and Design
Heatsink Integrated heatsink
Exclusive heatsink design featuring the PlayStation logo
Optimized for the PlayStation 5 and PlayStation 5 Pro consoles’ M.2 slot
Not specified
NAND Not specified Sandisk’s 8th generation BiCS TLC 3D CBA NAND
Power Efficiency Not specified Designed for power efficiency for low-power consumption for laptops and ROG XBOX Ally X
Physical Specifications
Dimensions (L x W x H) 3.15″ x 0.96″ x 0.39″ 3.15″ x 0.87″ x 0.09″
Weight 30.4gms Not specified
Reliability
Warranty 5-Year Limited Warranty 5-Year Limited Warranty
Endurance (TBW) 600 1,200
Operating Temperature 0°C to 85°C N/A
Non-Operating Temperature -40°C to 85°C N/A
Compatibility
Primary Compatibility PlayStation 5 and PlayStation 5 Pro ROG XBOX Ally, ROG XBOX Ally X, and PC
PC Compatibility Computers with M.2 (M-key) port (Capable of taking M.2 2280 form factor)
Windows 10+
PC laptops
ROG XBOX Ally
ROG XBOX Ally X
Product Features
Features Experience high-speed gaming SSD with PCIe 4.0 technology.
New SSD heatsink design specifically built for PS5 and PS5 Pro consoles.
Download and play games directly off the drive.
Equipped with PCIe 4.0 interface provides the speed and power for on-the-go XBOX gaming.
Designed for power efficiency for low-power consumption for laptops and ROG XBOX Ally X.
Endurance of up to 2,400 TBW.
Included Offer N/A 1-month trial of XBOX Game Pass Ultimate inside the box
Model and Availability
Model Number SDSG81100TAH-000E0 SDSG71200TAN-000G0
Starting Price $474.99 $799.99
Availability Sandisk store and select retailers Sandisk store and select retailers

Availability and Pricing

The Sandisk Optimus GX PRO 850P NVMe SSD for PS5 consoles is available now through the Sandisk store and select retailers, with pricing starting at $474.99.

Pricing for the Sandisk Optimus GX 7100X NVMe SSD starts at $799.99, with availability now through the Sandisk store and select retailers.

Other Releases

Alongside these launches, the broader Sandisk Optimus lineup is now available through the Sandisk store and select retailers, including:

  • SANDISK Optimus GX PRO 8100 NVMe SSD: Designed for professionals, gamers, and creators, the GX PRO 8100 is positioned as a high-performance PCIe 5.0 drive for demanding AI workflows, intensive gaming, and creative workloads. Pricing starts at $524.99.
  • SANDISK Optimus GX PRO 850X NVMe SSD: Built for users who need high-capacity storage for gaming and creative applications, the GX PRO 850X offers capacities up to 8TB for larger game libraries, applications, and project files. Pricing starts at $488.99.
  • SANDISK Optimus GX 7100 NVMe SSD: The GX 7100 is designed for laptops and handheld gaming consoles, using a power-efficient architecture for gaming sessions and creative workflows on the move. Pricing starts at $207.99.
  • SANDISK Optimus GX 7100M NVMe SSD: Built for portable systems, the GX 7100M supports upgrades for compatible Steam Deck, MSI Claw, Microsoft Surface, and Dell laptop systems, with capacities up to 2TB for modern AAA games. Pricing starts at $387.99.
  • SANDISK Optimus 5110 NVMe SSD: Planned for release later this year, the Optimus 5110 targets creators seeking faster application launches, greater capacity, and more room for high-resolution video and image files.

The post Sandisk Expands Optimus SSD Lineup with New PS5 and ROG Xbox Ally Storage Options appeared first on StorageReview.com.

Before yesterdayMain stream

AMD Radeon RX 9070 GRE Review: 12GB RDNA 4 for 1440p Gaming

2 June 2026 at 01:24

The Radeon RX 9070 GRE is not a new GPU. AMD introduced it last year as a China-only part, and at Computex 2026, the company gave it a global release. It slots into the upper-mainstream space below the RX 9070, focused on 1440p performance, modern display support, and the hardware behind newer features such as ray tracing, upscaling, frame generation, and AI-assisted rendering. It is not a flagship, but it aims to be a middle-ground 1440p option sitting under the more expensive cards in the lineup.

The AMD RX 9070 GRE is built around RDNA 4, with updated compute units, third-generation ray tracing accelerators, second-generation AI accelerators, and an enhanced media engine. That gives the card a stronger feature set than basic performance alone can provide, which is important in this price range. Buyers are also looking at ray tracing, AV1 encoding, high-refresh 1440p monitor support, driver features, and whether 12GB of memory will hold up well in newer titles over the next few years.

AMD PowerColor Red Devil RX 9070 GRE front fan view

On paper, AMD lines up the GeForce RTX 5060 Ti 16GB against the GeForce RTX 5060 Ti 16GB, which sells for around $569, and claims up to 22 percent higher performance across a mix of 40-plus raster and ray-tracing games, plus a 26 percent edge in performance per dollar. Those are AMD’s own figures, so we treat them as a starting point rather than a verdict. The more awkward comparison is inside AMD’s own stack. At $549, the GRE carries the same launch MSRP as the RX 9070, a card with 16GB, a 256-bit bus, and more enabled cores, and AMD is now listing the RX 9070 at $619. The GRE arrives at the price the better card used to hold, which says more about current memory and component costs than about the GRE’s standalone value.

For gamers coming from older 1080p or early 1440p GPUs, the RX 9070 GRE should be the most appealing option as a full-platform upgrade card. It brings 12GB of video memory, PCIe 5.0 x16 connectivity, DisplayPort 2.1a, HDMI 2.1b, and the newer RDNA 4 media block, which gives it a broader feature set than a simple FPS-focused upgrade. The 12GB memory capacity is not as generous as the 16GB found on some competing cards, and that will be worth watching in heavier future titles, but AMD is clearly aiming this GPU at high-quality 1440p gaming first.

Radeon RX 9070 GRE Specifications

Specifications Overview AMD Radeon RX 9060 XT AMD Radeon RX 9070 GRE AMD Radeon RX 9070 AMD Radeon RX 9070 XT
Architecture RDNA 4 RDNA 4 RDNA 4 RDNA 4
Compute Units 32 48 56 64
Stream Processors / Shaders 2,048 3,072 3,584 4,096
Ray Accelerators 32 48 56 64
AI Accelerators 64 96 112 128
Boost Clock Up to 3.13 GHz Up to 2.79 GHz Up to 2.52 GHz Up to 2.97 GHz
Memory Capacity 8GB / 16GB GDDR6 12GB GDDR6 16GB GDDR6 16GB GDDR6
Memory Bus 128-bit 192-bit 256-bit 256-bit
Memory Bandwidth 320 GB/s 432 GB/s 640 GB/s 640 GB/s
Infinity Cache 32 MB 48 MB 64 MB 64 MB
Peak FP32 Throughput 25.6 TFLOPS 34.3 TFLOPS 36.1 TFLOPS 48.7 TFLOPS
Peak INT4 AI Performance 821 TOPS 1,097 TOPS 1,156 TOPS 1,557 TOPS
Typical Board Power (TBP) 160W 220W 220W 304W
Recommended PSU 450W 650W 650W 750W
Launch MSRP $299 (8GB) / $349 (16GB) $549 $549 $599

Radeon RX 9070 GRE

The Radeon RX 9070 GRE is an AIB-only card, so the physical design will vary by partner model. Cooler size, fan layout, card thickness, factory tuning, acoustics, and smaller quality-of-life details will vary between brands. Partner cards are expected from Acer, ASUS, ASRock, Gigabyte, PowerColor, Sapphire, and XFX, so buyers should see the usual spread of dual-fan and triple-fan designs depending on price tier and case compatibility.

Our review sample is a PowerColor Radeon RX 9070 GRE with a full-size triple-fan cooler. It has a simple black shroud with minimal branding, aside from the PowerColor logos on the fans and the side edge. The card is long and built around cooling headroom, but the GRE version avoids the overly bulky styling found on some higher-end GPU designs. Around back, the card uses a full-length metal backplate with ventilation cutouts near the end. That will help provide some airflow through the rear section of the heatsink. The design is pretty simple overall, but that’s fine for its class.

The PowerColor model’s display output includes three DisplayPort 2.1a connections and one HDMI 2.1b port, which covers the usual mix for high-refresh 1440p monitors, 4K displays, and living-room setups.

AMD PowerColor Red Devil RX 9070 GRE display outputs

At the GPU level, the RX 9070 GRE uses 48 RDNA 4 compute units, 48 hardware ray tracing accelerators, and 96 hardware AI accelerators. The boost clock runs up to 2.79 GHz, with peak AI performance rated at 1097 TOPS using INT4 sparsity. That puts the GRE comfortably above entry-level gaming cards, but still leaves a gap between it and the larger RX 9070.

It also features 12GB of GDDR6 memory on a 192-bit bus, running at 18 Gbps. That gives the card 432 GB/s of effective bandwidth, which is a sensible configuration for 1440p gaming, especially for traditional rasterized workloads. The 12GB capacity is still something to keep in mind for buyers who plan to hold onto the card for several years, especially if they want to push ultra textures, ray tracing, and upscaling features in newer games.

The RX 9070 GRE is rated for 220 W total board power and recommends a 650 W power supply. This PowerColor model uses two standard 8-pin PCIe power connectors, which is a straightforward setup for a 220 W card and should work with most existing gaming PSUs. It also avoids any need for 12VHPWR or 12V-2×6 adapters, where cable seating and routing have been bigger concerns on some higher-power GPUs.

AMD PowerColor Red Devil RX 9070 GRE Power connector side view

The updated media engine also supports H.264, HEVC, and AV1 encode and decode, which is useful for streamers, creators, and anyone recording gameplay locally.

AMD Radeon RX 9070 GRE Performance

To test the new AMD Radeon RX 9070 GRE, we utilized our high-performance AMD Threadripper platform, featuring a 64-core CPU and a custom water-cooling loop. This setup ensures the GPU operates at full capacity without CPU bottlenecks. For comparison, we tested the Radeon RX 9070 GRE alongside the AMD Radeon RX 9060 XT, ASUS Prime Radeon RX 9070, ASUS Prime Radeon RX 9070 XT, PNY NVIDIA GeForce RTX 5060 Ti, NVIDIA GeForce RTX 5070 Founders Edition, and ASUS Prime NVIDIA GeForce RTX 5070 Ti. This mix of competing AMD and NVIDIA GPUs provides a useful mix of current upper-midrange and higher-end GPUs for evaluating gaming, AI, content creation, and synthetic benchmark performance.

Below is the complete system configuration.

StorageReview AMD Threadripper Test Platform

  • Motherboard: ASUS Pro WS TRX50-SAGE WIFI
  • CPU: AMD Ryzen Threadripper 7980X 64-Core
  • RAM: 128GB DDR5 4800MT/s
  • Storage: 2TB Samsung 980 Pro
  • OS: Windows 11 Pro for Workstations
  • Driver: AMD Adrenalin 25.3.1

UL Procyon: AI Text Generation

The Procyon AI Text Generation Benchmark simplifies AI LLM performance testing by providing a compact, consistent evaluation method. It allows for repeated testing across multiple LLM models while minimizing the complexity of large model sizes and variable factors. Developed with AI hardware leaders, it optimizes the use of local AI accelerators for more reliable and efficient performance assessments. The results shown below were tested using TensorRT on NVIDIA models and ONNX on AMD models.

The Radeon RX 9070 GRE performed as expected for its class, ahead of the RX 9060 XT but behind the larger RX 9070 and NVIDIA’s current line. It scored 1,579 on Phi, 1,699 on Mistral, and 1,526 on Llama3, giving it a noticeable step up over the RX 9060 XT across those models. The gap to the RX 9070 is still noticeable, with the RX 9070 scoring 1,933 in Phi and 2,040 in Mistral, while the RTX 5060 Ti also stays ahead in most of the text-generation results. The one rough spot is Llama2, where the GRE falls to 1,026 and trails even the RX 9060 XT. Overall, the RX 9070 GRE can handle local AI testing, but this is still a gaming card first.

UL Procyon: AI Text Generation AMD Radeon RX 9060 XT AMD Radeon RX 9070 GRE AMD Radeon RX 9070 AMD Radeon RX 9070 XT NVIDIA GeForce RTX 5060 Ti NVIDIA GeForce RTX 5070 FE ASUS PRIME NVIDIA GeForce RTX 5070 Ti
Phi Overall Score 1,281 1,579 1,933 2,080 2,870 3,453 4,179
Phi Output Time To First Token 1.473 s 1.089 s 0.954 s 0.855 s 0.375 s 0.323 s 0.290 s
Phi Output Tokens Per Second 94.453 tokens/s 105.954 tokens/s 139.187 tokens/s 144.471 tokens/s 120.773 tokens/s 150.435 tokens/s 192.487 tokens/s
Phi Overall Duration 39.365 s 33.473 s
26.989 s 25.587 s 25.216 s 20.302 s 15.771 s
Mistral Overall Score 1,274 1,699 2,040 2,231 2,807 3,562 4,412
Mistral Output Time To First Token 1.827 s 1.200 s 1.109 s 0.946 s 0.526 s 0.433 s 0.374 s
Mistral Output Tokens Per Second 65.115 tokens/s 76.040 tokens/s
101.300 tokens/s 103.348 tokens/s 91.057 tokens/s 120.507 tokens/s 160.167 tokens/s
Mistral Overall Duration 54.516 s 44.303 s 34.960 s 33.350 s 33.377 s 25.496 s 19.480 s
Llama3 Overall Score 1,150 1,526 1,904 2,070 2,599 3,125 4,187
Llama3 Output Time To First Token 1.632 s 1.143 s
0.981 s 0.845 s 0.449 s 0.379 s 0.306 s
Llama3 Output Tokens Per Second 53.167 tokens/s 65.507 tokens/s 87.594 tokens/s 89.102 tokens/s 74.709 tokens/s 100.388 tokens/s 131.583 tokens/s
Llama3 Overall Duration 62.563 s 49.833 s 38.273 s 36.742 s 39.489 s 29.720 s 22.786 s
Llama2 Overall Score 1,252 1,026 2,047 2,298 2,576 3,125 4,284
Llama2 Output Time To First Token 2.992 s 3.290 s
1.926 s 1.565 s 0.844 s 0.785 s 0.560 s
Llama2 Output Tokens Per Second 34.654 tokens/s 25.577 tokens/s 59.673 tokens/s 61.127 tokens/s 41.386 tokens/s 56.647 tokens/s 75.905 tokens/s
Llama2 Overall Duration 99.027 s 146.871 s 59.100 s 55.520 s 71.302 s 53.234 s 39.545 s

UL Procyon: AI Image Generation

The Procyon AI Image Generation Benchmark consistently and accurately measures AI inference performance across various hardware, from low-power NPUs to high-end GPUs. It includes three tests: Stable Diffusion XL (FP16) for high-end GPUs, Stable Diffusion 1.5 (FP16) for moderately powerful GPUs, and Stable Diffusion 1.5 (INT8) for low-power devices. The benchmark uses the optimal inference engine for each system, ensuring fair and comparable results.

The Radeon RX 9070 GRE performs better in Procyon AI Image Generation than it does in the text-generation test, especially compared to the RX 9060 XT. In Stable Diffusion 1.5 FP16, it scored 1,930 and completed the run in 51.812 seconds, a nice jump over the RX 9060 XT’s 1,436 and 69.633 seconds. It still trails the RTX 5060 Ti at 2,110 and the RX 9070 at 2,280, but the difference is fairly small in this test. Stable Diffusion XL FP16 follows the same pattern, with the GRE scoring 1,544 versus 1,124 for the RX 9060 XT, while the RX 9070, RTX 5070 FE, and RTX 5070 Ti move further ahead.

For the Stable Diffusion 1.5 INT8, it scores 18,332 and completes the run in 13.637 seconds, with a generation speed of 1.705 seconds per image. That trails the RTX 5060 Ti at 27,705 and 1.128 seconds per image, while the RTX 5070 FE and RTX 5070 Ti stretch the gap further at 36,320 and 46,744. This is one of NVIDIA’s obvious advantages in this benchmark set.

Stable Diffusion XL FP16 shows the Radeon RX 9070 GRE in a better spot relative to the RX 9060 XT, with a score of 1,544 versus 1,124 and a much shorter overall time of 388.432 seconds compared to 533.736 seconds. The RX 9070 is still faster at 1,805, while the RX 9070 XT reaches 2,010. NVIDIA remains well ahead in this workload, with the RTX 5070 FE at 2,473 and the RTX 5070 Ti at 3,352.

UL Procyon: AI Image Generation (overall score: higher is better) AMD Radeon RX 9060 XT AMD Radeon RX 9070 GRE NVIDIA GeForce RTX 5060 Ti AMD Radeon RX 9070 AMD Radeon RX 9070 XT NVIDIA GeForce RTX 5070 FE ASUS PRIME NVIDIA GeForce RTX 5070 Ti
Stable Diffusion 1.5 (FP16) — Overall Score 1,436 1,930 2,110 2,280 2,598 2,937 3,755
Stable Diffusion 1.5 (FP16) — Overall Time 69.633 s 51.812 s
47.590 s 43.858 s 38.481 s 34.038 s 26.625 s
Stable Diffusion 1.5 (FP16) — Image Generation Speed 4.352 s/image 3.238 s/image
2.974 s/image 2.741 s/image 2.405 s/image 2.127 s/image 1.664 s/image
Stable Diffusion 1.5 (INT8) — Overall Score N/A 18,332 27,705 N/A N/A 36,320 46,744
Stable Diffusion 1.5 (INT8) — Overall Time N/A 13.637 s 9.024 s N/A N/A 6.883 s 5.348 s
Stable Diffusion 1.5 (INT8) — Image Generation Speed N/A 1.705 s/image 1.128 s/image N/A N/A 0.860 s/image 0.669 s/image
Stable Diffusion XL (FP16) — Overall Score 1,124 1,544 1,940 1,805 2,010 2,473 3,352
Stable Diffusion XL (FP16) — Overall Time 533.736 s 388.432 s 326.550 s 332.400 s 298.499 s 242.606 s 178.946 s
Stable Diffusion XL (FP16) — Image Generation Speed 33.359 s/image 24.277 s/image 20.409 s/image 20.775 s/image 18.656 s/image 15.163 s/image 11.184 s/image

Luxmark

Luxmark is a GPU benchmark that uses LuxRender, an open-source ray-tracing renderer, to assess a system’s performance on highly detailed 3D scenes. This benchmark is particularly relevant for evaluating the graphical rendering capabilities of servers and workstations, especially in visual effects and architectural visualization applications, where accurate light simulation is crucial.

Here, the AMD Radeon RX 9070 GRE scored 5,708 in the Food scene and 12,279 in Hall, putting it comfortably ahead of the RX 9060 XT but behind the RTX 5060 Ti and well behind the RX 9070. The RX 9070 posts 8,233 in Food and 16,566 in Hall, while the RTX 5070 FE stretches further ahead at 9,061 and 22,062. For rendering-style workloads, the 9070 GRE shows a decent step up over the lower-tier Radeon option.

Luxmark (higher is better) AMD Radeon RX 9060 XT AMD Radeon RX 9070 GRE NVIDIA GeForce RTX 5060 Ti AMD Radeon RX 9070 AMD Radeon RX 9070 XT NVIDIA GeForce RTX 5070 FE ASUS PRIME NVIDIA GeForce RTX 5070 Ti
Food Score 4,220 5,708 6,590 8,233 8,610 9,061 12,073
Hall Score 8,007 12,279 15,348 16,566 16,758 22,062 28,635

Geekbench 6

Geekbench 6 is a cross-platform benchmark that measures overall system performance. The Geekbench Browser allows you to compare any system to it.

The Radeon RX 9070 GRE scored 136,742, which puts it very close to the RX 9070’s 138,463 and well ahead of the RX 9060 XT’s 102,750. That is one of the GRE’s better showings, especially given its lower placement in the lineup. The RTX 5060 Ti still comes in higher at 150,743, while the RTX 5070 FE and RX 9070 XT move further ahead at 173,255 and 188,892. Still, for a card positioned below the RX 9070, coming this close in OpenCL is a good result.

Geekbench (higher is better) AMD Radeon RX 9060 XT AMD Radeon RX 9070 GRE AMD Radeon RX 9070 NVIDIA GeForce RTX 5060 Ti NVIDIA GeForce RTX 5070 FE AMD Radeon RX 9070 XT ASUS PRIME NVIDIA GeForce RTX 5070 Ti
GPU OpenCL Score 102,750 136,742 138,463 150,743 173,255 188,892 246,875

3D Mark

3DMark Port Royal, Speed Way, and Steel Nomad are GPU benchmarks that test performance in different scenarios. Port Royal focuses on ray tracing, Speed Way evaluates performance in racing simulations, and Steel Nomad challenges GPUs with high-intensity, realistic graphics. They assess GPU capabilities in rendering, lighting, and dynamic scenes.

The RX 9070 GRE performed well here, particularly when compared to the RTX 5060 Ti. In Port Royal, it scored 13,066, ahead of the RTX 5060 Ti’s 10,432, though behind the RTX 5070 FE at 14,026 and the RX 9070 at 15,760. Speed Way is even tighter, with the GRE scoring 4,272, just ahead of the RTX 5060 Ti at 4,184, but still a clear step below the RTX 5070 FE and RX 9070. Steel Nomad is another solid result, with the GRE hitting 5,085 in DX12 and 5,220 in Vulkan, beating the RTX 5060 Ti and landing slightly ahead of the RTX 5070 FE’s 5,019.

3D Mark (higher is better) AMD Radeon RX 9060 XT NVIDIA GeForce RTX 5060 Ti AMD Radeon RX 9070 GRE NVIDIA GeForce RTX 5070 FE AMD Radeon RX 9070 AMD Radeon RX 9070 XT ASUS PRIME NVIDIA GeForce RTX 5070 Ti
Port Royal 9,751 10,432 13,066 14,026 15,760 17,989 19,290
Speed Way 3,004 4,184 4,272 5,869 5,791 6,237 7,709
Steel Nomad 3,767 3,611 5,085 (DX12) / 5,220 (Vulkan) 5,019 5,992 6,977 6,458

Power Consumption: PowerColor Radeon RX 9070 GRE

Power consumption is a significant component of any computing platform, whether high- or low-end. Higher-performance GPUs can place greater demands on the power supply and cooling setup, especially under sustained load. However, there is another aspect of power regarding performance: faster GPUs might reach higher peak performance, but the duration of each workload decreases.

During our testing, the PowerColor Radeon RX 9070 GRE demonstrated a strong balance between performance and energy usage. The test system measured 133.4W at idle and peaked at 785.3W under load while running the UL Procyon AI Image Generation benchmark. This represents a maximum system increase of roughly 652W during the workload.

The benchmark completed in 24.5 seconds, with the system consuming 3.84Wh over the duration of the run. While the 9070 GRE draws considerably more power than lower-tier  Nvidia GPUs at peak load, its faster completion time helps keep total energy consumption relatively competitive. This places it between the Radeon RX 9060 XT and higher-performing enthusiast-class GPUs, offering a reasonable tradeoff between performance and power efficiency.

Power Testing Summary AMD Radeon RX 9060 XT AMD Radeon RX 9070 GRE PNY NVIDIA GeForce RTX 5060 Ti NVIDIA GeForce RTX 5070 FE AMD Radeon RX 9070 XT ASUS Prime NVIDIA GeForce RTX 5070 Ti
Power Consumed 4.00 Wh 3.84 Wh 2.13 Wh 2.46 Wh 3.41 Wh 1.66 Wh
Test Duration 33.0 s 24.5 s 20.2 s 19.2 s 17.4 s 11.1 s

Conclusion

The Radeon RX 9070 GRE does a good job of filling the space between AMD’s mainstream and higher-end RDNA 4 cards. It’s not as powerful as the RX 9070 or RX 9070 XT, but it offers buyers a stronger 1440p option than the RX 9060 XT while keeping the price below that of the more expensive cards in AMD’s line. With 48 compute units, 12GB of GDDR6, a 192-bit bus, and 432 GB/s of bandwidth, the card has enough juice for high-quality 1440p gaming, and is especially useful for users upgrading from older 1080p or early 1440p-focused GPUs.

