Intel Foundry is leading the race towards Glass Substrates with its Rio Rancho facility, aiming to become the world's first to initiate mass production. Glass Substrates Are The Future of Semiconductors & Intel Foundry is Well on Its Way To Become The First To Initiate Mass Production Glass Core substrates have been gaining interest, as they have several benefits over traditional organic substrate solutions. The current substrates are also facing shortages due to the AI supercycle, leading one of the biggest substrate suppliers, Ajinomoto, to raise prices. These supply constraints are pushing the industry to look into new advanced packaging solutions, and […]

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Intel's CEO, Lip-Bu Tan, has set a tight policy for his Foundry, firing anyone whose products don't meet quality standards. Intel CEO Confirms Next-Gen 10A & 7A Process Technologies & Calls 14A PDK 0.9 "The Holy Grail", Coming October 2026 During a fireside chat at the J.P.Morgan Global Technology, Media and Communications conference, Intel CEO highlighted some of the company's internal policies and upcoming updates from the Foundry end of the business. When asked about the progress on upcoming technologies, Intel's CEO reaffirmed that 14A is on track for risk production in 2028 and volume production in 2029. In yesterday's […]

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Intel CEO, Lip-Bu Tan, says that its Foundry Business is a National Treasure, and continues to see more customers line up for its advanced packaging and process technologies. Intel Foundry Sees Massive Interest From Several External Customers, Many Already Prepaying For Substrates During today's Mad Money Show with Jim Cramer of CNBC, Intel's CEO, Lip-Bu Tan, talked about the company's Foundry business and how the AI buzz is pushing more customers towards it. Right off the bat, Lip-Bu said that the "Foundry is very important", calling it a national treasure. He says that currently, 90% of the most advanced processors […]

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Intel's recent comeback has been spearheaded by CEO Lip-Bu Tan, who has turned around the company & made it the center of tech conversation. Winning Over President Trump & Elon Musk Was Just The Start, The Real Opportunity of Intel Lies Ahead As CEO Lip-Bu Tan Focuses on "Leadership Through Execution" Intel's success didn't come overnight. Just a year ago, the company's share was a mess, and it was facing internal and external crises at the same time. However, decisions made by former CEO Pat Gelsinger on the Foundry front and a solid roadmap framework, along with current CEO Lip-Bu […]

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As rumors suggest that Google is interested in using Intel for its next-generation tensor processing unit (TPU) chips, well known analyst Ming-Chi Kuo has shared his thoughts on the matter. The analyst believes that yields will be a key factor in Google's decision, especially since the technology giant has started to focus on cost savings for the Humufish next-generation TPU's design. Intel's Yields With The EMIB-T Packaging Technology Will Play Key Role In Google's TPU Orders, Says Analyst Intel's EMIB-T packaging technology, short for Embedded Multi-die Interconnect Bridge Through Silicon Vias (EMIB-T) relies on using a 'bridge' that is embedded […]

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Moore's Law has slowed down, but progress continues in logic development as a new roadmap points to sub-1nm process nodes around 2034. It will Be Years Before Process Technology Go Sub-1nm, But They Are In Development: 0.7nm by 2034 & <0.2nm by 2046 Process technologies have slowed down as we transition into the Angstrom era. While newer nodes continue to offer uplifts, they are getting expensive to produce as the machinery needed to achieve newer designs comes at higher costs. Furthermore, the reliance on chiplets through advanced package solutions has reduced the need to shift to newer nodes immediately, as […]

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Intel's crucial EMIB technology has achieved a phenomenal yield rate, showing its readiness for upcoming adoptions in AI datacenter chips. Intel EMIB Is The Single Most Crucial Foundry Tech From Chipzilla, Which Will Set It As An Advanced Packaging Competitor to TSMC We recently discussed how EMIB is being eyed by AI firms for their next-generation AI chips. The tech has one simple purpose: to provide a cost-effective and scalable alternative to TSMC's CoWoS technology. The advanced packaging tech from Intel is set to be used by Google in its next-generation TPUs, and we have also cited NVIDIA using it […]

