Iran is likely to study and attempt to reverse-engineer a U.S. Navy underwater drone captured by Iranian forces near the Strait of Hormuz, potentially handing Tehran useful technology while delivering a setback for the Pentagon. According to a Reuters report published September 9, the 19-foot Dive-LD autonomous underwater vehicle malfunctioned while surveying regional waters before Iran’s Islamic Revolutionary Guard Corps recovered it.

Both the U.S. military and the drone’s manufacturer Anduril quickly moved to downplay the significance of the loss. Analysts cited by Reuters also said the captured drone was unlikely to provide Iran with a decisive military advantage. At the very least, however, the vehicle gives Tehran a propaganda victory and an opportunity to examine American undersea technology as the U.S.-Iran war enters its seventh month.

Tehran already appears to be having a field day with the situation, with Iranian embassies around the world mocking the U.S. for losing the drone. In an X post, Iran’s embassy in Ghana compared its recovery to pulling a plastic bottle from a fishing net, adding that it was “still blinking like an idiot.” Iran's embassy in Hyderabad was even more direct about what might happen next, posting: “Unboxing ceremony by our reverse engineers, tomorrow morning!”

A noticeable gap has emerged between how Anduril markets the Dive-LD and how the U.S. military is now describing the captured vehicle. Anduril promotes the Dive-LD as a highly reliable and adaptable large autonomous underwater vehicle capable of operating for up to 10 days in demanding environments, previously calling the platform the most reliable and flexible autonomous underwater vehicle on the market. The Navy, meanwhile, described the lost vehicle as an older, defective model that “neither collected sensitive data nor carried any classified sonar or radar equipment.”

Despite attempts to downplay the incident, Washington has historically taken similar incidents seriously. After Iran recovered an RQ-170 Sentinel stealth reconnaissance drone in 2011, then-President Barack Obama publicly requested its return. Tehran subsequently claimed that it had reverse-engineered the aircraft and unveiled domestic drones apparently influenced by its design. In 2022, the U.S. Navy dispatched a patrol ship and an MH-60S Seahawk helicopter after an Iranian naval vessel attempted to tow away an American Saildrone surface vehicle in the Gulf.

Iran's comical commentary is backed by a genuine ability to extract useful information from captured hardware. Bryan Clark, director of the Center for Defense Concepts and Technology at the Hudson Institute, told Reuters that Iranian engineers “could definitely reverse-engineer the mechanical systems.” However, he was more skeptical about Tehran’s ability to penetrate the software, which reportedly includes defenses intended to frustrate exploitation attempts.

Regardless of any reverse engineering limitations, analysts say Iran will continue to present the incident as evidence of Iranian control around the Strait of Hormuz and U.S. vulnerability there. “This is something that Iran has proven very adept at exploiting for its own benefit in terms of seeking to frame the narrative as one of U.S., in this case, ineptitude and their ability to sort of retain control over the Strait of Hormuz,” said Mona Yacoubian, director of the Middle East program at the Center for Strategic and International Studies.

The United States and Iran have been at war since Washington launched Operation Epic Fury in late February, with the conflict repeatedly spilling into the technology industry and its supply chains. In April 2026, an Iranian strike halted production at Saudi Arabia’s Jubail petrochemical complex, disrupting supplies of a critical resin used in PCB laminates. Iranian cruise missiles also reportedly struck an Amazon data center in Bahrain in July.

ABF substrates, the specialized insulating and wiring bases that connect tiny silicon chips above them to the much larger printed circuit boards below, sit beneath most high-end CPUs, GPUs, and AI accelerators. Featuring the Ajinomoto build-up film (ABF), these substrates have been critical to the semiconductor industry since the late 1990s, with personal computers, workstations, servers, and networking silicon driving steady demand for decades.

The artificial intelligence boom has multiplied that demand exponentially. Training and inference for frontier models now run across data centers, each housing hundreds of thousands of accelerators and providing hundreds of megawatts of compute. Nvidia alone shipped an estimated 3.2 million Blackwell GPU packages through the end of 2025, with every one of those accelerators packaged on an ABF substrate. Meanwhile, the industry is already entering the gigawatt era with humongous data center buildouts, each expected to house millions of AI accelerators.

