AMD has officially introduced the new Ryzen AI Max 400 series processors, bringing an upgraded version of the βStrix Haloβ platform focused on AI workloads and high-end performance. The new chips improve memory support, AI power, and graphics speeds while keeping the same powerful hybrid design introduced with the Ryzen AI Max 300 series.
The biggest change in the Ryzen AI Max 400 lineup is memory support. AMD has upgraded the memory controller to handle up to 192GB of LPDDR5X memory, which is a major jump from the previous 128GB limit. This improvement is especially important for AI developers and users working with large language models and heavy AI tasks.
AMD also allows users to manually divide memory between the system and the integrated graphics. The iGPU can now use up to 160GB of video memory, which could help with demanding AI and graphics workloads.
The Ryzen AI Max 400 series combines up to 16 Zen 5 CPU cores with a large integrated GPU based on the RDNA 3.5 graphics architecture. The built-in graphics feature up to 40 compute units, making these processors powerful enough for gaming, creative work, and AI processing without needing a separate graphics card.
The updated chips also receive small but useful speed improvements. GPU boost clocks now reach up to 3.00 GHz compared to 2.90 GHz on the previous generation. CPU boost clocks now go as high as 5.20 GHz, while the upgraded NPU delivers up to 55 TOPS of AI performance, offering around 10% better AI processing power than before.
AMD introduced three models in the new series. The Ryzen AI Max+ PRO 495 sits at the top with 16 cores, 32 threads, boost speeds up to 5.20 GHz, a full 40 CU GPU, and 55 TOPS AI performance.
The Ryzen AI Max PRO 490 comes with 12 cores and 24 threads, boost speeds up to 5.00 GHz, a 32 CU integrated GPU, and up to 50 TOPS AI performance.
Meanwhile, the Ryzen AI Max PRO 485 features 8 cores and 16 threads with the same 32 CU graphics and 50 TOPS AI engine.
AMD says the new processors are designed for advanced AI development platforms and professional systems with AMD PRO features that compete directly with Intel vPro technology. Consumer versions are also expected later this year.
One of the most important benefits of the new 192GB memory support is the ability to run massive 300B+ parameter AI models directly on supported systems. This could make the Ryzen AI Max 400 series attractive for AI developers, researchers, and workstation users looking for strong local AI performance without relying entirely on cloud hardware.
AMD has officially confirmed the processor enthusiasts have been waiting months for. The Ryzen 9 9950X3D2 Dual Edition is the worldβs first desktop chip to feature 3D V-Cache on both compute chiplets, and it arrives April 22nd.
There have been few processor announcements in recent memory that felt genuinely, structurally different from what came before. AMDβs Ryzen 9 9950X3D2 Dual Edition is one of them. Announced this morning by Jack Huynh, AMDβs SVP and GM of Computing and Graphics, through a video posted to AMDβs YouTube channel, this chip does something no desktop processor has ever done: it applies 3D V-Cache technology across both of its compute chiplets simultaneously, not just one.
The result is 208MB of total on-chip cache, comprising 192MB of L3 and 16MB of L2. That is the highest cache figure ever shipped in a consumer Ryzen processor, and AMD is not shy about leaning into that record. Full official specifications are available on theΒ AMD product page.
What Is Dual 3D V-Cache, Exactly?
To understand why this matters, a quick bit of context helps. AMDβs 3D V-Cache technology works by stacking additional SRAM directly on top of a compute chiplet via through-silicon vias. Previous X3D processors, including the Ryzen 9 9950X3D, applied this extra cache to only one of the two CCDs in a dual-chiplet design. The second CCD ran with standard cache allocations. That asymmetry created real-world trade-offs, with certain workloads performing better depending on which CCD a task was scheduled to.
The 9950X3D2 eliminates that compromise entirely. Both CCDs now carry stacked V-Cache, meaning every core on the chip has equal access to the expanded cache pool. A useful way to picture it: imagine two Ryzen 7 9850X3D processors fused onto a single package. That is essentially what AMD has engineered here.