AMD PowerColor Red Devil RX 9070 GRE rear backplate view

Our review model, manufactured by PowerColor, features a triple-fan cooler, a full-length backplate, two 8-pin PCIe power connectors, and a four-display output layout. It is a full-size card, so case fit still needs to be checked, but the design is simple. It also comes with DisplayPort 2.1a, HDMI 2.1b, AV1 encode/decode support, and the updated media engine.

In 3DMark, it beats the RTX 5060 Ti in Port Royal, Speed Way, and Steel Nomad, while landing closer to the RTX 5070 FE in some areas. Geekbench OpenCL also posted strong results, with the GRE scoring 136,742, very close to the RX 9070’s 138,463. AI and rendering results are more mixed. The GRE improves over the RX 9060 XT in Procyon image generation and Luxmark. However, NVIDIA still has an advantage in several AI-focused tests, especially INT8 image generation and text-generation workloads.

Overall, the Radeon RX 9070 GRE is best viewed as a 1440p gaming card first, with some creator and AI features adding a bit more value. The 12GB of VRAM is worth keeping in mind for long-term buyers, especially as newer games keep pushing texture quality and ray tracing demands higher. The synthetic graphics results are the card’s strongest argument, and on that basis, it is a capable 1440p part. The harder question is price. At $549, it asks the same price the RX 9070 launched at, and with the RX 9070 now listed at $619, the two sit close enough that the GRE only makes clear sense if it picks up a street discount or the RX 9070 stays scarce. For gamers who want a noticeable 1440p upgrade without moving to the RX 9070 XT or RTX 5070 Ti tier, the GRE is worth a look, but we would shop the price against the RX 9070 before committing.

Product Page – RX 9070 GRE

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NVIDIA Computex 2026 Keynote: The RTX Spark PC Family, DGX Station, and Physical AI

1 June 2026 at 19:08

Computex 2026 has kicked off in Taipei, and as usual, NVIDIA set the tone with a Jensen Huang keynote that ran the length of the company’s roadmap. A good chunk of it was the datacenter GPU goodness we had already seen, with Vera Rubin now in full production and the by-now-familiar messaging about agents reshaping every layer of computing. We will not rehash all of that here.


The genuinely new material, and the reason this keynote mattered for anyone who lives on the client side, was the PC. NVIDIA and Microsoft used Computex to announce a reinvention of the Windows machine, doing so across an entire product family rather than a single device. Before we get to that, though, one piece of the data center story is worth a closer look.

A Closer Look at the LPX Rack

One data center item did catch our eye. The LPX rack has changed. The systems appear to have moved from 1 OU to 2 OU, and the four Groq C2C links also look physically different from our earlier LPX coverage. NVIDIA gave us an even closer look at the rack this time. Beyond those two changes, nothing else stood out as obviously different on the outside, which leaves us very curious about what that second layer actually houses.

A Three-Tier PC Family

NVIDIA announced a family of client machines: a laptop, a desktop, and a workstation, all built on the same Spark and Blackwell foundation, and also aimed at supporting Windows. Jensen framed it as the first completely re-engineered line of PCs in 40 years. Whether or not you buy the framing, the structure is worth understanding, because each tier targets a very different buyer. We will take them in order.

The RTX Spark Laptops

At the center of the laptops is the RTX Spark superchip, which NVIDIA showed on stage under the codename N1X and built in partnership with MediaTek. It is a 70-billion-transistor part on a TSMC 3nm process that fuses two chiplets into one SoC. The GPU side is a large Blackwell design with 6,144 CUDA cores and fifth-generation Tensor Cores with FP4 precision, rated at 1 petaflop of FP4 AI performance. That connects over NVLink-C2C at 600GB/s (NVIDIA’s figure is roughly 5x PCIe Gen 5, with much lower power) to a 20-core Grace CPU. Memory tops out at 128GB of unified memory at 300GB/s of bandwidth.

If that reads like a DGX Spark spec sheet, that is because it nearly is. NVIDIA said as much during the press Q&A, calling the full-spec chip “based on the same system” as DGX Spark but optimized for a different platform in both hardware and software. The framing is that DGX Spark is built for Linux and AI developers, while RTX Spark is a Windows-first product that layers the RTX gaming and creation stack on top of the same silicon. NVIDIA describes performance as “in the same class as an RTX 5070 laptop GPU,” with the heavy caveat that the comparison varies by workload, since an SoC with unified memory behaves very differently from a discrete GPU over PCIe.This is where our DGX Spark experience makes us most curious, and where we expect this launch to differ from the last one. In our DGX Spark testing, one of the most consistent findings was how close the various OEM designs landed to one another. Some implementations were better engineered than others, but because every unit was built on essentially the same NVIDIA reference platform with the same power and thermal envelope, real-world performance clustered tightly.

We do not expect that to hold here. RTX Spark is going into laptops, some as slim as 14mm and as light as 3 pounds. NVIDIA confirmed these chips will run anywhere from single-digit watts up to roughly 80W at the top end for the largest configurations, with each OEM free to pick its own cooling approach, from vapor chambers to advanced heat pipes. In a chassis that thin, the chip is almost certainly going to be power-limited, which in turn makes it thermally and frequency-limited. That is not a knock. It is physics. But it means the OEM that builds the better thermal solution, gives the chip a higher sustained power budget, and tunes its fan curves well, could open a real, sustained performance gap over a thinner, quieter competitor running identical silicon. Two laptops with the same chip and the same memory could deliver noticeably different sustained throughput, and figuring out which OEM actually lets the chip stretch its legs is exactly the kind of testing we live for.RTX Spark also spans a whole family of chips. NVIDIA made it clear that there will be multiple SKUs, with the full-spec part (20 CPU cores, up to 128GB) at the top. Across the broader family, memory will range from 16GB to 128GB, and NVIDIA expects over 30 laptops and well over 10 desktops in the initial wave alone, from every major OEM, including named designs such as the Dell XPS 16 Creator Edition, HP OmniBook, and Microsoft’s Surface Laptop Ultra.

Two hardware details have us optimistic. The first is networking, or rather, the lack of it. DGX Spark shipped with NVIDIA’s ConnectX-7 networking and 200GbE connectivity baked in, which was great for a developer cluster box but consumed board space, power, and cost. NVIDIA confirmed RTX Spark laptops will not carry the CX7 package. For a consumer Windows laptop, that is the right call, and with that board space and power budget freed up, we want to see much better storage shipping in these units. DGX Spark’s storage was serviceable, but never the star of the show, and a consumer notebook with no networking silicon to feed has every reason to ship faster and larger NVMe. The second is I/O. Because every DGX Spark used the same reference board, every unit shipped with the same ports. After the uniformity of DGX Spark, real per-OEM I/O variety would be welcome.

Battery life is the last laptop question, and the one our benchmarks are built for. NVIDIA promised all-day battery for productivity and browsing, while being honest that gaming or full-tilt AI will drain any laptop in 45 minutes to an hour. What we cannot wait to quantify is battery life while doing actual AI work. An agent that runs even when the user is not is a nice pitch, but local inference on battery is a real draw, and the gap between all-day email and all-day running a 120B model could be enormous. We have a full suite of custom personal AI computing benchmarks ready for exactly this kind of platform, and we plan to measure the real productivity uplift rather than taking the marketing figures at face value.

The RTX Spark Desktop

NVIDIA confirmed small-form-factor RTX Spark desktops are coming this fall alongside the laptops, and showed one from MSI on stage. Honestly, at first glance, it looks like a DGX Spark, and that is about all we know about it. The industrial design appears different from that of the DGX Spark unit we reviewed, but beyond that, NVIDIA shared very little.


Our questions are the obvious ones, and they will have to wait until we get hardware on the bench. How does the desktop’s sustained performance compare to both the laptops and to DGX Spark, given that it should have far more thermal headroom than a 14mm notebook? And does the desktop keep the 200G networking that defined DGX Spark, or does it drop the CX7 package, like the laptops, to hit a cheaper consumer price point?

DGX Station

The third tier is the big one, and it is a machine we already know. NVIDIA has publicly shown the DGX Station before, and we recently had the privilege of getting hands-on with one. We are not going to go into much detail here, since the headline specs have been public for a while, and we will have much more to say in our review coming soon.


The short version: DGX Station for Windows is built on the GB300 Grace Blackwell Ultra Desktop Superchip, pairing a Blackwell Ultra GPU with a 72-core Grace CPU. It has up to 748GB of coherent memory and up to 20 petaflops of FP4, enough to run trillion-parameter models locally and, in NVIDIA’s words, hundreds of agents at once. Unlike the consumer Spark machines, this one includes fast networking with a ConnectX-8 SuperNIC capable of up to 800Gb/s, plus an optional RTX PRO 6000 Blackwell workstation GPU.

The big asterisk: can Microsoft pull this off?

Let us be clear about where we stand. DGX Spark was a major success for NVIDIA, and we are very optimistic about this whole family. The hardware song hits the right notes, the efficiency is there, and NVIDIA has already proven the silicon. We are skeptical about Microsoft’s ability to support these devices.

Microsoft has been in the headlines for the wrong reasons lately, with growing user dissatisfaction over the direction of Windows. Some users have taken to calling it “Microslop.” The complaints are familiar: the aggressive push of Copilot into every corner of the OS, the vertical integration of AI across the stack, and long-running practices like effectively forcing OneDrive on people. On top of that, Windows on Arm is not a platform anyone would call mature. NVIDIA is betting heavily that this time is different, citing years of joint work on the Prism emulator and work with all the major anti-cheat vendors. The company’s answer to “Why will Windows on Arm succeed now?” is basically, “because everyone is finally throwing their full weight behind it.” That may well be true. It is also more or less what we heard the last time.

I am personally rooting for Microsoft to deliver, because the upside is real. RTX Spark is a capable gaming machine, roughly RTX 5070-class. If the emulation and driver story holds together, it could end up being the cheaper and more efficient alternative to gaming on NVIDIA’s own discrete-GPU notebooks. There is also a Linux angle we cannot ignore. The silicon is the silicon, so RTX Spark should inherit the same strong Linux support that made DGX Spark such a capable little machine, and we are very curious whether the gaming and graphics work going into the Windows stack also shows up as gaming gains on Linux. If Microsoft fumbles a platform this good, that Linux pedigree means this might be the launch that finally kicks off the year of the Linux desktop for the masses.

The bigger surprise for us was NVIDIA’s choice to put Windows on the DGX Station at all. When the product was first announced in 2025, many of our friends at other publications and we thought it was a genius move. Software support has historically lagged new hardware, often by years, before the kernel and tooling mature enough to take real advantage of what the silicon can do. A DGX Station was the machine that top AI labs, researchers, and organizations could buy to start developing on the newest architecture, well before the datacenters were spun up around it. The problem is that the product is a year late to that party. And while we genuinely enjoyed our time with the system, pre-production quirks aside (a couple of those gave me night terrors), we cannot quite justify putting Windows on a machine this clearly built for hardcore AI. The B300 has no RT cores, so many of NVIDIA’s own workstation workloads would rely on the optional RTX PRO discrete card, leaving the B300 for AI tasks alone. We are very curious how Windows support on the DGX Station actually holds up, and frankly, skeptical that Microsoft can deliver a good experience here and make real use of the B300 and the 800G ConnectX-8 networking on a single host.

A New Product Family, Every Generation

The detail from the keynote that stuck with us most was not a spec.

Jensen presented this PC lineup as a permanent product family, promising a desktop, laptop, and workstation for every future architecture generation, with what he claims is 100% of the PC industry on board.

Just as a side note, we did finally see the smaller size 400 TFlop N1 Grace Blackwell Spark Superchip mentioned here. It will be interesting to see what type of devices end up featuring this chip.

Beyond the PC: Physical AI

The back half of the keynote pivoted hard into physical AI. It is a different world from the client hardware above, but it rounds out the Computex picture. NVIDIA also used the show to open-source a large collection of physical AI agent tools and skills, posted at github.com/NVIDIA/skills, including synthetic-data skills like Neural Reconstruction, Video Augmentation, and Defect Image Generation that manufacturing partners, including TSMC, Foxconn, and SK hynix, are already running on factory lines. The headline platforms are below.

Isaac GR00T Reference Humanoid Robot


NVIDIA released an open reference design for a humanoid robot, built on a Unitree H2 Plus chassis that is nearly six feet tall and weighs 150 pounds, with 75 degrees of freedom in total, thanks to dual Sharpa Wave tactile five-finger hands. The actuators are serious, with up to 120 Newton-meters of arm torque, up to 360 at the legs, and a rated 7kg payload that peaks at 15kg. For sensing, it carries a head-mounted stereo camera with a 140-degree horizontal field of view, wrist cameras for manipulation, an inertial measurement unit, and the usual Wi-Fi 6 and Bluetooth 5.2 connectivity. The brain is NVIDIA’s Jetson AGX Thor T5000, with a Blackwell GPU rated at 2,070 FP4 teraflops, a 14-core Arm CPU, and 128GB of unified memory, drawing a configurable 40 to 130 watts and running on a roughly 1kWh battery good for about three hours. The whole stack, from Isaac Teleop for data capture through Isaac Sim and Isaac Lab to the GR00T foundation models and Isaac ROS middleware for deployment, is open, and researchers keep control of their own data. Stanford, ETH Zurich, UC San Diego, and Ai2 are among the early adopters, with hardware available from Unitree in late 2026 and a Unitree G1 reference workflow due on GitHub and Hugging Face soon. Jensen pitched the stakes in characteristically large terms, calling humanoid robots a “multitrillion-dollar economic opportunity.”

Cosmos 3


Cosmos 3 is NVIDIA’s open frontier foundation model for physical AI. This mixture-of-transformers omnimodel handles text, images, video, ambient sound, and actions in one stack, trained on billions of multimodal samples. It plays three roles: a vision-language model for multimodal reasoning, a world model for simulating physical environments, and a backbone for the world-action models that train robots on specific tasks. It comes as Cosmos 3 Super for high-accuracy robotics and AV post-training, Cosmos 3 Nano for fast video and action reasoning, and Cosmos 3 Edge for real-time inference coming soon. NVIDIA says it leads the open-model field on a long list of benchmarks, including Physics-IQ and R-Bench for world generation, RoboLab and RoboArena for action policy, and VANTAGE-Bench for vision understanding, and that it can cut physical AI training and evaluation cycles from months to days. It is available on Hugging Face, GitHub, and build.nvidia.com as NIM microservices, with a coalition around it that includes Agile Robots, Black Forest Labs, Runway, and Skild AI, and adopters such as Samsung, LG Electronics, Li Auto, and Doosan Robotics.

Alpamayo 2 Super

For autonomous driving, NVIDIA introduced Alpamayo 2 Super. It’s an open 32-billion-parameter reasoning vision-language-action model built on the Cosmos world foundation models, that reasons, plans, and acts across the full driving stack for Level 4 development. It scales up from the prior 10-billion-parameter versions and expands to full 360-degree surround perception. It also produces both macro driving decisions and chain-of-causation traces that explain them, and its reasoning auto-labeling can compress annotation cycles from months to days. NVIDIA positions it as a teacher model that distills into smaller networks for in-vehicle deployment on DRIVE AGX Thor, and pairs it with supporting tools in AlpaGym for closed-loop reinforcement learning, OmniDreams for generative scenario creation, and Neural Reconstruction built on Omniverse NuRec for turning fleet data into 3D scenes. Earlier versions of Alpamayo were downloaded close to 400,000 times. The new model won a COMPUTEX Best Choice award and is expected to be available on GitHub and Hugging Face this summer.

DRIVE Hyperion

If Alpamayo is the brain, DRIVE Hyperion is the car it runs in. We covered Hyperion previously, so we will not relitigate the platform here, other than to note that it is NVIDIA’s Level-4-ready reference built on the Halos safety system and DriveOS, with DRIVE AGX compute. The more interesting story this time is who is lining up behind it. Uber is integrating several Hyperion-powered fleets, including a Munich robotaxi program launching later this year. Foxconn and Foxtron are targeting a 2028 robotaxi launch in Taiwan, starting in Kaohsiung and expanding across Asia. VinFast is bringing Level 4 vehicles to Southeast Asia, Autobrains is working with both VinFast and Uber, and HUMAIN is taking it to Saudi Arabia. That partner roster, more than any single spec, is what makes Hyperion worth watching.

Closing Thoughts

NVIDIA has the silicon and is now pushing it everywhere, from a 14mm laptop to a deskside GB300 to a humanoid’s chest, and that part we believe. What a spec sheet cannot tell us is whether Microsoft can make Windows on Arm worth the hardware cost, whether OEMs let the Spark chip stretch its legs or choke it in a too-thin chassis, and whether the petaflop and battery claims hold up once we can measure them. We are optimistic about the hardware and skeptical of the software (Microsoft, not Linux), and we will hold both positions until the machines reach the lab. When they do, the benchmarks will be ready.

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Silicon Motion Introduces SM2524XT PCIe Gen5 DRAM-less SSD Controller

29 May 2026 at 18:34
SM2524XT power efficiency SM2524XT power efficiency

Silicon Motion has introduced the SM2524XT, a PCIe Gen5 DRAM-less SSD controller targeting AI PCs, edge AI systems, and workloads centered on local AI inference. The controller is engineered to meet the storage demands of KV cache-intensive workloads, where sustained random I/O performance and low-latency access are increasingly critical for continuous inference.SM2524XT front

Silicon Motion says that the SM2524XT can deliver sequential read speeds of up to 14GB/s, sequential write speeds of up to 12GB/s, and random performance reaching up to 2.5 million IOPS. The controller was built to maintain stable throughput under fragmented, latency-sensitive access patterns commonly associated with AI inference workloads.

Specification Silicon Motion SM2524XT
Overview
Product Type PCIe Gen5 DRAM-less SSD controller
Target Workloads AI PCs, edge AI, AI inference, and KV Cache-intensive workloads
Primary Focus Sustained random I/O performance and low-latency AI inference workloads
Interface and Architecture
PCIe Interface PCIe Gen5 x4
NVMe Support NVMe 2.1
CPU Architecture Quad-core Arm Cortex-R8
NAND Channels 4 NAND channels
NAND Interface Speed Up to 4,800 MT/s
Performance and Power
Sequential Read Speed Up to 14 GB/s
Sequential Write Speed Up to 12 GB/s
Random Performance Up to 2.5 million IOPS
Power Consumption Below 5W SSD power
Performance-Per-Watt Improvement Up to 25% over the previous generation
Process and Technologies
Manufacturing Process TSMC 6nm
Key Technologies SCA (Separated Command Address), advanced FTL scheduling, NANDXtend LDPC ECC
Error Correction 4KB LDPC ECC capability with NANDXtend technology
Voltage Optimization PI-LTT low-voltage NAND I/O optimization

 

KV Cache Workloads Drive Higher Storage Demands

AI inference workloads exhibit different storage behavior than that of more traditional consumer SSDs. Instead of relying mainly on burst-oriented sequential transfers, KV Cache operations create continuous streams of fragmented random reads and writes that depend heavily on sustained IOPS throughput and low-latency access.

Silicon Motion describes KV Cache as one of the growing storage bottlenecks in AI PCs, particularly as larger local language models and AI agents move more context data from memory into local NVMe SSD storage. The SM2524XT was designed to maintain consistent random I/O performance during sustained inference sessions where storage responsiveness becomes critical.

PCIe Gen5 Interface And Four-Core Architecture

The SM2524XT uses a PCIe Gen5 x4 interface with NVMe 2.1 support and includes a quad-core Arm Cortex-R8 processor architecture. The controller supports four NAND channels with interface speeds up to 4,800MT/s and is manufactured using TSMC’s 6nm process technology.

The architecture also incorporates Silicon Motion’s Separated Command Address technology, or SCA, which separates command and address handling to improve NAND access efficiency. This design should help improve the efficiency of parallel data processing and reduce latency interruptions during sustained AI workloads.

Additional technologies integrated into the controller include advanced FTL scheduling and NANDXtend LDPC ECC error correction. Silicon Motion says these features will maintain more consistent performance and improve reliability during continuous inference.

Power Efficiency

Power efficiency is also important in the overall SM2524XT design, as Silicon Motion states that the controller delivers up to 25% higher performance-per-watt than the previous generation while keeping SSD power consumption below 5W.

SM2524XT power efficiency

The controller combines the 6nm manufacturing process with Silicon Motion’s PI-LTT voltage optimization technology, which lowers NAND I/O voltage to reduce power usage during sustained workloads. Silicon Motion also compares the SM2524XT against the earlier SM2504XT controller and reports higher sequential read throughput at similar active power levels.

Positioned Around Edge AI And Local Inference

Silicon Motion says the SM2524XT targets AI PCs and edge AI systems, where inference workloads increasingly run locally rather than relying entirely on cloud infrastructure. Workloads tied to enterprise AI agents, robotics, manufacturing systems, science applications, and AI coding environments are also relevant use cases for the SM2524XT.

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KIOXIA Announces XG10 Series PCIe 5.0 Client SSDs for OEM PCs

21 May 2026 at 20:27
KIOXIA XB10 SSD KIOXIA XB10 SSD

KIOXIA America has introduced the XG10 Series, a new client NVMe SSD family aimed at performance-class OEM notebooks, desktops, and workstations. As the successor to the XG8 Series, the XG10 moves to a PCIe 5.0 x4 interface and NVMe 2.0d, giving KIOXIA a Gen5 client drive designed for heavier local workloads such as AI-assisted applications, content creation, and high-end gaming.

The headline change is the jump to PCIe Gen5 bandwidth. In a four-lane client configuration, PCIe 5.0 roughly doubles the available host interface bandwidth over PCIe 4.0, which helps explain the step up in both sequential and random performance. KIOXIA rates the XG10 at up to 14,000 MB/s read and 12,000 MB/s write, with random performance up to 2,000K IOPS read and 1,600K IOPS write. Compared with the prior XG8 generation, the company says the new drive delivers up to 2x faster sequential reads, more than 2x faster sequential writes, roughly 122% higher random reads, and about 158% higher random writes.

KIOXIA XB10 SSD

That performance profile puts the XG10 squarely in the upper tier of client storage, especially for systems expected to process large data sets locally. For workstation-class laptops and AI PCs, higher sequential throughput can help with moving large project files, model assets, and media libraries. At the same time, stronger random performance is more relevant to application responsiveness, asset loading, and scratch-disk behavior. In gaming systems, the gains are more likely to show up in load times, patch installs, and background asset streaming than directly in frame rates.

Comparison to KIOXIA’s Recently Launched Client SSDs

EG7 BG8 XG10
Swimlane/Target Value Mainstream Performance
Form Factors M.2 Type 2230, 2242, 2280 2230, 2242, 2280 2280
Flash Memory Type BiCS FLASH gen. 8 QLC BiCS FLASH gen. 8 TLC BiCS FLASH gen. 8 TLC
(512GB and 1024GB use BiCS FLASH gen. 6 TLC)
NAND Package 1pkg NAND Flash Placement 1pkg NAND Flash Placement 2pkg NAND Flash Placement
Interface PCIe®Gen4 x4, NVMe 2.0d PCIe Gen5 x4, NVMe 2.0d PCIe Gen5 x4, NVMe 2.0d
SoC 4ch SoC design without DRAM (HMB) 4ch SoC design without DRAM (HMB) 8ch SoC design with DRAM
Capacities 512 GB, 1024 GB, 2048 GB 512 GB, 1024 GB, 2048 GB 512 GB, 1024 GB, 2048 GB, 4096 GB
Max Seq. Read 7,000 MB/s 10,300 MB/s 14,000 MB/s
Max Seq. Write 6,200 MB/s 10,000 MB/s 12,000 MB/s
Max Random Read 1,000 KIOPS 1,435 KIOPS 2,000 KIOPS
Max Random Write 1,000 KIOPS 1,300 KIOPS 1,600 KIOPS
Active Power 4.5 W 5 W 10 W
Endurance (1024GB) 600 TBW 1,200 TBW 1,200 TBW

 

The XG10 Series will ship in the standard M.2 2280 form factor with capacities of 512GB, 1TB, 2TB, and 4TB. KIOXIA is also including support for self-encrypting drive functionality based on TCG Opal 2.02, a feature that remains relevant for OEMs building commercial client systems that require hardware-based data-at-rest protection and policy-based fleet management. That makes the XG10 a better fit not just for enthusiast-class hardware, but also for business notebooks and mobile workstations where security and manageability matter.

