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AMD RDNA 4m iGPU Support Arrives in Open-Source Mesa GPU Driver

AMD's mysterious RDNA 4m integrated graphics have reappeared after a few months of silence, as the GPU has officially been merged into the Mesa 26.3 open-source driver stack. Running under the GFX1171 GPU target, this RDNA 4m is neither a true RDNA 4 design nor a simple RDNA 3 GPU IP. It sits just above RDNA 3.5, with supposed capabilities to support INT8 data types and native FSR 4 technology. However, since AMD announced that older RDNA generations are now getting FSR 4 upscaling, the true purpose of RDNA 4m remains unclear.

As readers may recall, AMD plans to keep its RDNA 3.5 iGPU in use until 2029, meaning most consumers buying laptops in the coming years will experience the same integrated graphics capabilities as those found in today's Ryzen AI 300 and 400 series processors. This suggests that the RDNA 4m, despite its limitations, will be a welcome addition to integrated graphics. "Redstone" features such as ML-based upscaling and rendering technologies rely on the RDNA 4 IP to function effectively. With RDNA 4m support now merged into the Mesa open-source graphics driver, the RADV and RadeonSI drivers are being updated for RDNA 4m.

(PR) Lenovo Rises to 153 on "Fortune Global 500" with AI Business Growth

Lenovo climbed 43 places to #153 on Fortune's annual Global 500 List, making it the highest ranking in the company's history and one of the most significant advances in recent years. The recognition underscores Lenovo's position as one of the world's 500 largest companies by revenue and concludes the strongest year in its history, with record revenue of US$83 billion and adjusted net income growing 42% year-on-year to US$2 billion.

The results demonstrate Lenovo's continued progress in delivering its Hybrid AI vision, positioning itself at the forefront of the AI inferencing and democratization era. AI-related revenue doubled year-on-year and accounted for 33% of group revenue for the full financial year, highlighting AI as the leading growth engine across Lenovo's businesses.

NVIDIA Neural Texture Compression Now Runs on RTX Spark

NVIDIA has officially brought its RTX Neural Texture Compression (NTC) technology to Windows-on-Arm, gearing up for a general release on its RTX Spark PC platform. First demonstrated at GTC 2026 in May, NVIDIA showcased how NTC can significantly reduce GPU VRAM usage by up to seven times. In a technology demo at one of the GTC 2026 sessions, NVIDIA revealed that NTC can lower VRAM usage from 6.5 GB to just 970 MB in certain scenes. NTC technology is an AI-driven texture output that enables games to feature high-quality, complex materials without sacrificing performance. Games can take advantage of the substantial VRAM reduction that NTC offers while maintaining the same texture quality.

For the upcoming RTX Spark, NVIDIA is enhancing the software ecosystem so gamers and future buyers receive a mature software that works seamlessly out of the box, eliminating the need for workarounds. Even Japan's legendary SEGA has released AAA titles optimized for RTX Spark and is dedicating more resources to support the ecosystem. NVIDIA has already started shipping its first preview build of the CUDA toolkit for the RTX Spark platform, specifically as a native Windows-on-Arm software toolkit. Now, emerging technologies like NTC will run on RTX Spark, which includes configurations such as one with 6,144 CUDA cores and another with 5,120 CUDA cores. Both configurations are based on the "Blackwell" GPU microarchitecture and are paired with a 20-core Arm CPU and up to 128 GB of LPDDR5X memory.

TSMC Sits on $1 Billion of Apple Chips as It Waits for DRAM

TSMC reportedly has a large stockpile of Apple chips as the company waits for DRAM delivery from Apple's suppliers to integrate into a complete package. Using Integrated Fan-Out Package on Package (InFO-PoP), TSMC is developing a 3D wafer-level fan-out package. This package is designed to hold memory directly above the SoC die, resulting in a smaller PCB design without the LPDDR5X module occupying over 100 mmΒ² of PCB area. With less than six weeks until the launch of the iPhone 18 series and the iPhone Ultra, Apple is rushing to place DRAM orders to secure new supplies. The Cupertino-based giant primarily relies on DRAM from Micron, whose LPDDR5X memory is used in a range of devices and is the main source for the next-generation iPhone. SK hynix and Samsung are also suppliers, but Micron remains the primary choice.

