At the silicon front, companies like Apple, Qualcomm, MediaTek, and Samsung have progressed tremendously in making their SoCs incredibly powerful for on-device AI, but their advancements will continue to remain stunted due to packaging and DRAM limitations. While one of these aspects has been addressed, a new report states that SK hynix is working on the second obstacle through the development of 3D-stacked DRAM-on-logic architecture on mobile phones. SK hynix is recruiting engineers to accelerate the development of 3D-stacked DRAM-on-logic architecture, removing on-device AI limitations on smartphones This next-generation memory stacks directly on top of a semiconductor chip and will […]

Read full article at https://wccftech.com/sk-hynix-working-on-dram-breakthrough-to-bring-real-on-device-ai-to-smartphones/