KIOXIA is positioning the XG10 for high-performance PCs, including AI PCs, workstations, and gaming platforms. That aligns with where Gen5 client SSDs are most practical today. While PCIe 5.0 brings clear bandwidth advantages, sustained performance in client systems still depends heavily on platform thermals, power delivery, and OEM tuning, particularly in thinner notebook designs. In larger mobile workstations and desktops, those constraints are typically easier to manage.

In its announcement, KIOXIA said PCIe 5.0 is a meaningful step forward for client storage and framed the XG10 as a response to increasingly demanding workloads across creator, gaming, and professional systems. The company is currently sampling the new SSDs to select PC OEM customers, with end-system shipments expected to begin in the second quarter of 2026.

 

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NerdioCon 2026: Manager 8.0 Brings AVD Hybrid to Nutanix, Adds Global Pools

18 May 2026 at 13:24

Last week, we had the opportunity to attend NerdioCon, held May 4–6, 2026, at the La Quinta Resort & Club in Palm Springs. The conference focused on Nerdio’s products and other cloud technologies, specifically Microsoft Azure, Azure Virtual Desktop (AVD), and Intune. It had keynotes, technical labs, and networking for IT leaders and MSPs. The opening day focused on Managed Service Providers (MSPs), so we attended the conference on days two and three.

General Conference Morning Session

The general conference kicked off on Tuesday, May 5th, with keynote speeches. Joseph Land, Nerdio president and co-founder, welcomed participants to the fifth annual conference. Following the opening remarks, Land introduced Rachel Bondi, Corporate Vice President, Small and Medium Enterprises and Channel at Microsoft Asia.

Bondi began by describing a “Frontier Firm” as a cutting-edge organization that redesigns its operating model to be “human-led and agent-operated,” by putting AI at the core of its strategy to boost productivity, innovation, and agility.

She said these companies go beyond simple AI adoption by deploying AI agents to handle, automate, and optimize business processes across various functions. She then outlined the path to becoming a frontier firm by integrating artificial intelligence. Bondi detailed a strategic framework for success built on enriching employee experiences, automating business processes, and leveraging a unified data strategy to drive innovation with AI.

She delivered real-world examples, which were appreciated, that included SoftBank and Chow Tai Fook. She underscored that true transformation requires leadership-led change management and a commitment to responsible AI governance. She concluded her presentation by celebrating the synergy between Microsoft and Nerdio and positioning their partnership as a vital catalyst for helping businesses navigate the emerging AI landscape securely and efficiently.

Tami Pesic, Head of Strategic Partnerships at Huntress, and Rob Rae, Corporate Vice President of Community for PAX8, joined Bondi on stage for a roundtable discussion.

The ensuing discussion centered on the inevitable shift toward artificial intelligence and its impact on managed service providers. They highlighted the current gap between rapid AI adoption and lagging data governance, and urged businesses to prioritize security as they explore new AI technologies. The speakers emphasized that success requires a cultural mindset shift, encouraging leaders to empower corporate “tinkerers” within their teams and move past historical resistance to change. Ultimately, their dialogue served as a call to action for companies to become “customer zero” by using and testing AI internally so they can guide their clients through the significant economic and operational transition that the AI era will require.

Vadim Vladimirskiy, CEO and co-founder of Nerdio, joined Joseph Lands, Scott Manchester, Chief Product & Technology Officer at Nerdio, and Christiaan Brinkhoff, Senior Director, Product Management at Nerdio, on stage to discuss The Great Cloud Migration.

It was interesting to see these Nerdio leaders on stage addressing the IT audience and discussing the “great migration” from legacy virtual desktop infrastructure to modern Windows cloud solutions. They framed the current landscape as a “generational disruption” where organizations must navigate rising costs and complexity by adopting more flexible, cloud-native tools.

Key technical announcements during the keynotes included the launch of Nerdio Manager for Enterprise 8.0, featuring Intune Policy Studio for streamlined endpoint management and Global Pools to overcome Azure regional capacity limits.

Nerdio Manager for Enterprise 8.0 represents a significant shift toward hybrid cloud management and DevOps integration. The feature we found most interesting was the public preview of Azure Virtual Desktop (AVD) Hybrid on Nutanix Cloud Platform (NCP). This feature extends the control plane to manage on-premises hyperconverged infrastructure. Organizations can orchestrate desktop delivery across local Nutanix AHV and Azure cloud environments from a single interface, enabling a more flexible, “at your own pace” migration strategy. Additionally, the introduction of Global Pools enables admins to deliver desktops across multiple Azure regions and subscriptions from a single, unified pool, effectively addressing capacity constraints and high-availability challenges for global deployments.

The update emphasizes modern automation and AI-driven operations. It has an advanced Terraform-based installer, allowing IT teams to treat their EUC environment as code and align deployment with existing infrastructure-as-code (IaC) workflows. For endpoint management, the Intune Policy Studio provides a centralized hub for creating, versioning, and rolling back Intune policies, with full change-history auditing. Finally, the reintroduction of Nerdio Copilot brings AI-powered assistance directly into the console to help with troubleshooting and should simplify administrative tasks.

The group also introduced Nerdio Compass as a strategic management and optimization platform for Managed Service Providers, designed to streamline the delivery and profitability of Microsoft Cloud services, particularly Azure and Windows 365. It is an extension of the Nerdio Manager that focuses on “the business of the cloud,” providing visibility into margins and automated cost-modeling tools. By simplifying the complexities of Azure pricing and configuration, Compass enables MSPs to move away from manual tracking costs toward a scalable, data-driven approach to managing client environments.

After the keynotes, we attended some sessions and spoke with vendors on the showroom floor, including 10ZiG, Numecent, Recast, and Omnissa.

The sessions we attended were well done, and we especially enjoyed our chats with vendors. We hope to follow up with them for future articles.

First Day, Afternoon Session

The afternoon keynote session featured talks by Tristan Scott, Microsoft’s Partner Group Product Manager for Windows Cloud, Tarkan Maner, President and Chief Commercial Officer at Nutanix, and Scott Manchester.

Tristan took the stage and focused on the evolution of the EUC world and how Windows has transitioned from a physical tether to a persistent, cloud-delivered service. He stated that, with over 1 billion Windows 11 users, the operating system is no longer where we work; it is also where AI works. Based on the latest strategic shifts from Microsoft, Nutanix, and Nerdio, the “beige box” is officially dead. In its place is an agentic, elastic, and cloud-smart future.

He went on to state that the most critical hurdle for IT leaders is understanding that Windows 365 isn’t just another line item in a software subscription. It isn’t an app like Word or Teams; it’s a fundamental re-architecture of the personal computer. By hosting a full, persistent Windows PC in Azure and streaming it to any device, from an iPad to the newly announced Windows 365 Link (a purpose-built, secure thin client), Microsoft is effectively moving the “unit of work” to the cloud.

Tristan Scott drove this home by stating, “Windows 365 is not an app… It is a full Windows PC. All of your apps, files, and settings hosted in Azure are streamed down to your device.”

For the strategist, this move from “managing infrastructure” to “managing endpoints” is underpinned by three pillars:

  • Security: With no local data, there is zero local risk. Even if the hardware is lost, the data remains protected by a cloud firewall.
  • Elasticity: Organizations are no longer locked into hardware specs for three-year cycles. vCPUs, RAM, and GPU power can be scaled instantly as needs change.
  • Simplicity: With Intune integration, Cloud PCs are managed just like physical laptops, eliminating the legacy complexity of traditional VDI.

Of course, AI is changing everything, and we are entering the age of “Windows 365 for Agents.” He feels that the Cloud PC provides the ultimate “UI Bridge.” As Microsoft is now deploying autonomous agents that don’t just process data, they can “read” the screen, click buttons, and type just like a human.

Next on stage was Tarkan Maner, President and CCO of Nutanix.

We hadn’t heard Tarkan speak before and found him to be a forceful and engaging speaker. He discussed the “Great Migration”, a period of unprecedented volatility in the hypervisor market, sparked largely by the Broadcom acquisition of VMware. Tarkan estimated that approximately 200 million vCPUs (or cores) are currently “up for grabs” as enterprises reassess their vendor loyalties.

A broken supply chain exacerbates this, he said, noting that lead times for physical servers are now stretching to 360 days or more. The old “Cloud First” mantra has matured into “Cloud Smart.”

Enterprises are now demanding hybrid flexibility. Solutions like Azure Virtual Desktop (AVD) Hybrid via Azure Arc are said to serve as the essential “stepping stone” for regulated industries. This architecture allows companies to keep session hosts on-premises, behind a firewall, for data gravity reasons, while still leveraging the Azure management plane. It provides the cloud’s elasticity without forcing an overnight total migration.

Tarkan got philosophical when he stated that “Simple is hard. Making things simple is very hard. People assume simple is simple. Simple is not simple. Simple is not easy.”

The goal of modern IT isn’t just “feeds and speeds”; it is delivering specific business outcomes. A simple doctor interface requires a sophisticated, orchestrated backend that hides the complexity of GPUs and security protocols. If technology gets in the way of the patient’s care, the infrastructure has failed.

Second Day Morning Session

After a cocktail reception the night before, we were primed for the second-day keynotes.

The first keynote featured Lior Bela, Business Director, Microsoft Intune.

It was no surprise that Bela’s keynote was Intune-specific. He said that many organizations are obsessed with the “penthouse” of AI productivity while building on a foundation of “legacy sand.” He feels that the industry is shifting toward “Identity 2.0,” in which the definition of a user has expanded beyond humans to include autonomous AI agents. Because these agents operate on a task-based model rather than during human office hours, Zero Trust must now evolve to monitor “agent identity at execution time,” treating code with the same, stricter, or even higher guardrails as those applied to high-level administrators.

In what can only be called a “scorched earth” move against competitors, Microsoft is radically changing its security suite by rolling out advanced Intune features as part of standard E3 and E5 licenses. This shift will effectively remove the cost barrier to tools like Remote Help, Cloud PKI, and Advanced Analytics. By making these “premium” features the new baseline, Microsoft is signaling that security is a fundamental requirement for the modern enterprise.

This is the new standard, Endpoint Privilege Management (EPM), which enables “least privilege” security by allowing users to perform specific elevated tasks without granting full admin rights. He highlighted that for organizations in 2026, failing to use these now-standard tools is increasingly viewed not just as being behind the curve, but as operational negligence.

The next keynote featured Huntress’s Tami and Jeremy. They had a great rapport.

During their interactions, they stated that the cybersecurity landscape has reached a “Tipping Point” where AI-generated phishing boasts a 52% success rate, rendering traditional human detection nearly obsolete. They said attackers are leveraging Large Language Models to discover zero-day vulnerabilities and deploy sophisticated malware such as “ClickFix,” which mimics legitimate system prompts with near-perfect accuracy. This surge of automated “AI slop” is currently overwhelming legacy defense systems and bug bounty programs, signaling that the human perimeter alone is no longer sufficient.

To combat these threats, the industry is pivoting toward the “Agentic SOC,” exemplified by systems like Huntress’s “Athena.” By deploying specialized AI agents to orchestrate playbooks, organizations can achieve instant signal pickup and total consistency without the “alert fatigue” that plagues human analysts. Of course, this approach will not replace people; instead, it uses machine learning to filter noise, routing only the most complex, indeterminate signals to humans for expert intuition.

Finally, they talked about how employee security training, which we can attest to sucks, how they shifted from boring, mandatory lectures that we have all attended to gamified Security Awareness Training (SAT). They did this through simulations, some created by world-class animators, which are driving a 94% behavioral change rate by letting users “play” the role of the attacker.

Looking back, their presentation had the same qualities as the SAT training: fun and interactive.

Final Thoughts

hadn’tn’t spent much time in Palm Springs and were unsure about its location for a conference, but we were pleasantly surprised by how well it worked and, more importantly, impressed by the breadth and depth of the information shared at NerdioCon.

NerdioCon 2026 highlighted a “generational disruption” in the IT landscape as organizations shift from legacy infrastructure toward an “agentic, elastic, and cloud-smart” future. The keynotes from Microsoft, Nerdio, Nutanix, and Huntress emphasized the transition to a “human-led and agent-operated” model, in which AI agents and cloud-native solutions such as Windows 365 and Azure Virtual Desktop (AVD) redefine the modern workstation as a persistent, cloud-delivered service rather than a physical device.

Our technical highlights included the launch of Nerdio Manager for Enterprise 8.0, featuring Intune Policy Studio and Global Pools, and the strategic introduction of Nerdio Compass to help MSPs manage cloud profitability. Security remained a central theme, with speakers advocating for “Identity 2.0” to govern AI agents, the inclusion of advanced features in Intune to combat “operational negligence,” and the rise of the “Agentic SOC” to counter increasingly sophisticated AI-generated cyber threats.

Ultimately, the conference did a good job of positioning the synergy between Microsoft and Nerdio as a vital catalyst for navigating this rapid economic and operational transition toward a hybrid, AI-integrated enterprise.

The post NerdioCon 2026: Manager 8.0 Brings AVD Hybrid to Nutanix, Adds Global Pools appeared first on StorageReview.com.

Dell Pro Max 16 Plus with Qualcomm AIC100 Review: Excellent Workstation, Experimental Accelerator

There are two stories in the Dell Pro Max 16 Plus, and they pull in opposite directions. One is a top-tier mobile workstation: Intel’s 24-core Core Ultra 9 285HX, up to 256GB of CAMM2 memory, three M.2 slots, NVIDIA RTX PRO Blackwell graphics up to the 5000-series with 24GB of GDDR7, MIL-STD-810H build, and a chassis that Dell has clearly poured engineering into.

The other is the SKU under review, which trades the GPU for a Qualcomm AIC100 PC Inference Card, a dual-SoC module built around 2019-era Cloud AI 100 silicon, and a software stack that turns most modern inference workloads into a painful exploration. This is a cautionary tale about what happens when a flagship chassis gets paired with the wrong accelerator, and why customers need to understand the software stack behind an AI solution before they sign the purchase order. Before we get to why, let’s look at the laptop as a whole.

The Pro Max 16 Plus sits at the top of Dell’s Pro Max workstation lineup, delivering more raw power than both the entry-level Pro Max 16 and the slimmer Pro Max 16 Premium. At its core is Intel’s scalable Core Ultra 9 285HX, a 55-watt, 24-core chip with a 5.5GHz turbo boost. All CPU configurations support Intel vPro Enterprise, reinforcing the laptop’s enterprise-grade credentials. Pricing starts at $2,779.

Graphics options span integrated Intel graphics through NVIDIA’s Blackwell-based RTX PRO 1000, scaling all the way up to the RTX PRO 5000 we reviewed previously, which features an impressive 24GB of GDDR7 memory. Storage and memory configurations are equally generous: up to 12TB across three M.2 Gen5 slots, and up to 128GB of DDR5-6400 memory delivered via Dell’s CAMM2 module.

Display choices range from a basic 1920 x 1200 IPS panel to the vivid 3840 x 2400 OLED touchscreen. A mid-tier 1920 x 1200 option sits between the two, adding 500 nits of brightness, a 120Hz variable refresh rate, and full DCI-P3 coverage. With over 100 ISV certifications, creative professionals can expect their applications to run smoothly.

Security features are enterprise-ready, including a fingerprint reader, Smart Card support, NFC, an 8MP IR camera for facial recognition, and Dell’s Control Vault 3. A standard three-year warranty rounds out the package, underscoring the laptop’s role as a serious tool for serious work.

Dell Pro Max 16 Plus Specifications

Specification Dell Pro Max 16 Plus
Platform
Processor Intel Core Ultra 5 245HX
Intel Core Ultra 7 265HX
Intel Core Ultra 9 285HX
Operating System Windows 11 Pro
Ubuntu Linux 24.04 LTS
Memory 16GB-128GB CSoDIMM or CAMM2, 1 slot
Graphics and AI Acceleration
Graphics Card Intel Integrated Graphics
NVIDIA RTX PRO 1000 8GB
NVIDIA RTX PRO 2000 8GB
NVIDIA RTX PRO 3000 12GB
NVIDIA RTX PRO 4000 16GB
NVIDIA RTX PRO 5000 24GB
Qualcomm AI Cloud 100 64GB (2x 32GB)
Storage and Display
Storage Up to 3x M.2 SSD, 4TB each
Available RAID 0/1/5
Display 16-inch 16:10
1920×1200, 300-nit, 45% NTSC, 60Hz, non-touch
1920×1200, 500-nit, 100% DCI-P3, 120Hz VRR, non-touch
3840×2400, 500-nit, OLED, touch
Connectivity and Power
Camera 8MP IR
Wireless Networking Intel Wi-Fi 7 BE200, with or without Bluetooth 5.4
Available mobile broadband
Battery 6-cell 96Whr
Power Adapter 165W or 280W
Security and Physical
Security Features IR webcam
Fingerprint reader
Smart Card reader
NFC
Control Vault 3
Dimensions and Weight 1.22 by 10.18 by 14.17 inches
Starting weight: 5.63 pounds
Warranty Standard three years, next business day onsite repair

Build and Design

Like the previous unit we reviewed, the Pro Max 16 Plus is unapologetically rugged, holding a MIL-STD-810H certification for durability in demanding environments. Dell’s material mix leans heavily into sustainability, incorporating post-consumer recycled plastic, recycled magnesium and cobalt, and bio-based plastics. In hand, the chassis feels exceptionally rigid, with no detectable flex. In short, it’s built like a tank.

This is a substantial machine. At 1.22 inches thick (including its feet) and starting at 5.63 pounds, it isn’t built for frequent travel, though its 10.18 x 14.17-inch footprint is reasonably compact for a 16-inch, 16:10 display. The webcam sits at the top of the lid, complete with a sliding privacy shutter; our review unit ships with the IR version for facial recognition.

Aesthetically, Dell’s design language is understated to a fault. The gray-black exterior and subtle branding emphasize that this is a product of function over form. The Pro Max Premium line offers more visual flair at the cost of performance and expansion.

The comprehensive port selection starts on the left edge:

  • 2.5Gbps RJ45 Ethernet
  • HDMI 2.1 output
  • Two Thunderbolt 5 (USB-C) ports
  • SD card reader
  • Optional SmartCard slot

On the right:

  • 3.5mm audio jack
  • Thunderbolt 4 (USB-C)
  • Two USB 3.2 Gen1 Type-A ports
  • Lock slot

There are no ports on the rear edge. Wireless connectivity is handled by Intel’s BE200 module, supporting Wi-Fi 7 and Bluetooth 5.4. Bluetooth can be omitted in custom configurations, and 5G mobile broadband is also available.

Screen and Input Devices

Our review unit features Dell’s 16-inch 1920×1200 display with a 120Hz VRR panel that looks excellent in daily use. Colors are vibrant, and with 100% DCI-P3 coverage, it’s well-suited for color-sensitive workflows once calibrated. The 500-nit brightness also helps the display remain comfortable to use in brighter office or studio environments.

Dell’s keyboard is well-suited for long typing sessions, with full-size keys that deliver a light, responsive feel and crisp tactile feedback. White backlighting keeps it visible in dim environments. The layout is largely conventional, but the uneven sizing of the arrow keys can cause occasional mispresses, and the placement of the Home and End keys is a particular drawback; they share space with F11 and F12, so enabling Fn-Lock (Fn + Esc) to prioritize the function row forces a Fn + F11 or F12 press to access them. Dedicated Page Up and Page Down keys would have been welcome; instead, they’re secondary functions of the up and down arrows, which are already the most awkward keys in the cluster. The power button, located at the top right, doubles as a fingerprint sensor.

The generously sized touchpad complements the 16-inch form factor. Its smooth anti-glare surface tracks accurately, and palm rejection performed flawlessly throughout testing.

Upgradeability

The Pro Max 16 Plus is built with expansion in mind, offering substantial upgrade potential. It features three M.2 Gen5 slots for storage, a CAMM2 slot for memory upgrades, and several modular components, including replaceable USB-C ports.

Accessing the internals is straightforward: remove the perimeter screws and lift the bottom panel from back to front. Inside, you’re greeted by a robust three-fan cooling system and a sizable 96Whr battery. The CAMM2 memory module sits at the bottom right, positioned beneath a dedicated heatsink and flanked by the M.2 slots. It’s difficult to tell from the photo, but the M.2 slot on the left is actually a stacked slot that houses two drives in the same footprint. The M.2 wireless card, also user-replaceable, sits just above the battery.

The Star of the Show: Qualcomm AIC100

The Dell SKU under review ships with the Qualcomm AI 100 NPU, a single module that houses two Qualcomm Cloud AI 100 SoCs side by side. Each SoC contributes 16 AI cores for a combined 32 across the module, and each carries its own 32GB of LPDDR4x, presented to the host as two individual NPUs.

Dell and Qualcomm advertise roughly 450 TOPS of INT8 throughput and the ability to run models in the 100-billion-parameter range, with Dell publicly demonstrating Llama 4 Scout (109B parameters, MoE) running locally on the laptop. The two SoCs communicate with the host through the Linux QAIC accelerator driver, with firmware blobs upstreamed into linux-firmware.

So far, so reasonable. The numbers, in isolation, are big. The problem is the silicon underneath those numbers.

Qualcomm announced the Cloud AI 100 in April 2019, sampled it in late 2020, and began shipping it commercially in the first half of 2021. The chip is built on a 7nm node and uses four 64-bit LPDDR4X controllers running at 2100 MHz (LPDDR4X-4200), delivering 136 GB/s of memory bandwidth per SoC, per Qualcomm’s own Cloud AI architecture documentation.

It was originally designed with the PCIe form factor in mind. Stuffing two of these chips onto a custom module and dropping it into a 2025 laptop does not change the underlying trade-offs. This is 2019-era silicon with 2019-era memory technology, refreshed and renamed but architecturally the same family. By the time it landed in the Dell Pro Max 16 Plus, the rest of the industry had moved through HBM2e, HBM3, HBM3e, and LPDDR5X, and is now heading toward GDDR7 and HBM4 on serious AI accelerators.

But the deeper issue matters more than memory bandwidth. There are many brilliant chip designs and engineering teams in the industry that understand the AI inference problem at a very deep level, and the Cloud AI 100 architecture itself may well be competent. The trouble is that the software engineers who actually make a product live or die have already invested heavily in another ecosystem: CUDA. Unless there is a strong incentive to switch, developers stick with the toolchain that already has great support, documentation, and community help. NVIDIA captured the developer base early and built an enormous community around it. AMD spent years lagging on this front, but the recent ROCm revs are genuinely excellent, and the gap is closing. Solutions like Modular’s Mojo and MAX even let you target NVIDIA or AMD with the same code, and sometimes beat the native runtimes. Every other accelerator, though, struggles with public adoption due to a lack of software backing.

Public adoption is the operative phrase. Large organizations like Google can pour billions into XLA and JAX to make TPUs sing. Well-funded private startups and AI labs can write custom kernels for their own narrow set of models and not care that nobody else can replicate the stack they aren’t building for infinite public use cases; they’re building for the problems they face. For a public consumer, or even most enterprises, an accelerator without a thriving public developer ecosystem is functionally useless. You will burn weeks trying to get your model onto it, and the moment Hugging Face ships a new architecture, you will be staring at a recompile job (or an unsupported-model error) while everyone on CUDA and ROCm has day-zero support.

So let me say it plainly: the AIC100 in this laptop is dead in the water. No individual should buy it. No organization should buy it unless it has the engineering resources and the explicit intent to spin up inference from scratch for its specific workload, and has accepted that it is signing up to maintain that stack itself.