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Amkor says that Glass Substrates, a packaging technology replacement for CoWoS spearheaded by Intel, is set for commercialization within 3 years. Intel-Partner, Amkor, Says Glass Substrates Will See First Commercialization Within Three Years Advanced Packaging is key to any major foundry business as chips are getting more and more complex to meet growing compute and memory demands. TSMC is the single-most important advanced packaging provider in the world thanks to its CoWoS 2.5D technology. Current chip requirements involve integration of HBM and logic chips in a single package & the number of HBM chips is expanding aggressively. Recently, OpenAI showcased […]

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Qualcomm is rumored to be preparing a brand new datacenter CPU, which will be just in time to power growing Agentic AI needs. Rumors that Qualcomm's New Datacenter CPU is just a few months away may not sound crazy, given the demand there is for agentic AI There's a rumor going around that Qualcomm is working on its very own "dedicated" Datacenter CPU based on the Arm architecture. Qualcomm making its own Datacenter CPU at some point was expected, but what the new rumor is suggesting is that we could see that chip being announced as early as June this […]

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Intel announced that its ZAM memory project, which is being developed with SoftBank's subsidiary, SAIMEMORY, has received a big boost from Japan. Japan Accelerates The 3.5-Year Development Plan of ZAM, A Memory Revolution By Intel & SoftBank In its latest presser, Intel Kabushiki Kaisha (Intel K.K.) and SoftBank Corp. subsidiary SAIMEMORY have unveiled that Japan's NEDO (New Energy and Industrial Technology Development Organization) has now selected ZAM, a next-generation memory standard which is being seen as an HBM replacement. With the selection of ZAM by NEDO, the program will fund the project through government subsidies, accelerating its development to address […]

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Intel's Foundry business will soon house some big names by the end of this year as its 14A technology gains huge momentum. Intel 14A Technology Will Be A Game Changer For Chipzilla As It Hopes To Get Some Big Names Onboard By The End of This Year Intel's Foundry success relies a lot of it's upcoming 14A process technology. The 14A node is designed to attract external customers more so than it is designed for internal use. That's something that 18A is built for. So far, Intel hasn't publicly named any big customers for its 14A technology, but it makes […]

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Well, you read the headline right, and we are talking about a critical element in AI chips that is not only in tremendous shortage but also originally comes from an MSG maker. Ajinomoto, the MSG Maker, Controls the Production of ABF That Is Absolutely Crucial For Advanced Packaging The aggressiveness of the AI demand cycle has left almost every supply chain entity involved facing shortages, whether in semiconductors, advanced packaging, OSAT services, and more. Traditionally, the computing industry has an idea of demand cycles, given how they have historically evolved, but with the AI datacenter buildout, the scale of customer […]

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Intel's advanced packaging services have been a significant opportunity for the foundry division in recent times, and now it seems customer interest is flowing in. Intel's Advanced Packaging Has Already Seen "Billions" In Customer Commitments This Year Advanced packaging has become a commodity for the tech industry, as significant as semiconductors in today's market, given that manufacturers like NVIDIA have resorted to using it to scale performance without entirely relying on Moore's Law. Right now, TSMC entirely sources advanced packaging demand, with customers looking at products like CoWoS-L for their AI architectures. The important point to note here is that […]

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Intel's packaging services are being considered a viable alternative to TSMC's CoWoS, as supply constraints are forcing US fabless customers to seek other options. Intel's EMIB Packaging Orders Could Reach 'Billions in Revenue' Moving Into H2 2026; a New Prospect For the Foundry Business Advanced packaging has emerged as a major driver of computing power in modern-day AI architectures, and alongside semiconductors, solutions like CoWoS are seen as vital for firms like NVIDIA and AMD. With the start of the AI frenzy, advanced packaging has been dominated by TSMC, but as demand for CoWoS and derivatives ramps up, a supply […]

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Intel's CFO, David Zinsner, took the stage at the Morgan Stanley conference, and based on his comments on the foundry front, Team Blue looks a lot more confident about division breakeven. Intel's 18A-P & 14A Will Prove to Be Effective Solutions For External Customers; Packaging To Bring 'Billions' In Revenue Under CEO Lip-Bu Tan, Intel has been entering the foundry market at a time when the AI frenzy significantly drives customer demand. One of the more significant achievements under Tan was the successful ramp-up of Panther Lake, and according to Zinsner, 18A has delivered on expectations, with yield rates improving […]

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