YMTC’s hybrid bonding patents: is Samsung losing ground in 400+ layer 3D NAND?

*YMTC’s hybrid bonding patents: is Samsung losing ground in 400+ layer 3D NAND?*
South Korea’s NAND flash leaders, Samsung and SK Hynix, face a potential threat as Yangtze Memory Technologies Corp. (YMTC) takes the lead in hybrid bonding for 400+ layer 3D NAND. YMTC continues to enhance its technology while aggressively securing patents. Reports indicate it has successfully commercialized 270+ layer 3D NAND, marking a major industry milestone.
Source: DigiTimes
Submitted February 26, 2025 at 12:13AM by NewMaxx via reddit ift.tt/BmStapq
Scroll to Top