China's effort to advance memory technology has gained a new research avenue, with a Fudan University team developing a room-temperature single-electron non-volatile memory device based on two-dimensional materials.

AI computing demand is rapidly increasing the complexity of chip integration, shifting advanced packaging competition beyond individual component performance to reliability and validation across packages, PCBs, systems, and even rack-level infrastructure.

As companies accelerate the adoption of AI agents to reshape business processes, attackers are using the same technology to increase the speed and scale of cyberattacks.

Novatek, a Taiwan-based display driver integrated circuit (DDI) supplier, said at its August 6 investor conference that second-quarter 2026 revenue and gross margin exceeded expectations, supported by stronger customer orders across all three major product lines and a sharp sequential increase in profit.

China's silicon wafer industry is entering a new phase of simultaneous capacity expansion and consolidation, with Xi'an Eswin Material Technology investing further in a 12-inch wafer base in Wuhan while Hangzhou Lion Microelectronics moves to take full control of Zhejiang Jinruihong Technologies.

Hiroca Holdings reported consolidated revenue of NT$370 million (approx. US$11.5 million) for July, down 17.2% from the previous month and 16.7% from a year earlier. Consolidated revenue for the first seven months of 2026 reached NT$2.89 billion, down 2.07% year-over-year.

VisEra, the TSMC-affiliated optical components supplier, is expanding into AI optical interconnects and silicon photonics, with its MicroLens products for 800G pluggable transceivers already in mass production and its next-generation PIC thin-film processes for 1.6T products targeted to begin gradual volume production by the end of 2026. A high-density optical coupling platform is planned for mass production in the second half of 2027.

WT Microelectronics (WT Micro) posted record revenue and profit in the second quarter of 2026, supported by strong AI momentum and better-than-expected demand from the automotive and consumer markets. AI data centers and communications now account for 70% of revenue, up from 50%, with their contribution expected to rise further.

The 2026 OCP APAC Summit will take place in Taipei on August 11-12. Ahead of the event, Lightmatter founder and CEO Nicholas Harris spoke exclusively with DIGITIMES about the company's advantages after joining the Nvidia NVLink ecosystem, its technology roadmap and the importance of close collaboration with Taiwan's supply chain.

Wistron expects stronger AI server growth in August 2026 after reporting July revenue of NT$308.22 billion (approx. US$9.53 billion), down 4.2% month-over-month but up 60.8% year-over-year. Revenue for the first seven months reached NT$2.05 trillion, up 88.2% from a year earlier. The company expects AI server shipments to grow sequentially throughout the second half of 2026.

Zhen Ding Tech (ZDT) said July revenue reached its highest level so far in 2026, supported by strong momentum across mobile communications, servers, optical modules and IC substrates. Its mobile communications business maintained double-digit year-on-year growth, while combined revenue from servers, optical modules and IC substrates sustained triple-digit growth, accelerated from the previous month and reached another monthly record. The gains were mainly driven by customers moving high-end AI products into adoption and mass production as planned, lifting ZDT's related shipments.

Chinese robotics company Unitree is entering a critical stage in its initial public offering. The IPO is expected to raise about CNY4.2 billion (approximately US$622 million), while the company's post-listing valuation could range from CNY40 billion to CNY50 billion. It would become the first company on China's A-share market whose primary investment theme is humanoid robotics.

The US Federal Communications Commission is reportedly considering restrictions on new models of Chinese-made optical transceivers used in data centers, potentially exposing suppliers including Zhongji Innolight and Eoptolink to fresh market-access risks.

The global smartphone market is approaching an unusual turning point in the second half of 2026. Artificial intelligence has become the industry's preferred growth narrative, while reports that Apple and Samsung Electronics are considering memory components from Chinese suppliers also reflect a market under mounting strain.

DIGITIMES Intelligence observed at the 2026 World Artificial Intelligence Conference (WAIC) that AI is rapidly reshaping the direction of the automotive industry. Competition in vehicle intelligence is shifting from software-defined vehicle (SDV) function integration towards the development of AI-defined vehicle (AIDV) capabilities, extending automakers' competitive focus from software architecture to AI models, computing platforms, and ecosystem integration.

US semiconductor policy is moving deeper into the most critical layers of advanced chipmaking, with former Intel chief executive Pat Gelsinger again emerging as a central figure. After previously urging Apple, AMD, Nvidia and Qualcomm to support Intel Foundry as part of a broader US manufacturing revival, Gelsinger is now backing xLight, a start-up seeking to challenge one of ASML's most entrenched advantages in extreme ultraviolet (EUV) lithography.

Flexium Interconnect said its second-quarter operating loss narrowed from the previous quarter as new flexible printed circuit products entered mass production for a US customer's latest notebooks, while smart glasses and AI server products began small-volume shipments.

Liteon Technology posted record profit and margins for the second quarter of 2026, fueled by surging demand for AI data center power infrastructure. The company raised its full-year capex plan from NT$13 billion to NT$18 billion and expects AI-related products to account for more than 30% of annual revenue.

C.C.P. Contact Probes said it has expanded its presence in the AI sector through a joint development project with a major semiconductor company covering microelectromechanical systems probes and probe-cleaning sheets. The products will be introduced into customer designs after development is completed.