The Software and Tooling Reality

To understand why that recommendation is as harsh as it is, you have to look at what shipping inference on this card actually involves.

The user-facing pieces are split into two SDKs and one wrapper library. The Qualcomm Cloud AI Platform SDK ships the kernel driver (the upstream accel/qaic driver in mainline Linux), the device firmware, the on-card runtime, and low-level APIs. The Apps SDK sits on top and provides the qaic-exec compiler, the qaic-runner inference CLI, ONNX Runtime integration via a QAIC execution provider, Python bindings, and a fork of vLLM. The Qualcomm efficient-transformers library, also called QEfficient, is a Hugging Face Transformers wrapper that reimplements popular LLM architectures with the static shapes, KV cache layouts, and graph transformations required by the AIC100. Qualcomm AI Hub is a separate model catalog and compile-as-a-service product aimed more at Snapdragon-class devices than the AIC100, though it shares branding.

The compile path is rigid. You take a PyTorch model, export it using torch.export or ONNX, and feed it to qaic-exec with flags such as -convert-to-fp16, -mxfp6-matmul, a batch size, a context length, and a target SoC count. The compiler does ahead-of-time scheduling and memory placement, then emits a QPC, a Qualcomm Program Container, a sealed binary that pins memory layout, KV cache shape, batch size, prefill sequence length, and context length. There is no JIT. Per Qualcomm’s own LLM documentation, the ahead-of-time AI 100 compiler pre-allocates device resources based on prompt length, generation length, KV cache, and batch size, and the Cloud AI 100 supports only static input shapes. Any change to those compile-time parameters triggers another full compile, which can take many minutes for small models and hours for large ones.

The list of supported architectures is very short. The QEfficient library and the Zentree-hosted prebuilt QPC catalog that Dell points customers to largely cover older models, and only a handful are worth using in 2026.

Newer FP8-native checkpoints require requantization. If a model ships natively in MXFP4, as the popular GPT-OSS models do, you are looking at a conversion-and-recompile pipeline rather than dropping the weights in. None of this is impossible to work around if you are willing to do the work, but it is a constant tax.

Then there is the concurrency problem, which is where the laptop falls apart, even for developers focused on out-of-the-box performance. The Dell-provided container images, which Dell instructs users to pull and run with vLLM, are based on QPCs that Zentree pre-compiled with specific shapes, and the shipped containers only run at concurrency 1. Regardless of input or output sequence shape, you get a single fixed throughput for a given model. Multiple parallel requests do not run concurrently; they are queued and processed in sequence by vLLM. You cannot dynamically batch. You cannot use continuous batching the way vLLM or SGLang gives you for free on Team Red or Green GPUs. To get any concurrency above 1, you have to recompile the QPC with a larger batch size.

Dell’s examples pitch this laptop to developers, and the most popular AI use case for developers today is vibe coding with tools like Claude Code, OpenCode, and the like. A single request to these tools can fan out into multiple parallel LLM calls; out of the box, these NPUs will queue those requests and process them sequentially rather than in parallel, so something that might take seconds on an NVIDIA Spark will take minutes on this setup.

Performance

The system Dell provided for testing has the following configuration:

  • Intel Core Ultra 9 285HX CPU
  • Qualcomm AIC100 PC Inference Card
  • 128GB 6400MTs CAMM2 DDR5
  • 4TB SSD

Before any numbers, a methodology note. As described above, the AIC100 runs ahead-of-time-compiled QPCs with a frozen batch size, sequence length, and KV-cache layout. Dell ships this laptop with a curated set of pre-compiled QPCs hosted on Zentree and a vLLM container image that pulls them down on first launch. That set of pre-cooked QPCs, served through Dell’s reference container at concurrency 1, is what an end user actually receives when they unbox the machine and follow Dell’s documentation, and that is the configuration we benchmarked.

We have the tooling to do otherwise. We could pull qaic-exec, take a checkpoint, run it through torch.export, requantize, recompile a QPC with a larger batch size, and feed it back through vLLM. We could write custom kernels against the QAIC accelerator driver if we wanted to. We chose not to, since the overwhelming majority of buyers in this laptop’s target market, developers, AI-curious engineers, and enterprise pilot teams, will not do that work. They will pull the container, run it, and judge the product on what comes out. So that is what we measured.

Every bar represents a Qualcomm-compiled QPC running with MXFP6 weights and an MXINT8 KV cache, the precision Dell’s shipped artifacts use across the board. Llama 3.2 1B is the only model on the chart that exceeds 100 TPS, reaching 128 TPS. Llama 3.2 3B follows at 56 TPS, Qwen3 4B at 45 TPS, Qwen3-Coder 30B-A3B at 35 TPS, Mistral 7B at 33 TPS, and Llama 3.1 8B at 30 TPS. GPT-OSS 20B sits at 28.9, 28.5, and 28.4 TPS across the 256/256, 1k/4k, and 4k/1k profiles, confirming what Qualcomm’s documentation promises about the AOT compiler: once a QPC is built for a shape, the decode rate is fixed and prompt length does not move the per-token cost. Phi-4 closes out the chart at 14 TPS.

Although larger models than the ones above will fit on this card, we did not benchmark them. Doing so, for example, with the Llama 4 Scout model, Dell demos publicly, requires dropping precision further to INT4, and in practice, a less-quantized, smaller model will outperform a heavily quantized, larger one across many workloads.

The shipped vLLM container also runs every QPC at batch_size=1, and we confirmed in practice that issuing two simultaneous requests does not double throughput. The second request simply waits in the software queue until the first finishes. There is no continuous batching, in-flight batching, or speculative decoding available in the shipped stack. For coding agents like Claude Code or OpenCode that fan out multiple parallel LLM calls from a single user turn, this single-stream cap turns what should be a few seconds of response time into a multi-minute wall-clock wait. Raising the batch dimension requires recompiling the QPC on the host, which puts us back at the trapdoor we already declined to step through.

Let’s compare this to the NVIDIA Spark. With 256/256 Input and Output Sequence Length, the Spark can run the 120B model faster than Dell’s Qualcomm AIC 100 can run the 20B model. And this is not even the best numbers the Spark can offer, since these results were collected using the Marlin Kernel on launch software revisions.

The takeaway is narrow. For a single user, a single conversation, and a model small enough that 136 GB/s of LPDDR4X per SoC is not the binding constraint (Llama 3.2 1B and, arguably, Llama 3.2 3B), the AIC100 in this laptop is usable. For anything larger, in the configuration the customer actually receives, the combination of single-stream decode and a static-shape compile pipeline that punishes any shape Qualcomm did not pre-bake leaves this accelerator behind the integrated NPU and integrated GPU on the same Intel Core Ultra HX it sits next to, let alone the discrete NVIDIA SKUs the same chassis can be ordered with.

If we just compare the raw specs for a second, the NVIDIA Spark offers 273GB/s, and we tested the maximum achievable floating-point flops (MAMF) at FP8 (E4M3) at 200TFLOPs on a single chip. The QAIC is advertised to offer 272GB/s across 2 chips and 435 TFLOPS of INT8. So, in theory, these should perform similarly, but the Qualcomm one lags behind due to the software.

Who is this for, and should you buy it

For anyone trying to do serious AI work today, the answer is no. Do not buy this configuration.

Dell’s US store lists the AIC100 SKUs of the Pro Max 16 Plus at $14,871.56 for the top configuration (Core Ultra 9 285HX, 128GB RAM, 4TB SSD), $9,661.56 for a mid configuration (Core Ultra 7 265HX, 64GB, 1TB), and $8,831.56 for the entry AIC100 SKU. All ship Ubuntu Linux only, Windows support coming soon. As tested, the machine lands in the $14,000-$15,000 range.

For reference, NVIDIA’s DGX Spark currently sells for $4,699. For that money, you get a GB10 Grace Blackwell Superchip, 128GB of unified LPDDR5X memory, a 4TB NVMe, a Blackwell GPU, and roughly 1 petaflop of FP4 AI compute, all backed by the full CUDA software stack, TensorRT-LLM, NIM, and the entire NVIDIA ecosystem. A single DGX Spark will outperform the AIC100 in this laptop for almost every realistic AI workload, and it will do so with software that any AI engineer hired this year already knows how to use. For the price of our review unit, you could buy three DGX Sparks, kit each one out with a monitor, peripherals, and a desk, and still have money left over. If small AI isn’t your jam, a Dell Pro Max Tower T2 workstation with Intel 285K, 128GB of DDR5 RAM, and an NVIDIA RTX Pro 6000 GPU is also right around $15,000, depending on the SSD size you pair with it.

It is hard to escape the feeling that Dell has put what amounts to e-waste into an otherwise excellent chassis. The Pro Max 16 Plus with an RTX PRO 5000 is a fantastic mobile workstation. The same machine, with an AIC100, is a messy science experiment under a Dell warranty.

Conclusion

If you are a tinkerer reading this a few years from now and you have stumbled across one of these laptops on a clearance shelf for two or three hundred dollars, by all means, pick it up. The system is repairable and upgradable, the keyboard is good, and getting the AIC100 modules to do something interesting as a weekend project is exactly the kind of low-stakes fun this hardware deserves.

If you are anyone trying to do serious AI work today, configure your Pro Max 16 Plus with literally any other accelerator. An NVIDIA RTX PRO mobile GPU, even the entry-level RTX PRO 1000, will serve you better than the AIC100 modules. The Intel Core Ultra HX’s integrated NPU will serve you better in many practical scenarios because it at least plugs into Windows ML, OpenVINO, and the existing PC AI stack.

One suggestion worth offering to Dell: the Pro Max 16 Plus is an excellent chassis, and the Pro Max line is one of the strongest mobile workstation platforms on the market. The AIC100 SKU, as shipped, does not meet that standard by any stretch. An experimental or developer-preview product line, clearly labeled as such, would give Dell a way to ship novel accelerators to customers who want to play with them, without putting the broader Pro Max name behind a stack that is not ready. The Pro Max brand is worth protecting, and there is a clean way to do that while still finding a home for experimental hardware.

The post Dell Pro Max 16 Plus with Qualcomm AIC100 Review: Excellent Workstation, Experimental Accelerator appeared first on StorageReview.com.

Lenovo Refreshes ThinkPad and ThinkStation Lineup With AI-Focused Business Laptops and Workstations

12 May 2026 at 16:17
Thinkstation P4 Thinkstation P4

Lenovo is expanding its business PC portfolio with new ThinkPad laptops and a ThinkStation desktop workstation aimed at organizations that need a mix of mobility, performance, manageability, and long-term serviceability. The lineup includes ultraportable systems for traveling professionals, scalable laptops for enterprise fleets, and a high-performance workstation designed for creators, engineers, and technical teams running demanding workloads.

Thinkstation P4

The new ThinkPad X13, ThinkPad L14, and ThinkPad L16 focus on AI-ready performance with Intel and AMD processor options, while also placing greater emphasis on repairability and recycled materials in key components. Lenovo is also introducing the ThinkStation P4, a 30-liter desktop workstation featuring AMD Ryzen PRO 9000 Series processors, NVIDIA RTX PRO 6000 Blackwell graphics, liquid cooling, enterprise security features, and independent software vendor certifications for professional applications from companies including Autodesk, Adobe, and Siemens.

Lenovo ThinkStation P4

Lenovo’s ThinkStation P4 is a new entry tower workstation designed for professionals who need desktop-class performance without moving into the highest-end workstation tier. Built around AMD Ryzen PRO 9000 Series processors, the system supports up to 16 cores and clock speeds of up to 5.5 GHz, providing the compute headroom needed for modeling, rendering, simulation, engineering, design, and other data-heavy workflows. Lenovo is also pairing the platform with advanced thermal design and available liquid cooling for higher-power CPU configurations, helping the workstation sustain performance under demanding workloads.

The ThinkStation P4 can be configured with up to an NVIDIA RTX PRO 6000 Blackwell Workstation Edition GPU featuring 96GB of GDDR7 ECC VRAM, providing professional users with substantial graphics and AI compute capabilities. The system supports up to 256GB of DDR5 memory, up to six total storage drives, PCIe Gen 5 expansion, and a broad mix of front and rear ports.

Thinkstation P4 front

Lenovo’s ThinkStation P4 is an entry tower workstation built for professional users who need strong desktop performance for modeling, rendering, simulation, engineering, design, and data-heavy workloads. The system is powered by AMD Ryzen PRO 9000 Series processors, with configurations reaching up to the AMD Ryzen 9 PRO 9965X3D, up to 16 cores, and up to 5.5 GHz. Lenovo is also emphasizing sustained performance through advanced thermal design, with liquid cooling available for higher-power CPU options up to 170W.

The ThinkStation P4 can be configured with up to NVIDIA RTX PRO 6000 Blackwell Workstation Edition graphics, including 96GB GDDR7 ECC VRAM, and supports up to 4000 TOPS of GPU AI performance. The workstation also includes up to 256GB of DDR5 memory, up to six total drives, PCIe Gen 5 support, Windows and Linux operating system options, ThinkShield security features, and ISV certifications from professional software developers, including AVID, Altair, Autodesk, ANSYS, Bentley, Dassault, Nemetschek, PTC, and Siemens.

Label Value
Overview
Workstation Type Entry tower workstation
Positioning Workstation Performance, Elevated
Performance
Processor Up to AMD Ryzen 9 PRO 9965X3D
up to 16 cores, up to 5.5GHz
Chipset AMD PRO 675
Graphics Up to NVIDIA RTX PRO 6000 Blackwell Workstation Edition
96GB GDDR7 ECC VRAM
AI GPU: up to 4000 TOPS
Total Memory Up to 256GB DDR5, up to 6400MT/s
Memory DIMM Capacity 16GB / 32GB ECC UDIMM
8GB / 16GB / 32GB / 48GB Non-ECC UDIMM
64GB Non-ECC CUDIMM
4 DIMM Slots
Storage Type Capacity M.2 PCIe NVMe SSD up to 4TB
3.5″ SATA HDD up to 12TB
Total Storage Up to 6 total drives
Max M.2 = 3 (12TB)
Max 3.5″ = 3 (36TB)
RAID 0/1/5
Power Supply 500W, 750W, 1100W (92% efficient)
Design
Dimensions (WxDxH) 180 x 401.5 x 415mm
7.09 x 15.81 x 16.34in
Weight Starting at: 8.75kg (19.29lbs)
Connectivity
Front Ports (1) Audio Combo Jack
(1) Microphone Jack
(1) USB-C® 3.2 Gen 2 (20Gbps)
(2) USB-A 3.2 Gen 2 (10Gbps)
(2) USB-A 3.2 Gen 1 (5Gbps)
(1) 3-in-1 Media Card Reader
Rear Ports (4) USB-A 3.2 Gen 1 (5Gbps)
(1) DisplayPort 2.0
(1) DisplayPort 1.4
(1) HDMI® 2.1
(1) RJ-45 2.5 Gigabit Ethernet
(1) Line out (3.5mm)
(1) DP/HDMI/Type-C/VGA
(1) Serial
(1) LPT
WLAN + Bluetooth® Foxconn MT7925 Wi-Fi 7 2*2be + Bluetoooth 5.4 PCIe 2230 module
Ethernet Realtek RTL8125BP-CG, 2.5GbE, supports Wake-on-LAN
Optional Ethernet Adapters
Expansion Slots (1) PCIe 5.0 x16
(1) PCIe 4.0 x4
(2) PCIe 4.0 x1
Software
Operating System Windows 11 Pro
Ubuntu Linux
Red Hat Enterprise Linux
Windows Preloads Lenovo Commercial Vantage
ISV Certifications Including AVID, Altair, Autodesk, ANSYS, Bentley, Dassault, Nemetschek, PTC, Siemens
Security
ThinkShield Discrete TPM 2.0
Kensington Security Slot
Chassis Intrusion Switch
E-Lock
Sustainability
Material 95% PCC ABS
95% PCC ABS wired USB keyboard/mouse top/bottom cover
90% PCC recycled plastic EPE cushion
30% OBP used in bag
16% recycled SGCC
FSC-certified paper in packaging
Certifications ENERGY STAR® 9.0
EPEAT®Gold
TCO Certified 10
RoHS Compliant

Lenovo ThinkPad L14 Gen 7

The ThinkPad L14 Gen 7 is Lenovo’s 14-inch business laptop for organizations that need a more portable system without sacrificing fleet manageability, repairability, and enterprise security. Available with AMD Ryzen AI PRO 400 Series processors or Intel Core Ultra 7 Series 3 processors, the L14 Gen 7 supports on-device AI features through NPUs rated at up to 50 TOPS, while also offering up to 64GB of DDR5 memory and up to 2TB of PCIe storage for heavier office, collaboration, and multitasking workloads.

Lenovo ThinkPad L14

The device keeps the L Series focus on practical enterprise deployment, with Wi-Fi 7, support for 4G LTE, a broad port selection, optional NFC, smart card, and NanoSIM support, a 5MP + IR camera option, and a 14-inch WUXGA display lineup that reaches up to 500 nits on the low-power non-touch panel. Lenovo is also emphasizing serviceability and durability, including customer-replaceable battery and storage, spill resistance, MIL-STD-810H testing, and ThinkShield security features that span biometric, camera, platform, and physical lock protections.

Lenovo ThinkPad L16 Gen 3

The ThinkPad L16 Gen 3 takes the same enterprise-centered L Series formula and fits it into a larger 16-inch chassis, aimed at hybrid workers who spend more time at a desk but still need a laptop that can move between offices, meetings, and home workspaces. Lenovo is offering AMD Ryzen AI PRO 400 Series and Intel Core Ultra 7 Series 3 processors, with up to 64GB of DDR5 memory, up to 2TB of PCIe storage, and NPUs rated up to 50 TOPS for local AI workloads and Copilot+ PC features.

Lenovo ThinkPad L16

The larger model centers on a 16-inch WUXGA IPS display with touch and non-touch options, 400-nit brightness, Wi-Fi 7, 4G LTE support, USB-C docking support, and the same broad port mix as the smaller L14. Lenovo also includes a 5MP + IR camera option, dual speakers, dual microphones, a spill-resistant keyboard, TrackPoint controls, and enterprise security features such as a power-on touch fingerprint reader, IR camera support, a webcam privacy shutter, a discrete TPM 2.0, and a Kensington Nano Lock Slot.

Metric/Field ThinkPad L14 Gen 7 AMD ThinkPad L14 Gen 7 Intel ThinkPad L16 Gen 3 AMD ThinkPad L16 Gen 3 Intel
Performance
Processor Up to AMD Ryzen AI PRO 400 Series processors Up to Intel Core Ultra 7 Series 3 processor Up to AMD Ryzen AI PRO 400 Series processors Up to Intel Core Ultra 7 Series 3 processor
NPU 50 TOPS Up to 50 TOPS 50 TOPS Up to 50 TOPS
Graphics AMD Radeon graphics Intel Graphics AMD Radeon graphics Integrated Intel Graphics
Memory Up to 64GB DDR5, 5600MT/s, dual SODIMM Up to 64GB DDR5, 5600MT/s, dual SODIMM Up to 64GB DDR5, 5600MT/s, dual SODIMM Up to 64GB DDR5, 5600MT/s, dual SODIMM
Storage Up to 2TB PCIe Gen4x4 SSD (2280) Up to 2TB PCIe Gen4x4 SSD (2280) Up to 2TB PCIe Gen4x4 SSD (2280) Up to 2TB PCIe Gen4x4 SSD (2280)
Display and Design
Display 14″ WUXGA IPS non-touch, 400nits, 45% NTSC, AG, DBEF5
14″ WUXGA IPS touch, LBL, 400nits, 45% NTSC, AG, DBEF5
14″ WUXGA IPS non-touch, low power, LBL, 500nits, 100% sRGB, AG
14″ WUXGA IPS non-touch, 400nits, 45% NTSC, AG, DBEF5
14″ WUXGA IPS touch, LBL, 400nits, 45% NTSC, AG, DBEF5
14″ WUXGA IPS non-touch, low power, LBL, 500nits, 100% sRGB, AG
16″ WUXGA IPS non-touch, LBL, 400nits, 45% NTSC, AG
16″ WUXGA IPS touch, LBL, 400nits, 45% NTSC, AG
16″ WUXGA IPS non-touch, LBL, 400nits, 45% NTSC, AG
16″ WUXGA IPS touch, LBL, 400nits, 45% NTSC, AG
Screen-to-Body Ratio 85.5% Screen-to-Body Ratio 85.5% Screen-to-Body Ratio 87% Screen-to-Body Ratio 87% Screen-to-Body Ratio
Dimensions 313.7 x 226 x 11.32 (front) / 17.01 (rear) mm
12.35 x 8.90 x 0.45 (front) / 0.67 (rear) in
Starting at 313.6 x 221.7 x 21.95 (rear) / 15.88 (front) / 11.3 (max) mm
12.34 x 8.72 x 0.86 (rear) / 0.62 (front) / 0.44 (max) in
Starting at 357.9 x 247.9 x 23.8 (rear) / 18.2 (front) / 11.45 (max) mm
14.09 x 9.75 x 0.93 (rear) / 0.71 (front) / 0.45 (max) in
357.6 x 253.6 x 10.96/19.57 (front/rear) mm
14.08 x 9.98 x 0.43(front)/0.77(rear) in
Weight 1.39kg/3.06lbs 1.39kg/3.06lbs 1.78kg/3.93lbs 1.78kg/3.93lbs
Connectivity and Collaboration
Input/Output Ports 2x Thunderbolt 4 40Gbps, with Power Delivery 3.0 and DisplayPort 2.1
1x USB-A (Hi-Speed USB / USB 2.0)
2x USB-A (USB 5Gbps / USB 3.2 Gen 1), one Always On
1x HDMI 2.1
1x RJ45
1x Audio
1x Smartcard reader
1x NanoSIM
2x Thunderbolt 4 40Gbps, with Power Delivery 3.0 and DisplayPort 2.1
1x USB-A (Hi-Speed USB / USB 2.0)
2x USB-A (USB 5Gbps / USB 3.2 Gen 1), one Always On
1x HDMI 2.1
1x RJ45
1x Audio
1x Smartcard reader
1x NanoSIM
2x Thunderbolt 4 40Gbps, with Power Delivery 3.0 and DisplayPort 2.1
1x USB-A (Hi-Speed USB / USB 2.0)
2x USB-A (USB 5Gbps / USB 3.2 Gen 1), one Always On
1x HDMI 2.1
1x RJ45
1x Audio
1x Smartcard reader
1x NanoSIM
2x Thunderbolt 4 40Gbps, with Power Delivery 3.0 and DisplayPort 2.1
1x USB-A (Hi-Speed USB / USB 2.0)
2x USB-A (USB 5Gbps / USB 3.2 Gen 1), one Always On
1x HDMI 2.1
1x RJ45
1x Audio
1x Smartcard reader
1x NanoSIM
Wireless Wi-Fi 7 (5 Gig)
Bluetooth 5.4
Support for 4G LTE CAT12 and CAT6 WWAN
WWAN-ready on CAT6 only
Intel Wi-Fi 7 (5 Gig)
Up to Bluetooth 5.4
Support for 4G LTE CAT12 and CAT6 WWAN
WWAN-ready on CAT6 only
Wi-Fi 7 (5 Gig)
Up to Bluetooth 5.4
Support for 4G LTE CAT12 and CAT6 WWAN
WWAN-ready on CAT6 only
Intel Wi-Fi 7 (5 Gig)
Up to Bluetooth 5.4
Support for 4G LTE CAT12 and CAT6 WWAN
WWAN-ready on CAT6 only
Camera HD RGB, 5MP+IR with webcam privacy shutter HD RGB, 5MP+IR with webcam privacy shutter HD RGB, 5MP+IR with webcam privacy shutter HD RGB, 5MP+IR with webcam privacy shutter
Power, Software, and Security
Operating System Windows 11 Pro
Linux Ubuntu
Windows 11 Pro
Linux Ubuntu
Windows 11 Pro
Linux Ubuntu
Windows 11 Pro
Linux Ubuntu
Battery 57Whr / 46.5Whr 57Whr / 46.5Whr 57Whr / 46.5Whr 57Whr / 46.5Whr
AC Adaptor Up to Type-C 65W (supports RapidCharge) Up to Type-C 65W (supports RapidCharge) Up to Type-C 65W (supports RapidCharge) Up to Type-C 65W (supports RapidCharge)
Security ThinkShield
Power-On Touch Fingerprint Reader
IR camera
Smartcard reader
Webcam privacy shutter
Discrete Trusted Platform Module (dTPM) 2.0
Kensington Nano Lock Slot
ThinkShield
Intel vPro security
Power-On Touch Fingerprint Reader
IR camera
Smartcard reader
Webcam privacy shutter
Discrete Trusted Platform Module (dTPM) 2.0
Kensington Nano Lock Slot
ThinkShield
Power-On Touch Fingerprint Reader
IR camera
Smartcard reader
Webcam privacy shutter
Discrete Trusted Platform Module (dTPM) 2.0
Kensington Nano Lock Slot
ThinkShield
Intel vPro security
Power-On Touch Fingerprint Reader
IR camera
Smartcard reader
Webcam privacy shutter
Discrete Trusted Platform Module (dTPM) 2.0
Kensington Nano Lock Slot

Lenovo ThinkPad X13 Gen 7

The ThinkPad X13 Gen 7 is Lenovo’s lightweight 13-inch business ultraportable for professionals who need a full enterprise laptop in a travel-first design. The AMD model starts at 953g, while the Intel model starts at 930g, keeping both under 1kg and the chassis less than 18mm thick. Both versions include a 13-inch WUXGA IPS display with 400-nit brightness, 100% sRGB coverage, and an 87.8% screen-to-body ratio, giving the system a larger working area than its compact footprint might suggest.

