Selby's VC firm, Copper Sky Capital, is currently raising a $300 million second fund, according to a regulatory filing.

Samsung & SK Hynix have announced a multi-billion-dollar expansion plan for AI and chip manufacturing in Korea. Korea's Largest Tech Firms, Samsung & SK Hynix, Pour In Over 1.3 Trillion Won For Major Expansion Plans In a bid to aggressively compete with rivals such as TSMC and Intel, Korea's major semiconductor firms, Samsung Electronics and SK Hynix, have pledged 1,350 Trillion Won towards the expansion of semiconductor manufacturing, AI Data Centers, and memory production. The expansion plan will span 10 years and will cost roughly 1350 Trillion Won or $870 billion. It's not just semiconductor manufacturing; the plan also involves […]

Read full article at https://wccftech.com/samsung-sk-hynix-go-into-hyperdrive-with-a-massive-fab-expansion-plan-in-korea/

Samsung Electronics is all set to tackle Intel 14A and TSMC A14 with its own 1.4nm process technology, which should be ready in 2029. Foundry Battle Heats Up With Samsung Electronics Aiming for Mass Production of 1.4nm Process Tech in 2029 Intel and TSMC are one of the leading firms working on 1.4nm class process technologies. Although each technology is fundamentally different than one another, both are officially designated as 1.4nm products. TSMC's A14 fabs are expected to come online next year & competitor Intel is also set to accelerate its 14A technology due to high demand, and major customers […]

Read full article at https://wccftech.com/samsung-ready-to-tackle-intel-tsmc-with-1-4nm-process-mass-production-2029/

In a surprising announcement, IBM introduced its 0.7-nanometer chip technology today to make it the first firm to have unveiled a manufacturing process smaller than the 1-nanometer technology node. The firm claims that the technology will enable chips to contain as much as 100 billion in an area the size of a fingernail. To achieve this, the technology relies on IBM's nanostack technology, which relies on nanosheets for chip fabrication. IBM Makes Headway With Nanostack Chip Manufacturing Technology As Part Of 0.7 Nanometer Development According to IBM, the 0.7-nanometer chip has nearly twice the density of its 2-nanometer chip unveiled […]

Read full article at https://wccftech.com/ibms-0-7-nanometer-nanostack-chipmaking-technology-shows-americas-semiconductor-innovation-still-leads-the-world/

Google is working with MediaTek to bring its next-generation TPUv9 chip, codenamed Triggerfish, to the Agentic AI market. MediaTek-Developed Google TPUv9 "Triggerfish" Packs A CPU That Should Accelerate Both AI Training & Inference Workloads A few months back, Google unveiled its latest TPU family, which included the Inference-optimized v8i "Zebrafish" developed by MediaTek, and the training-optimized v8t "Sunfish" developed by Broadcom. For its next-generation TPU, Google aims to deploy both Inference and Training capabilities on a single chip. The chip is internally codenamed "Triggerfish" and will be part of the upgraded TPUv9 series. Based on the latest report by FundaAI, […]

Read full article at https://wccftech.com/google-mediatek-build-tpuv9-triggerfish-cpu-compute-die-one-package-agentic-ai/

Taiwanese contract chip manufacturing giant is raising prices for most of its manufacturing process technology nodes, according to a report from Culpium. The price hikes have come in response to the meteoric price hike by memory manufacturers, say the publication's sources. The global memory chip market has been thrust into the spotlight following booming demand from the AI sector. However, TSMC's price increases will focus on all manufacturing process technology nodes reaching as far back as the mature 7-nanometer node, which implies that they could create ripple effects for a variety of sectors. TSMC Eager To Raise Prices Following Similar […]

Read full article at https://wccftech.com/report-tsmc-follows-samsung-and-sk-hynix-into-price-surge-catching-its-own-customers-off-guard-with-7nm-hikes/

Panel-Level Packaging (FOPLP) and Glass Substrates are going to drive the next chapter in advanced packaging, with the market exceeding $8 Billion by 2030. The AI & HPC Segments Want To Move Beyond Organic Substrates & Wafer Packages To Meet Their Growing Compute Needs, & That's Where Panel-level Packaging & Glass Substrates Come In TSMC & Intel are the two major semiconductor firms that are accelerating next-gen glass core substrates for panel-level packages. These two technologies go hand in hand in powering the next generation of semiconductors and come with major advantages over traditional organic substrates and wafer-level packages. The […]

Read full article at https://wccftech.com/tsmc-intel-race-to-replace-organic-substrates-with-glass-panel-level-packaging-8-billion-market-by-2030/

