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Qualcomm’s HBC Stacks Compute Beneath DRAM To Smash The AI Memory Wall, Claiming 6x The Bandwidth Per Watt Of HBM

A layered chip with gold-colored elements is shown above the text '200x capacity per watt vs. SRAM*'.

Qualcomm is unveiling its breakthrough for the AI data center market called HBC (High-Bandwidth Compute), to break the memory wall. Qualcomm's HBC Is A Memory Accelerator That Is Stacked Under DRAM, Offering A Major Boost Versus Standard SRAM & HBM Configurations At its Investors Day 2026, Qualcomm unveiled HBC under its Dragonfly brand, an innovative technology that aims to offer a major boost in memory capacity and bandwidth. The HBC architecture deploys a purpose-built & near-memory solution that bonds compute with boosted memory bandwidth in a 3D stacked chip design. With this, Qualcomm aims to solve the memory bottlenecks that […]

Read full article at https://wccftech.com/qualcomm-hbc-stacks-compute-beneath-dram-to-smash-the-ai-memory-wall/

Anthropic Eyes UK Startup’s Fusion Tech Promising 100x Faster AI Inference at One-Tenth the Cost of NVIDIA’s Groq

Anthropic Eyes UK Startup's Fusion Tech Promising 100x Faster AI Inference at One-Tenth the Cost of NVIDIA's Groq

Anthropic, the creators of Claude AI, are reportedly in early talks with a UK startup whose SRAM tech can boost AI inference by 100x & reduce costs by 10x. Anthropic Reportedly In Early Talks With Fractile, A UK-based Startup Working on the fusion architecture as an AI Inference Booster Currently, Anthropic sources its chips from various companies, including NVIDIA, Google, and Amazon. This trio allows the company to keep running its AI infrastructure without major concerns that are often associated with relying on a single chipmaker. But as compute demand intensifies in the AI space, many AI firms are now […]

Read full article at https://wccftech.com/anthropic-sets-eyes-on-uk-startup-tech-speeds-up-ai-inference-100x-reduces-costs-10x/

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