Lenovo ThinkPad X13

Lenovo is offering the X13 Gen 7 with AMD Ryzen AI PRO 400 Series processors or Intel Core Ultra 7 Series 3 processors, with both platforms supporting up to 50 TOPS of NPU performance for on-device AI features. The systems also share up to 64GB of LPDDR5x memory, up to 1TB PCIe Gen5 storage, Wi-Fi 7, up to 5G connectivity, NFC as an independent option, a 5MP RGB or 5MP + IR camera, user-facing Dolby Atmos audio, and five customer replaceable unit components, including the battery, RTC battery, SSD, WWAN, and D cover.

Metric/Field ThinkPad X13 Gen 7 AMD ThinkPad X13 Gen 7 Intel
Performance
Processor Up to AMD Ryzen AI PRO 400 Series processors Up to the Intel Core Ultra 7 Series 3 processor
NPU Up to 50 TOPS Up to 50 TOPS
Graphics AMD RDNA 3.5 Graphics Integrated Intel Iris Xe graphics
Memory Up to 64GB; LPDDR5x; 8533 MT/s; soldered-down UP to 64GB; LPDDR5x; 8533 MT/s; soldered-down
Storage Up to 1TB Performance PCIe Gen5 (2280) Up to 1TB Performance PCI Gen5 (2280)
Display and Design
Display 13″ WUXGA (FHD+) IPS AG 400nits, 100% sRGB, LBL
13″ WUXGA (FHD+) IPS On-cell Touch, AG, 400nits, 100% sRGB, LBL
87.8% screen-to-body ratio
13” WUXGA (FHD+) IPS AG 400nits, 100% sRGB, LBL
13” WUXGA (FHD+) IPS On-cell Touch, AG, 400nits, 100% sRGB, LBL
87.8% screen-to-body ratio
Dimensions (W X D X H) 299.3 × 207 × 17.75 mm (16mm MKT Z)/11.78 x 8.15 x 0.70 in
(0.63 in MKT Z)
299.3 × 207 × 17.75 mm (16mm MKT Z) / 11.78 x 8.15 x 0.70 in
(0.63 in MKT Z)
Weight Starting at 953g / 2.10 lbs Starting at 930g / 2.05 lbs
Keyboard 1.5mm bottom-load backlight
White LEDs w/tactile markings
TouchPad (115mm x 74.3mm)
TrackPoint QuickMenu
1.5mm bottom-load backlight
White LEDs w/tactile markings
TouchPad (115mm x 74.3mm)
TrackPoint QuickMenu
Colors Eclipse Black Eclipse Black
Connectivity and Collaboration
Input/Output Ports 1x USB-A 3.2 Gen 1
2x TBT4
HDMI 2.1
1x 3.5mm audio
1x USB-A 3.2 Gen 1
2x TBT4
HDMI 2.1
1x 3.5mm audio
Wireless Wi-Fi 7
5G LTE Sub-6 GHz, Cat6 WW & Cat4 PRC w/ eSIM
Intel Wi-Fi 7
5G LTE Sub-6 GHz, Cat6 WW & Cat4 PRC w/ eSIM
NFC Yes (independently optional) Yes (independently optional)
Docking Thunderbolt
USB-C
Thunderbolt
USB-C
Camera USB 5MP RGB, 5MP + IR
Physical camera shutter
USB 5MP RGB, 5MP + IR
Physical camera shutter
Audio User-facing Dolby Atmos
Lenovo Clear Voice
2x speakers
2x mics
User-facing Dolby Atmos
Lenovo Clear Voice
2x speakers
2x mics
Power, Software, and Security
Operating System Up to Windows 11 Pro
Linux
Up to Windows 11 Pro
Linux
Battery 100% recycled cobalt battery (CRU-able)
54.7 Wh Li-ion polymer
41Wh Li-ion polymer
100% recycled cobalt battery (CRU-able)
54.7 Wh Li-ion polymer
41Wh Li-ion polymer
AC Adaptor 65W standard 65W standard
Preloaded Apps Lenovo Commercial Vantage
Lenovo View
TrackPoint Quick Menu
Lenovo Commercial Vantage
Lenovo View
Intel Unison
Intel Connectivity Performance Suite
TrackPoint Quick Menu
Security Fingerprint reader in the power button
IR camera
SCR (independently optional)
Camera shutter
Privacy Guard
TPC 2.0
Kensington Nano Lock
Fingerprint reader in the power button
IR camera
SCR (independently optional)
Camera shutter
Privacy Guard
TPC 2.0
Kensington Nano Lock

 

Lenovo Workstations

The post Lenovo Refreshes ThinkPad and ThinkStation Lineup With AI-Focused Business Laptops and Workstations appeared first on StorageReview.com.

ORICO X50 Review: Thunderbolt 5 Speed in a Portable SSD Enclosure

11 May 2026 at 17:42

The ORICO X50 is a Thunderbolt 5 portable SSD line for those who want external storage with much more bandwidth than a standard USB drive. ORICO is offering it in a few different forms, including a diskless version and preconfigured 512GB, 1TB, 2TB, and 4TB models, so it can work either as a ready-to-use portable SSD or as an enclosure for a user-supplied drive. That gives it a fairly diverse audience, from video editors and photographers moving large project files to workstation users who need fast storage, high-speed external backups, or a portable drive that can keep up with heavier file workloads. The size is still compact enough for bag carry at 110 × 60 × 18.7mm, but this is very much a performance-focused external SSD.

Orico X50

ORICO rates it for up to 6000 MB/s read and 5800 MB/s write speeds, with actual speeds depending on the Thunderbolt 5 host, the included 80 Gbps cable, and a fast enough NVMe SSD inside. On older Thunderbolt 4, Thunderbolt 3, or USB4 systems, it still works, but the available bandwidth is limited by that host connection. ORICO also equips the enclosure with a fanless four-layer passive cooling setup, a CNC aluminum shell, and support for M.2 NVMe 2280 SSDs, which gives the X50 a more serious role than the average portable SSD. For large media transfers, active project storage, heavier backup jobs, and external work files that stay in regular use, the X50 is built for a much more intensive workload than a standard USB portable drive.

Backed by a limited 3-year warranty, the ORICO X50 goes for roughly $199.99 (affiliatelinnk) for the diskless model.

ORICO X50 – Specifications

Label Value
Overview
Product Name ORICO X50
Product Type Thunderbolt 5 Portable SSD
Product Model ORICO-X50
Color Silver
Material Aluminum Alloy
Size 110*60*18.7mm
Interface and Performance
Input Interface Thunderbolt 5
Theoretical Transfer Rate 6000MB/s Read
5800MB/s Write
Data Cable C To C 0.5M 80G Data Cable
Capacity Options
Diskless No built-in SSD
Built-in Capacity Options 512GB, 1TB, 2TB, 4TB
Compatibility and Box Contents
Support system Window / Mac / Linux
Packing list Data cable x1
instruction manual x1
thermal conductive silicone x2
screwdriver *1

ORICO X50 – Design and Build

The X50 has a slightly larger enclosure than most slim portable SSDs. At 110mm long, 60mm wide, and 18.7mm thick, it is still portable, but it is thicker than the slim card-style drives that are designed to slip easily into a pocket. ORICO uses an aluminum alloy body with rounded corners, a silver finish, and a top panel covered with a dark perforated surface, which promotes thermal control. It feels very sturdy when handled.

Orico X50 2

The port layout includes a single front-mounted Thunderbolt 5 port, with a small LED status light next to it for quick activity visibility. Besides that, the enclosure is kept clean and minimal, with branding along the side.

Orico X50 bottom

ORICO has also built the X50 with a ribbed underside, thermal conductive silicone pads, and a cooling film. That is important for an SSD of this class because the interface speed is high enough that thermal limits can become a real, sustained performance limitation. It also comes bundled with a screwdriver for those who want to mount their own drive.

With the top panel off, the X50 is very easy to work with, which is important for a diskless enclosure like this. The SSD (the Samsung in our case) is mounted on a compact internal board and secured with a single screw, as usual, while the underside of the cover has a thermal pad that presses down onto the drive once everything is closed.

Overall, it’s a very unique design, and it certainly looks more like a premium enclosure than a mass-market portable SSD. The trade-off is that it’s a bit bigger than some external SSDs, but that is normal for a device designed to handle far more bandwidth and heat than a basic portable USB drive.

ORICO X50 – Performance

For testing, we used a Dell Pro Max 14 and installed a 2TB Samsung 990 Pro SSD.

Blackmagic Diskspeed Test

The Blackmagic Disk Speed Test benchmarks a drive’s read and write speeds to estimate its performance, especially for video editing tasks. It helps users ensure their storage is fast enough for high-resolution content, such as 4K or 8K video. The Blackmagic results show clear, real-world performance.

In this run, the ORICO X50 posted 3,824.6 MB/s write and 2,568.1 MB/s read speeds, which put it well beyond the range of a typical USB portable SSD and into territory much more relevant for heavier professional usage.

ORICO X50 Blackmagic DiskSpeed Test

The read speed is below the quoted theoretical ceiling, but it is still very fast for an external drive, and the write speed, in particular, is impressive.

IOMeter

We also ran the ORICO X50 through IOMeter to better understand its behavior under both sequential and random workloads. For this round, we tested the drive at 1 queue for lighter access patterns and at 2 queue to see how it scales once the workload becomes more demanding.

At 1 queue, the X50 posted 1550.1 MB/s read and 1513.0 MB/s write in the sequential 2 MB test. Random 2MB performance came in at 1803.4 MB/s read and 1394.0 MB/s write, while 4K random performance reached 3522 IOPS read and 12344 IOPS write. That is a strong opening result, with especially good large-block random read speed for an external drive.

IOMeter (1 queue) ORICO X50
Seq 2MB Read 1,550.1 MB/s
Seq 2MB Write 1,513.0 MB/s
Random 2MB Read 1,803.4 MB/s
Random 2MB Write 1,394.0 MB/s
Random 4K Read 3,522 IOPS
Random 4K Write 12,344 IOPS

Moving up to 2 queue, the X50 scales sharply in sequential work, climbing to 5934.9MB/s read and 5354.8MB/s write. Random 2MB reads also jump to 5464.5 MB/s, while writes jump to 1577.2 MB/s. In 4K random activity, reads reach 15,908 IOPS and writes reach 87,279 IOPS. The read scaling here is very strong, and the sequential numbers are very close to ORICO’s rated ceiling, which is a good sign for the enclosure and host combination used in this test.

IOMeter (2 queue) ORICO X50
Seq 2MB Read 5,934.9MB/s
Seq 2MB Write 5,354.8MB/s
Random 2MB Read 5,464.5MB/s
Random 2MB Write 1,577.2MB/s
Random 4K Read 15,908IOPS
Random 4K Write 87,279IOPS

PCMark 10

PCMark 10’s Data Drive Benchmark goes beyond simple peak transfer rates and examines how a drive performs across a broader range of storage activity. Instead of focusing only on large sequential reads and writes, it is meant to reflect workloads closer to day-to-day use, including more varied file access patterns than a raw throughput test. That makes it a helpful benchmark for external SSDs such as the X50, as it gives a better idea of how a drive may perform when used for active project files, application data, game storage, and general file movement, not just large copy jobs.

In this run, the ORICO X50 posted a PCMark 10 Data Drive Benchmark score of 3,503, with a bandwidth of 514.94 MB/s and an average access time of 44ms. That is a strong result for an external drive.

It is not going to match a flagship internal Gen5 SSD result, but for an external drive, this is still a strong PCMark 10 score and shows that the X50 is great for heavier everyday work like active project storage, large file transfers, media editing, application files, and game libraries, not just cold storage.

Conclusion

The ORICO X50 is a high-speed external SSD for people who have more demanding storage needs than a typical USB portable drive can handle. Between the Thunderbolt 5 connection, the option to buy it diskless so you can use your own drive, and the larger aluminum enclosure, this is much more than a small carry-around SSD for casual file transfers. The X50 is still easy enough to carry around, but the thicker enclosure and thermal-focused design make it feel closer to a high-speed external work drive than a basic portable SSD.

Paired with a 2TB Samsung 990 Pro, Blackmagic posted an impressive 3,824.6 MB/s write speed, and IOMeter showed better performance as workload depth increased, with sequential read throughput climbing to 5,934.9 MB/s. PCMark 10 also showed how the X50 performs outside large sequential transfers, yielding a score of 3,503. Looking at the overall results, the X50 is definitely best used as active external storage for project files, large media transfers, and heavier day-to-day file work rather than as a simple backup drive. That said, exact performance will still depend on the SSD and the host system’s specs.

Priced at $199.99, the diskless X50 is easy to justify for anyone who already has a fast NVMe drive on hand, since the enclosure itself is not priced out of line for early Thunderbolt 5 hardware. The 1TB model at roughly $329.99 is harder to judge next to ordinary USB portable SSDs. However, the performance results here do a lot to justify that premium, especially when the drive delivers almost 6GB/s in read transfer speeds, which standard USB options cannot match.

The post ORICO X50 Review: Thunderbolt 5 Speed in a Portable SSD Enclosure appeared first on StorageReview.com.

KIOXIA Launches BG8 Client SSDs For Mainstream PC OEMs

28 April 2026 at 15:28
KIOXIA BG8 KIOXIA BG8

KIOXIA has introduced the BG8 Series, a new client SSD line aimed at PC OEMs that brings the PCIe Gen5 interface into more mainstream systems. The lineup is designed for a broad range of everyday computing hardware, including slim laptops, consumer and commercial notebooks, and desktop PCs.

KIOXIA BG8

KIOXIA BG8 Features and Performance

KIOXIA’s BG8 Series features 8th-generation BiCS FLASH TLC 3D flash memory, which improves both speed and power efficiency over the previous generation. KIOXIA indicates performance gains of up to 47% in sequential read, 67% in sequential write, 44% in random read, and 30% in random write, with that comparison tied specifically to its earlier generation based on BiCS FLASH generation 5 memory.

For raw throughput, the company says the BG8 Series can reach sequential read speeds of up to 10,300MB/s and sequential write speeds of up to 10,000MB/s. Random performance is rated at up to 1.4 million read IOPS and 1.3 million write IOPS, figures that place the drive in the high end of client storage performance, even though the product itself is meant for mainstream PC designs. KIOXIA says this combination enables OEMs to build faster, more responsive PCs across a wider range of workloads.

The BG8 is a DRAM-less SSD, so instead of onboard DRAM, it uses Host Memory Buffer support, which allows the drive to tap the host system’s memory to help balance speed, power use, and cost. DRAM-less SSDs have often involved compromises, especially under heavier workloads. KIOXIA is essentially using the BG8 to enable faster PCIe Gen5 speeds while maintaining the cost and power efficiency that matter for mainstream PC designs.

KIOXIA BG8 Form Factors, Capacities, and Compliance

KIOXIA will ship the drives in multiple M.2 form factors, including Type 2230, Type 2242, and Type 2280, giving OEMs the flexibility to use the same family across compact and standard layouts. That range is particularly useful for thin-and-light laptops and other systems where board space and mounting constraints vary from one product design to another.

In terms of standards support, the new SSD is compliant with PCIe Gen5 in a Gen5 x4 configuration and NVMe 2.0d. KIOXIA is also offering Self-Encrypting Drive support based on Trusted Computing Group Opal version 2.02, although the document notes that availability of SED models may vary by region.

Capacity options listed for the BG8 Series are 512GB, 1TB, and 2TB.

KIOXIA BG8 Availability

The BG8 Series is currently sampling to select PC OEM customers. Systems using the new SSD are expected to begin shipping in the 2nd quarter of 2026, which means the first commercial appearances should come through finished PCs rather than retail-branded standalone drives.

KIOXIA Client SSDs

The post KIOXIA Launches BG8 Client SSDs For Mainstream PC OEMs appeared first on StorageReview.com.

HP ZGX Nano G1n AI Station Review: A Secure, Sustainable Desk-Side AI Node

24 April 2026 at 19:01

The DGX Spark platform is familiar territory for us at this point. We’ve reviewed the Dell, ASUS, Acer, and Gigabyte takes on NVIDIA’s GB10 Grace Blackwell reference design, and the core ingredients are consistent across all of them: 1,000 TOPS of FP4 compute, 128GB of unified LPDDR5x memory, and dual 200GbE networking in a 150mm chassis. HP’s ZGX Nano G1n AI Station builds on that foundation, but the way HP has built around it sets this unit apart from the rest of the Spark field.

HP ZGX Nano G1n front bezel

The most visible differences are in materials and construction. HP wraps the ZGX Nano in a chassis built from up to 75% recycled aluminum and 20% recycled steel, with packaging that carries up to 93% recycled content. The internal layout splits the chassis into upper and lower halves, making it easier to access components like the SSD and coin-cell battery than on several of the Spark units we’ve tested. Thermally, HP rates the system at 22 dBA idle and 27.6 dBA under intensive workloads, quiet for a system dissipating approximately 780 BTU/hr at peak.

Security is where HP pushes furthest past the reference platform. The ZGX Nano ships with TPM 2.0 operating in FIPS 140-2 certified mode, meets Common Criteria EAL4+, and includes BIOS-level secure boot and PXE controls. Storage is factory-installed as a self-encrypting OPAL NVMe drive. Taken together, HP is positioning this unit not only as a developer desk-side AI node but also as a system that can operate within regulated environments where supply chain certifications, encryption at rest, and tamper resistance matter for procurement.

Specification HP ZGX Nano G1n AI Station
Overview
Product Name HP ZGX Nano G1n AI Station
Form Factor Mini
Operating System NVIDIA DGX OS 7 / Ubuntu 24.04
NOTE: This product does not support Microsoft Windows.
Hardware
Processor NVIDIA GB10 Grace Blackwell Superchip
Blackwell Architecture GPU
20-core Arm CPU (10x Cortex-X925 + 10x Cortex-A725)
Blackwell CUDA Cores
5th Gen Tensor Cores
4th Gen RT Cores
1x NVENC
1x NVDEC
Memory 128GB LPDDR5x, unified, 16 channels, soldered
Memory Bandwidth 273 GB/s
Storage (Internal I/O) 1x M.2 PCIe Gen5 x4
Options: 2TB or 4TB PCIe Gen4 x4 NVMe (2242, SED OPAL TLC)
Networking & I/O
Rear I/O Ports 1x USB-C power (240W)
3x USB-C 20Gbps (DisplayPort 1.4a, 30W total)
1x HDMI 2.1a
1x 10GbE RJ-45
2x QSFP 200GbE (ConnectX-7)
Network Controllers Realtek RTL8127-CG 10GbE
NVIDIA ConnectX-7 200GbE
WLAN & Bluetooth AzureWave AW-EM637
Wi-Fi 7 + Bluetooth 5.4
Performance
AI Compute Up to 1,000 TOPS (FP4)
Model Capacity Up to 200B parameters
Physical & Power
Dimensions (H x W x D) 2.01″ (no feet) / 2.1″ (with feet)
5.9″ x 5.9″
Weight Starting at 1.25kg (2.76 lbs)
Power Supply 240W USB-C external adapter, 89% efficiency, active PFC

Build and Design

The HP ZGX Nano G1n takes a noticeably different approach to the DGX Spark design compared with the other systems we have looked at so far (see our Dell/ASUS/Acer/Gigabyte reviews). Instead of the more common build, where the internals feel tucked into a top cover, HP splits the chassis into upper and lower halves, making the internal layout easier to understand once inside. What first appears more complicated turns out to be fairly practical, with straightforward access to parts like the coin-cell battery and SSD after removing just a handful of screws. That more considered internal structure also carries over to the outer build, where HP places greater emphasis on how the system is constructed and the materials used throughout.

That said, HP wraps it in a sleek black case with a 150mm-square footprint and relies heavily on recycled materials. Specifically, the build uses up to 75% recycled aluminum, 20% recycled steel, and significant amounts of post-consumer recycled plastics. Even the packaging reflects this commitment. Corrugated materials contain up to 93% recycled content, and plastic packaging incorporates at least 30% recycled content.

Thermally, the system relies on forced-air cooling. This is a notable engineering choice given the density of the NVIDIA GB10 Grace Blackwell Superchip. Despite its compact footprint, HP specifies a full thermal envelope. Under maximum load, the system dissipates up to approximately 780 BTU/hr, depending on configuration. Peak system power draw reaches approximately 228W. Furthermore, HP advertises relatively low noise levels, rated at 22 dBA at idle and 27.6 dBA under intensive workloads.

HP ZGX Nano G1n bottom

Physically, the unit measures 5.9 x 5.9 x 2.01 inches without feet, firmly placing it in ultra-compact territory. HP explicitly states that the unit is not rack-mountable, reinforcing its role as a desk-side AI node rather than traditional data center infrastructure. Serviceability is minimal by design. Users need a #1 Phillips screwdriver to access internal components, and most components, including memory, are non-user-replaceable.

HP ZGX Nano G1n internal fan section

Internally, the ZGX Nano uses NVIDIA’s reference board design, as do many other OEMs building on the DGX Spark platform. The LPDDR5x memory is soldered directly to the board and runs at up to 8533 MHz. Overall, the platform prioritizes efficiency and density over modularity.

Security and Upgradability

HP locks down the ZGX Nano G1n by design. It features an integrated TPM 2.0 module that operates in FIPS 140-2-certified mode, meets Trusted Computing Group specifications, and is Common Criteria EAL4+ certified. BIOS-level protections include secure boot controls, PXE-based remote boot capabilities, and the ability to disable boot from removable media entirely.

HP ZGX Nano G1n with bottom cover off

From a hardware standpoint, HP is explicit: this system is not upgradeable. The 128GB of LPDDR5x unified memory sits soldered directly to the board. Additionally, buyers must select storage at the time of purchase. While the single M.2 slot supports PCIe Gen5 x4 electrically, factory configurations ship with PCIe Gen4 x4 NVMe SSDs. These come in 2TB or 4TB capacities and are all self-encrypting OPAL drives.

HP notes that spare parts will remain available for up to five years after production ends. Nevertheless, this is fundamentally an appliance-style system rather than a modular workstation.

I/O and Expansion

The front of the unit is minimalist, featuring only a power button and a status LED. On the back, the system offers a dense array of high-performance connectivity options. HP delivers power via a standard NVIDIA-recommended 240W USB-C adapter and warns that third-party adapters may cause degraded performance or instability.

