We are thrilled to officially unveil our next-generation compact, high-performance workstation: the Acemagic F9A (Ryzen AI MAX+395). Designed as a 2L-class mini AI workstation, it combines the flagship AMD Ryzen AI platform with Oculink expansion, dual 40 Gbps USB4 connectivity, and a 4-unit digital microphone array—all housed within a studio-inspired, CNC-machined aluminium unibody chassis. Packing desktop-grade workstation performance into a footprint the size of two water bottles, this product is tailored for AI developers, video creators, and professionals deploying local AI large models, meeting their needs for powerful performance and a clutter-free workspace.

PowerColor today introduced the Radeon RX 9050 8 GB Reaper graphics card. Based on AMD's new entry-level gaming GPU from the RX 9000 series and powered by the AMD RDNA 4 graphics architecture, the RX 9050 is carved out of the 4 nm "Navi 44" silicon by enabling 16 out of 32 CU, for 1,024 stream processors, 32 AI accelerators, and 16 RT accelerators; while retaining the 128-bit GDDR6 memory interface, and giving it 8 GB of 18 Gbps GDDR6 memory on this particular card.

PowerColor's board design for the RX 9050 Reaper involves an aluminium fin-stack heatsink that's ventilated by a pair of 80 mm fans, a simple plastic cooler shroud, and a backplate. The card draws power from a single 8-pin PCIe power connector, that's plenty for its 100 W typical board power. PowerColor has given this card a 1920 MHz Game Clock, and 2600 MHz boost clock. Display outputs include two DisplayPort 2.1a, and one HDMI 2.1b. The card is 20 cm long, 10 cm tall, and strictly two slots thick.

Sapphire today introduced its Radeon RX 9050 Pulse 8 GB graphics card. Based on a compacted variant of its RX 9060 XT Pulse board design, the card forms AMD's new entry-level in the RX 9000 series generation of GPUs powered by RDNA 4 graphics architecture. AMD carved the RX 9050 out of the 4 nm "Navi 44" silicon by enabling 16 out of 32 compute units physically present on the silicon, resulting in 1,024 stream processors. The SKU interestingly gets the entire 32 MB Infinity Cache present on the silicon. It also features the chip's full 128-bit wide GDDR6 memory bus, and this particular card features 8 GB of 18 Gbps GDDR6 memory.

Sapphire's board design for the RX 9050 Pulse 8 GB features a dense aluminium fin-stack heatsink featuring two 6 mm-thick copper heat pipes. The fin-stack is ventilated by a pair of 70 mm fans. The card takes in a single 8-pin PCIe power connection that's sufficient for its 100 W typical board power. Display outputs include two HDMI 2.1b and one DisplayPort 2.1a connectors. The card is 20 cm in length, 12.2 cm in height, and is strictly 2 slots thick. The company didn't reveal pricing.

ASRock, a global leader in motherboards, graphics cards, gaming monitors, mini PCs, power supply units, and AIO liquid coolers, today launched the new Challenger series graphics cards based on the latest AMD Radeon RX 9050 GPU. As the latest member of the AMD Radeon RX 9000 series GPUs, AMD Radeon RX 9050 also uses the AMD RDNA 4 architecture, which is equipped with the 3rd Gen ray tracing, provides up to 16 AMD RDNA 4 compute units, and supports AMD HYPR-RX, AMD FSR Technology and other latest AMD-exclusive technologies. It also supports the latest suite of AMD FSR Gaming Technologies, plus the latest specifications such as DisplayPort 2.1a, PCI Express 5.0, and a large-capacity up to 8 GB GDDR6 memory.

The mainstream ASRock AMD Radeon RX 9050 Challenger 8 GB graphics card offers a Boost Clock of up to 2600 MHz. It features a newly designed and stylish dual-fan cooler, the exclusive Striped Axial Fan, and Ultra-fit Heatpipe to provide efficient heat dissipation. The LED indicator makes the graphics cards more visually appealing. The metal backplate strengthens the structure, while the high-quality Super Alloy Graphics Card components provide more stable operation and deliver higher performance. These practical designs make the ASRock AMD Radeon RX 9050 Challenger 8 GB an excellent choice for system integrators and mainstream users.

Kioxia Corporation, a world leader in memory solutions, today announced its UFS 5.0 embedded flash memory solutions, designed to deliver the performance, efficiency and capacity required for the next generation of AI-enabled mobile and edge devices. The new solutions will be demonstrated next week at FMS: the Future of Memory and Storage and are now available as commercial samples in 1 TB and 512 GB capacities. Mass production is expected to begin by the end of 2026.