This edifice rests on a remarkably narrow supply chain. Practically every advanced logic and AI chip made today by Intel, AMD, and Nvidia depends fundamentally on ABF substrates. These substrates are the conventional default for high-performance packaging. They are made by a small group of specialists, including Unimicron, Ibiden, Kinsus, Shinko Electric Industries, Samsung Electromechanics, and Nan Ya PCB. The upstream supply chain gets much tighter.

The one common denominator across ABF substrates, regardless of manufacturer, is the Ajinomoto build-up film itself. Each substrate maker laminates its build-up layers using dielectric film supplied by Japan's Ajinomoto, which controls a reported 95% or more of the global market. A single company, better known for food seasoning than microelectronics, sits at the base of one of the most concentrated supply chains in computing, almost singlehandedly supplying a material for hundreds of millions of semiconductor devices. Not surprisingly, demand is now growing beyond what the supply chain can comfortably supply.

Compounding this crunch, modern AI accelerators now pack multiple compute, memory, and supporting components onto a single board. As a result, the substrate is getting larger across the X-Y footprint to accommodate the expanding package. Manufacturers are also adding more build-up layers to the substrate to route the growing number of signals and power connections. Each additional layer requires another ABF layer, further multiplying demand across millions of accelerators and extending manufacturing times.

Unfortunately, the complications don't stop there. Beyond further straining the supply chain, expanding the substrates is creating technical problems, such as warpage, yield issues, and electrical losses within the component itself. This leaves the ABF substrate ecosystem facing two related challenges: producing enough advanced substrates for a rapidly expanding fleet of AI accelerators, while simultaneously re-engineering these substrates so they can continue to scale without becoming unmanufacturable or impractical.

The ABF substrate roadmap is consequently as much about supply-chain capacity as it is about the hardware itself, with suppliers such as Ajinomoto and Ibiden outlining plans to expand material and manufacturing capacity, respectively. At the same time, the wider industry — Intel, Samsung, and SK's Absolics among them — is exploring glass-core substrates and other material technologies to push past the limits of organic ABF.

ABF substrates

Silicon dies, including CPUs and GPUs, cannot communicate directly with the printed circuit board beneath them. The connection pads on a die are spaced micrometers apart, while the traces on a motherboard are spaced hundreds of micrometers to millimeters apart. Every high-performance chip, therefore, sits on an intermediary package substrate — a dense, multilayer board that fans the ultra-fine connections on the die outward into connections large enough for the motherboard to handle, while also providing signal routing, power and ground distribution, and mechanical support for the package.

ABF substrates used in AI accelerators typically consist of a rigid, glass-reinforced resin core sandwiched between successive build-up layers of copper wiring and insulating film. The core provides much of the mechanical rigidity, while the layers provide the increasingly dense wiring required close to the silicon.

To create the substrate, the manufacturer laminates the ABF dielectric onto the structure, forms microscopic vias — commonly with a CO2 laser — and then uses lithography and copper deposition to create a new wiring layer. High-end substrates typically use a semi-additive process (SAP), in which fine copper traces are plated up from a thin conductive seed layer. Another ABF layer is then laminated over it, and the process repeats. The film electrically separates successive copper layers, while plated microvias connect them vertically.

Ajinomoto developed the film in the 1990s, after which it gradually became the industry default for its low dielectric loss, fine-line capability, and smooth lamination. The company reportedly accounts for roughly 95% of the substrate film market, with its nearest competitor, Sekisui Chemical, holding only a low-single-digit share.

The manufacturing tier above the film is more populated but still concentrated. Unimicron, Ibiden, and Shinko together account for roughly three-quarters of the substrate market by most estimates, with AT&S and Nan Ya PCB rounding out the leading group. These companies take ABF and other materials and manufacture the finished multilayer substrate. Semiconductor packaging companies, such as TSMC and Amkor, then integrate those substrates into packages containing the processor, memory, and other components.

AI accelerators are pushing substrates outward and upward

To deliver the compute and memory bandwidth that frontier models demand, the industry is packing ever more silicon onto each AI accelerator. Designers now place multiple large logic dies alongside a growing number of high-bandwidth memory stacks on a single package. Nvidia's Blackwell generation mounts two reticle-sized GPU dies and eight HBM3E stacks on a single package, with its upcoming Rubin and Rubin Ultra parts pushing it further still. TSMC's CoWoS packaging is scaling from around 3.3 reticles — each roughly 830 square millimeters of silicon — a generation ago to 5.5 reticles in volume production in 2026, with a roadmap reaching 9.5 reticles in 2027 and beyond 14 reticles by 2029, when a single package is expected to carry roughly ten compute dies and twenty or more memory stacks.