HP ZGX Nano G1n rear ports and connectivity

Three USB 3.2 Type-C ports provide USB connectivity, each operating at 20 Gbps and supporting DisplayPort 1.4a Alt Mode. A dedicated HDMI 2.1a port provides additional display output. For networking, the system includes both a Realtek RTL8127-CG 10GbE controller and an NVIDIA ConnectX-7 controller, providing dual 200GbE QSFP112 ports, each with 200 Gbps throughput.

The networking stack supports a wide range of enterprise features. These include PXE boot, Wake-on-LAN, VLAN tagging (802.1Q), time synchronization (802.1as/1588), and full-duplex operation across all supported speeds. Additionally, a Wi-Fi 7 (802.11be) 2×2 module with Bluetooth 5.4 provides wireless connectivity and supports MU-MIMO, WPA3 security, and operation across the 2.4GHz, 5GHz, and 6GHz bands.

Graphics and Audio

The integrated NVIDIA Blackwell GPU in the GB10 Superchip handles all graphics tasks. The system supports up to 8K output at 60Hz via USB-C DisplayPort 1.4a and 8K at 30Hz via HDMI 2.1a. HP recommends using direct cable connections for 8K output, as adapters or docks may cause instability or degrade signal quality.

Audio runs over HDMI, with no dedicated analog audio outputs. This aligns with the system’s positioning as a compute node rather than a traditional multimedia workstation.

Thermals Testing

CPU Temperature

During CPU thermal testing, the HP ZGX Nano G1n reached a peak temperature of 77.3°C during the workload’s more intense bursts. This places HP below the hottest systems in the comparison stack during peak transitions, as other units climbed into the 90°C range. As the workload transitioned into Equal ISL/OSL and then Decode Heavy, CPU temperatures stabilized rather than continuing to rise sharply.

At the lower end, the CPU recorded a minimum temperature of 36.4°C during light-load conditions. This means the HP has effective heat dissipation when the system is not under heavier computational stress. Overall, the ZGX demonstrated controlled burst CPU thermal behavior with stable sustained-load performance.

 

GPU Temperature

GPU thermals followed a similar pattern. During periods of heavy acceleration, the GPU reached a maximum temperature of 69°C. This positions HP on the cooler side of the comparables during peak burst conditions, with several other systems (like the Dell, ASUS, and Founders Edition) running noticeably warmer at the top end. As activity shifted into Equal ISL/OSL and Decode Heavy phases, GPU temperatures leveled off and remained stable.

The GPU recorded a minimum temperature of 34°C during lighter phases, indicating solid idle thermal capabilities.

NVMe Temperature

During the Equal phase, the NVMe drive reached roughly 42°C, showing only a gradual rise from its resting baseline. As the workload shifted to Prefill Heavy, the storage temperature rose noticeably, ranging from 42°C to 47°C. In Decode Heavy, the drive operated in its warmest range, 47°C to 54°C, where it peaked, yet remained noticeably below most other Spark systems.

NIC Temperature

During the Equal phase, NIC temperature ranged from 39°C to 52°C, showing a steady climb, indicating moderate thermal buildup as network activity ramps up early in the run.

In Prefill Heavy, NIC thermals increased, ranging from 48°C to 64°C, because this phase places much more sustained pressure on the networking subsystem. During Decode Heavy, NIC temperature was in its warmest range, 52°C to 68°C, where the peak was reached. Nonetheless, thermal behavior remained stable throughout the test.

GPU Power Consumption

During the Equal phase, GPU power consumption ranged from 2.86W to just over 40W, placing the HP ZGX Nano G1n in the middle of the pack.

In Prefill Heavy, GPU power started at roughly 37W, dipped to as low as 35W, and spiked to as high as 69W, making this the most power-intensive phase of the run.

During Decode Heavy, GPU power consumption settled into a lower, more stable range of 35W to 46W, indicating that power demand eased as the workload shifted away from the more aggressive burst behavior.

Thermal Summary

Under load, the ZGX Nano G1n operates within a tightly controlled thermal envelope. Maximum system power consumption is approximately 228W, and heat dissipation is approximately 780 BTU/hr. By contrast, idle power draw remains low at approximately 36–38W, which indicates efficient power scaling when the system is not active. The forced-air cooling solution maintains stable operation within HP’s specified range of 5°C to 30°C.

HP ZGX Nano AI Performance Testing

To evaluate the HP ZGX Nano with GB10, we tested Spark units using the vLLM Online Serving benchmark, the most widely adopted high-throughput inference and serving engine for large language models. The vLLM online serving benchmark simulates real-world production workloads by sending concurrent requests to a running vLLM server and measuring key metrics, including total token throughput (tokens per second), time to first token, and time per output token, across varying load conditions.

Our testing spanned a range of models, including dense architectures and micro-scaling data types, and evaluated performance across three workload scenarios: Equal ISL/OSL, Prefill Heavy, and Decode Heavy. These scenarios represent distinct real-world serving patterns, from balanced input and output loads to compute-intensive prompt processing and memory-bandwidth-bound token generation.

In addition to the HP ZGX Nano with GB10, we benchmarked other OEM systems from Dell, ASUSAcer, and Gigabyte. This allowed us to place HP’s results within the broader competitive landscape and understand where it leads, keeps pace with the pack, or trails across different models and workloads.

GPT-OSS-120B

With GPT-OSS-120B, the HP ZGX Nano G1n posts its strongest results in Prefill Heavy, where throughput climbs from 304.5 tok/s at batch 1 to 2773.3 tok/s at batch 64. Equal ISL/OSL also scales steadily, rising from 69.6 tok/s to 722.9 tok/s across the sweep. Decode Heavy is much lighter by comparison, starting at 183.7 tok/s in batch 1, dipping slightly in batch 2, then recovering to 262.9 tok/s by batch 64.

 

GPT-OSS-20B

With GPT-OSS-20B, HP’s highest numbers come from Prefill Heavy, but the scaling is less linear than with the other models. Prefill starts at 1626.6 tok/s at batch 1, climbs to 1980.3 tok/s at batch 2, drops sharply to 1120.3 tok/s at batch 4, then recovers to 4345.1 tok/s by batch 64. Equal ISL/OSL scales more smoothly from 92.6 tok/s to 1550.6 tok/s, and Decode Heavy rises from 94.4 tok/s to 670.4 tok/s.

Qwen3 Coder 30B A3B FP8

For Qwen3 Coder 30B A3B (FP8), HP again excels in Prefill Heavy, with throughput increasing from 432.2 tok/s at batch size 1 to 2069.4 tok/s at batch size 64. Equal ISL/OSL rises from 104.2 tok/s to 1274.4 tok/s, while Decode Heavy improves from 55.9 tok/s to 480.4 tok/s. This is among HP’s stronger overall results.

Qwen3 Coder 30B A3B Base

On Qwen3 Coder 30B A3B (Base), HP delivers steady growth across all three phases, although the topline remains in the Prefill Heavy phase. That phase increases from 258.6 tok/s at batch 1 to 1629.4 tok/s at batch 64. Equal ISL/OSL scales from 60.3 tok/s to 690.3 tok/s, while Decode Heavy rises from 33.0 tok/s to 331.8 tok/s.

Llama 3.1 8B Instruct FP4

With Llama-3.1-8B-Instruct (FP4), HP shows a clear step up in throughput. Equal ISL/OSL climbs from 76.4 tok/s at batch 1 to 2774.1 tok/s at batch 64, making it the strongest of HP’s three phases on this model. Prefill Heavy also scales aggressively, rising from 316.8 tok/s to 2397.1 tok/s at batch 32 before slipping to 2270.4 tok/s at batch 64. Decode Heavy increases from 40.7 tok/s to 547.6 tok/s across the sweep.

Llama 3.1 8B Instruct (Base)

On Llama-3.1-8B-Instruct (Base), the HP ZGX Nano G1n scales cleanly across all three phases. In Equal ISL/OSL, throughput rises from 28.2 tok/s at batch 1 to 1298.6 tok/s at batch 64. In Prefill Heavy, HP increases from 123.2 tok/s to 1759.5 tok/s, with gains remaining strong throughout the sweep before tapering slightly at the top end. Decode Heavy is much lighter by comparison, rising from 15.5 tok/s at batch 1 to 366.4 tok/s at batch 64.

GPU Direct Storage

How GPU Direct Storage Works

Traditionally, when a GPU processes data from an NVMe drive, the data must first pass through the CPU and system memory before reaching the GPU. This process creates bottlenecks because the CPU acts as a middleman, adding latency and consuming system resources. GPU Direct Storage eliminates this inefficiency by allowing the GPU to access data directly from the storage device over the PCIe bus. This direct path reduces data movement overhead, enabling faster, more efficient transfers.

AI workloads, especially those involving deep learning, are highly data-intensive. Training large neural networks requires processing terabytes of data, and any delay in data transfer leads to underutilized GPUs and longer training times. Accordingly, GPU Direct Storage addresses this challenge by delivering data to the GPU as quickly as possible, minimizing idle time and maximizing computational efficiency.

In addition, GDS benefits workloads that stream large datasets, such as video processing, natural language processing, and real-time inference. By reducing CPU reliance, GDS accelerates data movement and frees CPU resources for other tasks, further enhancing overall system performance.

GDSIO Read Throughput 16K

Looking at GDSIO Read Throughput 16K, the HP ZGX Nano G1n starts at 0.70GiB/s with 1 thread, placing it among the stronger low-thread performers in the group. It dips to 0.41GiB/s at 2 threads, then climbs back to 0.86GiB/s at 4 threads, showing the same small early-thread inconsistency seen in a few of these systems. From there, scaling becomes much more consistent. Throughput rises to 1.6GiB/s at 8 threads and 2.2GiB/s at 16 threads, then continues upward to 3.0GiB/s at 32 threads. At the higher queue depths, the HP keeps gaining ground, reaching 3.9GiB/s at 64 threads and peaking at 4.6GiB/s at 128 threads.

GDSIO Read Average Latency 16K

Looking at GDSIO Read Average Latency (16K), the HP ZGX Nano G1n starts at approximately 0.02ms with 1 thread and remains low through 2 threads (0.08ms) and 4 threads (0.07ms). Latency edges up slightly at 8 threads (0.08ms) and 16 threads (0.11ms), then increases more noticeably at 32 threads (0.16ms) and 64 threads (0.25ms). At 128 threads, latency reaches 0.42ms, still a bit below the highest results in the group while tracking the system’s steady throughput scaling across the test.

GDSIO Write Throughput 16K

Looking at GDSIO Write Throughput 16K, the HP ZGX Nano G1n starts at 0.84GiB/s on 1 thread, rises to 1.4GiB/s on 2 threads, and reaches 2.2GiB/s on 4 threads. Performance continues to scale strongly at 8 threads (3.0 GiB/s) and reaches 3.3GiB/s at 16 threads, where it effectively levels off. From there, throughput remains nearly flat at 3.3GiB/s with 32 and 64 threads, then eases slightly to 3.2GiB/s with 128 threads, indicating the platform reaches its write ceiling relatively early and sustains that level consistently through the rest of the sweep.

GDSIO Write Average Latency 16K

Looking at GDSIO Write Average Latency (16K), the HP ZGX Nano G1n starts at approximately 0.02ms with 1 thread and remains very low through 2 threads (0.02ms) and 4 threads (0.03ms). Latency rises modestly at 8 threads (0.04ms) and 16 threads (0.07ms), then jumps at 32 threads (0.15ms) and 64 threads (0.30ms). At 128 threads, latency reaches 0.61ms, still fairly well controlled overall, though the upward trend aligns with the point where write throughput has already flattened at higher thread counts.

GDSIO Read Throughput 1M

Looking at GDSIO Read Throughput 1M, the HP ZGX Nano G1n starts at 3.2GiB/s on 1 thread and rises to 4.1GiB/s on 2 threads. Performance continues to climb at 4 threads (5.2GiB/s) and 8 threads (5.5GiB/s), after which the platform effectively reaches its ceiling. Throughput then holds essentially flat at 5.5GiB/s for 16, 32, and 64 threads, before easing slightly to 5.3 GiB/s at 128 threads, indicating a strong early ramp followed by a very stable high-thread plateau.

GDSIO Read Average Latency 1M

Looking at GDSIO Read Average Latency (1M), the HP ZGX Nano G1n starts at approximately 0.31ms with 1 thread and remains relatively low at 2 threads (0.47ms) and 4 threads (0.76ms). Latency increases with concurrency, rising to 1.4ms at 8 threads, 2.9ms at 16 threads, and 5.9ms at 32 threads. The trend continues at 64 threads (12.8ms) and reaches 27.2ms at 128 threads, tracking the higher queue depths even though throughput had already flattened much earlier in the sweep.

GDSIO Write Throughput 1M

Looking at GDSIO Write Throughput 1M, the HP ZGX Nano G1n starts at 3.1GiB/s with 1 thread and rises to 3.5GiB/s with 2 threads, then holds that level at 4, 8, and 16 threads. Performance dips slightly to 3.3GiB/s at 32 threads before returning to 3.5GiB/s at 64 threads. At 128 threads, throughput increases to 3.7GiB/s, indicating a mostly flat write profile across the sweep with only minor variation and a small uptick at the highest thread count.

GDSIO Write Average Latency 1M

Looking at GDSIO Write Average Latency (1M), the HP ZGX Nano G1n starts at approximately 0.31ms with 1 thread, rising to 0.57ms with 2 threads and 1.1ms with 4 threads. Latency continues to climb as concurrency increases, reaching 2.2ms with 8 threads, 4.4ms with 16 threads, and 9.4ms with 32 threads. The upward trend continues at 64 threads (17.7ms) and reaches 37.3ms at 128 threads, reflecting steadily increasing queue pressure even though write throughput itself remains fairly flat through most of the sweep.

Conclusion

HP’s ZGX Nano G1n carries the DGX Spark platform’s expected performance profile and adds engineering choices that set it apart from the other Spark systems in the field. In our testing, CPU temperatures peaked at 77.3°C and GPU temperatures at 69°C, both on the cooler side of the Spark units we’ve benchmarked. vLLM performance was strongest in Prefill Heavy workloads across all six models we tested, with scaling that held cleanly through higher batch sizes. GPU Direct Storage read throughput reached 4.6 GiB/s at 16K and 5.5 GiB/s at 1M block sizes, and write throughput plateaued early but held that level consistently across the remaining thread counts.

HP ZGX Nano G1n stacked

Where the ZGX Nano G1n separates itself from the rest of the Spark field is in the work HP did around the reference design. The recycled-materials content, the upper/lower-chassis split that improves internal serviceability, and the acoustic envelope that holds at 27.6 dBA under load all reflect deliberate engineering choices beyond what the GB10 platform itself requires. The security stack follows the same pattern. TPM 2.0 in FIPS 140-2 mode, Common Criteria EAL4+, and SED OPAL storage push this unit past a developer appliance and toward a system that can clear procurement in regulated environments.

Like other Sparks, this is not a general-purpose workstation, and HP does not position it as one. For developers, small teams, and organizations that need local AI compute with credible sustainability and security stories behind the purchase, the ZGX Nano G1n is a clear differentiated option within the Spark lineup. For shops where those criteria do not apply, the underlying platform is the constant across all five OEM systems we’ve reviewed, and the decision comes down to ecosystem, support, and price.

Product Page – HP ZGX Nano G1n AI

The post HP ZGX Nano G1n AI Station Review: A Secure, Sustainable Desk-Side AI Node appeared first on StorageReview.com.

LaCie 8big Pro5 Review: 256TB of HAMR-Powered Thunderbolt 5 DAS

23 April 2026 at 20:53

LaCie has been a fixture in our lab for well over a decade. From the 8big Rack Thunderbolt 2 we covered in 2014 through the many generations of 5big, 6big, 8big, and Rugged devices that have followed, the formula has been consistent: premium Neil Poulton-designed enclosures, Seagate drives inside, Mac-centric polish, a solid warranty, and a clear focus on creative professionals. The new LaCie 8big Pro5 carries that pedigree forward in build quality, design, and purpose, and arrives at a notable inflection point for high-capacity direct-attached storage.

With eight 32TB HAMR-based Seagate IronWolf Pro drives on board, the 8big Pro5 tops out at 256TB of raw capacity. As far as turnkey desktop DAS products go, nothing else on the market ships at that capacity today. Competing 8-bay Thunderbolt enclosures from OWC, Sabrent, and others cap out at around 192 TB with the previous-generation PMR drives. While it is technically possible to roll your own by pairing a bare enclosure with eight 32TB IronWolf Pros, that DIY route leaves you stitching together the warranties across vendors. Seagate backs the complete LaCie kit end-to-end, including the drives, which is an advantage at this capacity point and for the value of the workloads involved.

Heat-assisted magnetic recording has been more than two decades in the making, and it has finally moved from hyperscale sampling to a product that a creative professional can put on a desk. For teams working with multi-stream 4K and 8K RAW footage, large photogrammetry or virtual production asset libraries, or AI-assisted content pipelines that consume storage faster than any prior generation, the jump from 24TB-era PMR drives to 32TB HAMR in the same eight bays is a meaningful change. We walked through the technical foundations of HAMR with Seagate’s Colin Presly on Podcast #124: The Path to 50TB HDDs with Frickin Lasers. The roadmap Colin laid out then is now shipping as product, with Mozaic 3+ drives at 30TB and up, Mozaic 4+ pushing to 44TB, and a longer arc toward 100TB drives as platter density continues to climb.

Around that storage core, LaCie delivers the rest of the package you would expect. The 8big Pro5 connects via Thunderbolt 5, which Seagate quotes at up to 80Gbps bidirectional for data, with additional headroom when combined with display traffic. In practice, the ceiling for a hard-drive array is set by the drives themselves. The IronWolf Pro 32TB is rated for up to 285 MB/s sustained, so eight drives in parallel have a theoretical maximum of about 2.2 GB/s before caching effects are taken into account.

The host port delivers up to 140W of power to a connected laptop, with two downstream Thunderbolt 5 ports rated at 30W each and a USB 20Gbps port rated at 15W for daisy-chained peripherals and displays. The LaCie 8big Pro5 ships preconfigured as a single RAID 5 array for 224TB of usable capacity, with RAID 0, 1, 6, 10, 50, and 60 available through LaCie RAID Manager. Build quality, thermals, and design are vintage LaCie, which we will cover in detail throughout the rest of this review. Pricing starts at $5,979 for the 32TB base configuration, with SKUs available up to 64TB, 128TB, 192TB, and 256TB.

LaCie 8big Pro5 – Build and Design

At the front of the LaCie 8big Pro5, the unit features a clean, minimal industrial design that aligns with its professional focus. It measures 11.69 inches in length, 9.13 inches in width, and 8.46 inches in height, giving it a compact yet substantial footprint for an eight-bay system.

Our review unit shipped fully populated with eight of Seagate’s new IronWolf Pro 32TB drives, for a total raw capacity of 256TB. With all drives installed, the system weighs just over 29 pounds, underscoring both its density and solid construction.

The enclosure itself is crafted from a single-piece aluminum chassis finished in metallic gray, giving it a premium, durable feel. Up front, each drive bay is tool-less, allowing quick, easy access to swap or service drives. Each tray is paired with an individual status LED, providing clear, at-a-glance visibility into drive activity and health without requiring interaction with the software.

At the rear, the LaCie 8big Pro5 maintains the same clean, functional design, with heavy perforations across the back panel to support airflow in a fully populated chassis. Power is handled via a standard C19 input and a physical power switch, confirming that the power supply is fully integrated into the unit rather than relying on an external brick.

Connectivity centers on four USB-C ports, each clearly labeled for its role. The leftmost port serves as the primary host connection, operating over Thunderbolt 5 with up to 80Gbps bandwidth and delivering up to 140W of power, making it well-suited for powering and connecting a laptop with a single cable.

Next to it are two additional Thunderbolt 5 downstream ports. These ports enable expansion beyond the enclosure, supporting external storage devices or displays while also delivering up to 30W of power to connected peripherals. This makes the unit function as both a high-capacity storage array and a compact docking hub.

The final USB-C port supports a 20 Gbps connection, intended primarily for additional storage expansion. It also provides up to 15W of power, which is sufficient for bus-powered drives and similar accessories.

To round things out, there is a Kensington lock slot for physically securing the device, a practical addition for shared workspaces or studio environments where the unit may not always be in a controlled rack or locked room.

From a wider rear view, the airflow design becomes much more apparent. The majority of the back panel is perforated, allowing the system to move a significant amount of air across all eight drives. Cooling is handled by a three-fan setup, with two larger fans serving the primary drive bay area and a smaller fan dedicated to the lower section housing the controller and power components. This separation helps ensure consistent airflow across both the storage and internal electronics. This is especially important in a fully populated 256TB configuration where thermal buildup can become a limiting factor over sustained workloads.

You can also see the subtle branding here, with “LaCie – design by Neil Poulton” centered along the upper portion of the rear panel, reinforcing the industrial design heritage that has been a hallmark of LaCie systems for years.

Up top, LaCie adds a simple yet practical touch with the integrated handle cutouts. Machined directly into the aluminum, these recessed grips provide a secure way to lift and move the unit without compromising the clean design language.

Given that the system weighs just over 29 pounds when fully populated, a built-in grip like this makes a noticeable difference during deployment or repositioning. It is a small detail, but one that reflects an understanding that this is not a lightweight desktop accessory and will occasionally need to be handled with a bit more care.

LaCie 8big Pro5 – LaCie RAID Manager software

To manage the 8big Pro5’s storage configuration, LaCie requires its RAID Manager software. This utility is available for Windows and macOS and is necessary to configure the array in RAID modes or switch the unit to JBOD, depending on your deployment needs.

Through RAID Manager, users can choose from a full range of RAID levels, including RAID 0, RAID 1, RAID 5, RAID 6, RAID 10, RAID 50, and RAID 60. This flexibility allows the unit to be tailored for everything from maximum performance to high levels of redundancy and fault tolerance. As shown here, a RAID 5 configuration using all eight 32TB drives yields 224TB of usable capacity and provides single-drive fault tolerance through parity.

In addition to RAID configuration, the software also allows you to format the array in either APFS for macOS environments or NTFS for Windows deployments, making it easy to integrate into mixed or platform-specific workflows. The interface itself is straightforward, providing visibility into drive status, serial numbers, and overall array health, while also confirming valid configurations before deployment.

LaCie 8big Pro5 – Performance

For Windows testing, we leveraged a Dell Pro Max 14 with the following configuration:

  • Intel Core Ultra 9 285H
  • NVIDIA RTX PRO 2000 8GB GDDR7
  • 64GB LPDDR5X-8400
  • 1TB SSD

For macOS testing, we used an M4 MacBook Air.

To evaluate the performance of the 8big Pro5, we began testing in a Windows environment with ExFat, configuring the array in RAID 5. This setup reflects a common balance of capacity, performance, and redundancy for general-purpose use. In this configuration, we ran a series of benchmarks, including IOMeter for synthetic workload analysis, Blackmagic Disk Speed Test for media-focused throughput, and PCMark 10 Disk Benchmark to capture more real-world application behavior.

After completing Windows testing, we switched to a macOS environment using RAID 5 and ExFAT. This allowed us to measure the performance of the same configuration across Windows and Mac environments. In this configuration, we reran Blackmagic Disk Speed Test to compare results in a macOS-native workflow and added ATTO Disk Benchmark to analyze performance across varying transfer sizes.

Blackmagic Disk Speed Test

The Blackmagic Disk Speed Test benchmarks a drive’s read and write speeds to estimate its performance, especially for video editing tasks. It helps users ensure their storage is fast enough for high-resolution content, such as 4K or 8K video.

The Blackmagic results show clear, real-world performance gains across RAID configurations. In RAID 5 in Windows, the 8big Pro5 delivers 1,418.4 MB/s read and 2,061.5 MB/s write speeds, offering a strong balance of performance and data protection. When moved to macOS, read performance remains nearly identical at 1,414.9 MB/s, while write speeds are 1,751.3 MB/s, reflecting some platform differences rather than a limitation of the array itself.

