Micron is letting TSMC build custom base dies for HBM4E

Micron is letting TSMC build custom base dies for HBM4E

Direct:

Micron's (MU) latest roadmap reads as one continuous bet on AI memory, and the consumer business is being wound down to feed it. The pieces are 1-gamma DRAM, G9 NAND, and an HBM line that runs from HBM4 in volume now to HBM4E in 2027. What ties them together is where each node lands first.

Start with HBM4E, because that is the real shift. Micron is handing the base logic die to TSMC (TSM), including custom variants on advanced nodes up to 3nm-class. That moves HBM away from a standardized DRAM stack and toward a semi-custom product where the logic layer underneath the memory is tailored per customer. Micron says it has six HBM4 customers and that calendar 2026 memory output, HBM4 included, is already sold out.

HBM4 is shipping today. The 36GB 12-high part went into volume early in 2026 for NVIDIA's (NVDA) Vera Rubin platform, rated above 2.8 TB/s, roughly 2.3x the bandwidth of HBM3E. A 48GB 16-high sample is already out.

The DRAM and NAND under all of this move the same direction. 1-gamma is Micron's first EUV DRAM node, about 30% denser than 1-beta, now shipping from Taiwan with EUV being stood up in Japan and first Idaho output targeted for 2027. G9 NAND is in high-volume production, and it is the flash inside the 9650, the first PCIe Gen6 datacenter SSD, rated at 28 GB/s and 5.5 million random read IOPS.

That last drive is the one consumer SSD buyers should sit with. Micron's showcase Gen6 SSD is a liquid-cooled datacenter part, and its Crucial retail line shuts down in February 2026. The process leadership that used to trickle into cheap consumer drives is committed to AI infrastructure through 2027. Nothing here points to consumer SSD relief any time soon.

Drafted with AI assistance against parallel reporting.

Sources:

  • DigiTimes, “Micron maps out HBM roadmap with 2027 HBM4E debut and custom AI memory designs” (May 25, 2026, paywalled stub: headline and lead only)
  • Micron Technology IR, “Micron in High-Volume Production of HBM4 Designed for NVIDIA Vera Rubin, PCIe Gen6 SSD and SOCAMM2” (Mar 16, 2026)
  • Tom's Hardware, “Micron teams up with TSMC to deliver HBM4E, targeted for 2027” (2026)
  • Tom's Hardware, “Micron enters high-volume production of HBM4 for Nvidia Vera Rubin” (2026)
  • TrendForce, “Micron Plans HBM4 Mass Production in 2026, Customized HBM4E to Launch in 2027-2028” (Dec 23, 2024)
  • Micron Technology IR, “Micron Announces Shipment of 1-gamma DRAM” and Japan EUV release (2026)
  • Micron Technology IR / TrendForce, “Micron Announces Exit from Crucial Consumer Business” (Dec 3, 2025)
  • Blocks & Files, “Micron rides HBM surge to record quarter” (Dec 18, 2025)

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