This expansion of the accelerator package is driving the substrate’s expansion on two physical levels. The first expansion is the substrate's footprint in the X-Y axes. The base has to get wider and longer to accommodate the larger package footprint. Ibiden's current roadmap puts its cutting-edge substrate size at 90 × 90mm (3.54 x 3.54 inches) in 2026, 110 × 110mm (4.33 x 4.33 inches) in 2028, and 130 × 130mm (5.12 x 5.12 inches) and larger from 2030 onward. Ajinomoto independently expects the representative advanced AI packages its film goes into to grow from roughly 100 mm² in 2026 to about 120 mm² for 3D AI packages from 2031.

The second expansion is along the Z axis through additional layers. An expanded collection of compute dies and memory creates more signals to route, while the corresponding increase in power draw requires extensive power and ground distribution, all of which must be carried in a growing number of layers. Ibiden's roadmap targets a 10-X-10 buildup structure in 2026, 12-X-12 in 2028, and 14-X-14 from 2030. Here, the numbers represent the build-up layers on either side of the central substrate core: “10-X-10” means 10 build-up layers per side of the core — which is represented by the “X” — each comprising one dielectric layer (ABF) plus one patterned copper layer, working as a pair.

Nan Ya PCB's roadmap points in the same direction. From an 11+N+11 baseline, it targets 24-layer substrates in 2026 and more than 24 layers in the first half of 2027, while tightening line and space from a 9/12 µm baseline to 8/8 µm and then to 6/7 µm by early 2027. Layer-counting conventions differ between vendors, so a per-side figure and a total layer count don't necessarily line up directly.

The substrate’s expansion in both directions creates several challenges. Increasing the X-Y area makes the package harder to keep flat. Silicon, copper, the substrate core, and the polymer build-up materials that make up the substrate expand by different amounts when heated. As the package is bonded during assembly at around 250⁰C and then cooled, these mismatches cause the layers to pull against one another, leading to warping — a problem that becomes harder to control as package dimensions increase.

Excessive warpage can undermine solder-joint formation, layer-to-layer alignment, and reliability, while a larger substrate also occupies more manufacturing-panel area and exposes more area to potential defects. Organic substrates are reported to lose usable flatness once packages exceed roughly 120mm per side, a threshold that the largest AI accelerators are now reaching and that Ibiden's own roadmap — climbing toward 130mm and beyond — is set to cross.

The growing layer count along the z-axis also creates manufacturing challenges around yield, capacity, and time. Every new substrate layer requires a full manufacturing sequence of several steps, all held to sub-ten-micron tolerances. Each added layer increases the chance of a defect or alignment error that can scrap the whole substrate.

Additionally, layer count consumes manufacturing capacity and time in proportion. This is why Ibiden frames future demand in terms of semi-additive processing load rather than a simple substrate count, as a single advanced substrate now consumes far more of a line's capacity than a finished-unit tally would suggest.

Overall, the simultaneous expansion in substrate area and layer count means ABF consumption is rising much faster than processor shipments alone suggest. Ajinomoto illustrated this in its 2025 integrated report with a larger AI substrate that had about 3.5 times the board area and three times as many ABF layers as a conventional design — 18 layers against six — consuming roughly ten times as much ABF overall. This surging material consumption, set against an extremely concentrated supply base, extends the ABF substrate story beyond a technical problem into a supply-chain constraint.

The supply chain constraint

Like many components in the semiconductor industry chain before the AI boom, demand for ABF substrates periodically swung both ways. A severe bottleneck through 2020-2022 — driven by pandemic-era PC and server demand — was followed by an oversupply in 2023, as substrate manufacturers expanded capacity. However, that capacity was built for low-layer-count, smaller consumer substrates, not the large-body, multi-layer packages AI demands.

These advanced products require sufficiently large manufacturing formats, fine SAP wiring, tight layer registration, acceptable warpage, and high yields across much larger structures. Ibiden captures this by measuring demand not in finished substrates but in semi-additive-process load — the actual processing work each part imposes on a line. Indexing 2024 at 1.0, it expects the SAP load of a single AI-server substrate to reach 1.8 times that in 2026 and 2.5 times in 2028, with the company stating that substrate expansion will push total SAP demand beyond industry supply capacity, indicating a constraint in the manufacturing process itself.

