Asus rolls out rugged USB-C SSD enclosure that delivers transfer speeds up to 20 Gb/s — TUF Gaming A2 SSD is IP68 water- and dust-resistance, meeting U.S. MIL-STD-810H standards

*Asus rolls out rugged USB-C SSD enclosure that delivers transfer speeds up to 20 Gb/s — TUF Gaming A2 SSD is IP68 water- and dust-resistance, meeting U.S. MIL-STD-810H standards* ift.tt/5Gg98Xw Submitted November 04, 2024 at 03:19PM by NewMaxx via reddit ift.tt/nINiABF

Asus rolls out rugged USB-C SSD enclosure that delivers transfer speeds up to 20 Gb/s — TUF Gaming A2 SSD is IP68 water- and dust-resistance, meeting U.S. MIL-STD-810H standards Read More »

Samsung and SK Hynix heat up next-gen memory race with cryogenic etching breakthroughs

*Samsung and SK Hynix heat up next-gen memory race with cryogenic etching breakthroughs* Samsung Electronics and SK Hynix are advancing next-generation memory technology with “ultra-low-temperature” etching, a technique initially applied to high-density, multi-layer NAND flash. Recent reports indicate this technology is now being tested for DRAM production, paving the way for innovations in next-generation memory.

Samsung and SK Hynix heat up next-gen memory race with cryogenic etching breakthroughs Read More »

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