Built on the latest JEDEC UFS 5.0 standard, Kioxia's new devices leverage the MIPI M-PHY v6.0 physical layer and UniPro v3.0 protocol, including HS-Gear6 operation, to support theoretical interface speeds of up to 46.6 Gb/s per lane and approximately 10.8 GB/s of effective dual-lane read/write performance. As AI workloads continue moving onto devices, storage performance is becoming increasingly important. Large language models, multimodal AI, advanced imaging and real-time inference require significantly faster movement of data between storage and compute. Until now, UFS read performance has been a limiting factor for increasingly sophisticated on-device AI, constraining how quickly large language models and other AI workloads can access data. Kioxia's UFS 5.0 helps remove these bottlenecks, enabling faster application loading, greater responsiveness and unprecedented user experience across on-device AI applications when compared to UFS 4.1.

United Microelectronics Corporation (UMC), a leading global semiconductor foundry, today announced that its Board of Directors has approved a phased expansion plan to meet growing customer demand. The company will immediately expand cleanroom capacity in Singapore and simultaneously begin construction of a new fab building shell at its flagship Tainan campus in Taiwan.

This dual-track approach is designed to meet near-term customer demand while establishing the structural footprint required to capture future high-growth AI and edge-computing applications. The strategy dramatically reduces future capacity lead times while keeping near-term capital expenditure tightly aligned with secured, long-term customer commitments.

AAEON, a leading producer of industrial motherboards, has announced the release of the MIX-Q870A1, a sophisticated Mini-ITX motherboard supporting up to 65 W Intel Core Ultra 200S Series LGA 1851 socket-type processors (formerly Arrow Lake). Compatible with a broad selection of SKUs from the second generation of Intel Core Ultra processor range, the MIX-Q870A1 can leverage the platform's integrated NPU and Xe LPG Graphics for AI acceleration for a total of 36 TOPS alongside optimized multitasking and multicore performance.

A particularly notable inclusion among the MIX-Q870A1's specifications is its 16-lane PCIe Gen 5 slot with bifurcation, which can be split into x16, x8/x8, or x8/x4/x4 configurations through a dedicated jumper. This addition provides a modular foundation for the installation of expansion cards based on project need, meaning that even when equipped with a GPU to bolster the AI acceleration offered by the board's Intel Core Ultra platform, the remaining lanes of its PCIe slot can be used to accommodate additional modules like NVMe SSDs, NICs, frame grabbers, or field bus interface cards.

Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and Hi-fi audio products, proudly announces the COLORFUL Rimbook L1 Plus, powered by an AMD Ryzen processor. Designed for students, professionals, creators, and everyday users, the Rimbook L1 Plus combines powerful computing performance, a lightweight premium design, and a vibrant high-resolution display in an ultra-portable package.

Powered by the AMD Ryzen 7 7735HS Processor featuring 8 cores, 16 threads, and boost speeds of up to 4.75 GHz, the Rimbook L1 Plus delivers the performance needed for demanding productivity, multitasking, content creation, and entertainment. Weighing only 1.4 kg and measuring just 16.65 mm thin, the laptop features a refined matte metal top cover that offers a premium look and feel while remaining easy to carry for users on the go.

For decades, defense and aerospace systems have relied on architectures that were not designed for today's data intensity. Analog-heavy signal-processing chains, while effective in earlier generations of radar and sensing systems, pose inherent limitations on scalability, flexibility, and efficiency. As sensor resolution increases, particularly in applications such as phased array radar and infrared imaging, the volume of data grows exponentially, placing unsustainable demands on both processing and power.

At the same time, these systems must operate within fixed SWaP (size, weight, and power) operational limits. In aircraft, power is a shared and finite resource, with competing subsystems drawing from the same limited supply, making it the most constrained resource on the platform. In space-based systems, the challenge is even more acute: power generation is hampered, and thermal dissipation is intrinsically difficult in vacuum environments where conventional cooling methods are unavailable.

Noctua and Prusa Research today expanded the lineup of 3D printing filaments in signature Noctua colors. The new PETG Prusaments complement the previously released PLA materials, offering higher toughness and temperature resistance for more demanding applications. "We've already seen amazing projects come to life using the Noctua-colored PLA Prusaments", says Roland Mossig, CEO of Noctua. "The new PETG materials are stronger and can withstand higher temperatures, so we can't wait to see what users will create with them."