Looking at the Blackmagic workload breakdown, RAID 5 still proves more than capable for high-resolution media workflows. At these speeds, the array comfortably supports formats up through 8K, including 8K DCI and even 12K playback in several codecs, with consistent results across ProRes 422 HQ and H.265. This reinforces that RAID 5 is not just a safe option, but a practical one for professional video editing where both performance and redundancy matter.

In practice, RAID 5 delivers more than enough performance for demanding video workflows while maintaining data protection.

Blackmagic (higher is better) LaCie 8big Pro5 – Windows Raid 5 ExFat LaCie 8big Pro5 – macOS Raid 5 ExFat
Read 1,418.4 MB/s 1,414.9 MB/s
Write 2,061.5 MB/s 1,751.3 MB/s

PCmark 10 Storage

PCMark 10 Storage Benchmarks evaluate real-world storage performance using application-based traces. They test the system and data drives, measuring bandwidth, access times, and consistency under load. These benchmarks offer practical insights beyond synthetic tests, enabling users to compare modern storage solutions effectively.

The PCMark 10 result of 717 gives a useful look at how the 8big Pro5 behaves under real-world workloads rather than pure synthetic throughput. This benchmark incorporates traces from everyday applications, which tend to be more sensitive to latency and mixed I/O patterns than large sequential transfers.

PCmark 10 Storage (higher is better) LaCie 8big Pro5 – Windows Raid 5 ExFat
Overall Score 717

IOMeter

We also ran the LaCie 8big Pro5 array through IOMeter. This lets us dig deeper into workloads, including random and sequential performance. We tested the 8big with a single queue to simulate lighter use and with four queue to see how the DAS handles heavier, more demanding scenarios.

At 1 queue, sequential performance is 1,752.2 MB/s read and 1,851.5 MB/s write, showing strong throughput even under a lighter load. Random 2MB performance lands at 233.8 MB/s read, and 654.1 MB/s write, while small-block 4K operations reach 297 IOPS read and 5,482 IOPS write.

IOMeter (1  queue) LaCie 8big Pro5 – Windows Raid 5 Raw
Seq 2MB Read 1,752.2 MB/s
Seq 2MB Write 1,851.5 MB/s
Random 2MB Read 233.8 MB/s
Random 2MB Write 654.1 MB/s
Random 4K Read 297 IOPS
Random 4K Write 5,482 IOPS

Scaling to 4 queue, sequential reads increase to 1,949.1 MB/s, while writes remain steady at 1,873.6 MB/s, indicating the array is already near its write ceiling. Random 2MB performance improves more noticeably, with reads rising to 391.1 MB/s and writes to 980.5 MB/s. For 4K workloads, reads scale to 1,103 IOPS, while writes settle at 4,458 IOPS.

IOMeter (4 queue) LaCie 8big Pro5 – Windows Raid 5 Raw
Seq 2MB Read 1,949.1 MB/s
Seq 2MB Write 1,873.6 MB/s
Random 2MB Read 391.1 MB/s
Random 2MB Write 980.5 MB/s
Random 4K Read 1,103 IOPS
Random 4K Write 4,458 IOPS

ATTO Disk Benchmark Summary (LaCie 8big Pro5 – macOS RAID 5, ExFat)

The ATTO results provide a clear picture of how the 8big Pro5 behaves in macOS when pushed to maximum throughput across a wide range of transfer sizes in a RAID 5 configuration.

At lower transfer sizes, performance ramps up gradually, as expected for an HDD-based array. Small-block operations (under 16KB) remain relatively modest, but once you move to larger transfer sizes, the system scales more effectively.

From around 64KB onward, throughput stabilizes and becomes a far more representative measure of real-world performance. Peak read speeds reach approximately 3.4 GB/s, while write performance settles slightly lower in the 2.7-3.1 GB/s range across larger block sizes.

Overall, the results show strong sequential performance, with the array delivering high read throughput and slightly lower, but still consistent, write speeds under sustained workloads.

Conclusion

The LaCie 8big Pro5 marks a meaningful leap forward for the line. At 256TB raw over Thunderbolt 5, with eight HAMR-based IronWolf Pro drives housed in a well-designed Neil Poulton enclosure, it is the first turnkey desktop DAS to deliver both a massive capacity jump and next-generation interface bandwidth to creative pros in a single box. The 8big formula is all here: premium build, thoughtful thermals, quiet operation, mature RAID management through LaCie RAID Manager, and a clear focus on the video, photo, and 3D asset workflows that have consistently outpaced the storage they rely on.

Performance lands where a well-tuned eight-bay array should. In RAID 5, the array comfortably handles multi-stream 4K and 8K editing with room to spare. Small-block random performance is modest, as expected for any HDD-based array, but that is not the workload profile this product is built for. For bulk sequential transfers, active project storage, and long-form media ingest, the array delivers the throughput that modern creative workflows need. The Thunderbolt 5 host port with 140W of power delivery, plus the two downstream TB5 ports and the 20Gbps USB-C, also make the unit a legitimate one-cable docking solution for a laptop-based edit bay, not just a storage target.

Pricing starts at $5,979 for the 32TB base configuration and scales up through 64TB, 128TB, 192TB, and 256TB tiers. That is a meaningful investment, but a 5-year warranty that covers both the enclosure and the drives end-to-end, Rescue Data Recovery Services, and the operational simplicity of a single-box deployment distinguish it from a DIY build using bare IronWolf Pros and a third-party enclosure. For creative professionals, production teams, and studios working at 4K, 8K, and beyond, and for anyone whose project data has outgrown what previous-generation PMR arrays could deliver in the same footprint, the 8big Pro5 is the most capable turnkey desktop DAS available today and earns the shortlist spot for high-end workflows that need both the capacity and the interface to match.

Product Page – LaCie 8big Pro5

The post LaCie 8big Pro5 Review: 256TB of HAMR-Powered Thunderbolt 5 DAS appeared first on StorageReview.com.

Seagate FireCuda X Vault Review: 20TB of Single-Cable Storage for Massive Game Libraries

23 April 2026 at 20:09

Seagate’s FireCuda X Vault is the gaming-flavored half of a two-drive launch that brings bus-powered USB-C to 3.5-inch external hard drives for the first time. Available in 8TB and 20TB capacities starting at $269.99, it runs on a single USB-C cable for both data and power, provided the host port can supply at least 15W. That’s the same category-first hook Seagate is pitching with the new One Touch Desktop HDD, but the FireCuda X Vault trades the One Touch’s clean-desk minimalism for customizable RGB with Windows Dynamic Lighting support, Xbox on PC certification, and a one-month Xbox Game Pass Ultimate trial.

Seagate FireCuda X Vault front

The pitch here is overflow storage for buyers who’ve outgrown smaller drives and want a clean way to add serious capacity to a gaming PC or streaming rig. Large game libraries, captured gameplay, archived installs, and media collections are the target workloads. It’s worth being upfront about what it isn’t: the 5400 RPM drive inside won’t deliver SSD-like load times, so this isn’t the place to install the games you actually play. The better pairing is an internal NVMe for active titles and the FireCuda X Vault for everything else. Despite the Xbox branding on the box, the drive is PC-only and is not compatible with Xbox Series X/S. And because 15W USB-C delivery isn’t universal on older systems, it’s worth confirming your port can feed it before committing.

Seagate bundles Toolkit with the FireCuda X Vault, adding a decent set of storage management features beyond basic file transfers. Incremental backup copies only files that are new or changed after the first run, which helps reduce backup time for repeat jobs, and it supports both scheduled backups and manual runs. The software also includes folder mirroring for keeping selected directories synced, password protection on supported setups, and direct import from USB devices or memory cards.

Seagate FireCuda X Vault side

The FireCuda X Vault 8TB model is estimated to hold roughly 110 to 145 games, based on installations ranging from 80GB to 150GB, along with about 800 hours of 1080p video or around 120 hours of 4K footage. The 20TB version increases that to around 275-360 games, about 2,000 hours of 1080p video, or roughly 300 hours of 4K video.

Backed by a 2-year warranty, Seagate includes the drive, a 0.5-meter USB-C cable, Toolkit software, a quick start guide, and two years of Rescue Data Recovery Services. Seagate also adds a one-month Xbox Game Pass Ultimate offer for new users and a two-month Adobe Creative Cloud Pro subscription, which makes sense given its gaming and content-creation use cases.

Seagate FireCuda X Vault Specifications

Specification/Feature Seagate FireCuda X Vault
Overview
Product Name Seagate FireCuda X Vault
Product Type Bus-powered USB-C external hard drive
Form Factor 3.5-inch USB-C desktop drive
Target Audience PC Gamers, Streamers, and Content Hoarders
Capacities offered 8TB, 20TB
Connectivity and Compatibility
Connection USB-C
Power Bus-powered, single-cable USB-C desktop storage, no external power required
USB-C power requirement USB-C port must supply equal to or greater than 15W for drive operation
Operating System Compatibility Compatible with most Windows and macOS systems
Time Machine Reformatting required for use with Time Machine
Toolkit software compatibility Toolkit software not compatible with ChromeOS
Xbox on PC Designed for Xbox on PC
Software and Features
Toolkit included Yes
Toolkit features Incremental Backup: Keeps data protected while minimizing backup time by saving only new or changed files
Scheduled or “Backup Now” Options: Supports both hands-off automation and manual control
Mirroring (RealTime Sync): Maintains an always-updated copy of active folders on the drive
Seagate Secure (Password Protection): Helps prevent unauthorized access if the drive is lost or shared
Import from USB / Memory Cards: Simplifies photo and video offloads directly to the drive
RGB: Allows for various RGB illumination customization options
RGB lighting Customizable RGB lighting with Windows Dynamic Lighting support
Rescue Data Recovery Services Included
Capacity Estimates
8TB ~800 hours (≈10 GB/hr) 1080p HD Video
~120 hours (≈60–70 GB/hr) 4K Video
~110-145 (≈80-150GB Each) Games
20TB ~2,000 hours 1080p HD Video
~300 hours 4K Video
~275-360 (≈80-150GB Each) Games
In the Box and Bundles
What’s in the box Firecuda X Vault Main Unit
1.64-foot (0.5m) USB-C cable
Toolkit software
Quick start guide
Warranty 2-year limited warranty (may vary in region)
Data recovery coverage 2-year Rescue data recovery services (may vary in region)
Bundled offers Free month of Xbox Game Pass Ultimate included in box (for new users)
Complimentary 2-month subscription to Adobe Creative Cloud Pro (All Apps)

Seagate FireCuda X Vault Design and Build

The FireCuda X Vault has a very distinct desktop look. The front features vertical ribbing wrapped by the outer shell, with a distinct opening at the top where the LED emits light. It provides immediate power feedback via this LED, glowing white when the drive is getting enough power and red when the USB-C source is not supplying enough.

There are no ports or controls on the front panel. One side carries only the FireCuda X branding, while the rear has only a single USB-C port. The design is pretty basic, and the LED light may make it a bit much for some work environments; however, for gaming or home use, the drive will fit in well.

The outer shell is mostly plastic, and the base uses a high-friction material that helps keep the drive in place on a desk. It runs on bus power and passive cooling.

For everyday use, the single-cable design keeps setup simple, and the shape leaves enough open space around the ribbed sections, so placing two units one above the other does not appear to create an obvious airflow problem. However, the weak point is the RGB lighting. The top light bar fits the overall style, but the diffusion is uneven, so the glow looks patchy rather than smooth.

Seagate FireCuda X Vault Performance

To evaluate the performance of the Seagate FireCuda X Vault, we compared it against the Seagate One Touch Desktop HDD across a variety of benchmarks.

Here’s the high-performance test rig we used for benchmarking:

  • CPU: AMD Ryzen 7 9850X3D
  • Motherboard: Asus ROG Crosshair X870E Hero
  • RAM: G.SKILL Trident Z5 Royal Series DDR5-6000 (2x16GB)
  • GPU: NVIDIA GeForce RTX 4090
  • OS: Windows 11 Pro

The drive inside our 8TB Seagate FireCuda X Vault self-reported as the Seagate SkyHawk (ST8000VX009) at 5400 RPM.

Blackmagic Diskspeed Test

First up is the Blackmagic test, where we evaluated the Seagate FireCuda X Vault against the One Touch Desktop HDD.

The Blackmagic Disk Speed Test benchmarks a drive’s read and write speeds to estimate its performance, especially for video editing tasks. It helps users ensure their storage is fast enough for high-resolution content, such as 4K or 8K video.

In this run, the FireCuda X Vault reached 222.4MB/s read and 158.9MB/s write. The read performance stands out here, coming in noticeably ahead of the One Touch’s 211.9MB/s, and landing fairly close to Seagate’s quoted maximums for its internal FireCuda drives. Write performance tells a different story, where the One Touch leads at 211.2MB/s, putting the FireCuda’s 158.9MB/s more in line with typical HDD behavior.

Blackmagic (higher is better) Seagate FireCuda X Vault 8TB Seagate One Touch Desktop HDD 8TB
Read 222.4 MB/s 210.9 MB/s
Write 158.9 MB/s 152.0 MB/s

IOMeter

In the 1-queue IOMeter test, the FireCuda X Vault demonstrated strong sequential performance, reaching 224.03 MB/s read and 223.37 MB/s write, outperforming the One Touch Desktop HDD, which came in at 211.26 MB/s read and 211.48 MB/s write. This reinforces the FireCuda’s advantage in sustained, large-block transfers.

Random 2MB performance was much closer between the two drives. The FireCuda posted 117.17MB/s read and 149.59MB/s write, while the One Touch slightly edged ahead in write performance at 150.06MB/s and trailed slightly in reads at 113.83MB/s. These small differences are within the margin expected for mechanical drives.

Small-block performance remained predictably low across both drives. The FireCuda delivered 429 IOPS in random 4K writes and 126 IOPS in reads, nearly identical to the One Touch at 424 IOPS in writes and 129 IOPS in reads. At this level, neither drive is designed for latency-sensitive workloads, and their performance is effectively comparable.

IOMeter Test Seagate FireCuda X Vault 8TB Seagate One Touch Desktop HDD 8TB
Seq 2MB Write 223.37 MB/s 211.48 MB/s
Seq 2MB Read 224.03 MB/s 211.26 MB/s
Random 2MB Write 149.59 MB/s 150.06 MB/s
Random 2MB Read 117.17 MB/s 113.83 MB/s
Random 4K Write 429 IOPS 424 IOPS
Random 4K Read 126 IOPS 129 IOPS

PCMark 10

PCMark 10 Storage Benchmarks evaluate real-world storage performance using application-based traces. They test the system and data drives, measuring bandwidth, access times, and consistency under load. These benchmarks offer practical insights beyond synthetic tests, enabling users to compare modern storage solutions effectively.

In PCMark 10’s Data Drive Benchmark, both drives performed nearly identically, with the Seagate One Touch Desktop HDD scoring 750 and the Seagate FireCuda X Vault close behind at 746. This minimal difference indicates that, in trace-based workloads, there is no meaningful performance gap between the two.

As expected for high-capacity HDDs, both drives are better suited for bulk storage tasks such as backups, media libraries, and large file transfers rather than latency-sensitive workloads. Overall, this result shows that real-world responsiveness between the two is effectively on par in this test.

PCMark 10 Storage (higher is better) Seagate FireCuda X Vault 8TB Seagate One Touch Desktop HDD 8TB
Overall Score 746 750

Conclusion

The FireCuda X Vault’s appeal comes down to the same category-first hook as its One Touch sibling: a 3.5-inch desktop HDD that runs off a single USB-C cable with no power brick in the mix. For gamers and streamers who want to add significant capacity to a PC or laptop setup without another power supply on the floor, that’s a quality-of-life improvement over every desktop external HDD that came before it.

Performance lands where it should, for a 5400-RPM hard drive. Sequential read and write throughput sits in the 220 MB/s range; random workloads are modest; and small-block IOPS behave like the mechanical storage they are. Those numbers are fine for bulk transfers and archival use, but they confirm this isn’t a drive for running modern games directly. Pair it with an internal NVMe for active titles and use the FireCuda X Vault for everything that doesn’t need fast access.

Starting at $269.99 for 8TB, the pricing is competitive with other high-capacity external HDDs and considerably less than that of equivalent external SSDs. The RGB execution could be cleaner, the USB-C cable is short, and buyers should verify their host port can deliver 15W before committing. Those caveats aside, the FireCuda X Vault earns its spot on the shortlist for PC gamers, streamers, and media collectors who need ample local storage with minimal cable clutter.

Product Page – Seagate FireCuda X Vault

The post Seagate FireCuda X Vault Review: 20TB of Single-Cable Storage for Massive Game Libraries appeared first on StorageReview.com.

Seagate One Touch Desktop HDD Review: 24TB Without the Power Brick

23 April 2026 at 19:54

Seagate’s new One Touch Desktop HDD sidesteps one of the staples of the desktop external drive category: the power brick. The refreshed lineup runs 8TB, 20TB, and 24TB in a 3.5-inch chassis, but instead of a DC input and wall adapter, it draws everything it needs over a single USB-C cable. Seagate bills it as the industry’s only bus-powered USB-C desktop HDD, which is a meaningful shift in a segment where cable count and desk clutter have long been accepted costs of doing business. Pricing starts at $259.99 for 8TB and tops out at $619.99 for 24TB.

Beyond the cable story, the One Touch Desktop HDD is straightforward mechanical storage aimed at backup and archive workloads. It slots between the complexity of a NAS and the cost of high-capacity SSDs, working well as a companion to a smaller internal NVMe or as a bulk offload destination for photos, video, and project files. The bus-powered design also opens up use cases that traditional desktop drives can’t cover, such as pulling footage off a laptop in the field with no outlet nearby. Pair that with Windows and Mac support, Seagate’s Toolkit for backup and mirroring, and two years of Rescue Data Recovery Services, and the pitch comes down to storage headroom, data safety, and a cleaner desk at a competitive cost per terabyte.

Design & Features

The One Touch Desktop HDD features a refined, premium aesthetic, combining aluminum and plastic for a solid, high-quality feel. Rubber feet on the bottom also help stabilize the device and prevent unwanted movement during operation. To keep things clean and minimal, Seagate has also avoided adding unnecessary lighting elements.

Seagate One Touch bottom view

For connectivity, the drive uses a single USB-C cable and does not require a separate power adapter, provided the host port can supply at least 15W. While this requirement may be a limitation for older systems, it ultimately simplifies setup for modern devices. A small front-facing status light is the only visual indicator, blinking red if insufficient power is detected.

Seagate One Touch USB-C view

Getting started is pretty straightforward; simply plug in the cable and wait for the volume to mount. You can optionally install the Seagate Toolkit software, but it works out of the box with both Windows and macOS. Time Machine users will need to reformat before initial use, though.

Inside the box, Seagate includes a (0.5m) USB-C cable, Toolkit software, a quick-start guide, and a 2-year limited warranty. In addition, users receive 2-year Rescue Data Recovery Services, which include one in-lab recovery attempt, with recovered data returned on an encrypted device if the attempt is successful. The turnaround time for the recovery service is about 30 days, which provides peace of mind for anyone relying on the drive for long-term storage.

For creatives, Seagate provides a complimentary 2-month trial subscription to Adobe Creative Cloud Pro (All Apps). This inclusion gives users access to tools they might otherwise pay for separately, making the overall package more compelling.

Feature 8TB 20TB 24TB
Specifications
Connector USB-C
Interface USB 3.2 Gen 1 (up to 5Gb/s)
Power Bus-powered via USB-C (≥15W required)
Compatibility Windows & macOS (Time Machine requires reformat; ChromeOS not supported for Toolkit)
In the Box & Software
What’s in the Box One Touch HDD, 1.64ft USB-C cable, Toolkit software, Quick Start Guide
Included Software Seagate Toolkit, 2-month Adobe Creative Cloud Pro (All Apps) trial
Support & Pricing
Warranty 2-year limited (may vary by region)
Rescue Data Recovery 2-year included (may vary by region)
MSRP $259.99 $519.99 $619.99

Toolkit Software

Seagate Toolkit is a bundled utility that enhances the One Touch Desktop HDD’s functionality without complicating the user experience. After the initial backup, its incremental backup feature saves only modified files, helping keep backup times and system load manageable. At the same time, the Mirroring (RealTime Sync) feature continuously maintains updated copies of selected folders in the background. Additionally, Seagate Secure provides password protection for supported drives, while the Import function automatically transfers files from connected USB devices or memory cards, making it especially useful for frequent media offloads.

Moreover, Toolkit supports both scheduled and manual backups. Users who prefer automation can rely on scheduled backups, while those who want more control can trigger backups manually. Either way, it delivers essential data protection features without requiring third-party software.

Capacity in Context

To better understand available capacities, Seagate provides real-world storage estimates for common file types. Although actual results will vary depending on codec, compression, and workflow, these figures still offer a helpful baseline for planning:

Capacity 1080p HD Video (approx.) 4K Video (approx.) RAW Photos (approx.)
8TB ~800 hours ~120 hours ~200,000
20TB ~2,000 hours ~300 hours ~500,000
24TB ~2,400 hours ~360 hours ~600,000

Performance

To evaluate the performance of the Seagate One Touch Desktop HDD, we compared it against the Seagate FireCuda X Vault across a variety of benchmarks.

Here’s the high-performance test rig we used for benchmarking:

  • CPU: AMD Ryzen 7 9850X3D
  • Motherboard: Asus ROG Crosshair X870E Hero
  • RAM: G.SKILL Trident Z5 Royal Series DDR5-6000 (2x16GB)
  • GPU: NVIDIA GeForce RTX 4090
  • OS: Windows 11 Pro

The drive inside our 8TB Seagate One Touch HDD self-reported as the Seagate SkyHawk (ST8000VX009) at 5400 RPM.

Blackmagic Disk Speed Test

The BlackMagic Disk Speed Test benchmarks a drive’s read and write speeds to estimate its performance, especially for video editing tasks. It helps users ensure their storage is fast enough to handle high-resolution content, such as 4K or 8K video.

In Blackmagic, the Seagate FireCuda X Vault posted the stronger read speed at 222.4 MB/s, edging out the Seagate One Touch Desktop HDD at 210.9 MB/s. Write performance also showed a similar edge, with the One Touch measuring 152.0 MB/s compared to 158.9 MB/s from the FireCuda X Vault. Overall, both drives landed in expected territory for high-capacity external hard drives, though the FireCuda showed slightly better read and write speed.

Blackmagic (higher is better) Seagate One Touch Desktop HDD 8TB Seagate FireCuda X Vault 8TB
Read 210.9 MB/s 222.4 MB/s
Write 152.0 MB/s 158.9 MB/s

IOMeter

In the 1-queue IOMeter run, the FireCuda X Vault led in sequential throughput, reaching 224.03 MB/s read and 223.37 MB/s write, compared to 211.26 MB/s read and 211.48 MB/s write from the One Touch Desktop HDD. Random 2MB performance was much closer. The One Touch slightly led in random 2MB writes at 150.06MB/s versus 149.59MB/s, while the FireCuda posted the better random 2MB read at 117.17MB/s versus 113.83MB/s.

Small-block performance remained low on both drives, as expected for HDD-based storage, with the FireCuda reaching 429 IOPS in random 4K writes versus 424 IOPS on the One Touch, while the One Touch narrowly led in random 4K reads at 129 IOPS versus 126 IOPS on the FireCuda. Overall, the FireCuda showed a modest advantage in sequential performance, while the two drives were very close in lighter random workloads.

IOMeter Test Seagate One Touch Desktop HDD 8TB Seagate FireCuda X Vault 8TB
Seq 2MB Write 211.48 MB/s 223.37 MB/s
Seq 2MB Read 211.26 MB/s 224.03 MB/s
Random 2MB Write 150.06 MB/s 149.59 MB/s
Random 2MB Read 113.83 MB/s 117.17 MB/s
Random 4K Write 424 IOPS 429 IOPS
Random 4K Read 129 IOPS 126 IOPS

PCMark 10 Storage

PCMark 10 Storage Benchmarks evaluate real-world storage performance using application-based traces. They test the system and data drives, measuring bandwidth, access times, and consistency under load. These benchmarks offer practical insights beyond synthetic tests, enabling users to compare modern storage solutions effectively.