Apple has reportedly been working to get more manufacturers on board, even negotiating with CXMT for a discount based on volume, but CXMT reportedly rejected this idea. As TSMC waits for Apple's DRAM suppliers, especially Micron, the company can't assemble Apple's processors just yet. InFO-PoP requires DRAM dies to be integrated into the package, and TSMC can't ship any processors before packaging is complete. This process reportedly takes up to two weeks, which means that TSMC and Apple will be working with a tight deadline around the launch of the latest iPhone update.

Apple Scrambles for DRAM, CXMT Reportedly Rejects Negotiations

Apple is one of the largest supply chain operators in the world, maintaining a vast network of suppliers and manufacturing capacity. However, even a company of its stature is struggling amid the current DRAM shortage. According to Tim Culpan's Culpium newsletter, Apple is scrambling to secure DRAM just weeks before its annual iPhone update cycle. With less than six weeks until the launch of the iPhone 18 series and the iPhone Ultra, assemblers are rushing to place DRAM orders to secure new supplies. The Cupertino-based giant primarily relies on DRAM from Micron, whose LPDDR5X memory is used in a range of devices and is the main source for the next-generation iPhone. SK hynix and Samsung are also suppliers, but Micron remains the primary choice.

Interestingly, another report has surfaced about Apple's efforts to secure more DRAM. The company has reportedly entered negotiations with Chinese memory giant CXMT for LPDDR5X memory needed for its current product lineup. Apple attempted to negotiate better pricing with CXMT, likely due to the volume it plans to purchase, but CXMT rejected the proposed lower price. This is one of the first instances where negotiation power lies with the suppliers, as CXMT is producing one of the world's most in-demand commodities and is offering it at market rates without discounts.

Electronic Arts, the World's Largest Game Studio, Officially Goes Private

Electronic Arts is officially back to private ownership after nearly 36 years in the public markets. If readers recall, in September 2025, EA announced that the company would be going private again under a consortium managed by PIF, Silver Lake, and Affinity Partners. This private undertaking has been valued at $55 billion, primarily led by Saudi Arabia's PIF. Interestingly, this means that the company's decision-making process will be handled by the consortium instead of public-market investors. This will have a significant impact on individual game development, as the new company management will likely dictate how the funds are spent, alongside the chairman and CEO, Andrew Wilson. He has even promised to continue investing in the next generation of titles boldly, stating the following:
Andrew Wilson, Chairman & CEO of Electronic ArtsWe're entering this next chapter from a position of strength with partners who share our vision and ambition. Together, we'll invest boldly, accelerate innovation, and build the next generation of games and experiences for the hundreds of millions of players and fans who inspire us every day.

Huawei MateBook Pro Arrives with Kirin X90 Plus SoC and $1,480 Price Tag

Huawei has just unveiled its latest MateBook Pro laptop, featuring a homegrown processor, operating system, and a fully integrated experience. Priced at 9,999 RMB for the base model with 24 GB of RAM and a 512 GB SSD, this equates to about $1,480. The top-end configuration offers 32 GB of RAM and a 1 TB SSD for 13,999 RMB, approximately $2,072 at the current exchange rate.

Inside, the previous Kirin X90 has been replaced by the new Kirin X90 Plus, which is kept cool by a foam-copper vapor chamber, allowing the chip to maintain a 40 W performance envelope. Huawei seems to have retained the same core counts and GPU specs with a 10-core, 20-thread design, but the improved thermal management suggests they are extracting more performance from this generation. No official specifications have been released yet, so this remains speculative.

Microsoft Is Quietly Deleting 32 GB RAM Recommendation for Windows 11

Microsoft is retroactively removing documentation from its website and materials that mention 32 GB of RAM as a recommendation for new PC builds or purchases. Instead, the company is now emphasizing 8 GB devices that are optimized to run Windows 11 smoothly, even with that RAM configuration. Thanks to Windows Latest, which spotted the changes, Microsoft's Windows Learning Center has been updated to remove mentions of the 32 GB RAM recommendation. Previously, Microsoft published a document suggesting that 16 GB is a baseline for a modern PC, describing it as a good "starting point." However, the company also used to recommend that gamers try to surpass this baseline, suggesting 32 GB as a "no worries" upgrade for gaming PCs.

At that time, this sparked significant controversy as gamers were vocal about Microsoft recommending more RAM when purchasing additional memory could cost as much as an entire PC, depending on the configuration. Amid a severe DRAM shortage, Microsoft faced pushback from gamers and quietly removed the mention of the 32 GB "no worries" recommendation. This also raised concerns about whether Microsoft would optimize the Windows 11 operating system to perform better on lower-spec PCs with less than 16 GB of RAM, such as the 8 GB PCs that Microsoft sells itself, like the Surface Pro 12 and Surface Laptop 13, both of which come with 8 GB base configurations.