While PLA is undeniably the easiest material to print and therefore ideal for both novices and experts who seek maximum convenience for parts that don't require high mechanical or thermal stability, PETG remains convenient to print while offering superior toughness and temperature resistance. This makes it ideal for parts that are subject to structural load or used in environments that may exceed 50°C. For example, the new Prusament PETG materials are perfect for custom PC cases, electronic enclosures or air ducts that may be exposed to temperatures above this level.

The ARCTIC Fan Controller brings together intelligent fan management, detailed monitoring, and broad software compatibility in one compact solution. With support for up to ten independently controllable fans, it enables precise airflow optimization while simplifying the management of sophisticated cooling configurations. Extensive software compatibility, including open-source software and Linux support, ensures seamless integration into a wide range of systems.

The Fan Controller allows for true customization with independent channel control. Unlike daisy-chained hubs that share one signal, the ARCTIC Fan Controller lets you set unique speeds for every fan. Combined with open-source software, each fan can be monitored individually, making it easy to fine-tune cooling performance or to automate fan speeds based on workload. This results in improved system efficiency, enhanced reliability, and a more streamlined user experience.

be quiet!, the German manufacturer for premium PC components and peripherals, is proud to announce Light Loop IO LCD, a new addition to the Light Loop all-in-one water cooling series. Designed for heavily overclocked systems, Light Loop IO LCD combines high cooling performance and whisper-quiet operation with a striking IPS display and intense RGB lighting, in 240 mm and 360 mm radiator sizes and in two color options (black and white). An included IO Controller enables software control, while daisy-chained Light Wings LX PWM high-speed fans and extensive customization options make Light Loop IO LCD a visually impressive and highly capable cooling solution.

"With Light Loop IO LCD, we are expanding the Light Loop series with a model that combines powerful cooling, quiet operation, and a new level of personalization," says Aaron Licht, CEO of be quiet! "The IPS display, vivid ARGB lighting, and included IO Controller make this cooler a compelling choice for users who want high performance as well as a truly distinctive look for their system."

Alphacool International GmbH from Braunschweig is a pioneer in PC liquid-cooling technology. With one of the industry's most comprehensive product portfolios and more than 20 years of experience, Alphacool is expanding its DDCzero series with the Core DDCzero XS Reservoir, the Core DDCzero Pump Top and the ES Reservoir DDCzero 1U.

All three products are equipped with the compact Alphacool DDCzero PWM pump. It operates between 3300 and 4800 rpm and delivers a maximum flow rate of 220 l/h with a maximum head of 1.42 m. This provides a balanced combination of high performance and pleasantly quiet operation. The Core DDCzero XS Reservoir has been developed for systems with limited installation space. It combines a durable acetal base with an acrylic reservoir, three G1/4" ports and a subtle aRGB light strip.

Nykta has officially launched as a new German system integrator specializing in configurable gaming PCs, office PCs, and workstations. All systems are assembled in Germany and are available to customers in Germany, Austria, and France. In addition to pre-configured systems, Nykta offers a fully customizable PC configurator that allows users to build systems according to their individual requirements. A guided configuration process prevents incompatible hardware combinations, helping customers create technically sound system configurations.

Another key focus is pricing transparency. For every configuration, Nykta provides direct links to the lowest component prices listed on Geizhals, enabling customers to compare the cost of building a PC themselves with the price of a professionally assembled system. The company is backed by a team with many years of experience in the PC hardware industry, including expertise gained at hardware manufacturers, IT distribution companies, and system integration businesses.

GIGABYTE introduced a new Socket AM4 motherboard as part of a new wave of motherboards based on the older socket that supports DDR4 memory, timed with the re-launch of the Ryzen 7 5800X3D processor. The B550 AORUS Elite WiFi7 is essentially an upgrade of the B550 AORUS Elite AX V2, with a Wi-Fi 7 WLAN module replacing the Wi-Fi 6E module. GIGABYTE also took the opportunity to give the board its latest Wi-Fi antenna EZ-plug connector, replacing the older screw-type RP-SMA connectors. It also comes with a newer antenna. The WLAN module on this board is the Realtek RTL8922AE, which supports Wi-Fi 7 with 160 MHz channel width, along with Bluetooth 5.4 support, which is a significant upgrade over the MediaTek RZ608 or Realtek RTL8852CE module on the older board that supported Wi-Fi 6E with 80 MHz or 160 MHz channel widths (depending on the PCB revision), and Bluetooth 5.2.