The bottleneck is even tighter at the ABF material level. Ajinomoto's film capacity was already running at full load in the second quarter of 2026, at a reported two million square meters per month, although the company has outlined plans to increase capacity. A near-monopoly supplier at full capacity while consumption surges paints a clear picture of the bottleneck’s severity.

Unsurprisingly, prices have moved accordingly. Ajinomoto notified substrate manufacturers in May 2026 that it would raise ABF film prices by approximately 30%, effective in the third quarter. The hike is coming alongside comparable increases in copper-clad laminates from Resonac and Mitsubishi Gas Chemical, compounding pressure across the whole stack. Further tightening the squeeze, Ajinomoto recently cut shipments of the critical ABF film to China by 30%.

The growing ABF substrate problem cannot simply be attributed to Ajinomoto running out of film. In fact, while it's running at full capacity, the company says it has no concerns about its overall supply chain. The constraint stretches across the entire chain containing ABF, glass cloth, and other materials, SAP equipment, large-format substrate factories, yield, and customer-qualified production capacity.

The immense industry demand is progressively tightening the crunch. Several supply-chain analyses converge on an ABF supply-demand shortfall of roughly 10% in the second half of 2026, widening to around 21% in 2027 and potentially exceeding 40% by 2028, with demand for substrate area projected to grow at a compound annual rate near 39% from 2025 to 2028 as accelerators integrate more components.

The roadmap to recovery: more capacity, better materials

The industry is responding to ABF substrates' multifaceted constraints on multiple fronts: expanding manufacturing capacity to relieve near-term supply pressure while qualifying new materials and substrate architectures to break through the technical limits. Capacity expansion is already underway across the supply chain.

Ibiden is executing ¥500 billion ($3.1 billion) in capital investment across fiscal years 2026 to 2028 — the largest single substrate expansion on record — targeting 2.8 times its 2024 capacity for ASIC and AI-server substrates by 2028. Unimicron raised its 2026 capital spending to a record NT$34 billion ($1.07 billion), with a focus on ABF substrates. Meanwhile, Samsung Electro-Mechanics, Samsung's substrate arm, has committed $1.2 billion to expand ABF substrate production, with volume production expected by the third quarter of 2027.

Pegatron's substrate unit, Kinsus, has approved NT$23.5 billion ($722 million) for ABF equipment over three years and now focuses its most advanced lines almost entirely on AI clients, aiming to lift monthly output at its Taoyuan plant by roughly 25% by 2027. While these projects address the shortage directly, their lead times mean the crunch may continue for a while, as supply cannot respond instantly to the AI demand spike.

Ajinomoto is expanding upstream as well. A new plant in Gunma entered full operation in 2025. The company has invested roughly ¥25 billion ($157 million) in ABF production since 2023 and has said it will invest at least as much again by 2030, targeting a capacity increase of more than 50%. It is also adding a third Japanese base for varnish production — envisioned to provide capacity comparable to Gunma — with construction planned for 2028 and operations to begin in 2032.

However, capacity only solves the problem if the current substrate architecture can continue to scale. The material roadmap — aimed at addressing the physical constraints of ABF substrates — is therefore advancing parallel to the factory roadmap. Ajinomoto says present and future ABF generations are being engineered for larger, more multilayered substrates, high-bandwidth I/O, lower transmission loss, and improved resistance to warpage and humidity. The company expects newer, higher-value ABF grades to take an increasing share of its portfolio through 2030.

Substrate makers are addressing the problem from the process side. Nan Ya plans to move beyond 150 mm body sizes and 24 layers while shrinking copper line/space geometry toward 6/7 microns in the first half of 2027. Its materials roadmap includes an ultra-low-CTE core material with a CTE below 3 ppm/°C, alongside low-Dk, low-Df, and low-CTE dielectrics. Finer wiring allows a substrate to support more connections without relying solely on additional area or layers, while low-expansion materials help keep the growing structure flat.

Eventually, the substrate's central core itself may change to glass. Organic substrate cores are increasingly difficult to keep dimensionally stable as packages approach and surpass 100 mm. Glass can be matched more closely to silicon's thermal expansion — providing dimensional stability — and offers substantially lower dielectric loss for high-speed links. It has therefore emerged as one of the industry's main solutions to warpage.

