Sony has revealed a refreshed lineup of PS5 audio gear, introducing the PlayStation Pulse wireless headset and the higher-end Pulse Edge wireless headset. Both models feature custom, planar magnetic drivers and PlayStation Link connectivity for lossless, ultra-low-latency wireless audio.

According to Sony, both models pack larger planar magnetic drivers to generate fuller, deeper bass while preserving detailed sound separation and spatial accuracy. Simultaneous dual-device connectivity lets users pair to supported Bluetooth devices while connected to PS5 consoles, PlayStation Portal remote players, PCs, or Macs via PlayStation Link. For voice chat, both units include AI-enhanced noise rejection in their built-in microphones. A redesigned chassis features rotating earcups that lie flat for transport, with white and black finishes available.

Stepping up to the Pulse Edge model introduces planar magnetic drivers with double the magnet volume of the standard PlayStation Pulse for richer bass. This edition also adds active noise cancellation, a detachable boom microphone with an alternative hidden mic, upgraded materials, built-in game audio and chat balance control for PS5, and a carrying case.

Sony plans to release the PlayStation Pulse Wireless Headset in select markets starting this holiday season. The Pulse Edge will follow in early 2027. Pricing and pre-order dates remain unannounced.

KitGuru says: Curious about Sony's implementation of planar magnetic drivers in their new headsets?

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Intel has announced a new round of Core Series 3 processors for laptops. Aimed at entry-level mainstream laptops and edge computing, these new CPUs use Intel's 18A process node, along with Cougar Cove and Darkmont cores, delivering 40 TOPS of AI performance. Systems from OEM partners are scheduled for release starting this month. 

The Core Series 3 family, internally referred to as Wildcat Lake, features a hybrid architecture configured with up to 2 performance cores and 4 low-power efficiency cores. Intel confirms the platform shares architectural foundations with the Core Ultra Series 3 but differentiates itself via cost-saving measures, including a single-channel memory configuration. Integrated graphics are powered by up to 2 Xe3 cores, while the dedicated NPU is rated at up to 17 TOPS.

Connectivity for the platform includes support for Thunderbolt 4, PCIe Gen 4, Wi-Fi 7 (R2), and Bluetooth 6.0. Memory compatibility extends to LPDDR5x at up to 7467MT/s and DDR5 at 6400MT/s. Intel's internal testing claims the flagship Core 7 360 delivers up to 2.1x higher productivity scores in UL Procyon and 2.7x higher AI GPU performance in Geekbench AI than the previous Core 7 150U. Power efficiency is also highlighted, with Intel claiming up to 64% lower processor power consumption during video streaming.

The product stack includes several SKUs spanning the Core 7, Core 5, and Core 3 tiers. The Core 7 360 and 350 feature 6 cores with a maximum turbo frequency of 4.8GHz and a 17TOPS NPU. The Core 5 330, 320, and 315 also utilize 6 cores with frequencies ranging from 4.4GHz to 4.6GHz. The entry-level Core 3 304 offers 5 cores at 4.3GHz. All models operate with a 15W base power and up to 35W turbo power.

Laptops featuring these CPUs will begin shipping soon from the likes of Acer, Asus, HP, Lenovo and other OEMs.

KitGuru says: What type of system would you like to see being powered by Intel's new Core Series 3 CPUs?

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