The new B550 AORUS Elite WiFi7 is built in the ATX form-factor, and pulls power from a combination of 24-pin ATX and 8-pin EPS connectors, and uses a 12+2 phase VRM. The AM4 socket is wired to four DDR4 DIMM slots, a PCI-Express 4.0 x16 slot, and an M.2 Gen 4 NVMe slot. The board's second M.2 NVMe slot is Gen 3, and wired to the B550 FCH, and shares its lanes with a PCI-Express x16 (electrical x4) slot. There is a third x16 slot that's electrically x1, along with a physical x1 slot. Besides the contemporary WLAN module, the board comes with a 2.5 GbE wired LAN interface driven by a Realtek 8125-series controller. The onboard audio solution uses a Realtek ALC1200 HDA codec. USB connectivity includes a 5 Gbps USB-C header, two 5 Gbps USB 3.2 ports by headers, two 10 Gbps USB 3.2 Gen 2 ports, four 5 Gbps USB 3.2 Gen 1 ports, and a couple of USB 2.0 ports on the rear panel, besides four via headers. Expect a sub-$160 price.

AMD's flagship desktop processor until the Ryzen 9 9950X3D2 Dual Edition upstaged it, the 9950X3D, is now selling in the US at an all-time low price of $569. This amounts to an 18.5% drop from its launch price of $699.99. The $569 price can be found on both Amazon (US) and Newegg. The 9950X3D is a 16-core/32-thread Socket AM5 desktop processor based on the "Zen 5" microarchitecture, and powered by 3D V-Cache technology on one of its two 8-core chiplets.

The 9950X3D2 Dual Edition features 3D V-Cache on both its 8-core chiplets. In our testing, the 9950X3D was found to be about 3% slower than the 9950X3D2 at gaming (1080p, averaged), and about 2.5% slower averaged across all our application benchmarks; but it holds significant leads in our Physics Simulation, console emulation, AI ML, and rendering benchmarks.

Siemens today announced an expansion of its strategic partnership with NVIDIA to deliver self-verifying agentic AI workflows to EDA, helping semiconductor and printed circuit board (PCB) engineering teams move from autonomous task orchestration toward more trusted, continuously validated engineering outcomes. The new capabilities build on Siemens' recently introduced Fuse EDA AI Agent system and add new NVIDIA AI technology to help long-running, domain scoped, AI agents reason, act and continuously validate decisions against deterministic, physics-based EDA engines.

The updates to Siemens' Fuse EDA AI Agent are designed to help the semiconductor and PCB industry move beyond simple automation and deliver trusted and verifiable outcomes that improve result quality, time-to-results, tool-calling reliability and token efficiency across long-running engineering workloads. The Fuse EDA AI Agent system is now integrated into Siemens' recently launched Intelligence Center X, supporting agent creation and orchestration in Siemens' enterprise industrial AI environment. Intelligence Center X delivers AI-driven, coordinated processes across design, manufacturing and supply chain - enhancing the comprehensive Digital Twin to support smarter execution and more trusted outcomes.

Today at the 2026 DAC Chips to Systems Conference, Synopsys, Inc. announced advancements to agentic AI for engineering in collaboration with NVIDIA. Synopsys has developed fully autonomous, long-running agentic capabilities for chip design and electronics system design enabled with NVIDIA Nemotron on NVIDIA's accelerated computing platform and secured by the NVIDIA OpenShell runtime. Demonstrated at DAC for the first time, Synopsys' capabilities promise to be a force multiplier for R&D teams beyond task agents, transforming time-consuming chip verification and thermal simulation into automated insight delivery, engineering productivity, and system performance improvement engines.

"AI is fundamentally reshaping engineering, and Synopsys is at the forefront of this transformation, enabling fully autonomous agents across every stage of silicon and systems development," said Ravi Subramanian, Chief Product Management Officer at Synopsys. "Our close collaboration with NVIDIA continues to accelerate the development of next-generation AI technologies by combining Synopsys' domain expertise spanning EDA and CAE with NVIDIA's advanced AI infrastructure and technologies. Together, we are enabling a new class of autonomous engineering workflows that elevate productivity, unlock deeper insights, and help customers innovate faster."

Alphacool International GmbH from Braunschweig is a pioneer in PC liquid cooling technology. With one of the industry's most comprehensive product portfolios and over 20 years of experience, Alphacool is expanding its lineup with the Core DDCzero PWM pump, matching Flat Reservoirs, and the Core Universal Mounting Kit.

The Alphacool Core DDCzero combines strong delivery performance with a compact design. Developed for PC water-cooling systems, datacenter systems, and industrial applications, it ensures dependable coolant flow with low power consumption. Power supply, PWM control, and speed monitoring are conveniently handled through a 4-pin fan connector.