As we detailed in our glass substrate roadmap, the move to a glass core is drawing a broad field, as it sits at the intersection of substrate-making, glass manufacturing, and advanced packaging, pulling in chip-and-packaging houses, display and glass specialists, and the incumbent substrate makers alike. Intel demonstrated a package that combines EMIB with a glass substrate at NEPCON Japan in January 2026, although the company still places commercial glass-substrate deployment in the latter half of the decade.

SK Group subsidiary Absolics is operating a low-volume glass-substrate manufacturing facility in Covington, Georgia — backed by $100 million in US CHIPS Act funding — producing prototype and qualification samples for customers, such as AMD for its MI400-series accelerators, while Samsung Electro-Mechanics is producing prototypes on a pilot line in Sejong and now plans mass production through its glass-core joint venture after 2027.

TSMC, meanwhile, is pursuing panel-level packaging through its chip-on-panel-on-substrate (CoPoS) platform, moving to a 310 x 310mm panel format, with a pilot line at its VisEra subsidiary, trial production targeted for 2027 and mass production for the second half of 2028. Glass-core substrates are a separate, later step on TSMC's roadmap, with commercial scale projected after 2030. Ibiden also puts “glass core” on its substrate technology roadmap around 2030 as a solution for warpage control.

The glass core — most likely a late-2020s-to-2030s technology — is positioned as a solution to the warpage wall. It replaces the organic core, not the ABF itself, which would remain the buildup material. A glass core may soften ABF demand per package, as glass's flatness allows finer routing and potentially fewer buildup layers, but it does not remove the material or the dependency. There's the possibility that a future dielectric material will eventually replace ABF, although that doesn't seem to be the industry's main focus currently.

Regardless, the near-term roadmap centers on more advanced SAP capacity, rapidly expanding factories, improved materials, and increased supply. Through the late 2020s, finer wiring, lower-loss ABF, lower-CTE materials, and better warpage control will enable organic substrates to stretch toward 110 mm and beyond. Around 2030, glass cores offer a path toward the 130 mm-plus packages that Ibiden and others already have on their roadmaps.

Sony Japan has officially implemented a new customer harassment policy to address ongoing customer backlash, following the company’s controversial announcement to phase out physical PlayStation game discs by January 2028. In an official publication on September 1, the company outlined prohibited customer behaviors to protect the dignity and safety of its employees and threatened to suspend customer service if the behaviors continued.

“The dignity and safety of our employees must not be threatened by customer harassment, such as words or demands from customers that exceed what is considered reasonable according to social norms,” the publication read. “If any behavior constituting customer harassment is confirmed, we may restrict or suspend customer service in order to protect the safety of our employees.”

Some of the examples of customer harassment detailed in the publication include “persistent and repeated, or prolonged, demands; excessive or unreasonable demands for compensation; abusive language, threats, slander, and other similar behaviors; requests unrelated to products or services; intimidating attitude; discriminatory or sexual conduct; and attacks and demands against individual employees.

The company also listed “forcing someone to prostrate themselves,” visiting company grounds without permission, and excessively asking for apologies as customer harassment, expressing willingness to use legal force if necessary. “We will take a firm stance against such actions and aim to build healthy and sustainable relationships while respecting both our customers and employees,” it said. “If we deem it necessary, we will cooperate with the police, lawyers, etc., and consider taking action, including legal measures and criminal proceedings.”

The new policies appear to be in response to the intense backlash over Sony's decision to end physical disc production by 2028. The decision was met with immediate, widespread backlash from the gaming community, which argued — among other things — that ending physical discs was equivalent to eliminating true ownership. Critics also argued that digital purchases were rentals and placed too much power in the company's hands, which could restrict access at will. Just 6 days after the July 1st announcement, a Change.org petition to stop the move had amassed 200,000 signatures and is now approaching 400,000.

The company doesn't appear to be backing down. After a class action lawsuit related to Sony’s decision to kill physical discs, the company moved to force the case into out-of-court arbitration, arguing that “reasonable consumers would not be misled into believing they own digital games.” The plaintiffs allege that Sony misleads consumers by using "Buy" buttons for digital PlayStation games without clearly disclosing that buyers are only purchasing a temporary, revocable license rather than actual, permanent ownership of the game.

Several other related lawsuits are ongoing. Regardless, Sony has said it will "cautiously move forward" with its decision despite “strong views” from players. The company hopes its new customer harassment policy will curb some of the backlash individual employees are currently facing. The policies also align with Japan's recent law that mandates companies to take measures to prevent customer harassment towards their workers.