TSMC is aggressively working on CoPoS (Panel-Level) packaging to replace CoWoS for growing compute demand as Glass Core Substrates take center stage. Panel-Level Packaging Is The Next Logical Step for TSMC As It Eyes CoPoS "Glass Core Substrate" Technology Over CoWoS The ever-growing AI and compute demand requires next-generation packaging technologies. Intel and TSMC are aggressively working towards that goal, and glass core substrates are going to be a major part of their trajectories moving forward. In a recent report by Commercial Times Taiwan, it is reported that TSMC is now aggressively moving towards CoPoS (Chip-On-Panel-on-Substrate) as a replacement to […]

Read full article at https://wccftech.com/tsmc-accelerates-copos-packaging-replace-cowos-as-glass-core-substrates-cut-costs-boost-wafer-utilizatio/

The Taiwan Semiconductor Manufacturing Company (TSMC) is expanding its supply chain for glass substrates as part of the first step of establishing a supply chain for the chip-on-panel-on-substrate (CoPoS) packaging technology, according to supply chain sources. The glass substrates will be used in the firm's advanced versions of the chip-on-wafer-on-substrate (CoWoS) packaging technology, and TSMC is working with Innolux and Ibiden as part of these efforts. TSMC Gears Up For Glass Substrate Development By Sharing Plan With Suppliers According to the details, the two companies that TSMC is in touch with are its suppliers for Ajinomoto Buildup Film (ABF) and […]

Read full article at https://wccftech.com/tsmc-bets-on-glass-for-cowos-as-silicon-mimicking-thermals-beat-organic-substrates-yet-mass-production-stays-distant/

Dynamics in the semiconductor foundry industry and strong demand for AI products have led to the revenue at the top ten foundries increasing by 3.7% in the first quarter, says market research firm TrendForce. The research firm adds that underutilization for some nodes fell during the first quarter, and with manufacturers expecting utilization to grow in the second quarter, wafer prices can also rise later during the year. Top Global Foundries See Revenue Grow Despite Lower Smartphone Demand, Says Research Firm The first quarter of a calendar year is a slow quarter for foundries since smartphone demand typically slows down. […]

Read full article at https://wccftech.com/ai-chip-frenzy-drags-foundry-revenue-up-3-7-in-q1-yet-wafer-prices-are-about-to-hit-customers-next/

Intel Nova Lake Desktop CPUs are the next big platform upgrade for the consumer segment, offering up to 52 cores. Intel's 52-Core Nova Lake Desktop CPUs Made At TSMC, Consume Lots of Power & Produce Lots of Heat Every year at Computex, we try to bring you the latest updates on Intel's next-generation desktop lineup. In 2023, we shared the first details of Intel's 14th Gen Raptor Lake Refresh CPUs, and in 2024, we shared the first details about Intel's Arrow Lake CPUs. Our information turned out to be correct, and this year, we have an update for Intel's upcoming […]

Read full article at https://wccftech.com/intel-nova-lake-desktop-cpu-whispers-early-2027-launch-52-core-power-thermal-details-multi-core-overclocking-z990-z970-boards/

According to AMD, it wasn't as easy as it appears to bring back the AMD Ryzen 7 5800X3D to the market. AMD Ryzen 7 5800X3D Reportedly Required Extensive Engineering for Revival as the Manufacturing Technology Was No Longer Available AMD took a lot of time to bring back the Zen 3-based first-ever X3D chip, and now we know why. Millions were asking AMD to revive the AMD Ryzen 7 5800X3D and 5700X3D after the RAMpocalypse made it extremely difficult to build DDR5-based gaming builds. Considering the AM4 is still alive and doing well in the market, many Ryzen 5000 series […]

Read full article at https://wccftech.com/amd-says-it-had-to-rebuild-the-ryzen-5-5800x3d-to-bring-it-back-for-am4s-10th-anniversary/

Apple is already considering the discontinuation of the MacBook Neo's $599 base variant, which would be equivalent to a stealth price hike of $100. Now, however, as TSMC appears all set to pursue an inflationary pricing regime for its advanced nodes, Apple might have to resort to a bigger price jump to prevent its razor-thin margins on the MacBook Neo from tumbling into the negative territory. Apple's razor-thin margins on the MacBook Neo are now headed for another squeeze, courtesy of TSMC's inflationary pricing for its 3nm node process For the benefit of those who might not be aware, Apple […]

