Inventec expects both artificial intelligence (AI) servers and general-purpose servers to see growth in 2026, with company president Jack Tsai noting that orders for the latter are expected to grow through 2028. The company also plans to double capital expenditure in 2026, focusing on expanding production sites to meet customer demand.

Advanced Semiconductor Engineering (ASE) and PCB manufacturer Wus Printed Circuit are teaming up to build a new packaging facility in southern Taiwan, as the world's largest chip assembler moves to expand capacity ahead of surging AI-driven demand. The plant, to be located in the Kaohsiung Nanzih Technology Industrial Park, is scheduled to open in September 2029.

Taiwan and Germany signed a Science and Technology Arrangement (STA) in 2023 to promote joint research in semiconductors, hydrogen energy, artificial intelligence (AI), and other fields. Officials from Taiwan's National Science and Technology Council (NSTC) recently attended a lithium battery cooperation workshop in Dresden, Germany, where both sides confirmed continued support for a bilateral advanced battery research and development program from 2026 to 2029.

Topco Scientific reported record first-quarter 2026 revenue and profit on May 7, driven by strong demand for photoresists, photomask substrates, and silicon wafers used in advanced semiconductor manufacturing processes, as well as peak revenue recognition from environmental engineering projects in Taiwan and overseas.

Memory module maker Transcend Information posted strong financial results in the first quarter of 2026, with gross margin reaching 76.39%, comparable to levels seen at major international upstream memory manufacturers. Net profit after tax rose to NT$8.12 billion (approx. US$259.04 million), up 149% from the previous quarter and a staggering 2,075% higher than the same period in 2025. Earnings per share (EPS) came in at NT$18.93, surpassing the full-year 2025 EPS of NT$12.98, setting a new record high.

Network equipment maker Gemtek Technology, following the launch of its 800G linear-drive pluggable optics (LPO) optical module in 2025, announced on April 6 that it has successfully developed its next-generation 1.6T octal small form-factor pluggable (OSFP) optical transceiver module. The product targets hyperscale cloud data centers and is expected to enter mass production in the fourth quarter of 2026.

Winbond Electronics posted strong first-quarter 2026 results, with consolidated revenue totaling NT$38.25 billion (approx. US$1.21 billion), up 43.7% from the previous quarter and 91.3% from the same period in 2025, driven by strong market demand and an improved product mix. Net profit reached NT$10.12 billion, surging 226.9% sequentially and turning from a loss a year earlier, while earnings per share (EPS) were NT$2.25, exceeding the company's full-year 2025 results in a single quarter.

Semiconductor silicon wafer supplier GlobalWafers said during its May 5 earnings call that it is advancing its next-generation compound semiconductor strategy. In response to advanced packaging and thermal dissipation demand, the company is actively pursuing customer certification for 12-inch silicon carbide (SiC) wafers, while strong demand for gallium nitride (GaN) is driving plans to launch a second phase of capacity expansion.

Nanya Technology reported consolidated revenue of NT$25.49 billion (approx. US$805.3 million) for April 2026, surging 717.33% from NT$3.12 billion a year earlier and 40.29% from March, setting a record high as memory contract prices continue to rise.

Semiconductor test interface provider Chunghwa Precision Test Tech (CHPT) said its revenue in April 2026 continued to set a new all-time monthly high, driven by rising demand for semiconductor testing linked to artificial intelligence (AI) applications.

Asia Optical reported its first-quarter 2026 financial results, posting consolidated revenue of NT$6.21 billion (approx. US$196.43 million), up 15% year-over-year. Gross profit rose 16% from a year earlier to NT$1.07 billion, while operating income increased 58% from the first quarter of 2025 to NT$482 million, marking record highs for all three for the same period.

As artificial intelligence (AI) continues to drive power demands, investment in power-related sectors has become a key focus for component suppliers. Connector and cable supplier JPC Connectivity announced a major breakthrough in its power cable business during its earnings call on April 28, confirming that its ORV3 series of products have completed validation by major cloud service providers (CSP) and Taiwanese ODMs, and have entered the mass production and shipment phases.

Benefiting from the continued expansion of artificial intelligence (AI) computing power demand, Foxconn Industrial Internet (FII), a subsidiary of Hon Hai Precision Industry (Foxconn), reported first-quarter 2026 revenue that far exceeded market expectations. Revenue reached CNY251.08 billion (approx. US$36.74 billion), up 56.52% year over year, while net profit attributable to shareholders of the parent company reached CNY10.60 billion, soaring 102.55%, with profit growth significantly outpacing revenue.

MediaTek held its earnings call on April 30, expressing a cautious outlook for the 2026 smartphone market. Despite this, growth in other applications is expected to effectively offset the decline.

Global outsourced semiconductor assembly and test (OSAT) leader ASE Technology Holding (ASEH) held an earnings call on April 29, reporting a robust first quarter of 2026 that broke from the traditional seasonal slowdown. Growth was driven primarily by sustained strong demand for leading-edge advanced packaging (LEAP) technologies, alongside a simultaneous rebound in wire bonding orders — together fueling an 87% year-on-year surge in quarterly net profit after tax, the second highest on record for the period.

Taiwanese artificial intelligence (AI) software company Osense Technology is targeting the rapidly growing sports technology market — valued at more than US$10 billion — by independently developing a domestically produced baseball hawk-eye system and smart bullpen training solution.

Amid global supply chain restructuring, Asia's PCB industry is moving toward closer regional collaboration. Industry experts say that as southbound expansion in the PCB sector takes shape, the next phase for Thailand's PCB industry will shift from capacity expansion to accelerating the development of an advanced manufacturing ecosystem. Future competitiveness will hinge on localizing supply chains, developing talent, and continuously improving related supporting infrastructure and systems.

Global outsourced semiconductor assembly and test (OSAT) leader ASE Technology Holding (ASEH) held its 2025 ASE Supplier Award ceremony, inviting more than 100 suppliers of packaging and testing equipment, raw materials, components, and processing, along with its subsidiaries Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL), and Universal Scientific Industrial (USI).

Data released by Taiwan's Ministry of Economic Affairs (MOEA) on April 23 showed that major global cloud service providers continue to expand procurement of artificial intelligence (AI) hardware as countries worldwide build out AI infrastructure. As a result, industrial production of computer, electronic, and optical products — primarily AI servers — surged 146.32% in March 2026. Cumulatively, output from January to March rose 131.77% compared with the same period in 2025.