Hackers reportedly claiming to be good actors have drained about $320 million worth of Bitcoin from Liquid Network's federation wallet, according to a CoinDesk report. In an X post on September 6, Liquid — a Bitcoin sidechain developed by blockchain infrastructure company Blockstream — confirmed that 4,000 BTC, roughly 95% of the entire wallet's balance, had been withdrawn.

Interestingly, the post referred to those behind the exploit as “purported white-hat hackers,” echoing the hackers’ own claim, after they self-identified as “whitehats” in a message embedded in a Bitcoin transaction. They also reportedly requested an audience with Liquid via the on-chain message, promising to return the money once the vulnerability that enabled the exploit is fixed.

“Please fix the bug first,” the on-chain message said. "The chain is under risk at latest commit right now. Make sure every node is patched. Then we will transfer the money back safely after confirming the fix.” Liquid responded on-chain with its security team's contact and has reportedly moved communications to an encrypted channel. Meanwhile, the platform said it has suspended transactions and warns of service disruptions as federation members work to restore service.

Launched in 2018, Liquid is a federated sidechain designed to move Bitcoin faster and more privately than the main chain. Users lock BTC on Bitcoin and receive an equivalent token, L-BTC, on Liquid, which settles blocks roughly every minute and finalizes in about two minutes. Rather than relying on miners, the network is secured by a federation of more than 80 exchanges, brokers, and other financial firms. The block signing and the multisig wallet holding the pegged-in Bitcoin are handled by 15 rotating functionaries that require 11 signatures to move funds.

The mechanics behind the exploit are also unusual, as nothing appears to have been stolen in the conventional sense. For example, in January, the Solana-based platform Step Finance lost roughly $40 million after attackers compromised devices belonging to its executive team, gaining access to the keys that guarded its treasury wallets. According to Liquid, the coins left through the Peg-out Authorization Key (PAK), belonging to SideSwap, a decentralized exchange built on the sidechain.

However, Liquid said that the key had not been compromised, nor had any others. SideSwap gave a matching account, stating a customer sent 4,000 L-BTC to its peg-out service at 14:05 UTC, the service processed the order as it would any other, and the Liquid Federation paid out 3,996 BTC to the customer's Bitcoin address twenty-three minutes later. According to SideSwap, its systems had no way of distinguishing those coins from any other L-BTC.

The incident lands in what has already been a punishing stretch for crypto infrastructure. Recently, the trading platform Drift suspended deposits and withdrawals after a suspected $270 million hack in April. In 2025, roughly $17 billion worth of Bitcoin was stolen, driven largely by impersonation schemes and AI-assisted scams.

A 52-year-old Belgian-Chinese man has been arrested on suspicion of espionage for allegedly transferring specialized semiconductor intellectual property and trade secrets from Belgian chipmaker BelGaN, where he worked, to China. According to an AP News report citing details released by Belgium's federal prosecutor’s office on September 7, the Beijing-born Belgian resident was taken into custody on May 10 at a Brussels airport while attempting to board a flight to China.

The suspect — identified by Belgian media only as H.L. — previously held a senior research position at the now-defunct BelGaN, which specialized in gallium nitride (GaN) semiconductors. Investigators suspect he was concurrently leading a Chinese chip firm, GanKool, which was developing the exact same specialized gallium nitride chip technology as BelGaN. The company was established only a few months after H.L. joined BelGaN and was financed by a Chinese investment fund. The suspect now faces charges of industrial espionage, membership in a criminal organization, misuse of company assets, and unlawful disclosure of business secrets.

The espionage allegations emerged from an investigation into BelGaN's collapse. When the company collapsed into bankruptcy in the summer of 2024, Belgian authorities launched a routine financial probe into the failure. Investigators eventually uncovered highly unusual corporate activity. Instead of trying to keep BelGaN financially viable, the managers and the researcher may have actively tried to make the Belgian company “disappear” after transferring its proprietary knowledge. This led to further investigations that revealed GanKool’s existence and its connections to BelGaN.

In addition to the researcher’s role, the investigators also found evidence linking BelGaN's last CEO, a Chinese national, to the same Chinese rival. The prosecutors have said a second suspect remains at large, with Belgian media speculating that the CEO is the suspect.