Read full article at https://wccftech.com/tsmcs-ceo-urges-employees-to-buy-its-shares-while-apple-bleeds-on-macbook-neo-as-the-foundrys-15-3nm-price-hike-threatens-to-push-margins-into-negative-territory/

FuriosaAI and Broadcom have partnered to build a high-performance AI accelerator chip featuring next-gen HBM4/E memory. FuriosaAI's Next-Gen AI Accelerator Features 2nm Chiplet Architecture, HBM4/E Memory Support for Massive AI Compute Clusters FuriosaAI has announced its third-generation AI accelerator, which builds upon its 2nd Generation RNGD platform, which is currently in mass production on TSMC's 5nm process technology. The 2nd Gen RNGD AI platform comes in the form of a 180W PCIe-based design, which aims at LLM & Agentic AI workloads. The next-generation design is going to go all-in on the AI inference segment as Agentic AI continues to see […]

Read full article at https://wccftech.com/furiosaai-ditches-gpu-playbook-for-2nm-broadcom-built-inference-chip-claims-hbm4-e-bandwidth-beats-gpus/

TSMC has moved rapidly to quell a wave of discontent among its employees following the widespread dissemination of rumors related to impending bonus cuts, with such fears only bolstered by the recent comments from TSMC's CEO himself. Now, amid fears of a Samsung-like upheaval that might disrupt its intricate production cadence, TSMC has just assured its employees that their bonuses will grow at a stronger pace than what was recorded in the previous year. TSMC has just issued a two-point statement, acknowledging the contributions of its employees, while assuring them of a healthy increase in their performance-related bonuses We noted […]

Read full article at https://wccftech.com/tsmc-scrambles-to-calm-furious-employees-with-promises-of-bigger-bonuses-after-ceos-30-bonus-cut-comments-triggered-samsung-style-revolt-fears/

NVIDIA & AMD CEOs have landed in Taiwan as they prepare to unveil their next-gen lineups at Computex 2026, which is just a week away. NVIDIA & AMD Will Have a Jam-Packed Computex: Focusing on Show-Stopping Consumer & AI Technologies Computex 2026 is about a week away now, as the premier technology event is expected to take place on the 2nd of June. And everyone in the industry is excited to see what's coming next from major firms, such as NVIDIA and AMD. Ahead of Computex, both NVIDIA CEO Jensen Huang and AMD CEO Dr. Lisa Su have landed in […]

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Samsung made history by introducing its first 2nm GAA chipset to the masses, Exynos 2600, with the Korean firm’s semiconductor now shifting focus and resources towards the Exynos 2700, its next SoC that’s reported to use the improved iteration of the company’s 2nm node and launch just before the Galaxy S27 series launch in early 2027. For Samsung’s competitors, the Exynos 2600 would be brushed off as a one-time affair, but the Exynos 2700 sends an entirely different signal, one that could make Qualcomm and TSMC extremely nervous. For both Qualcomm and TSMC, the Exynos 2700 represents a potential loss […]

Read full article at https://wccftech.com/exynos-2700-can-brew-trouble-for-tsmc-and-qualcomm-next-year/

The seemingly never-ending bonus-related saga at Samsung is now spurring a chain reaction across Asia's industrial heartland, with some TSMC employees now actively advocating for the tactics employed by Samsung's unions in recent days to counter the management's penny-pinching ways. TSMC Employees are increasingly coalescing around the idea of threatening Samsung-style strikes to defend their wage-related perks A lot of TSMC employees appear to be venting their rage in recent days on select Facebook pages, honing in on persistent rumors that TSMC might cut employee bonuses. Of course, TSMC has a special place within Taiwan's discourse, with the company often […]

Read full article at https://wccftech.com/tsmc-employees-are-exploding-with-rage-over-rumored-bonus-cuts-despite-a-58-profit-jump-and-are-coalescing-around-samsung-style-strikes/

Samsung is apparently feeling confident enough on the back of its rapidly growing coffers to try to eat some of TSMC's lunch, especially the proverbial course related to MediaTek, if one were to adhere to a cullinary-themed analogy. As a case in point, consider the latest rumor, which posits that Samsung's Chairman is currently courting MediaTek on TSMC's home turf. Samsung wants to rope in MediaTek as a foundry client, and is not above dangling lucrative memory deals to achieve its goals According to a Taiwanese publication, Samsung's Chairman, Lee Jae-yong visited Taiwan on May 21 with a high-level entourage. […]

Read full article at https://wccftech.com/samsungs-chairman-lee-jae-yong-has-reportedly-slipped-into-taiwan-to-steal-mediatek-as-a-foundry-client-from-tsmc/