In PCMark 10’s Quick System Drive Benchmark, both drives delivered nearly identical performance, with the Seagate One Touch Desktop HDD scoring 750 and the Seagate FireCuda X Vault coming in at 746. This narrow gap suggests that, in trace-based workloads, the two drives perform very similarly, with no meaningful advantage for either.

As expected for high-capacity HDDs, both are best suited for bulk storage tasks such as backups, media libraries, and large file transfers rather than latency-sensitive workloads. Overall, this result shows that real-world responsiveness between the two is effectively on par in this test.

PCMark 10 Storage (higher is better) Seagate One Touch Desktop HDD 8TB Seagate FireCuda X Vault 8TB
Overall Score 750 746

Conclusion

The Seagate One Touch Desktop HDD is a category-first product in a commoditized space. Bus-powered USB-C on a 3.5-inch desktop drive genuinely changes how the drive fits on a desk or travels in a bag, and it’s the feature most likely to sway buyers who’ve grown tired of juggling bulky power bricks. Cross-platform support, Toolkit for backup and mirroring, and two years of Rescue Data Recovery Services round out a package that covers the basics without asking for much from the user.

Performance lands where it should for 5400 RPM mechanical storage. Sequential throughput sits in the low 200s MB/s, random workloads are modest, and small-block IOPS are firmly in HDD territory. That rules it out for anything latency sensitive or for active video editing off the drive, but those aren’t the workloads this product targets. For backup, archive, media libraries, and bulk offload, it does the job.

At $259.99 for 8TB and $619.99 for 24TB, pricing is competitive against other high-capacity external HDDs, and the single-cable design is a real differentiator rather than a marketing one. For users who want maximum capacity with minimum desk footprint and cable clutter, the One Touch Desktop HDD earns its spot on the shortlist.

Product page – Seagate One Touch Desktop HDD

The post Seagate One Touch Desktop HDD Review: 24TB Without the Power Brick appeared first on StorageReview.com.

KIOXIA EG7 Series SSDs Bring QLC Storage to Mainstream PCs

22 April 2026 at 01:00
KIOXIA EG7 Series KIOXIA EG7 Series

KIOXIA America has unveiled the EG7 Series, a new family of client SSDs that brings its BiCS FLASH generation 8 QLC with CMOS directly Bonded to Array (CBA) technology to this segment for the first time. KIOXIA says the new series is designed to help PC manufacturers bring high-performance, power-efficient storage to a wider range of systems at a more accessible price point. Capacity options will include 512GB, 1TB, and 2TB models.

KIOXIA EG7 Series

KIOXIA EG7 Series Performance and Main Features

The EG7 Series uses 4-bit-per-cell (quadruple-level cell) NAND flash. QLC storage is typically used in lower-cost systems, though it has long faced skepticism about whether it can keep pace with TLC-based drives in everyday performance. KIOXIA is positioning the EG7 Series as a response to that skepticism, saying the new SSDs can deliver TLC-level performance while lowering the total cost of ownership for PC makers building mainstream and more price-conscious systems.

For performance, the drives offer up to 1,000 KIOPS for random reads and writes. Sequential read speeds reach up to 7,000MB/s, while sequential write speeds go as high as 6,200MB/s. This places the EG7 Series in the range of modern PCIe Gen4 client SSDs.

KIOXIA EG7 Bit Density graphic

The EG7 Series also supports the NVMe 2.0d specification, which KIOXIA says will provide PC OEMs with added flexibility in device management and overall system design.

KIOXIA EG7 Series Form Factors, Design, and Security

KIOXIA is offering the drives in several M.2 form factors: Type 2230, Type 2242, and Type 2280. That range allows the EG7 Series to fit in compact devices with tight board space, as well as in more conventional notebook and desktop configurations. The smaller 2230 and 2242 formats are important because thin-and-light systems and compact PCs often use shorter SSD layouts.

Metric 512GB 1024GB 2048GB
Sequential Read 6,400 MB/s 7,000 MB/s
Sequential Write 5,000 MB/s 6,000 MB/s 6,200 MB/s
Random Read 550,000 IOPS 850,000 IOPS 1,000,000 IOPS
Random Write 850,000 IOPS 950,000 IOPS 1,000,000 IOPS

The EG7 Series also uses a DRAM-less design. Rather than relying on onboard DRAM, the drives use Host Memory Buffer (HMB) technology, which taps into a portion of system memory to help manage SSD functions. This design is common in more budget-conscious storage products, and can help lower the total cost of ownership and reduce power use without sacrificing responsive performance.

The drives support TCG Opal version 2.02 self-encrypting drive functionality, which is important for business systems that require hardware-based security.

Storage vendors are pushing higher-density flash into a wider range of devices as manufacturers seek more capacity without adding significant system costs. So, the EG7 Series gives OEMs another option for mainstream PCs that need to balance performance, power efficiency, and affordability.

KIOXIA EG7 Series Availability

The EG7 Series is currently sampling with select PC OEM customers. Systems with the new SSDs are expected to begin shipping in the second quarter of 2026.

KIOXIA

The post KIOXIA EG7 Series SSDs Bring QLC Storage to Mainstream PCs appeared first on StorageReview.com.

AMD Ryzen 9 9950X3D2 Dual Edition Review: 3D V-Cache on Both CCDs

21 April 2026 at 15:15
AMD Ryzen 9950X3D2 in the cpu socket AMD Ryzen 9950X3D2 in the cpu socket

AMD is once again pushing the boundaries of the high-performance desktop market with the Ryzen 9 9950X3D2 Dual Edition, which launches at an MSRP of $899. When we reviewed the Ryzen 9 9950X3D in March 2025, it made a compelling case as the first 16-core X3D processor, with thermal and TDP constraints no longer forcing a meaningful trade-off between gaming and productivity. It brought 3D V-Cache to a 16-core design, including full overclocking support, and raised the TDP ceiling to deliver sustained performance that earlier X3D chips couldn’t match. The 9950X3D2 builds on that foundation, extending 3D V-Cache across both CCDs for the first time and increasing the total L3 cache from 128MB to 192MB. AMD provided us with a sample for evaluation against the full 9000-series X3D stack.

AMD Ryzen 9950X3D2 in its box

AMD Ryzen 9 9950X3D2: Solving the Asymmetry Problem

The core problem the 9950X3D2 solves is one the 9950X3D never fully escaped. Because the 9950X3D applied 3D V-Cache to only one of its two CCDs, threads migrating between dies during normal Windows load balancing would periodically lose access to the cache-rich CCD, causing unpredictable latency spikes. AMD’s chipset drivers helped manage this, but the asymmetry remained. The 9950X3D2 eliminates it. Each CCD combines 32MB of traditional 2D L3 cache with a 64MB 3D V-Cache stack, giving both CCDs an identical 96MB L3 pool and all 16 cores symmetrical, low-latency access to a combined 192MB total. For workloads sensitive to memory latency, particularly high-FPS gaming, this is a meaningful architectural improvement rather than a simple spec bump.

The underlying 2nd Gen 3D V-Cache design is the same as the under-die architecture introduced with the 9800X3D and carried through to the 9950X3D, with cache placed beneath the compute cores to keep the primary heat source close to the cooling solution. What changes with the 9950X3D2 is scope: that design now covers both CCDs, and the TDP rises from 170W to 200W to support the additional sustained throughput. Total on-chip cache reaches 208 MB across L2 and L3, up from 144 MB on the 9950X3D.

AMD Ryzen 9 9950X3D2 Specifications

Specifications AMD Ryzen 9 9950X3D2 AMD Ryzen 9 9950X3D AMD Ryzen 9 9900X3D AMD Ryzen 7 9850X3D AMD Ryzen 7 9800X3D
Cores/Threads 16/32 16/32 12/24 8/16 8/16
Platform AM5 AM5 AM5 AM5 AM5
Max Boost / Base Clock 5.6 / 4.3GHz 5.7 / 4.3GHz 5.5 / 4.4GHz 5.6 / 4.7GHz 5.2 / 4.7GHz
L2 Cache 16MB 16MB 12MB 8MB 8MB
L3 Cache 192MB 128MB 128MB 96MB 96MB
Total Cache 208MB 144MB 140MB 104MB 104MB
Architecture Zen 5 Zen 5 Zen 5 Zen 5 Zen 5
PCIe Gen5 Gen5 Gen5 Gen5 Gen5
DRAM DDR5 DDR5 DDR5 DDR5 DDR5
TDP / Default Socket Power (PPT) 200W / 270W 170W / 230W 120W / 230W 120W / 162W 120W /162W
Graphics Radeon Radeon Radeon Radeon Radeon
AMD Recommended Cooler Liquid cooler Liquid cooler Liquid cooler Liquid cooler Liquid cooler

Platform and Compatibility

The 9950X3D2 slots into the AM5 ecosystem without requiring a platform change. Like the 9950X3D, it supports existing A620, B650/B650E, X670/X670E, X870/X870E, B840, and B850-class motherboards with a BIOS update, making it a straightforward upgrade for users already invested in the platform. The higher 200W TDP does demand more from the cooling side, however. While the 9950X3D can be managed with a capable 240mm AIO, AMD recommends a 360mm liquid cooler for the 9950X3D2 to maintain sustained boost performance under heavy workloads.

AMD Ryzen 9950X3D2 in the cpu socket

AMD Ryzen 9 9950X3D2 Performance

To evaluate overall performance, we compared the AMD Ryzen 9 9950X3D2 against the AMD Ryzen 9 9950X3D, Ryzen 7 9850X3D, and Ryzen 7 9800X3D. While all four processors feature AMD’s 3D V-Cache design, the two Ryzen 9 models sit in a higher-performance tier, sharing a 16-core, 32-thread configuration. The Ryzen 7 chips, with 8 cores and 16 threads, sit a step below, with performance differences becoming more apparent in heavily threaded workloads while remaining relatively close in lighter tasks. All testing was conducted at stock settings (no overclocking) to ensure a consistent baseline across the stack.

AMD Ryzen 9 9950X3D2 CPU-Z

AMD Consumer Test Platform

To keep the testing environment as consistent as possible, all CPUs have been tested across X870E-based motherboards at stock settings. The only changes above stock settings have been the same DDR5 memory and EXPO configuration. Here’s a full rundown of our testing rig in this review:

  • Motherboard:  ASRock X870E Taichi (provided by AMD)
  • Memory: G.SKILL Trident Z5 Royal Series DDR5-6000 (2x16GB), running on EXPO 1
  • Cooling: NZXT Kraken Elite 360
  • Operating System: Windows 11 Pro

3DMark CPU Profile

The 3DMark CPU Profile measures CPU performance across different workloads by testing 1, 2, 4, 8, 16, and max threads. It highlights how the CPU handles single-threaded tasks, gaming workloads, and multithreaded applications such as 3D rendering. The benchmark minimizes GPU impact, offering a clear view of the CPU’s performance in various scenarios.

In the 3DMark CPU Profile benchmark, the Ryzen 9 chips most clearly separate themselves as thread counts increase. The 9950X3D2 tops the chart with 17,672 points in the Max Threads test, about 6% ahead of the 9950X3D, while the 9950X3D still holds a sizable lead over the Ryzen 7 9850X3D and 9800X3D by roughly 63% and 67%, respectively. That gap narrows quickly under lighter workloads, when all four chips are much closer together, but the ranking still favors the two Ryzen 9 processors overall.

3DMark CPU Profile (higher is better) AMD Ryzen 9 9950X3D2 AMD Ryzen 9 9950X3D AMD Ryzen 7 9850X3D AMD Ryzen 7 9800X3D
Max Threads 17,672 16,690 10,261 10,018
16 Threads 16,956 15,983 10,285 10,034
8 Threads 9,141 9,070 8,611 8,269
4 Threads 4,980 4,846 4,867 4,646
2 Threads 2,508 2,521 2,487 2,394
1 Threads 1,274 1,264 1,267 1,213

y-cruncher

y-cruncher is a popular benchmarking and stress-testing application that launched in 2009. This test is multithreaded and scalable, computing Pi and other constants up to the trillions of digits. Faster is better in this test.

In y-cruncher, both Ryzen 9 chips show a clear advantage in this long-running computational workload. The 9950X3D2 completes the 1-billion-digit test in 12.605 seconds, roughly 31% faster than the 9950X3D, which itself is about 12% faster than the 9850X3D and 31% faster than the 9800X3D. As the workload grows, the lead widens further, with the 9950X3D2 completing the 5 billion run about 41% faster than the 9950X3D, reinforcing its stronger sustained compute performance.

y-cruncher (lower time is better) AMD Ryzen 9 9950X3D2 AMD Ryzen 9 9950X3D AMD Ryzen 7 9850X3D AMD Ryzen 7 9800X3D
1 Billion 12.605 s 16.450 s 18.503 s 21.487 s
2 Billion 34.925 s 48.047 s 52.589 s 64.273 s
5 Billion 77.370 s 109.343 s 115.581 s 143.891 s

y-cruncher BBP

This y-cruncher benchmark uses the Bailey-Borwein-Plouffe (BBP) formulas to compute a large number of hexadecimal digits of Pi, measuring the CPU’s total computation time, utilization, and multi-core efficiency.

Looking at the y-cruncher BBP test, the Ryzen 9 9950X3D2 again sets the pace, completing the 100 BBP run in 47.07 seconds, about 7% faster than the 9950X3D. The non-D2 9950X3D still maintains a major lead over both Ryzen 7 chips, finishing that same workload about 66% faster than the 9850X3D and 66% faster than the 9800X3D. Across the full sweep, the order stays consistent, with the two Ryzen 9 processors comfortably ahead.

y-cruncher BBP (lower time is better) AMD Ryzen 9 9950X3D2 AMD Ryzen 9 9950X3D AMD Ryzen 7 9850X3D AMD Ryzen 7 9800X3D
1 BBP 0.384 s 0.426 s 0.669 s 0.671 s
10 BBP 4.173 s 4.538 s 7.501 s 7.497 s
100 BBP 47.070 s 50.291 s 83.719 s 83.345 s

Maxon Cinebench

Cinebench is a widely used benchmarking tool that measures the performance of CPUs and GPUs by rendering with Maxon Cinema 4D. It provides a score that allows you to compare the performance of different systems and components. We ran R23 and R24, both popular Cinebench versions, so you can compare the results with those on popular online leaderboards.

In Cinebench, the separation between the Ryzen 9 and Ryzen 7 parts is immediately clear in multi-core performance, while single-core results remain much tighter across the stack. In Cinebench R23, the Ryzen 9 9950X3D2 leads with a score of 42,555, about 6% ahead of the 9950X3D, while both Ryzen 9 chips nearly double the performance of the Ryzen 7 models, holding roughly an 87–99% advantage in multi-core workloads. Cinebench R24 shows the same trend, with the 9950X3D2 reaching 2,508, about 12% ahead of the 9950X3D and again maintaining a significant 80%+ lead over the Ryzen 7 parts.

Single-core results tell a different story. In R23, all three newer chips cluster closely, with the 9950X3D2 holding only about a 2% lead over the 9950X3D and effectively tying the 9850X3D. R24 tightens even further, where the 9950X3D2 and 9850X3D are nearly identical, and the 9950X3D trails slightly. This consistency highlights that lightly threaded performance is broadly similar across the lineup, with only small gains at the top end.

Cinebench R23

Cinebench R23 (higher is better) AMD Ryzen 9 9950X3D2 AMD Ryzen 9 9950X3D AMD Ryzen 7 9850X3D AMD Ryzen 7 9800X3D
Multi-Core 42,555 39,993 21,382 22,718
Single-Core 2,248 2,200 2,216 2,089

Cinebench R24

Cinebench R24 (higher is better) AMD Ryzen 9 9950X3D2 AMD Ryzen 9 9950X3D AMD Ryzen 7 9850X3D AMD Ryzen 7 9800X3D
Multi-Core 2,508 2,246 1,366 1,338
Single-Core 143 134 142 130

7-Zip Compression

The 7-Zip Compression Benchmark evaluates CPU performance during compression and decompression, measuring GIPS (Giga Instructions Per Second) and CPU usage. Higher GIPS and efficient CPU usage indicate superior performance.

In 7-Zip, the 9950X3D2 achieves the highest overall score, with a total rating of 233.09 GIPS, about 9% ahead of the 9950X3D. The non-D2 9950X3D still holds a commanding advantage over the Ryzen 7 chips, outperforming the 9850X3D by roughly 64% and the 9800X3D by about 69% in total rating. Compression and decompression follow the same general pattern, with the two Ryzen 9 processors well out in front.

7-Zip Compression AMD Ryzen 9 9950X3D2 AMD Ryzen 9 9950X3D AMD Ryzen 7 9850X3D AMD Ryzen 7 9800X3D
Compressing
Current CPU Usage 2,736% 2,737% 1,394% 1,387%
Current Rating/Usage 7.132 GIPS 6.565 GIPS 8.864 GIPS 8.488 GIPS
Current Rating 195.145 GIPS 179.648 GIPS 123.563 GIPS 117.745 GIPS
Resulting CPU Usage 2,717% 2,727% 1,390% 1,393%
Resulting Rating/Usage 7.186 GIPS 6.531 GIPS 8.852 GIPS 8.466 GIPS
Resulting Rating 195.272 GIPS 178.094 GIPS 123.073 GIPS 117.895 GIPS
Decompressing
Current CPU Usage 3,148% 3,034% 1,564% 1,570%
Current Rating/Usage 8.674 GIPS 8.207 GIPS 8.821 GIPS 8.365 GIPS
Current Rating 273.103 GIPS 248.987 GIPS 137.919 GIPS 135.527 GIPS
Resulting CPU Usage 3,134% 3,036% 1,567% 1,564%
Resulting Rating/Usage 8.643 GIPS 8.242 GIPS 8.820 GIPS 8.663 GIPS
Resulting Rating 270.917 GIPS 250.233 GIPS 138.223 GIPS 135.448 GIPS
Total Rating
Total CPU Usage 2,926% 2,882% 1,479% 1,478%
Total Rating/Usage 7.915 GIPS 7.387 GIPS 8.836 GIPS 8.564 GIPS
Total Rating 233.094 GIPS 214.163 GIPS 130.648 GIPS 126.671 GIPS

UL Procyon

UL Procyon AI Inference is designed to gauge a workstation’s performance in professional applications. It should be noted that this test does not leverage multiple CPU capabilities. Specifically, this tool benchmarks the workstation’s ability to handle AI-driven tasks and workflows, providing a detailed assessment of its efficiency and speed in processing complex AI algorithms and applications.

UL Procyon shows a tighter spread, but the overall hierarchy still favors the Ryzen 9 chips. The 9950X3D2 posts the top overall AI Computer Vision score at 271, about 23% ahead of the 9950X3D, while the 9950X3D itself remains 5% ahead of the 9850X3D and 17% ahead of the 9800X3D. Model-level results are more mixed, particularly in lighter tasks like MobileNet V3. Still, the two Ryzen 9 parts pull further apart in heavier inference workloads such as YOLO V3 and REAL-ESRGAN.

UL Procyon (higher score & lower ms is better) AMD Ryzen 9 9950X3D2 AMD Ryzen 9 9950X3D AMD Ryzen 7 9850X3D AMD Ryzen 7 9800X3D
Overall AI Computer Vision Score 271 220 209 188
MobileNet V3 0.97 ms 0.94 ms 0.70 ms 0.61 ms
ResNet 50 3.76 ms 5.33 ms 5.95 ms 7.01 ms
Inception V4 13.90 ms 17.12 ms 19.34 ms 22.28 ms
DeepLab V3 19.26 ms 21.70 ms 20.40 ms 23.98 ms
YOLO V3 24.93 ms 35.27 ms 48.17 ms 56.07 ms
REAL-ESRGAN 1,593.81 ms 2,037.51 ms 2,348.97 ms 2,728.62 ms

PCMark10

PCMark 10 evaluates CPU performance by simulating real-world office productivity tasks like word processing, web browsing, video conferencing, and spreadsheet calculations. The benchmark combines workloads that reflect the demands of modern workplaces, providing a comprehensive assessment of how a CPU handles day-to-day applications.

PCMark 10 compresses the gap more than any of the heavier compute-focused tests. Interestingly, the non-D2 Ryzen 9 9950X3D actually posts the highest overall score at 10,849, edging out the 9950X3D2 by about 1.8%. Even so, both Ryzen 9 chips remain ahead of the Ryzen 7 9850X3D and 9800X3D, showing that everyday productivity performance is broadly strong across the stack with only small differences at the top.

PCMark10 (higher is better) AMD Ryzen 9 9950X3D2 AMD Ryzen 9 9950X3D AMD Ryzen 7 9850X3D AMD Ryzen 7 9800X3D
Overall Score 10,650 10,849 10,461 10,250

SPECworkstation 4.4.0

SPECworkstation 4 specializes in benchmarks designed to test all key aspects of workstation performance. It uses over 30 workloads to test CPU, graphics, I/O, and memory bandwidth. The workloads fall into broader categories, including Media and Entertainment, Financial Services, Product Development, Energy, Life Sciences, and General Operations. We will list each broad-category result instead of the individual workloads. The results are averages of all individual workloads in each category.

In SPECworkstation 4.4.0, the 9950X3D2 leads most categories, but the non-D2 9950X3D remains firmly in second and well ahead of the Ryzen 7 parts in most professional workloads. In AI & Machine Learning, the 9950X3D2 scores 3.96, about 20% ahead of the 9950X3D, while the 9950X3D still leads the 9850X3D by roughly 12%. Some categories tighten considerably, such as Media & Entertainment and Life Sciences, but the overall pattern still puts the two Ryzen 9 chips ahead.

SPECworkstation 4.4.0 (higher is better) AMD Ryzen 9 9950X3D2 AMD Ryzen 9 9950X3D AMD Ryzen 7 9850X3D AMD Ryzen 7 9800X3D
AI & Machine Learning 3.96 3.30 2.95 2.92
Energy 3.22 2.66 2.20 2.13
Financial Services 2.63 2.48 1.42 1.42
Life Sciences 2.62 2.71 2.11 2.15
Media & Entertainment 3.39 3.34 2.56 2.57
Product Design 2.75 2.43 2.14 2.08
Productivity & Development 1.39 1.28 1.14 1.12

Conclusion

The AMD Ryzen 9 9950X3D2 is not just an iteration; it is the point where AMD fully resolves the trade-offs that defined earlier X3D designs. By eliminating the asymmetric cache layout and extending 3D V-Cache across both CCDs, AMD has transformed what was once a situational advantage into a consistent, system-wide benefit. Every core now has equal access to a massive 192MB L3 pool, removing scheduling penalties and delivering the predictability high-end workloads demand.

The 9950X3D2 led in nearly every benchmark. Whether in heavily threaded compute like y-cruncher, rendering in Cinebench, or compression in 7-Zip, the 9950X3D2 repeatedly edges ahead of the 9950X3D. The gains span across nearly every category, reinforcing that this refinement meaningfully improves sustained performance rather than chasing peak numbers.

AMD Ryzen 9950X3D2 in cpu tray

At the platform level, it also represents the ceiling of what AM5 can currently deliver. With drop-in compatibility, it gives existing users a clear upgrade path to the most balanced high-end desktop CPU AMD has produced to date. The higher 200W TDP and cooling requirements are the only real trade-offs, but they are proportional to the level of performance it offers.

Ultimately, the 9950X3D2 earns its place not by redefining the category, but by perfecting it. It takes the hybrid identity of X3D processors, part gaming chip, part workstation CPU, and removes the friction between those roles. For users who want top-tier gaming performance without sacrificing multithreaded capability, or vice versa, this is the first X3D processor to truly deliver on both fronts.

AMD Ryzen 9 9950X3D2 – Product Page

The post AMD Ryzen 9 9950X3D2 Dual Edition Review: 3D V-Cache on Both CCDs appeared first on StorageReview.com.

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