The incident highlights the increasingly intense competition over technology and intellectual property in the semiconductor industry, particularly as China pushes to reduce its reliance on foreign chip technology while the U.S. continues to restrict its access to advanced processors and semiconductor manufacturing equipment. Just last month, South Korean court documents accused Chinese memory maker CXMT of using a detailed “Project Hefei” roadmap to obtain Samsung's proprietary DRAM technology, including a 620-step process recipe. A former Samsung engineer has already been sentenced to seven years in prison over the scheme.

The Trump administration has imposed tariffs of up to 100% on imported drones and their components. This is its latest move in a long-running campaign to reduce reliance on foreign drones and other electronics — especially Chinese — citing national security while bolstering the domestic supply chain. The tariffs came into effect on Thursday, September 3, 21 days after President Donald Trump signed the measure on August 13. Consequently, the U.S. Customs and Border Protection (CBP) published guidance detailing exact filing procedures and tariff rates for the affected drones.

The proclamation categorizes drones by capability, with the 100% rate applying to unmanned aircraft with a maximum takeoff weight above 55 pounds (25kg); any drone with thermal imaging and docking stations; and a defined list of critical components, including static converters, airframe components, and electronic control boards. The White House calls this category “particularly sensitive for natural security purposes.”

A 25% rate applies to smaller drones that lack those capabilities, as well as other components. This system of classification splits many brands into both categories. DJI’s thermal-equipped, public-safety Matrice series, for example, falls into the 100% bracket regardless of its weight, while consumer models such as the Mini and Air series are at 25%. Both rates apply to imports regardless of country of origin, except for specific allied countries. However, they overwhelmingly land squarely on China — home to DJI, which holds more than two-thirds of the global market and supplies the bulk of the drones on US shelves.

Drones and components from the European Union, Japan, Liechtenstein, South Korea, Switzerland, and Taiwan are set at 15%, while those from the United Kingdom are set at 10%, provided that substantially all of the hardware, software, and technology originates in those countries or the United States. The proclamation also phases in the tariff across two component groups. A 25% to 100% rate on finished aircraft, docking stations, and the most sensitive components — power converters, flight-control boards, and the airframe parts used in drones over 25 kilograms — took effect on Sept. 3. For a second, lower-priority group of components — largely the same categories of parts, but produced for smaller consumer and commercial drones — the rate, which is set at 25%, does not take effect until Feb. 9, 2027. The administration framed the 180-day runway as time for importers to shift sourcing.

The tariffs are the latest development in a widening federal effort to push Chinese drones out of the US market on grounds of national security. In December 2025, the Federal Communications Commission added all foreign-made drones and their critical components to its Covered List, blocking new models from the authorization they need to be sold domestically. Last month, the agency moved to retroactively ban previously cleared models it deems "military-grade," including those with LiDAR. That proposal's public-comment window closed September 2, one day before the tariffs took effect. If passed, many of the items affected by the tariffs would be automatically banned. Conversely, if the proposal fails, the tariffs would still apply significant pressure.

The proclamation pairs the duties with incentives meant to rebuild a domestic supply chain, with U.S. makers such as Skydio attracting major investment since the original ban. The onshoring push has also drawn scrutiny for its proximity to the president's family. Donald Trump Jr. has sat on the advisory board of Florida drone-parts maker Unusual Machines since November 2024 and holds a sizable stake. The company's shares climbed sharply after the tariff announcement. Government-ethics groups have flagged the arrangement as at least the appearance of a conflict.

Microsoft will begin automatically enabling its Memory Integrity security feature on a broader range of eligible Windows PCs through quality updates starting in October 2026, extending the kernel-level protection to more existing devices by default. In a September 1 blog post, Microsoft said the rollout will provide stronger protection for more devices against attacks targeting the Windows kernel, while PCs that already have Memory Integrity deliberately disabled will retain their existing configuration.

“Windows quality updates will begin enabling memory integrity protection on eligible devices,” Microsoft said. The updates will also enable Virtualization-based Security (VBS) where required, which provides the isolated environment underlying Memory Integrity. Before making the change, Windows will automatically assess each device using what Microsoft describes as readiness signals covering its hardware capabilities, compatibility, and performance.

The October rollout is basically an expansion of Microsoft’s existing default-enablement policy. Memory Integrity is already switched on by default on clean Windows 11 installations that meet Microsoft’s hardware requirements, as well as on Secured-core PCs. Current requirements include an 8th Gen or newer Intel processor for Windows 11 22H2, an AMD Zen 2 or newer processor, at least 8GB of RAM on x64 systems, an SSD of at least 64GB, compatible drivers, and enabled hardware virtualization. Automatic activation under that policy applies to clean installations and not upgrades of existing devices.