Samsung Continues DRAM Market Share Lead, Micron Is Catching Up, Notes Report

According to Counterpoint Research's Global Memory Tracker update for the second quarter of 2026, memory manufacturers are adjusting their share of the global DRAM revenue. The report highlights that South Korean memory makers remain dominant, with 65% of global DRAM revenue going to Samsung and SK hynix. Samsung holds the top position, capturing 39% of the global DRAM revenue. The South Korean giant has reportedly resolved its manufacturing issues, and its foundry has delivered strong performance, widening the gap with other manufacturers. Price increases in regular DRAM and specialty solutions like HBM have significantly boosted the company's revenue, securing its stable number one spot.

In second place, SK hynix holds about 26% of the global revenue share. This is a decrease from the 39% share the company held in Q2 2025, despite its revenue growing 214% year-over-year. This indicates that while the DRAM market is expanding, Samsung is capturing a larger share of the new market growth, leading to a higher overall revenue share. SK hynix was the first to implement long-term agreements with customers, where price volatility is predetermined. This strategy involves encouraging customers into multi-year agreements rather than capitalizing on short-term price fluctuations.

GIGABYTE Reportedly Hikes GPU Pricing by Up to 40% in Japan

GIGABYTE is reportedly implementing a round of GPU price hikes ranging from 20% to 40%, depending on the model. According to Japanese hardware distributor CFD-BIZ, these price increases have been officially in effect since August 1st. While the specific GPU models affected by this pricing strategy are not yet known, CFD-BIZ noted that some existing orders might not be shipped. Any outstanding orders that haven't been shipped are at risk of being canceled, and CFD-BIZ may contact customers individually to discuss cancellations depending on the order. Since each order is unique, the distributor might be able to fulfill some at current prices, but new prices are now in place for future orders.

PC DIY hardware enthusiasts in Asia are facing challenges, as NVIDIA GeForce RTX 50 graphics card prices have reportedly increased by up to 30% in South Korea, depending on the model. The falling value of the Japanese Yen might be contributing to an additional 10% price difference, as the supply of GIGABYTE GPUs may have been delivered when USD/JPY exchange rates were at historical levels, bringing the Yen to new lows. However, the US and Japan have jointly intervened to support the currency, suggesting that the 40% increase might not be entirely sustained, and we may see a similar 30% price increase as rumored for the rest of the industry. What actually happens at the retail level remains to be seen, as CFD-BIZ handles wholesale shipping, not direct consumer sales. Therefore, we still have some time to determine which GPU models are affected and by how much.

EU Pressures Apple Into Universal Clipboard for Compatibility With Windows

Apple is once again complying with the rules of the European Union, as the company is now developing a universal copy and paste system to transfer text directly from an iPhone to a Windows-based PC. Under the EU Digital Markets Act (DMA), Apple is required to create a feature to align itself with Microsoft's formal interoperability request, which will help users with the simple copy and paste action that hasn't worked until now. Currently, third-party applications on iOS, which powers iPhone mobile devices, can only access the iPhone's clipboard contents while they are open and active on the screen. Every copy or paste action required the user's manual approval.

However, Microsoft has built a workaround, and the EU has been pressuring Apple to adopt the standard. The company reportedly reviewed the Union's request in March 2026, put forward project plans by late June, and is now in development. Apple will implement this universal clipboard through a framework called AccessorySetupKit. One permission is granted per device, and once a Windows PC is approved, clipboard items will move automatically in the background. No further prompts will be required. The Cupertino-based company already offers similar universal syncing between its own ecosystem of devices through the existing Universal Clipboard, which connects iPhones with Mac computers for seamless integration.
Apple Universal Clipboard

CXMT Enters LPDDR6 Risk Production with 12.8 Gbps Memory Chips

We have seen numerous reports about Chinese memory giant CXMT and its production. The company has now reportedly entered risk production of the latest LPDDR6 memory, reaching parity with Samsung, SK hynix, and Micron in both manufacturing and technological evolution. According to multiple reports, CXMT's LPDDR6 memory will operate at speeds of up to 12.8 Gbps, with the base speed of LPDDR6 being 10.7 Gbps. LPDDR6 picks up where LPDDR5X left off, which could reach speeds of up to 10.7 Gbps when highly overclocked. However, the newest standard is pushing for much higher speeds, with the first generation of LPDDR6 from CXMT's fabs reaching 12.8 Gbps. Additionally, CXMT is producing these chips with a 16 Gb capacity, equivalent to 2 GB, and the memory IC is placed inside a package-on-package (POP) casing, featuring about 1,295 pins in a ball grid array.