β208MB of cache means more game data, more assets, and more working data sitting right next to the CPU cores.β β Jack Huynh, AMD SVP
Specifications at a Glance
Architecture
Zen 5 (Granite Ridge)
Cores / Threads
16 / 32
Base / Boost Clock
4.3 GHz / Up to 5.6 GHz
L1 / L2 / L3 Cache
1280 KB / 16 MB / 192 MB
Total Cache
208 MB
3D V-Cache
Both CCDs (second-generation)
TDP
200W
Socket
AM5
Memory
DDR5, up to 256 GB
PCIe Version
PCIe 5.0
Instruction Set Extensions
AVX-512, AVX2, AES-NI
Cooler Included
No (liquid cooler recommended)
Overclocking
Unlocked
Launch Date
April 22, 2026
Price
TBA
Performance Claims and Target Workloads
AMD is quoting 5 to 10 percent performance gains over the existing Ryzen 9 9950X3D across creative workloads, with applications like DaVinci Resolve, Blender, and large-scale source code compilations such as Unreal Engine and Chromium cited specifically. Some third-party analyses of AMDβs slide deck suggest gains of up to 13 percent in select tasks, though those figures come with the usual caveats around controlled testing conditions.
It is worth stressing that AMD is not pitching this primarily as a gaming upgrade. The company acknowledges that standard X3D gaming performance is already exceptional, and incremental frame rate gains from the dual-cache design are unlikely to be the headline story. Where AMD says the 9950X3D2 will really distinguish itself is in workloads that live and die by data access latency: large software builds, game engine compiles, AI model training on-device, 3D rendering pipelines, and complex content creation workflows.
That 200W TDP is a number worth paying close attention to, and AMDβs note that a liquid cooler is recommended for optimal performance underscores just how much heat this chip is designed to manage. AMD has historically made strong arguments for the efficiency credentials of its Zen architecture; we have covered that ground in detail at BonTech Labs, including why Intel continues to trail AMD on power efficiency. Whether dual 3D V-Cache pushes AMDβs thermal story in a direction that complicates those comparisons will be worth examining carefully when review hardware is in hand.
The Long Road to Announcement
The 9950X3D2 has had a peculiar path to official existence. Rumours of a dual X3D design circulated throughout 2025, and by the time CES 2026 arrived, most enthusiasts expected AMD to confirm it alongside the Ryzen 7 9850X3D. It did not. The chip was conspicuously absent from AMDβs CES press event, and it remained officially unacknowledged for weeks afterwards.
Then, just days ago, ASRock inadvertently published BIOS support documentation for the 9950X3D2 across its motherboard lineup, effectively announcing the chip before AMD had a chance to. This morningβs video from Jack Huynh brings everything to light at last, with a confirmed worldwide launch date of April 22nd.
For owners of existing AM5 motherboards, the transition should be straightforward. The 9950X3D2 supports the same chipset lineup as current Ryzen 9000 series processors, including X870E, X870, B650E, B650, and A620, so a BIOS update should be all that is required.
What About Zen 6?
The 9950X3D2 arrives at an interesting moment on AMDβs roadmap. Zen 5 has proven competitive across both consumer and professional segments, but speculation about what comes next is already building. If you are trying to decide whether now is the right time to invest in an AM5 flagship or whether it is worth waiting, BonTech Labs has a detailed breakdown ofΒ what Zen 6 and AVX-512 support means for PC and server buyers, and it is worth reading before committing to a platform decision.
Pricing and Availability
AMD has not yet revealed the retail price, and that remains the most consequential unknown right now. The Ryzen 9 9950X3D currently sits at around $675 to $700 in most markets. The 9950X3D2 carries additional manufacturing complexity with its three-die package design, so a premium over the existing flagship is virtually certain. Whether AMD prices it to compete with its own Threadripper line or positions it closer to the top of the mainstream desktop stack will define its appeal to the professional and enthusiast markets it is clearly targeting.
We will be pursuing review hardware ahead of the April 22nd launch and will have full performance analysis live as close to release as possible.