CXMT is now charging more for memory than the big three DRAM makers as demand swells in China's domestic AI markets. CXMT Benefits Big Time From DRAM Crisis By Charging Hefty Premium For Its Memory Products Most global media outlets were under the impression that CXMT was going to be the "Cheaper Alternative" to Samsung, SK Hynix, and Micron, who are asking big sums of cash for their DRAM products, but that wasn't the case. In our exclusive, we reported that CXMT's advantage was not in its price, but in its supply, and that remained true; demand skyrocketed 10-fold, and […]

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Qualcomm is expanding its chip-design services to China as it is reportedly in early talks with ByteDance. China's ByteDance To Get Custom-Chip Design Assistance From Qualcomm As It Expands Its Revenue Beyond Smartphones Custom-chip designs are picking up momentum across the tech industry, and a report by Reuters suggests that Qualcomm might be assisting ByteDance, a leading Chinese firm, with chip-design services. Although the talks between Qualcomm and ByteDance are still early, if they succeed, then that would make ByteDance one of the first customers of Qualcomm's chip-design services. The move will also help Qualcomm diversify its revenue, breaking its […]

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SK Hynix is being crushed by massive memory demand, but investors are offering assistance to increase its production capacity. SK Hynix Memory Demand Swells, but It Is Wary of Investments Towards Its Production Capacity While Agentic AI shifts gears from GPUs to CPUs, the DRAM demand continues to remain high as both components require memory. SK Hynix, being one of the leading DRAM makers, is already facing severe production constraints. At the same time, SK Hynix is being approached by tech firms to invest in its chip production capabilities. As per Reuters, it is reported that tech firms, mainly in […]

Read full article at https://wccftech.com/sk-hynix-buried-under-customer-cash-offers-to-expand-memory-output-but-insider-warns-available-capacity-essentially-zero/

ASML has reportedly achieved a critical breakthrough in its EUV lithography technology, boosting the power of its light source to 1000W. This leap from the current 600W standard is projected to increase per-machine chip output by 50% by the end of the decade, enabling foundries to process approximately 330 wafers per hour, up from the 220-wafer limit of today's systems.

Generating EUV light remains one of the most complex engineering feats in modern manufacturing. In ASML's laser-produced plasma (LPP) system, microscopic droplets of molten tin are fired through a vacuum and struck by a CO₂ laser. According to Reuters, to achieve the 1,000W threshold, ASML implemented two significant architectural changes: droplet acceleration, which enables the system to fire roughly 100,000 droplets per second (twice the current rate), and two-pulse laser shaping, which uses two smaller laser bursts instead of the single pulse currently in use.

ASML's roadmap suggests this is just the beginning, with internal targets already set for 1500W and, eventually, 2000W. Assuming the same ratio, that would triple the current production rate.

By scaling the power of the 13.5 nm light beam, ASML aims to directly lower the cost-per-chip for advanced AI and logic processors while extending the economic viability of the sub-2 nm era.

KitGuru says: The “photon bottleneck” has long been the primary limiter for EUV economics. By hitting the 1000W mark, ASML is effectively telling the world that it can keep Moore's Law alive through raw power scaling. For companies like TSMC, a 50% increase in wafer production without expanding their footprint is certainly welcome news.