For now, this production will be only a trial run before high-volume manufacturing (HVM), which will likely take place weeks or even months after the initial risk production. Currently, the company is shipping its LPDDR6 to customers for validation, suggesting that we will likely see full risk production soon. As CXMT has manufacturing, construction, and other factors far ahead of industry standards, it is possible that HVM will occur in just a few weeks.
CXMT LPDDR6

Memory Makers Seal 2027 Deals: No Room for New Buyers

According to DigiTimes, industry insiders are now claiming that the entire memory production capacity for 2027 has been fully booked, well ahead of the schedule the industry expected. All of the big three memory makersβ€”Samsung, SK hynix, and Micronβ€”have sold out their memory capacity for the upcoming year, leaving no room for additional supply for third parties to purchase more DRAM wafers. Interestingly, the report notes that everyone from OEM server makers and PC makers to AI labs knows that July and August are crucial months for securing allocations for the following year. However, some businesses have been kept in the dark because nobody has been public about this out of fear of losing their allocation.

Memory makers have been pushing customers into long-term agreements with contracts ranging from three to five years, using an advance payment deposit model where customers essentially pre-pay for some of the memory capacity. These deals are made on an individual customer level. All of this combined signals that 2027 will be the worst year in recent history regarding memory shortages, meaning that only those who managed to sign agreements for supply will benefit, while the rest are left without as there simply isn't enough available DRAM. Only about 60-70% of the estimated demand can be met in 2027, leaving a significant amount of demand unmet and waiting for the 2028 supply.

ASUS, GIGABYTE, and MSI to Raise Motherboard Prices in Q3

Motherboard manufacturers are currently facing a challenging situation where declining sales are impacting their revenue, and rising component costs are eroding their margins. According to the latest update from Board Partners, major motherboard manufacturers, including ASUS, GIGABYTE, and MSI, are expected to introduce a series of planned price increases to maintain their margins. Taiwanese motherboard makers are experiencing price increases across their supply chain, with the cost of bare PCBs used in manufacturing these motherboards expected to rise by at least 50% this year, significantly impacting component costs. Raw materials used in manufacturing, such as copper, are also in high demand, leading to price increases. Other electronic components like control chips, power devices, and surface-mount capacitors, such as MLCCs, are experiencing significant bottlenecks.

As a result, motherboard manufacturers are facing substantial price increases from their supply chain and are being forced to implement price hikes this quarter. The total bill of materials (BOM) for each motherboard design varies, as every platform uses a different number of capacitors, power components, and control chips. Additionally, each motherboard uses a different number of PCB layers, affecting the BOM. This means we are not yet certain how much motherboards will be impacted by the component shortage, as only motherboard manufacturers know exactly how much they need to adjust their pricing percentage-wise, likely on a per-motherboard SKU basis.

NVIDIA GeForce RTX 50 Series Faces 30% Price Increase in South Korea

NVIDIA's GeForce RTX 50 series is rumored to see a price increase of about 20-30%, depending on the model, due to rapidly rising costs of GDDR7 memory from NVIDIA's VRAM suppliers. According to ZDNet Korea, South Korean importers and distributors have already informed the supply chain about this price hike, which could reach up to 30%. NVIDIA provides its add-in board partners with GDDR7 memory as a kit that includes both the GPU die and GDDR7, so any price increase from memory manufacturers affects AIBs and, ultimately, consumers.

Currently, each 2 GB GDDR7 memory module costs in the low 20s in USD. This spot pricing for GDDR7 means NVIDIA needs 16 of these modules for its flagship GeForce RTX 5090 GPU. This results in at least $320 being spent on GDDR7 memory for the flagship model, before adding the cost of the GPU die, research and development, and the margins for AIB partners. The situation remains challenging even in South Korea, the world's hub of DRAM production. Despite being home to SK hynix and Samsung, no one is exempt from these price increases, which are expected to continue.