Memory Integrity — also known as Hypervisor-Protected Code Integrity (HVCI) — has existed since the Windows 10 era and was originally released as part of Microsoft’s Device Guard security technology. It uses VBS and the Windows hypervisor to move kernel-mode code-integrity checks into an isolated environment, helping prevent malicious or untrusted code and drivers from executing in the Windows kernel. Windows 10 generally left the protection optional outside configurations such as S mode, while Windows 11 made it more of a default security feature on compatible new installations.

The feature comes with a performance wrinkle familiar to PC gamers, leading many gamers to disable it. Microsoft acknowledged in 2022 that Memory Integrity and Virtual Machine Platform could affect gaming performance on some Windows 11 configurations, and advised gamers prioritizing performance that they could temporarily disable these protections while playing, warning that doing so reduces security. The company’s own gaming guidance subsequently continued to recommend temporarily disabling Memory Integrity and VMP where they interfere with gaming performance.

The security feature’s impact on performance depends on the hardware. Microsoft says Memory Integrity performs better on newer processors with hardware features designed to accelerate the required isolation, while older CPUs relying on software emulation can experience a larger performance hit. Driver compatibility can also prevent activation, with Microsoft documenting issues ranging from malfunctioning software to incompatible gaming anti-cheat solutions.

For most users, the October change requires no action. Eligible PCs will be evaluated and updated automatically, while administrator policies and previous user choices remain in place. Microsoft specifically says systems where Memory Integrity has already been disabled “won’t be automatically changed by this rollout,” leaving gamers and other users who previously opted out in control of the setting.

A federal grand jury in California has indicted Russian citizen Searzhudin Tamirlanovich Aktulaev for allegedly conducting phishing attacks that stole data from over 80,000 computers between June 2016 and November 2017, using TVRAT and DarkVNC remote-control malware. Detailed in a Department of Justice press release on September 1st, the indictment — filed in June 2021 and released September 2026 — lists charges of “Conspiracy, Transmission of a Program, Information, Code, and Command to Cause Damage to a Protected Computer, and Aggravated Identity Theft, among other offenses.”

Aktulaev was extradited to the U.S. in August 2026, five years after his arrest in Cyprus in May 2021. He made his first appearance in federal court in San Francisco — after which he was remanded to federal custody — and is scheduled to appear in district court on October 5, 2026. The arrest was made after an FBI investigation, and the case is being prosecuted by the National Security, Cyber, and Special Prosecutions Section.

According to the indictment, Aktulaev “conspired to exploit the online message platform of a well-known freelance employment technology company, located in the Northern District of California, to spread malware to approximately 80,000 freelancers”. He sent messages containing malicious Microsoft Excel attachments, using approximately 255 fake user accounts. Once opened, the attachments prompted users to run a macro that then downloaded malware from the Internet, mirroring a hack earlier this year in which an unofficial 7-zip.com website served malware-laden downloads for over a week.

The attack used TVRAT (TeamViewer Remote Access Trojan) and DarkVNC malware, both of which grant the attacker remote control of the infected system. TVRAT exploits TeamViewer, while DarkVNC exploits VNC Viewer, popular remote administration tools. The malware stole and uploaded data from the victims' computers to a command-and-control server, from which Aktulaev and his co-conspirators extracted the stolen data to “commit fraud and other criminal activities”.

The indictment says thousands of computers infected by the TVRAT malware were “calling back” to a command-and-control domain hosted in the United States, which was paid for using virtual currency. Roughly half of the victims were in the United States, many of whom were Northern District of California residents, according to the indictment.

“A database found on the command-and-control domain revealed thousands of victims. Additionally, a shared document on the email account used in the criminal activities contained information to include e-commerce login credentials, as well as personally identifiable information (“PII”) for hundreds of victims,” the press release said.

If convicted, Aktulaev could spend up to 20 years behind bars and pay a $250,000 fine or twice the total illicit gains for the conspiracy to commit wire fraud charge alone. The other charges carry terms ranging from two to twenty years in prison, in addition to fines. Meanwhile, the FBI is currently investigating another hack in which 153 million US and Canadian drivers’ licenses were leaked on a Russian cybercrime forum.