Taiwan is moving closer to issuing a request for proposal (RFP) for its quantum computing system project.

Google's Humufish TPU project, scheduled to enter mass production by the end of 2027, is set to adopt Intel's EMIB-T advanced packaging technology with support from ASIC partner MediaTek. MediaTek has also stated during an earnings call that EMIB-T yields have reached levels capable of supporting stable mass production, expressing confidence in the project's 2027 production plans.

China's rare earth export controls are changing the rules governing global critical mineral supply chains. For Taiwan, the real concern is not that China could suddenly halt all exports one day, but that export licensing, end-use reviews, price volatility, longer lead times, and "hidden dependencies" embedded in intermediate materials and components could gradually raise the cost and uncertainty of maintaining normal production.

Huawei's internal Heart Voice Community recently published minutes from a discussion between Guo Ping, chairman of Huawei's supervisory board, and newly hired employees, offering a glimpse into the company's ambitions in AI, computing, semiconductors, and future technologies.

Huawei and Seres, a Chongqing-based premium manufacturer of high-end electric NEVs, are reportedly adjusting their smart vehicle partnership in the AITO brand. Huawei would shift toward a more asset-light role, and Seres would take greater control over AITO's product, marketing, sales, and service operations.

DIGITIMES Intelligence observes that discussions at the semiconductor sustainability and energy forum during SEMICON Taiwan 2026 centered on two questions: whether Taiwan will have enough electricity to support continued semiconductor expansion driven by AI, and whether that electricity will come from renewable sources.

In 2026, major smartphone system-on-chip (SoC) vendors began moving selected flagship processors to 2nm technology, seeking not only to secure sufficient capacity but also to deliver meaningful upgrades in technical specifications.

S&P Global Mobility senior research analyst for connected cars and user experience in Asia-Pacific Quan Zhang shared the latest forecasts for the cockpit display and head-up display (HUD) markets.

PwC and Oxford Economics jointly released their Global Data Centre Outlook 2026–50 in early September, projecting cumulative global data center capex of US$31.6 trillion by 2050 under the baseline scenario. If AI adoption accelerates, investment could approach US$50 trillion under an upside scenario.

Asustek Computer (Asus) has been accelerating the integration of AI, hardware, software, and cloud technologies into healthcare as it builds a next-generation smart healthcare ecosystem. Kuo-Hao Huang, vice president of the Asus AI Research Center, said the biggest challenge hospitals face in adopting AI is not the AI models themselves, but whether their data, workflows, and system architectures are ready.

Breaking from the industry's mainstream reliance on III-V compound semiconductors, Taiwanese startup Taiwan Nano & Micro-Photonics (N&M) is using complementary metal-oxide-semiconductor (CMOS) processes to develop a single chip capable of emitting more than four wavelengths of mid- to far-infrared light.

Rising demand for generative AI, high-performance computing (HPC), and data center buildouts is pushing the global IC substrate industry into a new phase marked by upgrades in high-end product specifications, tight supplies of critical materials, and intensifying competition in advanced packaging technologies.

Taiwan's EV charging industry remains in a fiercely competitive, fragmented phase, according to Blockcert chairman Chang Chung-I. While charging stations may appear to offer an unattended business model, their operations involve numerous complexities that operators often discover only after sites go live, and a lack of operational management experience can result in substantial costs.

Arm unveiled its second-generation mobile Compute Subsystem (CSS), Arm CSS for Mobile 2, at its annual Arm Everywhere China event in Shanghai on September 8, further integrating AI computing capabilities across the CPU, GPU, and system interconnect while strengthening its presence in the Chinese market.

Nvidia's Vera Rubin platform is entering its production ramp, and although server ODM shipments are still expected to ramp further, server ODMs delivered strong operating results in August. Industry sources said demand remains robust for both the H-series and GB-series products.

As AI drives the transition toward high-speed transmission technologies such as 800G and 1.6T, silicon photonics has become increasingly mainstream in high-speed optical communications, attracting investment from major industry players.

Capacity for advanced semiconductor processes and packaging remains tight, while mature-node chips required for AI-related peripheral applications are also facing mounting supply pressure. IC design houses and semiconductor industry sources generally expect the current capacity constraints to last longer than the chip supply crunch that followed the COVID-19 pandemic.

A battery quality controversy involving GAC Aion has put supplier CALB, the world's fourth-largest EV battery maker, under scrutiny and highlighted a less comfortable side of China's breakneck expansion in new energy industries.

If Taiwan's government is determined enough, finding funding and land for the Industrial Technology Research Institute (ITRI) or the National Institutes of Applied Research (NIAR) is not necessarily the hardest part. The more difficult question comes later: who will shoulder the enormous and recurring cost of keeping advanced semiconductor research infrastructure running?