Lenovo Googlebook 15 Renders Appear Months Ahead of Launch

In mid-May, Google announced that it is working on bringing its new Googlebook devices to the masses, with a promise to introduce a new operating system featuring integrated Gemini AI across the board. As the company collaborates with multiple OEMs, including Acer, ASUS, Dell, HP, and Lenovo, we have received the first leak of the Lenovo Googlebook 15 model. This model is set to offer a 15-inch experience of Google's upcoming "Aluminium" operating system. Thanks to a leak by Digital Citizen, we can see the first renderings of the Lenovo Googlebook 15, showcasing a sandblasted aluminium casing in a 15-inch body. The device features the traditional Lenovo bezel and overall design, housed in a medium-thickness body.

On the keyboard front, Lenovo has included a small "G" button with the Google icon, reminiscent of the Windows key on standard Windows-based laptops. Two speakers flank the keyboard, and the left side of the unit includes an HDMI port, a USB-C or Thunderbolt port, and a 3.5 mm headphone jack. On the right, there is another USB-C port, a USB Type-A port, and a slot similar to an SD card reader. Specifications such as display resolution, refresh rate, and details about the processor powering this PC are currently unknown, but we expect to learn more when Googlebooks officially launch. Scheduled for release in the fall of this year, we are still months away from the official debut.

TSMC Targets 100,000 N2 Wafers per Month by the End of 2026

If readers recall, a few days ago we reported that TSMC has achieved a milestone of about 20,000 wafers per month on the company's latest 2 nm N2 node. However, the company is now rapidly scaling its high-volume manufacturing, aiming to produce about 100,000 N2 wafers per month by the end of 2026. This gives the company about four months to increase its manufacturing output fivefold. While that might seem impossible, TSMC has been rapidly scaling its manufacturing output over the years, and the latest N2 node is no exception. Currently, the N2 node accounts for only 3% of TSMC's revenue, while the 3 nm node holds 30%, and the 5 nm node secures the top spot at 33%. Even with projected growth in N3 and N5 consumption, increasing revenue fivefold would mean the N2 node would represent more than 10% of the company's overall revenue share.

Meanwhile, the demand for its 3 nm N3 family of nodes is still strong. Reportedly, TSMC's customers, including NVIDIA, AMD, Broadcom, and many others, have pushed the total monthly wafer output of the N3 node to 180,000 units, exceeding the company's internal targets. While TSMC hoped to achieve this number in the fourth quarter of 2026, demand has pushed production capacity to its limits, prompting TSMC to consider additional expansion plans for this node.

Microsoft Denies New Tracking Service in Windows 11

Over the weekend, social media drama took a turn when the community accused Microsoft of running a new background tracking service on Windows 11. However, the company officially denies this. The whole event started on July 31st when a user on X noticed a new background service called "Windows Health and Optimized Experiences" that starts automatically every time the system is booted. This background service monitors the CPU's thermals and reportedly sends data every 15 minutes. However, this feature is not actually new and is used for diagnostics. According to Microsoft VP Scott Hanselman, when Windows 11 detects slow or sluggish behavior, it can record performance traces that can be sent to Microsoft via the Feedback Hub.

The service is not standalone telemetry but is initiated by Windows 11 itself, saving these files under "%SystemRoot%\Temp\DiagOutputDir\Whesvc." These files are stored locally, but there is an option to send them back to Microsoft for diagnostics and to improve future experiences using the Feedback Hub. Contrary to the fear-inducing post, this data-sending service is optional if the user chooses to submit a report. Additionally, Microsoft did not suddenly introduce this feature to Windows 11, as it has existed for over a year, having been included in the Windows 11 Canary build introduced in May 2025.

Xbox Disc to Digital Arrives This Month for Xbox One and Series X

Microsoft's internal roadmap for the Disc to Digital feature has been leaked, revealing that the feature will be generally available this month. According to the roadmap, an insider beta of the Disc to Digital feature has been available since July, with general availability for Xbox One and Series X owners expected in August. For those unfamiliar, Disc to Digital is Microsoft's initiative to promote a digital-only future for Xbox consoles. This feature allows players to insert their game discs into the console to convert them into digital licenses. When the disc is scanned, Microsoft uses the unique key to create a digital license, which prevents the disc from being activated on third-party consoles and stops it from being rented, borrowed, or sold to others.

This marks a significant shift away from physical disc game releases, as both Sony and Microsoft are moving towards ending disc-based games, encouraging gamers to use digital licenses exclusively. According to the roadmap, Xbox One and Series X users will be the first to scan their games and obtain digital licenses, as these consoles have physical disc readers. Game licensing will now be tied to the specific user account, with Xbox managing all engineering, certification, and support efforts if any issues arise. However, publishers retain the right to participate, maintaining full control over rights, pricing, and branding.
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